CN104303281B - 用于将芯片接合到衬底的压力传递设备 - Google Patents

用于将芯片接合到衬底的压力传递设备 Download PDF

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CN104303281B
CN104303281B CN201280043727.7A CN201280043727A CN104303281B CN 104303281 B CN104303281 B CN 104303281B CN 201280043727 A CN201280043727 A CN 201280043727A CN 104303281 B CN104303281 B CN 104303281B
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CN104303281A (zh
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M.温普林格
A.西格尔
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EV Group E Thallner GmbH
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Abstract

本发明涉及一种用于将多个芯片(13)接合到衬底(12)上的压力传递设备，具有：‑压力主体(2)，用于将沿接合方向(B)起作用的接合力施加到芯片(13)，压力主体(2)具有第一压力侧(2o)和对接合方向(B)横向分布的相对第二压力侧(2f)，‑固定部件(8，8’，8”)，能够附连到压力传递设备(1)的周边，用于将压力传递设备(1)沿接合方向(B)固定在保持主体(9)上，以及‑滑动层(3)，用于压力主体(2)对接合方向(B)的横向滑动移动。

Description

用于将芯片接合到衬底的压力传递设备
技术领域
本发明涉及用于将多个芯片接合到衬底的压力传递设备以及用于将多个芯片接合到衬底的接合装置。
背景技术
在半导体工业中，存在用于将不同功能单元相互连接、特别是接合的多种可能性。这些可能性之一是芯片到晶圆(C2W)方法，其中将单独芯片单独地接合到衬底。另一个重要方法是所谓的“高级芯片到晶圆”(AC2W)方法，其中首先将芯片临时地(暂时地)连接到衬底，并且永久连接在接合步骤中一起进行，其中所有芯片同时永久接合到衬底。在该接合步骤中，在将芯片压到衬底上(接合力)的同时，对芯片和衬底进行加热。
例如由于加热期间的热膨胀，上述压力和加热过程特别是对于变为越来越小的结构造成技术问题。
发明内容
因此，本发明的任务是给出压力传递设备或者接合装置，通过其，能够优化上述方法并且在接合时的废品为最少。
在说明书和/或附图中给出的特征的至少两个的全体组合也落入本发明的范围之内。在值范围的情况下，位于所指示极限之内的值也将被认为作为边界值来公开，并且将在任何组合中要求保护。
本发明的基本思路是压力传递设备如此布置用于将多个芯片接合到衬底，使得将其构造成允许压力主体对接合方向B横向的滑动移动。但是，如果设置有用于限制对接合方向B的横向滑动移动的限制部件、特别是采取用于将压力传递设备沿接合方向B固定在保持主体上的固定部件的形式，则是有利的。具有AC2W方法的本发明的使用是特别有利的，其中将芯片暂时连接到衬底，并且然后在接合过程中使用压力传递设备的情况下接合。此外，如果在压力传递之前，到接合温度的加热过程至少大部分完成，则根据本发明是有利的。这样，与采用沿接合方向B的紧贴接合力的情况下相比，压力主体能够更自由地对接合方向B横向滑动。
特别是半导体，优选地是晶圆可能作为衬底。
通过本发明至少在很大程度上解决了在压力传递设备与芯片表面之间在接合时发生的热应力的技术问题，这是因为只有压力主体本身的应力是相关的，这是因为它通过根据本发明的滑动层与对接合方向B横向的滑动层的另一侧上的所有组件至少大部分分离。因此，滑动层允许与其相接的组件的几乎完全无摩擦相对移动。根据本发明，将滑动层特别构造为优选主要含碳的固体。优选地将其基面尤其至少大部分与接合方向B垂直对齐的石墨选择作为材料。
按照本发明的有利实施形式规定，固定部件构对接合方向B横向造成成弹性的。因此，同时，固定部件能够提供沿接合方向B的压力传递设备的结合，同时允许压力主体对接合方向B的横向滑动移动。同时，固定部件能够按照这种方式充当上述限制部件，并且因此能够承担多个根据本发明的功能。
在这里，如果固定部件构造为用于沿保持主体的方向夹持压力主体的夹具、特别具有布置在其之间的滑动层，则这是特别有利的。这种布置能够特别容易并且节省空间地来实现，并且执行上述多个功能。
在本发明的改进方案中规定，压力主体、特别是关于材料和/或尺寸，如此选择使得它至少沿接合方向B的横向的热膨胀性质对应于产品衬底的热膨胀性质。优选地选择衬底和/或芯片的材料作为材料。如果特别是对接合方向B的横向上，压力主体的尺寸与衬底的尺寸基本一致，则根据本发明是特别有利的。热膨胀性质特别是包括压力主体和/或衬底和/或芯片的热膨胀的系数。非排他地具体来说，能够使用诸如金属、陶瓷、塑料或者合成材料之类的材料类。具体来说是Si、CTE匹配玻璃、因此其热膨胀系数与产品衬底相适应的玻璃、低CTE金属等。CTE匹配玻璃和低CTE金属在英语名称的情况下也称为“CTE matchedglass”和“low CTE metals”。其热传导性极高的材料特别是优选的。硅的热膨胀系数例如是大约2.6*10-6K-1。产品衬底和根据本发明的实施形式的热膨胀系数的差的绝对量小于100*10-6K-1，优选地小于10*10-6K-1，更优选地小于1*10-6K-1，最优选地小于0.1*10-6K-1，最为优选地小于0.01*10-6K-1，最理想地为0 K-1。
通过设置有至少沿接合方向B是弹性的并且特别是在芯片的中间空间上至少部分中断的层以用于压力平衡，通过该压力传递设备还平衡沿接合方向B的膨胀、应力和高度差，使得可实现均匀压力施加。因此，弹性层用作补偿层。特别地，弹性层具有的弹性模量在1 MPa与10 GPa之间，优选地在1 MPa与10 GPa之间，甚至更优选地在1 MPa与1 GPa之间。优选材料是聚合物。有效各向同性弹性模量大约为1 MPa的橡胶用作弹性模量的对比值。纤维增强聚合物是优选的，其沿纤维的纵轴的有效弹性模量大约为100 GPa。它们标志弹性材料的上限。
在本发明的另一个有利实施形式中规定，在压力主体与芯片之间，设置有硬的、特别是在芯片的中间空间上至少部分中断的层，以用于到芯片上的直接压力传递。该硬层具有比弹性层要高的弹性模量(特别是两倍大)，其中硬层用作保护层。具体来说，硬层还用来构造平面表面，特别是其中平均表面粗糙度小于10 μm，优选地小于1 μm，甚至更优选地小于100 nm，最优选地小于10 nm。硬层优选地构造为超硬层。优选材料是金属和陶瓷，特别是铁材料、非铁金属、硬金属、氮化物层、碳化物层、硼化物层和氧化物陶瓷。硬层沿接合方向B的厚度小于10 mm，更优选地小于5 mm，甚至更优选地小于2 mm，最最优选地小于500 μm，更为优选地小于100 μm。
有利地，按照另一个实施形式规定，压力主体具有固定位点，其布置在第一压力侧的周边，特别是采取优选环形凹槽的形式。这样，压力主体在保持主体上的节省空间的固定是可能的，其中由于在接合期间从保持主体直到要接合的芯片的可能热传递，沿接合方向B尽可能薄的压力传递设备的扩展方案是有利的。
压力传递设备的所述特征类似地适用于根据本发明的接合装置。
附图说明
通过优选示范实施例的以下描述并且根据附图，将得出本发明的其它优点、特征和细节。它们在以下附图中示出：
图1示出根据本发明的接合装置的示意侧视图，
图2a示出第一实施形式中根据本发明的的接合装置的示意详细视图，
图2b示出压力传递设备的根据本发明的另一个实施形式的示意视图，
图2c示出另一个实施形式中的根据本发明的压力传递设备的示意侧视图，
图3a示出根据本发明的接合装置的另一个实施形式的示意详细视图，
图3b示出另一个实施形式中根据本发明的压力传递设备的示意侧视图，以及
图3c示出另一个实施形式中根据本发明的压力传递设备的示意侧视图。
具体实施方式
相同或等效组件在附图中采用相同参考标号来标识。
图1示出接合装置的示意性并且高度简化表示，其具有壳体11，壳体11包围接合室16，该壳体11能够经由未示出的开口来装载和卸载，并且该开口能够采用未示出的门来封闭。在接合室16中，能够调整定义的大气压和温度，对其能够设置对应进料管线和排料管线或加热部件。特别是，保持主体9和/或容器10用作加热部件。
在接合室16的底板上，设置用于接纳产品衬底14的容器10，其中产品衬底的固定能够特别是通过真空通路、机械夹持或者通过静电进行。
产品衬底14由衬底12(其平放在容器10上并且固定到容器10)和芯片13(其暂时固定在衬底12上)组成，并且设置接合装置用于对其的永久固定。
在容器10上方，设置保持主体9，其中保持主体9能够相对于容器10、也就是沿X、Y和Z方向相对移动。保持主体9优选地还能够围绕X、Y和/或Z轴转动，以便平衡楔入故障或者改进相互之间表面的取向。相对移动优选地通过保持主体9的移动进行，同时容器10是刚性的或者没有任何自由度。
在将产品衬底14装载到接合室16中并且将压力传递设备1附连到保持主体9的下侧9u之后，压力传递设备1相对于产品衬底14来对齐并且降低，直到压力传递设备1邻接其侧面1u(其与产品衬底14相对)，并且通过沿接合方向B的移动的对应控制来将限定接合力施加到芯片13的芯片表面13o上。同时或者随后，将产品衬底14加热到接合温度。该过程由控制设备来控制。
图2a中详述压力传递设备1和产品衬底14，其中为了表示目的而使所示部分的关系是高度示意性的，以及特别是芯片13不是对应于真正事实。
在按照图2a的第一所示实施形式中，除了所有实施方式均具有的压力主体2之外，压力传递设备1还具有保持主体4，其经由采取多个夹在压力主体2和保持主体4的周边上的夹具的形式的固定部件8夹持到压力主体2。
在压力主体2与保持主体4之间，特别是整个表面地设置有滑动层3，通过其实现压力主体2对接合方向B的横向滑动移动。
压力主体2和保持主体4构造成特别是接近镜像的(在滑动层3上反射)。
压力传递设备1通过固定部件8、特别是夹具上成型的支臂8a来固定在接合装置的保持主体9上。作为替代或补充，保持主体4能够通过真空通路固定在保持主体9上。
固定部件8具有U形段8u，在其支臂之间实现与保持主体4的压力主体2的夹持。因此，U形段8u围绕压力主体2和保持主体4的周边的一部分。为了啮合U形段8u，在第一压力侧2o的压力主体2上布置固定位点17，特别是采取压力主体2的周边上的特别优选的环形凹槽的形式。在对接合方向B的横向，在固定位点设置余隙18，使得实现压力主体2对接合方向B的横向滑动移动。
U形段8u的相对支臂啮合保持主体4的对应固定位点，其中在这里优选地设置有没有余隙的固定。
压力元件5附连在背向滑动层3的压力主体2的第一压力侧2o上，确切地说在沿X和Y方向、因此沿第一压力侧2o的与衬底12上芯片13对应的位置上。压力元件5由弹性层6(其与芯片13之间的中间空间15分别对应被中断)和硬层7(其分别施加到弹性层6上)组成。同样，硬层在中间空间15的区域中与弹性层6类似地被中断，使得在压力施加到芯片13的情况下，对接合方向横向伸展的可能侧力为最小。
在压力施加到具有压力表面1u的芯片13的情况下，在这里在硬层7的表面7o上，其中压力元件5的重心5s分别以单独芯片13的重心13s为中心来对齐。压力元件5因压力主体2和衬底12的相似或相同热膨胀系数并且因压力主体2对接合方向B横向的在很大程度上无摩擦相对移动而完全跟随芯片13，使得没有引起横向位移和横向力。
图2b中，设置有简化固定部件8’，其中压力主体2和保持主体4的固定通过经修改的固定部件8’来实现，经修改的固定部件8’排他地固定在压力主体2的固定位点而不是保持主体4，使得实现沿接合方向在压力主体2与保持主体9之间的固定。具有余隙18的压力主体2和滑动层3的运动学是图2a中的运动学。因此，以更简单实施得到改变的压力传递设备1’，因为更简单实现固定部件8’和保持主体4’。
在按照图2c的实施形式中，省略保持主体4，并且滑动层3直接设置在压力主体2与保持主体9之间。得出改变的压力传递设备1”，其构造成比上述压力传递设备1、1’更为简单，因为能够省略保持主体4、4’，以及压力传递设备1”能够构造成更薄并且倘若保持主体9产生热量，更好地传递热量。
相反，在图3a所示的实施方式中，省略图2a至图2c所示的压力元件5，使得压力主体2的第一压力侧2o承担硬层7的功能。在压力主体2与保持主体4之间设置弹性层6’。在弹性层6’与压力主体2之间的界面上，设置滑动层3，而固定部件8对应于图2a的固定部件8。因此，得到压力传递设备1”’的改变实施方式。
在这个实施方式中第一压力侧2o充当压力表面1u’，通过其将压力施加到芯片13的芯片表面13o。
在图3b所示的实施方式中，对应于图2b所示的实施方式，设置固定部件8’，其省略与保持主体4’的啮合。因此，得到压力传递设备1””的改变实施方式。
在图3c所示的压力传递设备1””’的实施中，对应图2c所述的实施省略保持主体4、4’保持主体4、4’。相应地，还使用与固定部件8”类似的固定部件。
参考标号列表
1, 1’, 1", 1"', 1"" 压力传递设备
1u, 1u’ 压力表面
2 压力主体
2o 第一压力侧
3 滑动层
4,4' 保持主体
5 压力元件
6, 6’ 弹性层
7 硬层
8, 8', 8" 固件部件
8a 支臂
8u u形段
9 保持主体
9u 下侧
10 容器
11 壳体
12 衬底
13 芯片
13o 芯片表面
13s 重心
14 产品衬底
15 中间空间
16 接合室
17 固定位点
18 余隙
接合方向B

Claims (7)

1.一种用于将多个芯片(13)接合到衬底(12)的压力传递设备，具有：
- 压力主体(2)，用于将沿接合方向(B)起作用的接合力施加到芯片(13)，压力主体(2)具有第一压力侧(2o)和与所述第一压力侧(2o)相对并且对接合方向(B)横向伸展的第二压力侧，
- 固定部件(8，8’，8”)，能够附连到所述压力传递设备(1)的周边，用于将所述压力传递设备(1)沿所述接合方向(B)固定在保持主体(9)上，以及
- 滑动层(3)，用于压力主体(2)对接合方向(B)的横向滑动移动，
其特征在于，所述固定部件(8，8’，8”)
a)对所述接合方向(B)横向地构造为弹性的，和/或
b)构造为用于沿所述保持主体(9)的方向夹持所述压力主体(2)的夹具，具有滑动层(3)布置在其之间。
2.如权利要求1所述的压力传递设备，其中，设有至少沿所述接合方向(B)是弹性的并且在所述芯片(13)的中间空间(15)上至少被中断的层(6)以用于压力平衡。
3.如以上权利要求中的任一项所述的压力传递设备，其中，在所述压力主体(2)与所述芯片(13)之间，设有在所述芯片(13)的中间空间(15)上被中断的硬层(7)以用于到所述芯片(13)的直接压力传递。
4.如权利要求1-2中的任一项所述的压力传递设备，其中，所述压力主体(2)具有布置在所述第一压力侧(2o)的周边、采取环形凹槽形式的固定位点。
5.一种用于将多个芯片(13)接合到衬底(12)的接合装置，具有：
-如以上权利要求中任一项所述的压力传递设备(1)，
-所述保持主体(9)，
-容器(10)，用于接纳所述衬底(12)，
-加热部件，用于加热所述芯片(13)和所述衬底(12)，
-驱动部件，用于通过所述保持主体(9)沿所述接合方向(B)的移动来产生所述接合力。
6.一种用于采用如权利要求1所述的压力传递设备(1)或者如权利要求5所述的接合装置将多个芯片(13)接合在衬底(12)上的方法。
7.如权利要求6所述的方法，其中，所述压力主体(2)、关于材料和/或尺寸，选择成使得它至少沿所述接合方向(B)的横向的热膨胀性质对应于所述衬底(12)的热膨胀性质。
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