CN104253023B - Substrate processing apparatus - Google Patents
Substrate processing apparatus Download PDFInfo
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- CN104253023B CN104253023B CN201410302503.4A CN201410302503A CN104253023B CN 104253023 B CN104253023 B CN 104253023B CN 201410302503 A CN201410302503 A CN 201410302503A CN 104253023 B CN104253023 B CN 104253023B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention provides a substrate processing apparatus, comprising a first chamber used for processing a substrate using a first processing liquid; and a second chamber configured behind the first chamber and used for processing the substrate using a second processing liquid. The first chamber is provided with a first housing, a first transmission unit conveying the substrate in a first direction, and a first nozzle unit having a first length consistent with the first direction and provided with a first nozzle supplying the first processing liquid for the substrate. The second chamber is provided with a second housing, a second transmission unit conveying the substrate in the first direction, and a second nozzle unit having a first length consistent with the first direction and provided with a second nozzle supplying the second processing liquid for the substrate. The first nozzle and the second nozzle are configured to break away from a first line mutually.
Description
Technical field
The present invention relates to be used to process the substrate board treatment of substrate.
Background technology
The polluters such as granule (Particle), organic pollution and metal pollutant in the remained on surface of substrate are significantly
Affect the characteristic and productivity ratio of semiconductor element.Therefore, in semiconductor fabrication sequence, removal is attached to the various of substrate surface
The matting of polluter is critically important, and in step before and after the constituent parts operation of manufacture quasiconductor, enforcement is carried out to substrate
The operation of cleaning treatment.Generally, the cleaning of substrate includes：Chemical treatments operation, is removed using chemicals and is remained on substrate
Metallic foreign body, organic substance or granule etc.；Washing procedure, the chemicals remained on substrate are removed using pure water；And it is dry
Drying process, using nitrogen etc. come dry substrate.
Fig. 1 illustrates of the substrate board treatment for performing common chemical treatments operation.With reference to Fig. 1, adjacent
Within the chamber, the nozzle for supplying chemicals is configured along base plate transfer direction permutation.Therefore, in the region of substrate, correspondence
In the region of nozzle, the cleaning uniformity interregional with other is different.
The content of the invention
It is an object of the present invention to provide the substrate board treatment of the cleaning efficiency of substrate can be improved.
Also, it is an object of the present invention to provide when washing procedure is carried out, nozzle can be effectively transmitted to substrate
Impact force substrate board treatment.
The technical problem of the present invention is not limited to the problems referred to above, and those skilled in the art can be according to this
Description and accompanying drawing are expressly understood that the other problemses not referred to.
The present invention provides substrate board treatment.Substrate board treatment according to an embodiment of the invention includes：First chamber,
It is processed substrate with the first treatment fluid, and second chamber, and it is configured at the rear of above-mentioned first chamber, uses at second
Reason liquid is processed aforesaid substrate；Above-mentioned first chamber has：First shell, the first supply unit, it is along a first direction
Conveying aforesaid substrate, and first jet unit, its length direction is consistent with above-mentioned first direction, and with to aforesaid substrate
Supply the first jet of above-mentioned first treatment fluid；Above-mentioned second chamber has：Second housing, the second supply unit, it is along
One direction conveys aforesaid substrate, and second nozzle unit, and its length direction is consistent with above-mentioned first direction, and with upwards
State the second nozzle that substrate supplies above-mentioned second processing liquid；Above-mentioned first jet and above-mentioned second nozzle are configured to de- each other
From a straight line.
Above-mentioned first jet and above-mentioned second nozzle are respectively equipped with multiple；Above-mentioned first jet when observing from top along
Second direction perpendicular to above-mentioned first direction is arranged；Above-mentioned second nozzle is arranged when observing from top along above-mentioned second direction
Row.
Multiple above-mentioned first jets and multiple above-mentioned second nozzles respectively to be separated from each other prescribed distance in the way of arrange.
Above-mentioned first treatment fluid can be identical with above-mentioned second processing liquid.
Above-mentioned first treatment fluid can be chemicals.
Aforesaid substrate processing meanss may also include the washing chamber positioned at the rear of above-mentioned second chamber, the washing chamber tool
Have：3rd shell, the 3rd supply unit, it conveys aforesaid substrate, and supplies nozzle for liquid along above-mentioned first direction, and it is to above-mentioned
The top supply cleaning mixture of substrate.
Above-mentioned confession nozzle for liquid can have with the outlet that downward-sloping mode is arranged Jie Jin above-mentioned second chamber.
The length direction of above-mentioned confession nozzle for liquid can be consistent with above-mentioned first direction.
Above-mentioned confession nozzle for liquid can be provided with multiple.
Above-mentioned confession nozzle for liquid can spray above-mentioned cleaning mixture to spray (spray) mode.
Above-mentioned washing chamber may also include：Positive knife, it is configured at above-mentioned 3rd shell in the mode adjacent with inflow entrance
Inside, with the outlet that downward-sloping mode is arranged with the direction away from above-mentioned second housing, and to above-mentioned
Substrate sprays above-mentioned cleaning mixture；And reverse knife, it is compared positive knife and is configured at downstream, with Jie Jin above-mentioned inflow entrance
And the outlet that downward-sloping mode is arranged, and spray above-mentioned cleaning mixture to aforesaid substrate.
The rear that above-mentioned reverse knife can be configured at above-mentioned positive knife in the mode adjacent with above-mentioned positive knife.
The length direction of above-mentioned positive knife and above-mentioned reverse knife can be consistent with second direction respectively, and the second direction is vertical
In above-mentioned first direction.
Above-mentioned positive knife and above-mentioned reverse knife can be located at trip more top than above-mentioned confession nozzle for liquid in the inside of above-mentioned 3rd shell.
Above-mentioned positive knife and above-mentioned reverse knife can respectively have the outlet of seam shape.
Above-mentioned shell may also include：Next door, it is between above-mentioned reverse knife and above-mentioned confession nozzle for liquid under above-mentioned shell
Face vertically extends, by the above-mentioned supply unit of ratio of the inside of above-mentioned shell on the lower portion region division be first area and second
Region, the first discharge pipe, it is connected with above-mentioned first area, and the second discharge pipe, and it is connected with above-mentioned second area；
Above-mentioned first area is the region corresponding with above-mentioned positive knife and above-mentioned reverse knife, and above-mentioned second area is and the spray of above-mentioned feed flow
The corresponding region of mouth.
Aforesaid substrate processing meanss also include：Flow container, its storage aforesaid liquid, the first supply line, its above-mentioned flow container of connection
With above-mentioned positive knife, the second supply line, it connects above-mentioned flow container and above-mentioned reverse knife, and the 3rd supply line, and its connection is above-mentioned
Flow container and above-mentioned confession nozzle for liquid；Above-mentioned second discharge pipe connects above-mentioned second area and above-mentioned flow container, reclaims above-mentioned second area
The above-mentioned liquid of inside is simultaneously reused.
Also, the present invention provides the substrate board treatment of another embodiment.In the substrate board treatment, multiple chamber edges
First direction arrangement；Be provided with multiple nozzles in the inside of above-mentioned multiple chambers, the length direction of above-mentioned multiple nozzles respectively with
Above-mentioned first direction is consistent, and supplies treatment fluid to aforesaid substrate；When observing above-mentioned multiple nozzles from top, above-mentioned multiple sprays
Mouth is configured to depart from a straight line between adjacent above-mentioned chamber.
Above-mentioned multiple nozzles can be arranged when observing from top along above-mentioned second direction.
Above-mentioned treatment fluid can be chemicals.
The rear of the last chamber for being configured in above-mentioned first direction in above-mentioned multiple chambers can also be provided with washing cavities
Room；Above-mentioned washing chamber can have the confession nozzle for liquid that cleaning mixture is supplied to the top of aforesaid substrate.
Above-mentioned confession nozzle for liquid can be so that with the inflow entrance Jie Jin above-mentioned inside the shell, downward-sloping mode is arranged.
Above-mentioned washing chamber may also include：Positive knife, it has with the downward-sloping mode away from above-mentioned chamber
The outlet of setting, and spray above-mentioned cleaning mixture to aforesaid substrate；And reverse knife, it is compared above-mentioned positive knife and is configured at down
Trip, with the outlet that downward-sloping mode is arranged Jie Jin above-mentioned chamber, and sprays above-mentioned washing to aforesaid substrate
Wash liquid.
Above-mentioned positive knife compares above-mentioned confession nozzle for liquid and may be disposed at upstream with above-mentioned reverse knife.
According to one embodiment of the invention, it is possible to provide the substrate board treatment that cleaning efficiency is improved.
Also, according to one embodiment of the invention, it is possible to provide when washing procedure is carried out, can be to the effective transmission nozzle of substrate
Impact force substrate board treatment.
The effect of the present invention is not limited to the effect above, and those skilled in the art can be according to this explanation
Book and accompanying drawing are expressly understood that other effects not referred to.
Description of the drawings
Fig. 1 is the accompanying drawing of the substrate board treatment for illustrating conventional.
Fig. 2 is the sectional view for illustrating the substrate board treatment according to a currently preferred embodiment.
Fig. 3 is the accompanying drawing of the first chamber and second chamber that Fig. 2 is observed from top.
Fig. 4 is the axonometric chart of the first supply unit for illustrating Fig. 2.
Fig. 5 is the accompanying drawing of the washing chamber for illustrating Fig. 2.
Fig. 6 is the accompanying drawing for illustrating positive knife and reverse knife.
Fig. 7 is the accompanying drawing of the washing chamber that Fig. 5 is observed from top.
Fig. 8 is to illustrate the accompanying drawing that the process of chemicals is removed in conventional common washing chamber.
Fig. 9 and Figure 10 are to illustrate that the washing chamber in Fig. 5 removes the accompanying drawing of the process of chemicals.
Figure 12 is the accompanying drawing of the washing chamber for illustrating another embodiment.
Figure 13 is the accompanying drawing of the washing chamber for illustrating another embodiment.
Figure 14 is the accompanying drawing of the substrate board treatment for illustrating another embodiment.
Figure 15 is the accompanying drawing of the substrate board treatment for illustrating another embodiment.
Specific embodiment
The embodiment recorded in this manual is to clearly state the present invention to one skilled in the art of the present invention
Thought and provide, therefore the present invention is not limited to the embodiment described in this specification, and the scope of the present invention should be interpreted that
Including the modification or variation of the thought without departing from the present invention.Also, the term and accompanying drawing for using in this manual is use
There is provided in the convenient explanation present invention, therefore the present invention is not limited to the term and accompanying drawing used in this specification.Also,
During illustrating the present invention, be judged as that the specific description of associated known function or structure can obscure the present invention will
In the case of purport, detail explanation can be omitted.
In the present embodiment, it is used in as a example by the substrate S of flat display panel manufacture and illustrates substrate S.But, unlike this,
Substrate S can be the chip for being used in semiconductor chip manufacture.
Hereinafter, referring to the drawings, embodiments of the invention are described in detail.
The present invention is provided to process the device of substrate.Fig. 2 is the processing substrate for illustrating a currently preferred embodiment
The accompanying drawing of device 1000.Fig. 3 is to observe the top view of the first chamber 100 of Fig. 2 and the inside of second chamber 200 from top.The
One chamber 100 and second chamber 200 can perform various operations, but following illustrates to etching work procedure.
With reference to Fig. 2, substrate board treatment 1000 has first chamber 100, second chamber 200 and washing chamber 300.Its
In, the direction that first chamber 100, second chamber 200 and washing chamber 300 are arranged is referred to as first direction X.Also, from top
During observation, the direction perpendicular to first direction X is referred to as second direction Y, hangs down with the two directions of second direction Y with first direction X
Straight direction is referred to as third direction Z.Inflow entrance 12 and flow export 14 are provided with the inside of each chamber 100,200,300.Flow into
Mouth 12 is formed at the one side of shell 110,210,310.Substrate S flows into the inside of shell 110,210,310 by inflow entrance 12.
Flow export 14 is provided with the opposite side opposed with this.Substrate S is flowed out by flow export 14 from shell 110,210,310.
First chamber 100 performs the first etching work procedure.First chamber 100 has the first shell 110, first jet unit
120 and first supply unit 150.First shell 110 provides the space for performing the first etching work procedure.
First jet unit 120 supplies the first treatment fluid on substrate S.First jet unit 120 can be set to multiple first
Nozzle 120a, 120b, 120c.The length direction of each first jet 120a, 120b, 120c is consistent with first direction X.First
Nozzle 120a, 120b, 120c are configured at the top of axle.With reference to Fig. 3, when observing first jet 120a, 120b, 120c from top,
First jet 120a, 120b, 120c are arranged along second direction Y.As shown in figure 3, multiple first jet 120a, 120b, 120c
Can to be separated from each other prescribed distance in the way of arrange.Spray first in first jet 120a, 120b, 120c to the top of substrate S
Treatment fluid.Used as one, the first treatment fluid can be chemicals.
Fig. 4 is the axonometric chart of the first supply unit 150 for illustrating Fig. 2.Along a first direction X is defeated for first supply unit 150
Send substrate S.In operation chamber 100, between 200,300, and in operation chamber 100,200,300, the first supply unit 150 makes base
Plate S X movements along a first direction.With reference to Fig. 4, the first supply unit 150 has multiple axles 160, conveying roller 170 and drive division
180。
The X arrangements along a first direction of axle 160.The length direction of each axle 160 is consistent with second direction Y.Axle 160 is mutual
Abreast configure.Axle 160 is located at from the position adjacent with inflow entrance 12 to the position adjacent with flow export 14.In each axle 160,
Along the multiple conveying rollers 170 of its length direction secure bond.Axle 160 is rotated on the basis of central shaft by drive division 180.
Multiple conveying rollers 170 are provided with each axle 160.The bottom surface of the supporting substrate S of conveying roller 170.In conveying roller 170
Heart axle is formed with hole, and axle 160 is inserted in hole.Conveying roller 170 rotates together with axle 160.
Drive division 180 has belt wheel 182, band 184 and motor 186.Belt wheel 182 is respectively with the two ends of each axle 160 to knot
Close.In combination with mutually different axle 160, and the belt wheel 182 being adjacent to is connected by band 184.In belt wheel 182
Motor 186 is combined with any one, said motor 186 rotates belt wheel.By belt wheel as above 182, band 184 and horse
Up to 186 assembly, axle 160 and conveying roller 170 rotate, the lower surface of substrate S with the state that contacts with conveying roller 170 along
Axle 160 moves linearly.Each horizontal arrangement of axle 160, and substrate S can be transferred with horizontality.Selectively, each axle 160
One end and the other end can be arranged with different height, thus substrate S is transferred in a slanted state.
Second chamber 200 is configured at the rear adjacent with first chamber 100.Second chamber 200 performs the second etching work procedure.
Second chamber 200 has second housing 210, the second supply unit 250 and second nozzle unit 220.Second housing 210 provides use
In the space for performing the second etching work procedure.Second supply unit 250 has or class roughly the same with above-mentioned first supply unit 150
As structure and function.
Second nozzle unit 220 supplies second processing liquid on substrate S.Second nozzle unit 220 can be set to multiple second
Nozzle 220a, 220b.The length direction of second nozzle 220a, 220b is consistent with first direction X.Second nozzle 220a, 220b
It is configured at the top of axle.Referring again to Fig. 3, from top second nozzle 220a, 220b, above-mentioned second nozzle 220a, 220b are observed
Along the arrangement of second direction Y.Second nozzle 220a, 220b and first jet 120a, 120b, 120c depart from each other straight line
Configuration.Multiple second nozzle 220a, 220b can be arranged mutually in the way of separation prescribed distance.Second nozzle 220a, 220b
Second processing liquid is sprayed to the top of substrate S.Second processing liquid can be identical with the first treatment fluid.As one, second processing liquid
Can be chemicals (chemical).Preferably, second processing liquid can be and the different types of chemicals of the first treatment fluid.
Fig. 5 illustrates of washing chamber 300.Fig. 6 is the accompanying drawing for illustrating positive knife 320 and reverse knife 330.Fig. 7 is to show
Go out from top to observe the accompanying drawing of the washing chamber 300 of Fig. 5.Washing chamber 300 is configured at the rear adjacent with second chamber 200.
The chemicals on substrate S are remained in washing chamber 300 pairs to wash.With reference to Fig. 5, washing chamber 300 has the 3rd shell
310th, the 3rd supply unit 350, positive knife 320, reverse knife 330 and for nozzle for liquid 340.
3rd shell 310 provides the space for performing washing procedure.3rd shell 310 and the 3rd supply unit 350 have
There is the structure and function roughly the same or similar with the first shell 110 of above-mentioned first chamber 100 and the first supply unit 150.
Positive knife 320 is to jet washing liquid on substrate S.Used as one, cleaning mixture can be pure water.With reference to Fig. 5, positive knife
320 inside that washing chamber 300 can be configured in the mode adjacent with inflow entrance 12.As shown in fig. 7, the length of positive knife 320
Degree direction can be consistent with second direction Y.Positive knife 320 has outlet, and above-mentioned outlet is with away from second housing 200
And downward-sloping mode is arranged.Positive knife 320 supplies pure water on substrate S, releases come X along a first direction and remains in substrate
Chemicals on S.
Reversely knife 330, compares positive knife 320 and is configured at downstream.Reversely knife 330, is matched somebody with somebody in the mode adjacent with positive knife 320
It is placed in the rear of positive knife 320.Reversely the length direction of knife 330 can be consistent with second direction Y.Reversely knife 330 is on substrate S
Jet washing liquid.Used as one, cleaning mixture can be pure water.Reversely knife 330 has outlet, and above-mentioned outlet is with close stream
Entrance 12 and downward-sloping mode is arranged.
The inside of the 3rd shell 300 is configured at for nozzle for liquid 340.For nozzle for liquid 340, positive knife 320 and reverse knife are compared
330 are configured at downstream.Cleaning mixture is supplied for nozzle for liquid 340 to the top of substrate S.Used as one, cleaning mixture can be pure water.For
The length direction of nozzle for liquid 340 is consistent with first direction X.With reference to Fig. 7, can be provided with multiple for nozzle for liquid 340.From top observation
Multiple confession nozzle for liquid 340, above-mentioned multiple confession nozzle for liquid 340 are configured along second direction Y.Multiple confession nozzle for liquid 340 can be with phase
The mode for mutually separating prescribed distance is configured.There is outlet for nozzle for liquid 340, above-mentioned outlet is with close second chamber
200 and downward-sloping mode is arranged.By obliquely supplying pure water on substrate S, from substrate S pure water is released.Thus, energy
Enough prevent from remaining pure water on substrate S.Therefore, can be directly delivered on substrate S for the impact force of nozzle for liquid 340.Thus, energy
It is enough effectively to carry out washing process.
Fig. 8 illustrates conventional common chemicals removal process.Conventional washing chamber 300 generally includes positive knife 320
With for nozzle for liquid 340.Fig. 9 and Figure 10 illustrate the process that chemicals are removed with the washing chamber 300 of Fig. 5.As shown in figure 8, only setting
Have positive knife 320 and for nozzle for liquid 340 in the case of, because of positive knife 320, along a first direction X is pushed away the chemicals on substrate S
Go out.Therefore, when cleaning mixture is supplied on substrate S for nozzle for liquid 340, because of the chemical layer for thickly being formed, and it is delivered to base
The impact force of the confession nozzle for liquid 340 on plate S can be reduced.Also, the chemicals remained on substrate S and the supply on substrate S
Cleaning mixture mixes and remains, so as to carry out the etching of substrate S.Unlike this, with reference to Fig. 9, the chemicals released by positive knife 320
Can not X flowings along a first direction by reverse knife 330.Therefore, the chemical layer on substrate S is thinning, so as to supply nozzle for liquid
340 effectively can transmit impact force on substrate S.Also, the quantitative change of the residual chemical mixed with cleaning mixture on substrate S
It is few, and the etched amounts of substrate S can be reduced.As shown in Figure 10, substrate S continues on first direction X conveyings, and chemicals are from base
Separate and be removed on plate S.
Figure 11 illustrates the washing chamber 400 of another embodiment.Washing chamber 400 has flow container 405, shell 410, positive knife
420th, the first supply line 425, reverse knife 430, the second supply line 435, for nozzle for liquid 440, the 3rd supply line 445 and supply unit
450.Positive knife 420, reverse knife 430, there is positive knife 320, the reverse knife with Fig. 5 for nozzle for liquid 440 and supply unit 450
330th, for structure and function that the supply unit 350 of nozzle for liquid 340 and the 3rd is roughly the same or similar.
Flow container 405 is used for storing liquid.First supply line 425 is used to connect flow container 405 and positive knife 420.Second supply line
435 are used to connect flow container 405 and reverse knife 430.3rd supply line 435 is used to connect flow container 405 and for nozzle for liquid 440.
Shell 410 has next door 412, the first discharge pipe 414 and the second discharge pipe 416.Next door 412 is in the He of reverse knife 430
For between nozzle for liquid 440, vertically extending from below shell 410.Next door 412 is by the ratio supply unit 450 inside shell 410
On the lower the region division in portion is first area D1 and second area D2.First area D1 is and positive knife 420 and the reverse phase of knife 430
Corresponding region.Liquid used in first area D1 is processed to the outside discharge of shell 410 in operation.Second area D2 be with
For the corresponding region of nozzle for liquid 440.Second area D2 recovery process process used in liquid and reuse.First discharge pipe
414 are connected with first area D1.First discharge pipe 414 makes the liquid inside the D1 of first area discharge to the outside of shell 410.
Second discharge pipe 416 is connected with second area D2.Used as one, as shown in figure 11, the second discharge pipe 416 can connect the secondth area
Domain D2 and flow container 405.The liquid that reclaimed inside second area D2 by the second discharge pipe 416 is simultaneously reused.Optionally, such as
Shown in Figure 12, positive knife 420, reverse knife 430 and the inside of adjacent multiple chambers 400,500 is respectively arranged on for nozzle for liquid 440.
Figure 13 and Figure 14 are the accompanying drawing of the substrate board treatment 2000 for illustrating another embodiment.Figure 15 is to illustrate another enforcement
The accompanying drawing of the substrate board treatment 3000 of example.Substrate board treatment 2000 has multiple chambers 1100,1200,1300,1400.Ginseng
According to Figure 13 and Figure 14, first chamber 1100, second chamber 1200, the 3rd chamber 1300 and the 4th chamber 1400 are along a first direction
X is configured.Multiple nozzles are respectively equipped with first chamber 1100, second chamber 1200, the 3rd chamber 1300 and the 4th chamber 1400.
In first jet 1120 and the second nozzle 1220 in second chamber 120 located at the inside of first chamber 1100, have
With the first jet 120 and the same or similar structure of second nozzle 220 and function of Fig. 3.Located at the inside of the 3rd chamber 1300
The 3rd nozzle 1320 have and located at the same or similar structure of first jet 1120 and work(of the inside of first chamber 1100
Energy.The nozzle of the inside of adjacent chamber 1100,1200,1300,1400 is configured at from top observation, nozzle departs from each other one
Straight line configuration.With reference to Fig. 9, first jet 1120a, 1120b, 1120c and second nozzle 1220a, 1220b, 1220c depart from always
Line is configured, and second nozzle 1220a, 1220b, 1220c and the 3rd nozzle 1320a, 1320b, 1320c depart from a straight line configuration.Can
It is arranged in unlike this such as Figure 15.
In above-mentioned example, to carrying out washing procedure after the etching work procedure of substrate S in case of illustrate.But, with
This is different, and the period of operation and the quantity of operation chamber can be with differences.Also, in above-mentioned example, nozzle unit is located at and continuously sets
Illustrate in case of the inside of the device put.But, unlike this, steam part or brush portion can be also provided with to substrate S
Part etc..The present invention for the above-described, for those skilled in the art, without departing from the skill of the present invention
Various modifications, replacement and deformation can be carried out in the range of art thought, therefore the present invention is not limited to above-described embodiment and accompanying drawing.
Also, the embodiment for illustrating in the description is not intended to what is limited, and all or part of of each embodiment can be optionally
Combination is constituted, can carry out various modifications.
The explanation of reference
100：First chamber 200：Second chamber
300：Washing chamber 120：First jet
220：Second nozzle 320：Positive knife
330：Reverse knife 340：For nozzle for liquid
12：Inflow entrance 14：Flow export
Claims (22)
1. a kind of substrate board treatment, it is characterised in that include：
First chamber, it is processed substrate with the first treatment fluid；
Second chamber, it is configured at the rear of above-mentioned first chamber, and aforesaid substrate is processed with second processing liquid；
Above-mentioned first chamber has：
First shell,
First supply unit, it conveys along a first direction aforesaid substrate, and
First jet unit, its length direction is consistent with above-mentioned first direction, and with to aforesaid substrate supply above-mentioned first
The first jet for the treatment of fluid；
Above-mentioned second chamber has：
Second housing,
Second supply unit, it conveys aforesaid substrate along above-mentioned first direction, and
Second nozzle unit, its length direction is consistent with above-mentioned first direction, and with to aforesaid substrate supply above-mentioned second
The second nozzle for the treatment of fluid；
Above-mentioned first jet and above-mentioned second nozzle are configured to depart from a straight line each other；
Aforesaid substrate processing meanss also include the washing chamber at the rear for being located at above-mentioned second chamber,
The washing chamber has：3rd shell；3rd supply unit, it conveys aforesaid substrate along above-mentioned first direction；Feed flow
Nozzle, it supplies cleaning mixture to the top of aforesaid substrate；Positive knife, it is configured at the above-mentioned 3rd in the mode adjacent with inflow entrance
The inside of shell, with the outlet that downward-sloping mode is arranged away from above-mentioned second housing, and to above-mentioned base
Plate sprays above-mentioned cleaning mixture；And reverse knife, it is compared positive knife and is configured at downstream, with Jie Jin above-mentioned inflow entrance
The outlet that downward-sloping mode is arranged, and spray above-mentioned cleaning mixture to aforesaid substrate.
2. substrate board treatment according to claim 1, it is characterised in that
Above-mentioned first jet and above-mentioned second nozzle are respectively equipped with multiple；
Above-mentioned first jet is arranged when observing from top along the second direction perpendicular to above-mentioned first direction；
Above-mentioned second nozzle is arranged when observing from top along above-mentioned second direction.
3. substrate board treatment according to claim 2, it is characterised in that
Multiple above-mentioned first jets and multiple above-mentioned second nozzles respectively to be separated from each other prescribed distance in the way of arrange.
4. substrate board treatment according to claim 1, it is characterised in that
Above-mentioned first treatment fluid and above-mentioned second processing liquid phase are same.
5. substrate board treatment according to claim 4, it is characterised in that
Above-mentioned first treatment fluid is chemicals.
6. substrate board treatment according to claim 1, it is characterised in that
Above-mentioned confession nozzle for liquid has with the outlet that downward-sloping mode is arranged Jie Jin above-mentioned second chamber.
7. substrate board treatment according to claim 1, it is characterised in that
The length direction of above-mentioned confession nozzle for liquid is consistent with above-mentioned first direction.
8. substrate board treatment according to claim 1, it is characterised in that
Above-mentioned confession nozzle for liquid is provided with multiple.
9. substrate board treatment according to claim 1, it is characterised in that
Above-mentioned confession nozzle for liquid sprays above-mentioned cleaning mixture with spray regime.
10. substrate board treatment according to claim 1, it is characterised in that
Above-mentioned reverse knife is configured at the rear of above-mentioned positive knife in the mode adjacent with above-mentioned positive knife.
11. substrate board treatments according to claim 1, it is characterised in that
The length direction of above-mentioned positive knife and above-mentioned reverse knife is consistent with second direction respectively, and the second direction is perpendicular to above-mentioned
First direction.
12. substrate board treatments according to claim 1, it is characterised in that
Above-mentioned positive knife and above-mentioned reverse knife are located at trip more top than above-mentioned confession nozzle for liquid in the inside of above-mentioned 3rd shell.
13. substrate board treatments according to claim 1, it is characterised in that
Above-mentioned positive knife and above-mentioned reverse knife have respectively the outlet of seam shape.
14. substrate board treatments according to claim 1, it is characterised in that
Above-mentioned shell also includes：
Next door, it vertically extends between above-mentioned reverse knife and above-mentioned confession nozzle for liquid from below above-mentioned shell, will be above-mentioned outer
The region division in the above-mentioned supply unit of ratio of the inside of shell portion on the lower is first area and second area,
First discharge pipe, it is connected with above-mentioned first area, and
Second discharge pipe, it is connected with above-mentioned second area；
Above-mentioned first area is the region corresponding with above-mentioned positive knife and above-mentioned reverse knife, and above-mentioned second area is and above-mentioned confession
The corresponding region of nozzle for liquid.
15. substrate board treatments according to claim 14, it is characterised in that
Also include：
Flow container, its above-mentioned cleaning mixture of storage,
First supply line, it connects above-mentioned flow container and above-mentioned positive knife,
Second supply line, it connects above-mentioned flow container and above-mentioned reverse knife, and
3rd supply line, it connects above-mentioned flow container and above-mentioned confession nozzle for liquid；
Above-mentioned second discharge pipe connects above-mentioned second area and above-mentioned flow container, reclaims liquid inside above-mentioned second area and again
Use.
A kind of 16. substrate board treatments, it is characterised in that
Multiple chambers are arranged along a first direction；
Be provided with multiple nozzles in the inside of above-mentioned multiple chambers, the length direction of above-mentioned multiple nozzles respectively with above-mentioned first direction
It is consistent, and supply treatment fluid to aforesaid substrate；
When observing above-mentioned multiple nozzles from top, above-mentioned multiple nozzles are configured to depart from a straight line between adjacent above-mentioned chamber；
The rear of last chamber in above-mentioned multiple chambers, to be configured in above-mentioned first direction is additionally provided with washing chamber；
Above-mentioned washing chamber has the confession nozzle for liquid that cleaning mixture is supplied to the top of aforesaid substrate,
Above-mentioned washing chamber also includes：Positive knife, its have with away from above-mentioned chamber what downward-sloping mode was arranged
Outlet, and spray above-mentioned cleaning mixture to aforesaid substrate；And reverse knife, it is compared above-mentioned positive knife and is configured at downstream, has
With the outlet that downward-sloping mode is arranged with close above-mentioned chamber, and above-mentioned cleaning mixture is sprayed to aforesaid substrate.
17. substrate board treatments according to claim 16, it is characterised in that
Above-mentioned multiple nozzles are arranged when observing from top respectively along the second direction perpendicular to above-mentioned first direction.
18. substrate board treatments according to claim 16, it is characterised in that
Above-mentioned treatment fluid is chemicals.
19. substrate board treatments according to claim 16, it is characterised in that
Above-mentioned confession nozzle for liquid has with the outlet that downward-sloping mode is arranged Jie Jin above-mentioned chamber.
20. substrate board treatments according to claim 16, it is characterised in that
Above-mentioned confession nozzle for liquid sprays above-mentioned cleaning mixture with spray regime.
21. substrate board treatments according to claim 16, it is characterised in that
Above-mentioned positive knife compares above-mentioned confession nozzle for liquid and is arranged at upstream with above-mentioned reverse knife.
22. substrate board treatments according to claim 16, it is characterised in that
Above-mentioned positive knife and above-mentioned reverse knife have respectively the outlet of seam shape.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0074542 | 2013-06-27 | ||
| KR20130074542 | 2013-06-27 | ||
| KR1020130104069A KR20150001569A (en) | 2013-06-27 | 2013-08-30 | Substrate treating apparatus |
| KR10-2013-0104069 | 2013-08-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104253023A CN104253023A (en) | 2014-12-31 |
| CN104253023B true CN104253023B (en) | 2017-05-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410302503.4A Active CN104253023B (en) | 2013-06-27 | 2014-06-27 | Substrate processing apparatus |
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| Country | Link |
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| CN (1) | CN104253023B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101055833A (en) * | 2006-04-12 | 2007-10-17 | 东京应化工业株式会社 | Substrate processing apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4223121B2 (en) * | 1998-06-11 | 2009-02-12 | 日本ミクロン株式会社 | Shower jet apparatus and shower jet method for electronic device |
| KR100924931B1 (en) * | 2007-11-07 | 2009-11-05 | 세메스 주식회사 | Cleaning device and method of cleaning substrate |
| JP5334216B2 (en) * | 2011-10-28 | 2013-11-06 | 株式会社Ｎｓｃ | Manufacturing method of glass substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101055833A (en) * | 2006-04-12 | 2007-10-17 | 东京应化工业株式会社 | Substrate processing apparatus |
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| CN104253023A (en) | 2014-12-31 |
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