CN106065475A - Etaching device - Google Patents
Etaching device Download PDFInfo
- Publication number
- CN106065475A CN106065475A CN201610249047.0A CN201610249047A CN106065475A CN 106065475 A CN106065475 A CN 106065475A CN 201610249047 A CN201610249047 A CN 201610249047A CN 106065475 A CN106065475 A CN 106065475A
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- China
- Prior art keywords
- running roller
- processed object
- support member
- etaching device
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The open a kind of Etaching device of the present invention.Etaching device according to one embodiment of the invention is as etching the Etaching device of processed object, including chamber, it is provided that for performing the space of described etching；More than one ejection section, is positioned at described chamber, and described processed object is sprayed etching solution；Multiple transfer running rollers, are used for making described processed object move；Sucting, for sucking the etching solution of the upper surface of described processed object, wherein, described sucting includes more than one suction tube, described transfer running roller comprises rotary shaft and multiple support members of the length direction formation along described rotary shaft respectively, and described suction tube lays respectively at the support member of a transfer running roller and adjacent in the interval between the support member of the adjacent transfer running roller of one transfer running roller.
Description
Technical field
Embodiments of the invention relate to a kind of Etaching device, can either thoroughly prevent in particular to one
Only converge (puddling) phenomenon, the Etaching device that the traveling of flexible thin substrate is obstructed will not be made again.
Background technology
Generally, etching (etching) is a kind of pattern form processing method, and it is at material to be dealt with
On the surface of (such as tellite), required part is covered (masking) and process it
After, the shape needed for remaining part spraying chemicals (such as etching solution) being formed by nozzle,
The method is widely used recently in semiconductor fabrication process.
The quality of the product produced according to this processing method generally fills with etching solution and etching
It is equipped with pass.Specifically, nozzle in the kind of etching solution, temperature, concentration etc. and Etaching device
Shape, number, size, be spaced, arrange, various condition such as material translational speed will act as erosion
Carve the variable of quality.Additionally, the etching solution sprayed by nozzle directly contacts material (injection etching)
Situation and be not directly contacted with material and the etching solution that remained impregnates the situation of (dipping) to quality
Bring the biggest difference.
It addition, (puddling) phenomenon can be converged in etching process procedure.Converging phenomenon is for be sprayed
It is mapped to the etching solution on material surface and is exceedingly deposited on the phenomenon that material represents, and can be existing according to converging
As and cause the less desirable etchings such as uneven etching so that product quality reduce.Converging phenomenon
Number according to nozzle, pitch (pitch) or arrangement in general Etaching device and simply also exist
The difference of size, but this phenomenon is inevitable.
Fig. 1 is the profile representing the converging phenomenon occurred according to existing Etaching device.
With reference to Fig. 1, the upper of substrate 50 will be deposited on by the etching solution of the ejection sections such as suction nozzle 10 injection
Surface and form etching solution residue 20.The closer to the central authorities of substrate 50, etching solution residue 20 will
Existing the most, therefore the central authorities at substrate 50 can form etching rather than be sprayed because of the etching solution of deposition
The etching solution penetrated forms etching.Compared with the situation according to injected etching solution, due to the erosion of deposition
Carve liquid and etched in the case of can not etch normally, the quality of a kind of product will become
Mutually different.In order to prevent this phenomenon, disclose one in the prior art and be provided for sucking
The method of the inhalation stick (bar) of etching solution.
Fig. 2 is the profile representing the inhalation stick being arranged in existing Etaching device.
With reference to Fig. 2, existing Etaching device transfers substrate by top running roller 30a and bottom running roller 30b
50.And, during arranging top running roller 30a, arrange inhalation stick 40.The bottom shape of inhalation stick 40
Become to have suction inlet 41 such that it is able to suck the etching solution of the upper surface being deposited on substrate 50.But, because of
Inhalation stick 40 directly contacts substrate 50, is thin substrate (such as, the flexible print with flexibility at substrate 50
Brush circuit (FPC) substrate) in the case of, substrate 50 may be due to the suction inlet 41 of inhalation stick 40
Suction and be attached to suction inlet 41.Then, it is impossible to be normally formed by top running roller 30a and
The transfer of the substrate 50 of bottom running roller 30b, thus production efficiency can be reduced.
[prior art literature]
[patent documentation]
Korean granted patent publication the 10-1150022nd (2012.05.31)
Summary of the invention
Embodiments of the invention aim to provide one, and that converging phenomenon can either be prevented to be prevented from again is processed right
As being attached at the Etaching device of the phenomenon of adsorption section.
Even if embodiments of the invention aim to provide one and also are able in the case of object is ultra thin substrate
It is etched the Etaching device of operation.
Embodiments of the invention aim to provide the suction of a kind of sucting that can ensure that for preventing converging phenomenon
Etaching device.
According to one embodiment of present invention, it is provided that a kind of Etaching device, processed right as being used for etching
The Etaching device of elephant, including: chamber, it is provided that for performing the space of described etching；More than one spray
Penetrate portion, be positioned at described chamber, and described processed object is sprayed etching solution；Multiple transfer running rollers,
For making described processed object move；Sucting, for sucking the upper surface of described processed object
Etching solution, wherein, described sucting includes that more than one suction tube, described transfer running roller comprise respectively
Multiple support members that rotary shaft and the length direction along described rotary shaft are formed, described suction tube divides
It is not positioned at support member and the adjacent transfer running roller adjacent to one transfer running roller of a transfer running roller
Support member between interval in.
Described processed object can have flexibility.
Described processed object can be flexible print circuit (FPC) substrate.
Described ejection section can include being positioned at the top ejection section of the upside of described processed object and being positioned at institute
State the bottom ejection section of the downside of processed object.
Described transfer running roller comprises the steps that top running roller, connects with the upper surface of described processed object；Under
Portion's running roller, connects with the lower surface of described processed object.
Described suction tube can lay respectively at the support member of a top running roller and adjacent to one top
In interval between the support member of the adjacent top running roller of running roller.
The described support member of one transfer running roller can be arranged as follows: when from described rotary shaft
Direction observe time, partially overlap the support member of described adjacent transfer running roller.
Described support member can be as the central portion at center using described rotary shaft.
Can be disposed with between rotary shaft and the rotary shaft of described adjacent transfer running roller of one transfer running roller
More than one connection support member.
Described connection support member can support described processed object.
Described connection support member can make shape between one transfer running roller and described adjacent transfer running roller
Become to connect, and maintain the interval that is connected.
Described sucting can include the main body being formed with the suction tube of more than one.
Interval between lower end and the described processed object of described suction tube can be 0.5～3mm.
The suction of described suction tube can be in more than 0mmHg, the scope of below 500mmHg.
According to embodiments of the invention, sucting comprises suction tube, and suction tube is positioned at a transfer running roller
In interval between the support member of support member and transfer running roller adjacent thereto, the most both prevented
Converging phenomenon prevents again processed object to be attached at sucting such that it is able to improve the efficiency of etch process.
According to embodiments of the invention, suction tube is between support member, thus even for flexibility
It also is able in the case of the ultra thin substrates such as tellite perform etch process.
Additionally, partially overlap adjacent when the support member of a transfer running roller is to observe from rotary shaft direction
The mode of support member of transfer running roller be arranged such that it is able to reliably support processed object in case
The most processed object is attached at sucting.
It addition, be disposed with one between rotary shaft and the rotary shaft of adjacent transfer running roller of a transfer running roller
Individual above connection supporting part such that it is able to the most reliably support processed object.
Additionally, reliably support processed object by means of support member and connection support member, from
And it is able to ensure that the suction of the sucting for preventing converging phenomenon.
Accompanying drawing explanation
Fig. 1 is the profile representing the converging phenomenon occurred according to existing Etaching device.
Fig. 2 is the profile representing the inhalation stick being arranged in existing Etaching device.
Fig. 3 is the profile representing the Etaching device according to one embodiment of the invention.
Fig. 4 is the side view of the sucting according to one embodiment of the invention.
Fig. 5 is the ground plan of the sucting according to one embodiment of the invention.
Fig. 6 is the partial perspective view of the transfer running roller according to one embodiment of the invention.
Fig. 7 is to represent the transfer running roller according to one embodiment of the invention and the partial front figure of sucting.
Fig. 8 is to represent the top running roller according to one embodiment of the invention and the side view of sucting.
Fig. 9 is the partial perspective view representing the top running roller according to one embodiment of the invention.
Figure 10 is the partial plan layout representing the top running roller according to one embodiment of the invention.
Figure 11 is to represent the transfer running roller according to one embodiment of the invention and the amplification side of sucting
Figure.
Symbol description
100: Etaching device 150: processed object
200: chamber 210a: top ejection section
The nozzle 210b of 210a': top ejection section: bottom ejection section
The nozzle 230a of 210b': bottom ejection section: top running roller
231a: end 232a: rotary shaft
233a: support member 235a-1,235a-2: connect support member
230b: bottom running roller 231b: end
232b: rotary shaft 233b: support member
240: sucting 241: main body
242: suction tube 300: pump
400: filter 500: pipeline
Detailed description of the invention
Hereinafter, concrete real to the Etaching device according to one embodiment of the invention with reference to Fig. 3 to Figure 11
Execute example to illustrate.But this embodiment being merely exemplary, the invention is not limited in this.
During embodiments of the invention are illustrated, if it is considered to for the present invention known
The likely purport to the present invention that illustrates of technology causes unnecessary confusion, then omit it specifically
Bright.It addition, term described later is the term defined in view of the function in the present invention, it may be because of
User, the fortune intention of user or convention etc. and different.Accordingly, it would be desirable to run through in entire disclosure
Based on appearance, it is defined.
The technological thought of the present invention is determined by the scope of claims, and below example is only to use
The people in the technical field belonging to the present invention with ABC illustrates that the technology of the present invention is thought effectively
The means thought.
Convergence (puddling) phenomenon occurred in the etch process occurs over just processed object (substrate)
Upper surface, without lower surface occur.Its reason is, in the lower surface of processed object, erosion
Carve liquid vertically to drip because of gravity, therefore can naturally be removed；But at upper surface, injected
Etching will deposit.Therefore, the most efficient method eliminating converging phenomenon is residual for being sucked by sucting
Stay etching solution.
That is, therefore etching solution will be located in arrival continuously from the nozzle injection for spraying etching solution
The etching solution of reason object can supply new etching solution before the outside of processed object departs from, if so
The most individually be removed the process of etching solution, then etching solution will be deposited on the upper surface of processed object.
Especially, the closer to the centre of processed object, the deposition of etching solution will be the most.
But, the relatively thin flexible base boards such as flexible print circuit (FPC) substrate are being etched operation
During, inhaled by sandwiched inhalation stick (bar) between the running roller of top to remove etching solution
In the case of entering etching solution, substrate will be attached to inhalation stick due to the suction of inhalation stick, therefore may be used
Can will not be transferred.It is thus possible to the technique of circuit cannot be normally carried out being formed on flexible circuit board,
Consequently, it is possible to final product cannot be produced.
According to one embodiment of the invention, it is provided that a kind of Etaching device, this Etaching device is for effectively
The etching solution of the upper surface being deposited on processed object is removed on ground, and to ultra-thin bases such as flexible circuit boards
For the situation of plate, etch process also will not be obstructed due to sucting.
Fig. 3 is the profile representing the Etaching device 100 according to one embodiment of the invention.
With reference to Fig. 3, Etaching device 100 is the device for etching processed object 150, and it can wrap
Include: chamber (chamber) 200, it is provided that for the space being etched；Ejection section 210a, 210b,
It is positioned at chamber 200, and processed object 150 is sprayed etching solution；Transfer running roller 230a, 230b,
For making processed object 150 move；Sucting 240, for sucking the upper table of processed object 150
The etching solution in face.
Processed object 150 can be the substrate with flexibility, it is particularly possible to be flexible circuit (FPC:
Flexible Printed Circuit) substrate.
Ejection section 210a, 210b can include top ejection section and the position being positioned at the upside of processed object
Bottom ejection section in the downside of processed object.
Transfer running roller 230a, 230b can include the top running roller that connects with the upper surface of the object that is processed with
And the bottom running roller connected with the lower surface of processed object.
Sucting 240 may be located at running roller 230a side, top.In order to provide suction to sucting 240, can
To use pump 300 as shown in Figure 3, it is also possible to use special pump (not shown).Sucting 240
Specific configuration will be described in following part.
When the etching solution from ejection section 210a, 210b ejection is deposited on the bottom of chamber 200 or is inhaled into
When portion 240 sucks, etching solution can circulate by means of pump 300 and be again provided to ejection section 210a,
210b.Before the injection liquid again supplied is provided to ejection section 210a, 210b, filtration can be set
The foreign bodies such as the metal residue that device 400 is comprised with removal etching solution.In figure 3, it is illustrated that for etching solution
Arrive before pump 300 via filter 400, but be not limited thereto, pump 300 and ejection section 210a,
Filter 400 it is also provided with between 210b.
In order to connect between pump 300 and ejection section 210a, 210b and the thesaurus of residual etching solution (is not schemed
Show) and pump 300 between, pipeline (line) 500 can be formed in the middle of it.
Fig. 4 is the side view of the sucting 240 according to one embodiment of the invention, and Fig. 5 is according to this
The ground plan of the sucting of a bright embodiment.
With reference to Fig. 4 and Fig. 5, sucting 240 can include main body 241 and the following table from main body 241
The suction tube 242 extended downwards.Main body 241 can be formed the inside being connected with suction tube 242
Space (not shown), the inner space of main body 241 can be by the suction means (example for providing suction
Such as, pump 300) and pipeline (not shown) and interconnect.Because main body 241 is formed inner space,
Preferably, there is the predetermined altitude of the degree that can form inner space.
Suction tube 242 can be formed as described above the shape for extending downwards from the lower surface of main body 241
State.Suction tube 242 could be formed with more than one, preferably can be formed multiple and from processed object
Multiple positions of the upper surface of 150 suck.Suction tube 242 forms thin tube shape such that it is able to
It is inserted into and is drawn in narrower clearance space.According to Fig. 5, suction tube 242 is main body 241 times
Surface is arranged to 2 row, but is not limited thereto, and can arrange situation etc. according to suction tube 242
And realize various deformation.
Sucting 240 can be disposed with more than one in chamber 200.Preferably, multiple suctings 240
Can be arranged along the travel direction of processed object 150.Accordingly, according to processed object 150
Transferred along transfer running roller 230a, 230b and sprayed erosion by multiple ejection sections 210a, 210b continuously
In the case of carving liquid, can be continuously drawn into be deposited on processed object 150 by multiple suctings 240
The etching solution of upper surface.
Fig. 6 is the partial perspective view of transfer running roller 230a, the 230b according to one embodiment of the invention.
With reference to Fig. 6, transfer running roller 230a, 230b can include the upper table touching processed object 150
The top running roller 230a in face and touch the bottom running roller 230b of lower surface of processed object 150.Top
The shape of running roller 230a and bottom running roller 230b can be same or like, therefore will be with top running roller
Illustrate centered by 230a, and be omitted for the explanation of bottom running roller 230b.
Each top running roller 230a can comprise end 231a, rotary shaft 232a, multiple supporting part respectively
Part 233a.End 231a is corresponding to the two ends of each top running roller 230a, although illustrating the most in figure 6,
The function of gear can also be performed similarly to along around forming zigzag fashion.In this case, end
Portion 231a can perform to transmit the function of the transfer unit for the revolving force making top running roller 230a rotate.
Multiple support members 233a can be separated from each other predetermined space with the length direction along rotary shaft 232a
Mode is formed.Each support member 233a can be as the central portion at center using rotary shaft 232a.
Support member 233a of top running roller 230a is rotating together with rotary shaft 232a and into contact with its underpart
Processed object 150 transfer while, can by perform to be arranged in the way of being separated from each other predetermined interval
And support the function of processed object 150.Therefore, when by sucting 240 to processed object 150
Upper surface when carrying out suction process, in order to prevent the processed object 150 as the thin film with flexibility
It is attached at the suction tube 242 of sucting 240, can perform to support the function of processed object.
Additionally, according to Fig. 6, support member 233a of a top running roller 230a can be with from rotary shaft
232a direction partially overlaps the side of support member 233a of top running roller 230a adjacent thereto when observing
Formula is arranged.Therefore, when observing from rotary shaft 232a direction, the support member of a top running roller 230a
Interval is there is not between support member 233a of 233a and top running roller 230a adjacent therewith, it is thus possible to
Enough processed objects 150 of reliably support.
Fig. 7 is to represent transfer running roller 230a, the 230b according to one embodiment of the invention and the office of sucting
Portion's front elevation.
With reference to Fig. 7, the suction tube 242 of sucting 240 may be located at and a top running roller 230a respectively
Between adjacent top running roller 230a.Specifically, suction tube 242 may be located at a upper roll respectively
Wheel 230a rotary shaft 232a (being positioned at the rear of end 231a in the figure 7, not shown) and therewith neighbour
Between rotary shaft 232a of the top running roller 230a connect.According to one embodiment of the invention, sucting 240
Suction tube 242 lay respectively between rotary shaft 232a of two adjacent top running roller 230a, with
The situation that the form of existing inhalation stick arranges inhalation part is different, it is possible to prevent because fexible film is attached at
Inhalation part and make the phenomenon that the progress of technique is obstructed.
The situation on the top being formed at processed object 150 with sucting 240 is contrary, and it is processed right to be positioned at
Sucting 240 can be not provided with between the bottom running roller 230b of the bottom as 150.As it has been described above, to
The etching solution of the lower surface injection of processed object 150 is dripped downwards because of gravity, and therefore etching solution is not
The lower surface of processed object 150 can be deposited on.
Fig. 8 is to represent the top running roller 230a according to one embodiment of the invention and the side of sucting 240
Figure.
With reference to Fig. 8, suction tube 242 can be arranged in the support member of a top running roller 230a-1 respectively
233a-1 and top running roller 230a-2 adjacent therewith is (heavy with the back of top running roller 230a-1 in fig. 8
Folded, the most not shown) support member 233a-2 between interval in.Therefore, with as above with
The situation that the shape of existing inhalation stick arranges inhalation part is different, it is possible to prevent because flexible thin substrate attaches
The phenomenon that the progress of technique is obstructed is made in inhalation part.
Fig. 9 is the partial perspective view representing the top running roller 230a according to one embodiment of the invention.
Structure with reference to Fig. 9, top running roller 230a itself is identical with the above embodiments, but on one
Rotary shaft 232a-1 of portion running roller 230a-1 and rotary shaft 232a-2 of top running roller 230a-2 adjacent therewith
Between can be disposed with more than one connection support member 235a-1.Similarly, top running roller 230a-2
Rotary shaft 232a-2 and the rotary shaft of top running roller 230a-3 adjacent therewith between can also the company of being disposed with
Connect support member 235a-2.Connect holding components 235a-1,235a-2 shape with a biconjugate hook (hook)
Shape is formed, such that it is able to house rotary shaft 232a of described adjacent top running roller 230a in hook.Cause
This, connection support member 235a-1,235a-2 can make to be formed between upper roll wheel 230a to connect, and energy
Enough maintain the interval between the running roller 230a of top.Moreover, support member 235a-1,235a-2 are connected
Bottom can also carry out the support member of the processed object 150 that is in contact with it with top running roller 230a
The function that 233a together supports.Therefore, according to the present embodiment, it is possible to be more reliably prevented because of flexible thin
The phenomenon that substrate is attached at suction tube 240 and makes the progress of technique be obstructed.
Additionally, be shown only for top running roller 230a in fig .9, but at bottom running roller 230b
On can also be disposed with connection support member.
Figure 10 is the partial plan layout representing the top running roller 230a according to one embodiment of the invention.
With reference to Figure 10, due to support member 233a-1,233a-2,233a-3 and connection support member 235a-1,
235a-2 is arranged in the way of centre does not exists interval, passes through its underpart therefore, it is possible to reliably support
And the processed object 150 transferred.Therefore, as mentioned above, it is possible to be more reliably prevented because of flexible thin
The phenomenon that substrate is attached at suction tube 240 and makes the progress of technique be obstructed.
Figure 11 is to represent transfer running roller 230a, the 230b according to one embodiment of the invention and sucting
The amplification profile of 240.
Upper surface with reference to Figure 11, the lower end of the suction tube 242 of sucting 240 and processed object 150
Between can have predetermined interval d.Interval d can be 0.5～3mm.If interval d is excessively big,
Then can not normally suck the etching solution being deposited on upper surface.On the contrary, if interval d the least, then by
The transfer processing object 150 will be obstructed.Interval d can be by regulation fixed component (not shown)
Tight condition and realize change, this fixed component (not shown) can be bolt, and it sucks for fixing
Portion 240 is to be arranged on sucting 240 in chamber 200.
Additionally, the suction of suction tube 242 can be in more than 0mmHg, the scope of below 500mmHg.
In the case of the suction of suction tube 242 exceeds this scope, may be due to the suction of suction tube 242
The process progress making processed object 150 is obstructed.
Above the representative embodiment of the present invention is described in detail, but in the present invention
Belonging to technical field in have the personnel of ABC be all appreciated that to the above embodiments can without departing from
Various deformation is carried out in the limit of the scope of the present invention.Therefore, the interest field of the present invention is not limited to
In described embodiment, the interest field of the present invention needs the scope according to claims and and right
The scope of claim equalization determines.
Claims (14)
1. an Etaching device, as being used for etching the Etaching device of processed object, including:
Chamber, it is provided that for performing the space of described etching；
More than one ejection section, is positioned at described chamber, and described processed object is sprayed etching solution；
Multiple transfer running rollers, are used for making described processed object move；And
Sucting, for sucking the etching solution of the upper surface of described processed object,
Wherein, described sucting includes more than one suction tube,
Described transfer running roller comprises rotary shaft respectively and the length direction along described rotary shaft is formed many
Individual support member,
Described suction tube lays respectively at the support member of a transfer running roller and adjacent to one transfer roller
In interval between the support member of the adjacent transfer running roller of wheel.
2. Etaching device as claimed in claim 1, wherein,
Described processed object has flexibility.
3. Etaching device as claimed in claim 2, wherein,
Described processed object is flexible printed circuit substrate.
4. Etaching device as claimed in claim 1, wherein,
Described ejection section includes the top ejection section being positioned at the upside of described processed object and is positioned at described
The bottom ejection section of the downside of processed object.
5. Etaching device as claimed in claim 1, wherein, described transfer running roller includes:
Top running roller, connects with the upper surface of described processed object；And
Bottom running roller, connects with the lower surface of described processed object.
6. Etaching device as claimed in claim 5, wherein,
Described suction tube lays respectively at the support member of a top running roller and adjacent to one upper roll
In interval between the support member of the adjacent top running roller of wheel.
7. Etaching device as claimed in claim 1, wherein, the described support of one transfer running roller
Parts are arranged in such a way:
When observing from the direction of described rotary shaft, partially overlap the supporting part of described adjacent transfer running roller
Part.
8. Etaching device as claimed in claim 1, wherein,
Described support member is as the central portion at center using described rotary shaft.
9. Etaching device as claimed in claim 1, wherein,
It is disposed with one between rotary shaft and the rotary shaft of described adjacent transfer running roller of one transfer running roller
Individual above connection support member.
10. Etaching device as claimed in claim 9, wherein,
Processed object described in described connection support member supports.
11. Etaching devices as claimed in claim 9, wherein,
Described connection support member makes the company of being formed between one transfer running roller and described adjacent transfer running roller
Connect, and maintain the interval that is connected.
12. Etaching devices as claimed in claim 1, wherein,
Described sucting includes the main body being formed with the suction tube of more than one.
13. Etaching devices as claimed in claim 1, wherein,
It is spaced apart 0.5～3mm between lower end and the described processed object of described suction tube.
14. Etaching devices as claimed in claim 1, wherein,
The suction of described suction tube is more than 0mmHg and be below 500mmHg.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150055282A KR101663081B1 (en) | 2015-04-20 | 2015-04-20 | Etching apparatus |
| KR10-2015-0055282 | 2015-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106065475A true CN106065475A (en) | 2016-11-02 |
Family
ID=57145244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610249047.0A Pending CN106065475A (en) | 2015-04-20 | 2016-04-20 | Etaching device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101663081B1 (en) |
| CN (1) | CN106065475A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107690229A (en) * | 2017-08-09 | 2018-02-13 | 常熟东南相互电子有限公司 | Reduce the Etaching device and its engraving method at circuit board lateral erosion inclination angle |
| CN110172698A (en) * | 2019-06-24 | 2019-08-27 | 深圳市华星光电技术有限公司 | A kind of etch system |
| CN117241482A (en) * | 2023-10-25 | 2023-12-15 | 广东达源设备科技有限公司 | Etching device and method for manufacturing circuit board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102540482B1 (en) | 2022-12-08 | 2023-06-07 | 주식회사 지씨이 | Non-contact type and dipping type developing apparatus, etching apparatus, developing-etching apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS60159179A (en) * | 1984-01-27 | 1985-08-20 | Hitachi Chem Co Ltd | Etching device |
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| JP2005036299A (en) * | 2003-07-18 | 2005-02-10 | North:Kk | Etching system |
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| CN103021905A (en) * | 2011-07-20 | 2013-04-03 | 显示器生产服务株式会社 | Apparatus for treating substrate |
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| JPH03180385A (en) * | 1989-12-08 | 1991-08-06 | Oji Paper Co Ltd | Thermal recording material |
| KR200424380Y1 (en) * | 2006-06-07 | 2006-08-22 | (주) 에스엠씨 | Device for etching a flexible film |
| KR101150022B1 (en) | 2010-09-09 | 2012-05-31 | 삼성테크윈 주식회사 | Apparatus for etching |
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2015
- 2015-04-20 KR KR1020150055282A patent/KR101663081B1/en active IP Right Grant
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2016
- 2016-04-20 CN CN201610249047.0A patent/CN106065475A/en active Pending
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| JPS60159179A (en) * | 1984-01-27 | 1985-08-20 | Hitachi Chem Co Ltd | Etching device |
| JPH01132780A (en) * | 1987-11-18 | 1989-05-25 | Dainippon Screen Mfg Co Ltd | Surface treatment of substrate and device therefor |
| US4996939A (en) * | 1988-11-03 | 1991-03-05 | D.E.M. Controls Of Canada, Inc. | Apparatus for drying printed circuit boards |
| JP2005036299A (en) * | 2003-07-18 | 2005-02-10 | North:Kk | Etching system |
| CN102453915A (en) * | 2010-10-27 | 2012-05-16 | 富葵精密组件(深圳)有限公司 | Etching apparatus and method of applying same in etching substrate |
| CN103021905A (en) * | 2011-07-20 | 2013-04-03 | 显示器生产服务株式会社 | Apparatus for treating substrate |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107690229A (en) * | 2017-08-09 | 2018-02-13 | 常熟东南相互电子有限公司 | Reduce the Etaching device and its engraving method at circuit board lateral erosion inclination angle |
| CN107690229B (en) * | 2017-08-09 | 2020-03-31 | 常熟东南相互电子有限公司 | Etching device for reducing side etching inclination angle of circuit board and etching method thereof |
| CN110172698A (en) * | 2019-06-24 | 2019-08-27 | 深圳市华星光电技术有限公司 | A kind of etch system |
| CN117241482A (en) * | 2023-10-25 | 2023-12-15 | 广东达源设备科技有限公司 | Etching device and method for manufacturing circuit board |
| CN117241482B (en) * | 2023-10-25 | 2024-04-12 | 广东达源设备科技有限公司 | Etching device and method for manufacturing circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101663081B1 (en) | 2016-10-07 |
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Application publication date: 20161102 |