CN117241482B - Etching device and method for manufacturing circuit board - Google Patents

Abstract

The application relates to the circuit board etching field discloses an etching device for circuit board preparation, including conveying subassembly, etching subassembly and clean subassembly, conveying subassembly is used for conveying the circuit board, and etching subassembly is used for spraying the etching solution to the circuit board on the conveying subassembly, and conveying subassembly includes many imbibition rollers that are parallel to each other, is equipped with a plurality of imbibition running rollers on every imbibition running roller, is equipped with the imbibition hole on the imbibition running roller, and clean subassembly is used for keeping away from one side of circuit board to the imbibition hole at the imbibition running roller. The device also comprises a liquid suction assembly and a control assembly, wherein the liquid suction assembly is respectively communicated with the liquid suction holes on each liquid suction roller through a liquid suction air path, the liquid suction gas path is provided with a negative pressure sensor for detecting suction pressure, and the cleaning assembly, the negative pressure sensor and the liquid suction assembly are respectively and electrically connected with the control assembly. The negative pressure liquid suction hole that absorbs the etching solution has been avoided effectively to take place to block up, has improved the degree of consistency of circuit board etching process.

Description

Etching device and method for manufacturing circuit board

Technical Field

The present disclosure relates to the field of circuit board etching technology, and more particularly, to an etching apparatus and method for manufacturing a circuit board.

Background

In the etching process of the printed circuit board production line, it is necessary to etch the printed circuit board with an etching liquid. In the etching process, an etching section is provided on a printed circuit board production line, and an etching liquid storage container is provided on the etching section to store an etching liquid. Since the etching solution consumes hydrochloric acid and an oxidizing agent in the etching solution after etching the circuit board, it is necessary to detect the proportions of three sub-solutions of water, hydrochloric acid and oxidizing agent in the etching solution in the etching tank in real time in the etching process. Meanwhile, in the etching process, the etching operation is generally performed by spraying the etching solution on the circuit board in the moving process, and in the spraying etching operation of the etching solution, the etching solution remains on the surface of the circuit board or in the etching tank, so that the concentration of the etching solution remaining along with the etching process is reduced, the etching efficiency of the etching solution without remaining is higher than that of the etching solution, and the etching quality of the circuit board is affected, and the overall quality of the circuit board is reduced.

Patent CN105208782B (application number: CN 201510641811.4) provides an automatic etching device for a circuit board, wherein a plurality of liquid suction holes are formed in an etching conveying roller of the automatic etching device, the liquid suction holes are used for generating negative pressure and sucking etching liquid on the circuit board, so that the etching liquid can be prevented from remaining on the surface of the circuit board or in an etching groove, the problem of different local etching degrees of the circuit board can be avoided, the uniformity of the etching procedure of the circuit board can be ensured, and the etching quality of the circuit board is improved. However, the automatic circuit board etching apparatus in patent CN10208782B may have a poor effect of sucking the etching solution due to the blockage of the negative pressure suction hole for sucking the etching solution during use, resulting in poor uniformity of the circuit board etching process.

Disclosure of Invention

The purpose of the application is to provide an etching device and method for manufacturing a circuit board, which solves the technical problems that the suction effect of etching liquid is poor and the uniformity of the etching process of the circuit board is poor due to the blocking of a negative pressure liquid suction hole for sucking the etching liquid, and achieves the technical effect of improving the etching uniformity of the circuit board by improving the negative pressure suction process of the etching liquid in the etching process.

The embodiment of the application provides an etching device for circuit board preparation, including conveying subassembly, etching subassembly and clean subassembly, conveying subassembly is used for conveying the circuit board, and etching subassembly is used for spraying etching solution to the circuit board on the conveying subassembly, and conveying subassembly includes many imbibition rollers that are parallel to each other, is equipped with a plurality of imbibition running rollers on every imbibition running roller, is equipped with the imbibition hole on the imbibition running roller, and clean subassembly is used for keeping away from one side of circuit board to the imbibition hole at the imbibition running roller.

In one possible implementation mode, the cleaning device further comprises a liquid suction assembly and a control assembly, wherein the liquid suction assembly is respectively communicated with the liquid suction holes on each liquid suction roller through a liquid suction air path, a negative pressure sensor for detecting suction pressure is arranged on the liquid suction air path, and the cleaning assembly, the negative pressure sensor and the liquid suction assembly are respectively and electrically connected with the control assembly.

In another possible implementation manner, the cleaning assembly comprises a liquid spraying head, a liquid spraying valve and a cleaning pump, the cleaning pump is sequentially connected with the liquid spraying valve and the liquid spraying head through pipelines, the liquid spraying valve is arranged on the liquid spraying head, the liquid spraying head sprays etching liquid along the tangential direction of the liquid sucking roller, and the liquid spraying valve, the cleaning pump and the control assembly are electrically connected.

In another possible implementation manner, the conveying assembly further comprises a plurality of supporting rollers which are parallel to each other, each supporting roller is provided with a plurality of supporting rollers, the supporting rollers are used for supporting the circuit board, the liquid sucking rollers and the supporting rollers are arranged at intervals, the diameter of the liquid sucking rollers is larger than that of the supporting rollers, and the elasticity of the supporting rollers is smaller than that of the liquid sucking rollers.

In another possible implementation manner, an annular liquid suction groove is arranged on the circumference of the liquid suction roller, the cross section of the liquid suction groove is in a V shape, a semicircle shape or an arc shape, and the large end of the opening of the liquid suction groove is arranged on the circumference of the liquid suction roller, and the liquid suction hole is communicated with the liquid suction groove.

In another possible implementation manner, the liquid suction roller wheel comprises a ring body and a flexible ring, the flexible ring is connected to the ring body in a sleeved mode, the ring body is of a rigid structure, the flexible ring is of a flexible structure, the liquid suction groove is formed in the flexible ring, and the liquid suction hole sequentially penetrates through the ring body, the flexible ring and the liquid suction groove to be communicated.

In another possible implementation manner, the plurality of suction rolls on each suction roll are uniformly arranged on the suction roll, or the intervals between the plurality of suction rolls on each suction roll gradually increase from the middle part of the suction roll to the two ends of the suction roll; the spacing between the plurality of support rollers on each support roller gradually decreases from the middle of the support roller to the two ends of the support roller.

The embodiment of the application also provides an etching method for manufacturing the circuit board, which is applied to the etching device for manufacturing the circuit board, and comprises the following steps: spraying etching liquid to a circuit board on the conveying assembly through the etching assembly in the etching process, opening the liquid suction assembly to suck the etching liquid, and respectively obtaining negative pressure detection values of the negative pressure sensors corresponding to the liquid suction rollers; when the negative pressure detection value corresponding to the liquid suction roller is larger than the preset negative pressure value, opening a liquid spraying valve corresponding to the liquid suction roller, and spraying etching liquid to the liquid suction roller to clean the liquid suction roller.

In another possible implementation manner, the method further includes: and when the negative pressure detection value corresponding to the liquid suction roller is smaller than or equal to the preset negative pressure value, closing the liquid spraying valve corresponding to the liquid suction roller, and stopping spraying the etching liquid to the liquid suction roller.

In another possible implementation manner, the method further includes: dividing the transmission assembly into a pre-etching section and an etching section according to the etching thickness of the circuit board to be etched, and respectively configuring the liquid absorption assembly for the pre-etching section and the etching section; spraying etching liquid to the circuit board on the conveying assembly through the etching assembly in the pre-etching section, closing the liquid suction assembly corresponding to the pre-etching section, and opening the liquid spraying valve corresponding to the liquid suction roller corresponding to the pre-etching section to supplement the etching liquid to the circuit board in the pre-etching section; spraying etching liquid to the circuit board on the conveying assembly through the etching assembly in the etching section, opening the liquid suction assembly corresponding to the etching section, closing the liquid spraying valve corresponding to the liquid suction roller corresponding to the etching section, and cleaning the liquid suction hole through the cleaning assembly in the etching section; the etching liquid pressure value of the cleaning component corresponding to the pre-etching section is smaller than that of the cleaning component corresponding to the etching section.

In another possible implementation manner, the method further includes: when the negative pressure detection value corresponding to the liquid suction roller is larger than a preset negative pressure value, setting the etching liquid pressure value of the cleaning assembly to be a first pressure value, opening a liquid spraying valve corresponding to the liquid suction roller, and spraying etching liquid to the liquid suction roller to clean the liquid suction roller for a first time period; after the first time period, when the negative pressure detection value is continuously larger than a preset negative pressure value, reducing the conveying speed of the conveying component, setting the etching liquid pressure value of the cleaning component to be a second pressure value, opening a liquid spraying valve corresponding to the liquid suction roller, and spraying etching liquid to the liquid suction roller to clean the liquid suction roller for a second time period; wherein the second pressure value is greater than the first pressure value.

In another possible implementation manner, the method further includes: after the second time period, when the negative pressure detection value is continuously larger than the preset negative pressure value, stopping inputting the circuit board to the conveying component, controlling the liquid suction roller of the conveying component to reversely convey, setting the etching liquid pressure value of the cleaning component to be a third pressure value, opening a liquid spraying valve corresponding to the liquid suction roller, and spraying etching liquid to the liquid suction roller to clean the liquid suction roller for a third time period; wherein the third pressure value is greater than the second pressure value.

Compared with the prior art, the embodiment of the application has the beneficial effects that:

the embodiment of the application provides an etching device for circuit board preparation, including conveying subassembly, etching subassembly and clean subassembly, conveying subassembly is used for conveying the circuit board, and etching subassembly is used for spraying etching solution to the circuit board on the conveying subassembly, and conveying subassembly includes many imbibition rollers that are parallel to each other, is equipped with a plurality of imbibition running rollers on every imbibition running roller, is equipped with the imbibition hole on the imbibition running roller, and clean subassembly is used for keeping away from one side of circuit board at the imbibition running roller and cleans the imbibition hole. According to the embodiment of the application, the liquid suction holes of the liquid suction roller are cleaned through the cleaning assembly, the liquid suction holes are prevented from being blocked, the effect of continuously sucking etching liquid by the liquid suction roller in use is improved, and the stability of the production quality of a circuit board is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required for the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic front view of an etching apparatus for manufacturing a circuit board according to an embodiment of the present application;

FIG. 2 is a schematic view of a part of the etching apparatus for manufacturing a circuit board shown in FIG. 1;

FIG. 3 is a schematic view of a partial cross-sectional structure of an etching apparatus for circuit board fabrication in FIG. 2;

FIG. 4 is a schematic top view of a transfer assembly according to an embodiment of the present application;

FIG. 5 is a schematic top view of another transfer assembly according to an embodiment of the present application;

FIG. 6 is a schematic top view of another transfer assembly according to an embodiment of the present application;

FIG. 7 is a schematic view of a portion of the transfer assembly of FIG. 4 at B;

FIG. 8 is a schematic diagram of a control structure of an etching apparatus for circuit board fabrication according to an embodiment of the present application;

FIG. 9 is a schematic flow chart of an etching method for manufacturing a circuit board according to an embodiment of the present application;

in the figure, 1, a transmission assembly; 11. a liquid suction roller; 111. a liquid suction roller; 111a, a ring body; 111b, a flexible ring; 112. a liquid suction hole; 113. a liquid suction tank; 12. a support roller; 121. a supporting roller; 2. an etching assembly; 3. a cleaning assembly; 31. a liquid ejecting head; 32. a liquid spraying valve; 33. a cleaning pump; 4. a liquid-absorbing assembly; 41. a liquid suction gas path; 411. a negative pressure sensor; 5. and a control assembly.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It will be understood that when an element or structure is referred to as being "mounted" or "disposed" on another element or structure, it can be directly on the other element or structure or be indirectly on the other element or structure. When an element or structure is referred to as being "connected to" another element or structure, it can be directly connected to the other element or structure or be indirectly connected to the other element or structure.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the device or a component or structure being referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Patent CN105208782B (application number: CN 201510641811.4) provides an automatic etching device for a circuit board, wherein a plurality of liquid suction holes are formed in an etching conveying roller of the automatic etching device, the liquid suction holes are used for generating negative pressure and sucking etching liquid on the circuit board, so that the etching liquid can be prevented from remaining on the surface of the circuit board or in an etching groove, the problem of different local etching degrees of the circuit board can be avoided, the uniformity of the etching procedure of the circuit board can be ensured, and the etching quality of the circuit board is improved. However, the automatic circuit board etching apparatus in patent CN10208782B may have a poor effect of sucking the etching solution due to the blockage of the negative pressure suction hole for sucking the etching solution during use, resulting in poor uniformity of the circuit board etching process.

Based on the above reasons, the embodiment of the application provides an etching device and method for circuit board manufacturing, including conveying subassembly, etching subassembly and cleaning subassembly, conveying subassembly is used for conveying the circuit board, and etching subassembly is used for spraying etching solution to the circuit board on the conveying subassembly, and conveying subassembly includes many mutually parallel imbibition rollers, is equipped with a plurality of imbibition running rollers on every imbibition roller, is equipped with the imbibition hole on the imbibition running roller, and cleaning subassembly is used for keeping away from the one side of circuit board at the imbibition running roller and cleans the imbibition hole. According to the embodiment of the application, the liquid suction holes of the liquid suction roller are cleaned through the cleaning assembly, the liquid suction holes are prevented from being blocked, the effect of continuously sucking etching liquid by the liquid suction roller in use is improved, and the stability of the production quality of a circuit board is improved.

In some scenes, the etching device for manufacturing the circuit board can be applied to circuit board etching equipment and can be applied to circuit board etching equipment combining procedures of spraying, etching, cleaning and the like, so that high-quality production of the circuit board is achieved.

An etching apparatus for circuit board manufacturing according to an embodiment of the present application will be specifically described with reference to specific examples.

Fig. 1 is a schematic front view of a structure of an etching device for manufacturing a circuit board according to an embodiment of the present application, fig. 2 is a schematic partial structure of an a part of the etching device for manufacturing a circuit board in fig. 1, fig. 3 is a schematic partial cross-sectional structure of the etching device for manufacturing a circuit board in fig. 2, and as shown in fig. 1 to 3, an etching device for manufacturing a circuit board provided in an embodiment of the present application includes a conveying component 1, an etching component 2 and a cleaning component 3, the conveying component 1 is used for conveying a circuit board, the etching component 2 is used for spraying an etching solution onto the circuit board on the conveying component 1, the conveying component 1 includes a plurality of mutually parallel liquid suction rollers 11, a plurality of liquid suction rollers 111 are provided on each liquid suction roller 11, liquid suction holes 112 are provided on the liquid suction rollers 111, and the cleaning component 3 is used for cleaning the liquid suction holes 112 on a side of the liquid suction roller 11 away from the circuit board.

As shown in fig. 1, in structure, a transfer assembly 1 is used to limit and transfer a circuit board when the circuit board is produced by etching. The etching component 2 is used for spraying etching liquid to the circuit board on the conveying component 1, so that the circuit board on the conveying component 1 is etched.

As shown in fig. 1, the conveying assembly 1 comprises a plurality of mutually parallel liquid suction rollers 11, and the liquid suction rollers 11 can specifically limit and convey a circuit board.

As shown in fig. 2 and 3, the liquid suction roller 111 is provided with a liquid suction hole 112, the liquid suction hole 112 is used for sucking the etching liquid, and the etching liquid on the circuit board is timely sucked through the liquid suction hole 112, so that the etching liquid can be prevented from remaining on the surface of the circuit board or in the etching groove, the problem of different local etching degrees of the circuit board can be avoided, the uniformity of the etching procedure of the circuit board can be ensured,

in terms of structure, the rotation shaft of the liquid suction roller 11 is of a hollow pipe structure, the hollow pipe structure of the liquid suction roller 11 is communicated with the liquid suction holes 112 of the liquid suction roller wheel 111, and when the hollow pipe structure of the liquid suction roller 11 is sucked, the purpose of sucking etching liquid from the liquid suction holes 112 to the hollow pipe structure of the rotation shaft of the liquid suction roller 11 can be achieved by sucking the liquid suction holes 112 of the liquid suction roller 11 under negative pressure, so that the purpose of sucking etching liquid from the rotation shaft of the liquid suction roller 11 is achieved.

In actual use, since chemical substances, corrosion products, dirt, impurities and other substances which need to be cleaned later are often present on the circuit board in the etching of the circuit board, the liquid suction holes 112 are likely to be blocked due to the chemical substances, corrosion products, dirt and impurities which are generated in the etching and remain on the circuit board when the etching liquid is sucked, and in actual use, the liquid suction holes 112 can be cleaned on one side of the liquid suction roller 11 away from the circuit board through the cleaning component 3, so that the chemical substances, corrosion products, dirt and impurities at the mouth parts of the liquid suction holes 112 can be timely cleaned.

The beneficial effects that the realization mode brought above are that, through carrying out timely clearance of chemical substance, corrosion product, dirt and impurity to the imbibition hole 112 of imbibition roller 11, can carry out timely cleanness to the imbibition hole 112 of imbibition roller 11, improved imbibition hole 112 to the clear efficiency of etching solution, can improve the stability of imbibition hole 112 to the etching solution suction function, improved the stability of the etching quality in the circuit board etching process, improved the production quality of circuit board.

In some implementations, the cleaning device further comprises a liquid suction assembly 4 and a control assembly 5, the liquid suction assembly 4 is respectively communicated with the liquid suction holes 112 on each liquid suction roller 11 through liquid suction gas paths 41, a negative pressure sensor 411 for detecting suction pressure is arranged on the liquid suction gas paths 41, and the cleaning assembly 3, the negative pressure sensor 411 and the liquid suction assembly 4 are respectively electrically connected with the control assembly 5.

Fig. 4 is a schematic top view of a conveying assembly according to an embodiment of the present application, fig. 5 is a schematic top view of another conveying assembly according to an embodiment of the present application, fig. 6 is a schematic top view of another conveying assembly according to an embodiment of the present application, fig. 8 is a schematic control structure of an etching device for manufacturing a circuit board according to an embodiment of the present application, as shown in fig. 4 to fig. 6 and fig. 8, the liquid suction assembly 4 is a power assembly for sucking etching liquid, and the liquid suction assembly 4 is respectively communicated with the liquid suction holes 112 on the liquid suction roller 111 on each liquid suction roller 11 through the liquid suction air channels 41, so that negative pressure generated by the liquid suction assembly 4 can suck etching liquid on the circuit board through the liquid suction holes 112 through the liquid suction air channels 41.

Structurally, the suction gas path 41 is provided with a negative pressure sensor 411 for detecting suction pressure, the negative pressure on the suction gas path 41 can be detected by the negative pressure sensor 411, and when the negative pressure value on the suction gas path 41 is abnormal, the suction component 4 and the cleaning component 3 can be controlled in a targeted manner.

When the etching device is used, the control assembly 5 is used for carrying out centralized control on the etching device for manufacturing the circuit board, the cleaning assembly 3, the negative pressure sensor 411 and the liquid suction assembly 4 are respectively and electrically connected with the control assembly 5, so that the control assembly 5 can control the working states of the cleaning assembly 3 and the liquid suction assembly 4 according to the detection value of the negative pressure sensor 411.

Illustratively, the liquid suction assembly 4 may include a pump body, a gas-liquid separator, and a filter connected in this order, and the liquid suction assembly 4 sucks the etching liquid by generating negative pressure, separates gas from the etching liquid by the gas-liquid separator, and filters impurities in the etching liquid by the filter.

Illustratively, when the negative pressure value detected by the negative pressure sensor 411 is too large, it is indicated that the suction hole 112 may be blocked at this time, so that the negative pressure detection value of the negative pressure sensor 411 is too large, and the suction hole 112 needs to be cleaned to eliminate the blocking of the suction hole 112. When the liquid suction hole 112 is cleaned, the liquid suction hole 112 can be cleaned through the cleaning assembly 3, so that the blocking condition of the liquid suction hole 112 is eliminated, and the liquid suction hole 112 can be ensured to effectively suck etching liquid.

The realization mode has the beneficial effects that through cleaning the imbibition hole through cleaning assembly when the negative pressure value that negative pressure sensor detected is too big, realized the cleanness to imbibition hole department, improved the stability that imbibition hole was taken the etching solution, improved the stability to the quality of circuit board production.

In some implementations, the cleaning assembly 3 includes a liquid jet head 31, a liquid jet valve 32, and a cleaning pump 33, the cleaning pump 33 is connected to the liquid jet valve 32 and the liquid jet head 31 in order by pipes, the liquid jet valve 32 is disposed on the liquid jet head 31, the liquid jet head 31 jets the etching liquid along the tangential direction of the liquid suction roller 11, and the liquid jet valve 32 is electrically connected to the control assembly 5.

As shown in fig. 1 to 3, the cleaning unit 3 includes a liquid ejecting head 31 for ejecting an etching liquid, a liquid ejecting valve 32 for controlling opening and closing of the liquid ejecting head 31, and a cleaning pump 33 for pumping the etching liquid, the liquid ejecting valve 32 is provided on the liquid ejecting head 31, and when the liquid ejecting valve 32 is opened, the etching liquid can be ejected through the liquid ejecting head 31, and further cleaning is performed at the liquid suction hole 112 through the liquid ejecting head 31; when the liquid ejection valve 32 is closed, the ejection of the etching liquid from the liquid ejection head 31 can be stopped, and the ejection of the etching liquid from the liquid ejection head 31 can be stopped.

In use, the cleaning pump 33 is used for pumping the etching liquid, and the cleaning pump 33 is sequentially connected with the liquid spraying valve 32 and the liquid spraying head 31 through pipelines, so that the cleaning pump 33 can sequentially spray the etching liquid to the liquid sucking holes 112 through the liquid spraying valve 32 and the liquid spraying head 31 through the pipelines, and the cleaning of the liquid sucking holes 112 is realized.

In use, the spray direction of the liquid spray head 31 is along the tangential direction of the liquid suction roller 11, so that the liquid spray head 31 can spray etching liquid along the tangential direction of the liquid suction roller 11, and cleaning of the liquid suction holes 112 along the tangential direction of the liquid suction roller 11 is realized.

Structurally, the liquid spray valve 32, the cleaning pump 33 and the control assembly 5 are electrically connected so that the control assembly 5 can control the operation state of the liquid spray valve 32.

Illustratively, when cleaning the liquid suction hole 112, the liquid suction hole 112 can be cleaned by spraying the etching liquid through the liquid spraying head 31 to eliminate the blocking condition at the liquid suction hole 112, so that the liquid suction hole 112 can suck the etching liquid effectively.

Illustratively, each of the liquid suction rollers 11 has a plurality of liquid jet heads 31, and one liquid suction roller 111 is cleaned by one liquid jet head 31.

When the cleaning device is used, chemical substances, corrosion products, dirt and impurities separated from the liquid suction holes 112 can be cleaned in the subsequent cleaning process of the circuit board when the liquid suction holes 112 are cleaned, so that the effect of stably sucking etching liquid in the etching process is ensured.

The realization mode has the beneficial effects that the liquid suction holes are cleaned by spraying the etching liquid through the liquid spraying head, so that the cleaning effect of the liquid suction holes is ensured.

The beneficial effect that above-mentioned realization mode brought also lies in, and the etching solution that sprays through the hydrojet head can not exert an influence to the etching process of script, and the etching solution that the hydrojet head sprayed can continue to exert etching action in the subsequent etching process, has guaranteed the stability to circuit board etching.

In some implementations, the conveying assembly 1 further includes a plurality of support rollers 12 parallel to each other, each support roller 12 is provided with a plurality of support rollers 121, the support rollers 121 are used for supporting the circuit board, the liquid suction rollers 11 and the support rollers 12 are arranged at intervals, the diameter of the liquid suction rollers 111 is greater than that of the support rollers 121, and the elasticity of the support rollers 121 is smaller than that of the liquid suction rollers 111.

As shown in fig. 1 to 6, in structure, the transfer assembly 1 further includes a plurality of support rollers 12, the plurality of support rollers 12 being disposed parallel to each other, the plurality of support rollers 12 being for supporting the circuit board.

Structurally, the elasticity of the supporting roller 121 is smaller than that of the liquid absorbing roller 111, so that the supporting roller 121 mainly plays a role in rigidly supporting the circuit board, and stability of the circuit board in conveying can be guaranteed. Meanwhile, the elasticity of the liquid suction roller 111 is larger than that of the supporting roller 121, so that the supporting roller 121 can play a certain flexible limiting role on the circuit board, the purpose of buffering vibration of the circuit board in transmission is achieved, and the stability of the circuit board in transmission is improved.

Structurally, the liquid suction roller 11 and the support roller 12 are partially overlapped in the conveying direction, so that the liquid suction roller 11 and the support roller 12 can mutually cooperate to limit and support the circuit board, and the stability of the circuit board in conveying is improved.

In structural arrangement, the liquid suction roller 11 and the support roller 12 are arranged at intervals, so that flexible limit of the liquid suction roller 11 and rigid support of the support roller 12 can be matched more uniformly to limit and support the circuit board more stably, and stability in circuit board conveying is further improved.

Structurally, the diameter of the liquid suction roller 111 is larger than that of the supporting roller 121, and the elasticity of the supporting roller 121 is smaller than that of the liquid suction roller 111, so that the liquid suction roller 111 with larger diameter can generate certain deformation when limiting a circuit board, the liquid suction roller 111 flexibly limits the circuit board, meanwhile, the liquid suction holes 112 of the liquid suction roller 111 are tightly attached to the circuit board, and the suction effect of etching liquid on the circuit board is improved.

The beneficial effect that foretell realization mode brought lies in, can carry out more stable spacing and support to the circuit board through the spacing of flexibility of liquid suction roller and the rigid support of backing roll, has further improved the stability in the circuit board conveying.

The beneficial effect that foretell realization brought also lies in that, and the elasticity of back-up roll is less than the elasticity of imbibition running roller for the great imbibition running roller of diameter can produce certain deformation when spacing circuit board, makes imbibition running roller carry out the inseparabler of imbibition hole and the laminating of circuit board of imbibition running roller when flexible spacing to the circuit board, has improved the suction effect to the etching solution on the circuit board.

In some implementations, the circumferential direction of the liquid suction roller 111 is provided with an annular liquid suction groove 113, the cross section of the liquid suction groove 113 is V-shaped, semicircular or arched, and the large end of the opening of the liquid suction groove 113 is arranged on the circumferential direction of the liquid suction roller 111, and the liquid suction hole 112 is communicated with the liquid suction groove 113.

Fig. 7 is a schematic view of a part B of the conveying assembly in fig. 4, as shown in fig. 7, in the structure, an annular liquid suction groove 113 is formed in the circumferential direction of the liquid suction roller 111, and when the liquid suction roller 111 is attached to a circuit board, etching liquid on the circuit board can be sucked through the liquid suction groove 113, so that the sucking effect on the etching liquid on the circuit board is improved.

Illustratively, the cross-section of the suction tank 113 in FIG. 7 is "V" shaped, and the cross-section of the suction tank 113 may be semicircular or arcuate.

Structurally, the large end of the opening of the liquid suction groove 113 is arranged on the circumference of the liquid suction roller 111, and the liquid suction hole 112 is communicated with the liquid suction groove 113, so that when the etching liquid is sucked into the liquid suction hole 112 through the liquid suction groove 113, the etching liquid is prevented from being blocked by the circuit board, and the suction effect on the etching liquid is improved.

The realization mode has the beneficial effects that when the etching liquid is pumped into the liquid suction holes through the liquid suction grooves, the etching liquid is prevented from being blocked by the circuit board, and the pumping effect on the etching liquid is improved.

The realization mode has the beneficial effects that as the liquid suction roller has certain elasticity, when the liquid suction roller is elastically deformed, the liquid suction groove is arranged, so that the liquid suction hole for sucking etching liquid in the liquid suction hole can be prevented from being blocked by the circuit board, and the suction effect of the liquid suction roller on the etching liquid is improved.

In some implementations, the liquid absorbing roller 111 includes a ring body 111a and a flexible ring 111b, the flexible ring 111b is sleeved on the ring body 111a, the ring body 111a is of a rigid structure, the flexible ring 111b is of a flexible structure, the liquid absorbing groove 113 is arranged on the flexible ring 111b, and the liquid absorbing hole 112 sequentially penetrates through the ring body 111a, the flexible ring 111b and the liquid absorbing groove 113 to be communicated.

As shown in fig. 1 to 3, in the structure, the liquid absorbing roller 111 includes a ring body 111a and a flexible ring 111b, the flexible ring 111b is sleeved on the ring body 111a, the ring body 111a is of a rigid structure, the flexible ring 111b is of a flexible structure, so that the ring body 111a plays a role in supporting the ring body 111a, the ring body 111a and the flexible ring 111b are mutually matched to improve the integral structural strength of the liquid absorbing roller 111, the liquid absorbing roller 111 also has certain elasticity, and the stable limiting effect of the liquid absorbing roller 111 on a circuit board in use is ensured.

Structurally, the liquid suction grooves 113 are formed in the flexible ring 111b, and the liquid suction holes 112 sequentially penetrate through the ring body 111a, the flexible ring 111b and the liquid suction grooves 113, so that the flexible ring 111b is of a flexible structure with certain elasticity, and the suction effect on etching liquid can be guaranteed through the liquid suction grooves 113 formed in the flexible ring 111 b.

The liquid suction roller has the beneficial effects that the liquid suction roller is arranged into the ring body and the flexible ring, the ring body and the flexible ring are mutually matched, so that the overall structural strength of the liquid suction roller is improved, the liquid suction roller has certain elasticity, and the stable limiting effect of the liquid suction roller on the circuit board in use is ensured.

In some implementations, the plurality of suction rolls 111 on each suction roll 11 are uniformly disposed on the suction roll 11, or the intervals between the plurality of suction rolls 111 on each suction roll 11 gradually increase from the middle of the suction roll 11 toward both ends of the suction roll 11. The intervals between the plurality of support rollers 121 on each support roller 12 gradually decrease from the middle of the support roller 12 toward both ends of the support roller 12.

As shown in fig. 4, the plurality of suction rollers 111 on each suction roller 11 are uniformly disposed on the suction roller 11, so that the plurality of suction rollers 111 on each suction roller 11 can uniformly suck the etching liquid on the circuit board, thereby improving the uniformity of the suction of the etching liquid on the circuit board.

As shown in fig. 6, when the circuit in the middle of the circuit board is denser, the etching solution to be sprayed and the etching solution to be pumped in the middle of the circuit board are more, the intervals between the plurality of liquid suction rollers 111 on each liquid suction roller 11 are gradually increased from the middle of the liquid suction roller 11 to the two ends of the liquid suction roller 11, so that the effect of pumping the circuit board from the middle to the two sides is gradually weakened, and when the etching solution in the middle of the circuit board is more, the etching solution in the middle of the circuit board is timely and efficiently pumped out by arranging more liquid suction rollers 111 in the middle of the circuit board, and the uniformity of the etching effect of the circuit board is ensured.

As shown in fig. 5, when the circuit in the middle of the circuit board is denser, in order to reduce the impact of the supporting rollers 12 on the extrusion of the circuit in the middle of the circuit board, the intervals between the supporting rollers 121 on each supporting roller 12 gradually decrease from the middle of the supporting roller 12 to the two ends of the supporting roller 12, so that the supporting rollers 121 in the middle of the circuit board are less extruded, the impact of the supporting rollers 121 on the whole circuit of the circuit board is reduced, and the production quality of the circuit board is improved.

The realization mode has the beneficial effects that the etching liquid on the circuit board is uniformly pumped through the plurality of the liquid suction rollers on each liquid suction roller, so that the uniformity of pumping the etching liquid on the circuit board is improved.

The circuit board has the beneficial effects that when the circuit in the middle of the circuit board is denser, the etching liquid to be sprayed and the etching liquid to be pumped in the middle of the circuit board are more, and the etching liquid in the middle of the circuit board is pumped out efficiently in time by arranging more liquid suction rollers in the middle of the circuit board, so that the uniformity of the etching effect of the circuit board is ensured.

The beneficial effect that foretell realization mode brought also lies in, when the circuit at circuit board middle part was comparatively intensive, and the interval between a plurality of backing rolls on every backing roll reduces gradually from the middle part of backing roll to the both ends of backing roll for the extrusion that the backing roll received at circuit board middle part is less, has reduced the influence that the backing roll produced the whole circuit of circuit board, has improved the production quality of circuit board.

Fig. 9 is a schematic flow chart of an etching method for circuit board manufacturing in the embodiment of the present application, and as shown in fig. 9, the embodiment of the present application further provides an etching method for circuit board manufacturing, which is applied to the etching apparatus for circuit board manufacturing described above, and the etching method for circuit board manufacturing includes S110 to S120, and S110 to S120 are specifically described below.

And S110, spraying etching liquid to the circuit board on the conveying assembly 1 through the etching assembly 2 in the etching process, opening the liquid suction assembly 4 to suck the etching liquid, and respectively acquiring the negative pressure detection value of the negative pressure sensor 411 corresponding to each liquid suction roller 11.

In the etching step, the etching liquid is sprayed to the circuit board on the transfer unit 1 by the timing unit 2, and the circuit board is etched by the etching liquid. Meanwhile, the etching liquid is sucked through the liquid suction component 4, so that the etching liquid on the circuit board is timely pumped away, the etching liquid can be prevented from remaining on the surface of the circuit board or in the etching groove, the problem that the local etching degree of the circuit board is different can be avoided, the uniformity of the etching process of the circuit board can be ensured, and the etching production quality of the circuit board is improved.

When in use, the negative pressure detection value of the negative pressure sensor 411 corresponding to each liquid suction roller 11 is obtained respectively, so that the effect of sucking etching liquid by each liquid suction roller 11 can be determined according to the negative pressure value in the liquid suction air path 41 of each liquid suction roller 11, and when the negative pressure value in the liquid suction air path 41 corresponding to the liquid suction roller 11 is abnormal, the situation that the liquid suction hole 112 is blocked is indicated, and at the moment, the liquid suction hole 112 can be cleaned.

And S120, when the negative pressure detection value corresponding to the liquid suction roller 11 is larger than a preset negative pressure value, opening the liquid spraying valve 32 corresponding to the liquid suction roller 11, and spraying etching liquid to the liquid suction roller 11 to clean the liquid suction roller 11.

When the negative pressure detection value corresponding to the liquid suction roller 11 is larger than the preset negative pressure value, the situation that the liquid suction holes 112 on the liquid suction rollers 111 on the liquid suction roller 11 are blocked is severe, and at the moment, the liquid spraying valve 32 corresponding to the liquid suction roller 11 is opened through the control component 5, so that the liquid spraying head 31 can spray etching liquid to the liquid suction roller 11 to clean the liquid suction roller 11, the liquid suction holes 112 on the liquid suction rollers 111 on the corresponding liquid suction roller 11 are cleaned and blocked, and the etching liquid can be smoothly sucked through the liquid suction holes 112 on the liquid suction rollers 111 on the liquid suction roller 11.

The preset negative pressure value may be, for example, 1500Pa to 2000Pa.

The implementation mode has the beneficial effects that when the negative pressure detection value corresponding to the liquid suction roller is larger than the preset negative pressure value, the situation that each liquid suction hole on a plurality of liquid suction rollers on the liquid suction roller is blocked is serious, each liquid suction hole on a plurality of liquid suction rollers on the liquid suction roller is cleaned and blocked, and each liquid suction hole on a plurality of liquid suction rollers on the liquid suction roller can suck etching liquid smoothly.

In some implementations, the method further includes: when the detected negative pressure value corresponding to the suction roller 11 is less than or equal to the preset negative pressure value, the liquid spraying valve 32 corresponding to the suction roller 11 is closed, and the etching liquid is stopped from being sprayed to the suction roller 11.

When the circuit board etching liquid suction device is used, when the negative pressure detection value corresponding to the liquid suction roller 11 is smaller than or equal to the preset negative pressure value, the fact that the liquid suction holes 112 on the liquid suction roller 111 on the liquid suction roller 11 are not seriously blocked is indicated, and etching liquid on the circuit board can be sucked through the liquid suction holes 112 without cleaning the liquid suction holes 112 on the liquid suction roller 11, so that the purpose of timely sucking the etching liquid is achieved.

When the negative pressure detection value corresponding to the liquid suction roller 11 is smaller than or equal to the preset negative pressure value (when the negative pressure detection value is within the normal range), the liquid spray valve 32 corresponding to the liquid suction roller 11 can be closed, and the etching liquid is stopped from being sprayed to the liquid suction roller 11, so that the etching liquid amount on the circuit board can be ensured to be within the normal range, and the etching liquid amount for etching the circuit board can be ensured to be within the normal range.

The implementation mode has the beneficial effects that when the negative pressure detection value corresponding to the liquid suction roller is smaller than or equal to the preset negative pressure value, the liquid spraying valve of the liquid spraying head corresponding to the liquid suction roller can be closed, and then the etching liquid is stopped from being sprayed to the liquid suction roller, so that the etching liquid on the circuit board can be ensured to be in a normal range, and the etching liquid for etching the circuit board can be ensured to be in a normal range.

In some implementations, the method further includes S210 to S230, and S210 to S230 are specifically described below.

In the process of etching the circuit board, the thickness of the copper foil to be etched on the circuit board often varies, so that the etching process of the circuit board can be accurately controlled in the actual etching process, thereby improving the etching quality of the circuit board. In some situations, the copper foil to be etched has a larger thickness, so that more etching liquid and longer etching time are needed, and the method can ensure the etching effect on the circuit board when the thickness of the copper foil of the circuit board is larger through S210 to S230.

S210, dividing the conveying assembly 1 into a pre-etching section and an etching section according to the etching thickness of the circuit board to be etched, and respectively configuring the liquid suction assembly 4 for the pre-etching section and the etching section.

When in use, the conveying assembly 1 can be divided into a pre-etching section and an etching section according to the etching thickness of the circuit board to be etched, wherein the pre-etching section is a stage of pre-etching the circuit board, and sufficient etching liquid can pass through the pre-etching section to realize primary etching of the surface layer of the copper foil of the circuit board.

Illustratively, when the copper foil thickness of the circuit board is greater, the length of the pre-etched segment may be increased, correspondingly decreasing the length of the etched segment; when the copper foil thickness of the circuit board is small, the length of the pre-etched section can be reduced, and the length of the etched section is correspondingly increased.

The etching section is a stage for continuing to etch the circuit board after the pre-etching section, in the etching section, as the primary etching of the surface layer of the copper foil of the circuit board in the pre-etching section is performed, etching liquid can be timely pumped away from the circuit board in the etching section, so that the etching liquid is prevented from remaining on the surface of the circuit board or in an etching groove, the problem of different local etching degrees of the circuit board can be avoided, the uniformity of the etching process of the circuit board in the etching section can be ensured, and the etching production quality of the circuit board is improved.

Structurally, the liquid suction units 4 are respectively arranged on the pre-etching section and the etching section, and etching liquid on the pre-etching section and the etching section can be respectively sucked through the liquid suction units 4.

S220, spraying etching liquid to the circuit board on the conveying assembly 1 through the etching assembly 2 in the pre-etching section, closing the liquid suction assembly 4 corresponding to the pre-etching section, and opening the liquid spraying valve 32 corresponding to the liquid suction roller 11 corresponding to the pre-etching section to supplement the etching liquid to the circuit board in the pre-etching section.

When the etching device is used, in the pre-etching section, etching liquid is sprayed to the circuit board on the conveying assembly 1 through the etching assembly 2, so that the etching assembly 2 can spray sufficient etching liquid to the circuit board, and the liquid suction assembly 4 corresponding to the pre-etching section is closed, so that the etching liquid can be prevented from being pumped away too quickly, and the copper foil on the surface layer of the circuit board is fully etched in the pre-etching section by the etching liquid.

When the liquid suction device is used, the liquid spraying valve 32 corresponding to the liquid suction roller 11 corresponding to the pre-etching section can be opened to supplement etching liquid to the circuit board in the pre-etching section, the liquid spraying valve 32 is used for controlling the liquid spraying head 31 to be opened, so that the etching liquid can be further supplemented to the circuit board in the pre-etching section, the effective supplementation to the pre-etching section can be realized, and the effect of etching the circuit board in the pre-etching section is further improved.

Because the liquid spraying head 31 shields the etching liquid sprayed by the etching component 2, the liquid spraying valve 32 controls the liquid spraying head 31 to be opened to supplement the etching liquid to the circuit board, and the liquid spraying head 31 is opposite to the position where the liquid absorbing roller 11 is positioned, the influence of uneven distribution of the etching liquid caused by the shielding of the etching liquid sprayed by the liquid spraying head 31 to the etching component 2 can be avoided, and the uniformity of the etching effect on the circuit board is improved.

S220, spraying etching liquid to the circuit board on the conveying assembly 1 through the etching assembly 2 in the etching section, opening the liquid suction assembly 4 corresponding to the etching section, closing the liquid spraying valve 32 corresponding to the liquid suction roller 11 corresponding to the etching section, and cleaning the liquid suction hole 112 through the cleaning assembly 3 in the etching section.

In the etching section, the etching component 2 can continuously spray the etching liquid to the circuit board on the conveying component 1, so that the etching component 2 can continuously supplement the etching liquid to the circuit board on the conveying component 1, and the etching process of the circuit board can be continuously finished.

In the etching section, in order to avoid the problem that etching liquid remains on the surface of the circuit board or in the etching groove, so as to avoid the problem of different local etching degrees of the circuit board, the liquid suction component 4 corresponding to the etching section can be opened, the liquid spraying valve 32 corresponding to the liquid suction roller 11 corresponding to the etching section is closed, and the purpose of ensuring the etching quality in the etching section is realized.

In the etching section, the liquid suction hole 112 can be cleaned through the cleaning component 3 by the flow in the method, so that the cleaning component 3 is guaranteed to timely clean the liquid suction hole 112, and the cleanliness of the liquid suction hole 112 is improved.

Illustratively, the value of the etching liquid pressure of the cleaning component 3 corresponding to the pre-etching section is smaller than that of the cleaning component 3 corresponding to the etching section, so that the splashing and the pressure of the etching liquid are reduced when the cleaning component 3 of the pre-etching section sprays the etching liquid, the influence on etching caused by overlarge pressure of the cleaning component 3 when the circuit board in the pre-etching section sprays the supplementary etching liquid can be avoided, and the cleanliness of equipment of the pre-etching section can be improved.

Meanwhile, the etching liquid pressure value of the cleaning assembly 3 corresponding to the pre-etching section is smaller than that of the cleaning assembly 3 corresponding to the etching section, when the cleaning assembly 3 cleans the liquid suction hole 112 in the etching section, the liquid suction hole 112 can be effectively cleaned by the etching liquid with larger pressure, effective cleaning of the liquid suction hole 112 is guaranteed, and timely pumping of the etching liquid is guaranteed.

Illustratively, the pressure of the etching solution in the pre-etching section may be 0.05MPa to 0.1MPa, and the pressure of the etching solution in the etching section may be 0.2MPa to 0.4MPa.

The realization mode has the beneficial effects that the conveying assembly is divided into the pre-etching section and the etching section according to the etching thickness of the circuit board to be etched, the pre-etching section is used for pre-etching the circuit board, and sufficient etching liquid can be used for realizing primary etching of the surface layer of the copper foil of the circuit board in the pre-etching section, so that the circuit board can be fully etched when the copper foil of the circuit board is large in thickness.

The beneficial effect that the realization mode mentioned above brought also lies in, in the etching section in advance, sprays etching solution to the circuit board on the conveying subassembly through etching component for etching component can spray sufficient etching solution to the circuit board on, and close the imbibition subassembly that etching section corresponds in advance, can avoid etching solution to be taken out too fast, realized that etching solution carries out abundant etching to the copper foil on the top layer of circuit board in the etching section in advance.

The liquid suction assembly corresponding to the etching section is opened in the etching section, the liquid spraying valve corresponding to the liquid suction roller corresponding to the etching section is closed, etching liquid can be prevented from remaining on the surface of the circuit board or in the etching groove, the problem that the etching degree of the circuit board is different is avoided, the purpose of ensuring the etching quality in the etching section is achieved, the liquid suction hole is cleaned by controlling the liquid spraying head, effective cleaning of the liquid suction hole can be guaranteed, and timely pumping-away of the etching liquid is guaranteed.

The implementation mode has the beneficial effects that the etching liquid pressure value of the cleaning component corresponding to the pre-etching section is smaller than that of the cleaning component corresponding to the etching section, so that the influence on etching caused by overlarge pressure of the cleaning component in spraying the supplementary etching liquid on the circuit board in the pre-etching section can be avoided, and the cleanliness of equipment of the pre-etching section can be improved; meanwhile, when the cleaning assembly cleans the liquid suction hole in the etching section, the liquid suction hole can be effectively cleaned by the etching liquid with larger pressure, so that the effective cleaning of the liquid suction hole is ensured, and the timely pumping-off of the etching liquid is ensured.

In some implementations, the method further includes S310 to S320, where the liquid suction holes 112 may be cleaned according to different pressure levels through S310 to S320, and S310 to S320 are described in detail below.

And S310, when the negative pressure detection value corresponding to the liquid suction roller 11 is larger than a preset negative pressure value, setting the etching liquid pressure value of the cleaning assembly 3 to be a first pressure value, opening the liquid spraying valve 32 corresponding to the liquid suction roller 11, and spraying etching liquid to the liquid suction roller 11 to clean the liquid suction roller 11 for a first time period.

When the liquid suction holes 112 on the liquid suction roller 11 are cleaned, the liquid spray valve 32 corresponding to the liquid suction roller 11 can be opened, so that the cleaning assembly 3 is controlled to clean the liquid suction holes 112 according to the first pressure value in a first time period.

Illustratively, the first pressure value may be 0.2MPa to 0.4MPa and the first time period may be 30s to 60s.

And S320, after the first time period, when the negative pressure detection value is continuously larger than a preset negative pressure value, reducing the conveying speed of the conveying assembly 1, setting the etching liquid pressure value of the cleaning assembly 3 to be a second pressure value, opening the liquid spraying valve 32 corresponding to the liquid suction roller 11, and spraying etching liquid to the liquid suction roller 11 to clean the liquid suction roller 11 for a second time period. Wherein the second pressure value is greater than the first pressure value.

In use, if the suction hole 112 is cleaned by the first time period, if the cleaning effect on the suction hole 112 is not good, the pressure for cleaning the suction hole 112 can be continuously increased, and further cleaning of the suction hole 112 is attempted.

After the first period, when the detected negative pressure value corresponding to the suction roll 11 is continuously greater than the preset negative pressure value, it is indicated that the cleaning effect of the suction hole 112 on the suction roll 11 is not good, at this time, the etching liquid pressure of the cleaning assembly 3 can be increased to the second pressure value, and the suction hole 112 is cleaned by the etching liquid pressure increased by the cleaning assembly 3, specifically, the etching liquid is sprayed to the suction roll 11 to clean the suction roll 11 for the second period, that is, the cleaning is continued for the second period.

When the cleaning unit 3 cleans the suction roll 11 at the second pressure value for the second period of time, the conveying speed of the conveying unit 1, that is, the rotation speed of the suction roll 11 may be reduced, so that the cleaning effect on the suction roll 11 may be improved.

Illustratively, the second pressure value may be 0.5MPa and the second time period may be 20s to 50s.

The liquid suction roller has the beneficial effects that when the cleaning effect on the liquid suction holes on the liquid suction roller is poor, the etching liquid pressure of the cleaning assembly can be increased, the liquid suction holes are cleaned through the etching liquid pressure increased by the cleaning assembly, and the cleaning effect on the liquid suction holes can be improved.

In some implementations, the method further includes: after the second period, when the negative pressure detection value is continuously greater than the preset negative pressure value, stopping inputting the circuit board to the conveying component 1, controlling the liquid suction roller 11 of the conveying component 1 to reversely convey, setting the etching liquid pressure value of the cleaning component 3 to be a third pressure value, opening the liquid spraying valve 32 corresponding to the liquid suction roller 11, and spraying etching liquid to the liquid suction roller 11 to clean the liquid suction roller 11 for the third period. Wherein the third pressure value is greater than the second pressure value.

After increasing the pressure of the etching liquid of the cleaning assembly 3 and cleaning the suction roller 11 for the second period of time, when the negative pressure detection value is continuously greater than the preset negative pressure value, the input of the circuit board to the transfer assembly 1 may be stopped, and further cleaning of the suction roller 11 may be performed.

When cleaning the suction roller 11, the suction roller 11 of the transfer assembly 1 may be controlled to be reversely transferred, that is, the suction roller 11 is controlled to reversely rotate in the normal transfer direction, the etching liquid pressure value of the cleaning assembly 3 is set to a third pressure value larger than the second pressure value, the liquid spraying valve 32 corresponding to the suction roller 11 is opened, and the etching liquid is sprayed to the suction roller 11 to clean the suction roller 11 for a third period of time.

When the cleaning device is used, the liquid suction holes 112 on the liquid suction roller 11 can be flushed in the opposite direction by controlling the liquid suction roller 11 to rotate in the opposite direction of the normal conveying direction, so that the cleaning effect on the liquid suction roller 11 is improved.

Illustratively, the third pressure value may be 0.6MPa to 2MPa and the third time period may be 80s to 160s.

The realization mode has the beneficial effects that the cleaning effect of the cleaning assembly can be improved by controlling the reverse rotation of the liquid suction roller according to the normal conveying direction and setting the etching liquid pressure value of the cleaning assembly to be a third pressure value larger than the second pressure value.

The foregoing description of the preferred embodiments of the present application is not intended to be limiting, but is intended to cover any and all modifications, equivalents, and alternatives falling within the spirit and principles of the present application.

Claims (9)

1. The etching device for manufacturing the circuit board is characterized by comprising a conveying component (1), an etching component (2) and a cleaning component (3), wherein the conveying component (1) is used for conveying the circuit board, the etching component (2) is used for spraying etching liquid to the circuit board on the conveying component (1), the conveying component (1) comprises a plurality of mutually parallel liquid suction rollers (11), a plurality of liquid suction rollers (111) are arranged on each liquid suction roller (11), liquid suction holes (112) are formed in each liquid suction roller (111), and the cleaning component (3) is used for cleaning the liquid suction holes (112) on one side, far away from the circuit board, of the liquid suction rollers (11);

still include imbibition subassembly (4) and control assembly (5), imbibition subassembly (4) are through imbibition gas circuit (41) respectively with imbibition hole (112) on every imbibition roller (11) intercommunication, be equipped with on imbibition gas circuit (41) and be used for detecting suction pressure's negative pressure sensor (411), clean subassembly (3) negative pressure sensor (411) with imbibition subassembly (4) respectively with control assembly (5) electricity is connected.

2. Etching device for circuit board manufacture according to claim 1, characterized in that the cleaning assembly (3) comprises a liquid jet head (31), a liquid jet valve (32) and a cleaning pump (33), the cleaning pump (33) is connected with the liquid jet valve (32) and the liquid jet head (31) in sequence through pipelines, the liquid jet valve (32) is arranged on the liquid jet head (31), the liquid jet head (31) jets etching liquid along the tangential direction of the liquid suction roller (11), and the liquid jet valve (32), the cleaning pump (33) and the control assembly (5) are electrically connected.

3. Etching device for circuit board manufacture according to claim 2, characterized in that the transfer assembly (1) further comprises a plurality of mutually parallel support rollers (12), each support roller (12) is provided with a plurality of support rollers (121), the support rollers (121) are used for supporting the circuit board, the suction rollers (11) and the support rollers (12) are mutually spaced, the diameter of the suction rollers (111) is larger than that of the support rollers (121), and the elasticity of the support rollers (121) is smaller than that of the suction rollers (111).

4. An etching device for circuit board manufacture as claimed in claim 3, wherein an annular liquid suction groove (113) is provided in the circumferential direction of the liquid suction roller (111), the cross section of the liquid suction groove (113) is V-shaped, semicircular or arcuate, and the large end of the opening of the liquid suction groove (113) is provided in the circumferential direction of the liquid suction roller (111), and the liquid suction hole (112) is communicated with the liquid suction groove (113).

5. The etching device for manufacturing a circuit board according to claim 4, wherein the liquid suction roller (111) comprises a ring body (111 a) and a flexible ring (111 b), the flexible ring (111 b) is connected to the ring body (111 a) in a sleeved mode, the ring body (111 a) is of a rigid structure, the flexible ring (111 b) is of a flexible structure, the liquid suction groove (113) is formed in the flexible ring (111 b), and the liquid suction hole (112) sequentially penetrates through the ring body (111 a), the flexible ring (111 b) and the liquid suction groove (113) to be communicated.

6. The etching apparatus for circuit board production according to claim 5, wherein the plurality of suction rolls (111) on each suction roll (11) are uniformly arranged on the suction roll (11), or the intervals between the plurality of suction rolls (111) on each suction roll (11) gradually increase from the middle of the suction roll (11) to both ends of the suction roll (11); the spacing between the plurality of support rollers (121) on each support roller (12) gradually decreases from the middle of the support roller (12) to both ends of the support roller (12).

7. An etching method for circuit board fabrication, applied to the etching apparatus for circuit board fabrication according to claim 6, the method comprising:

spraying etching liquid to a circuit board on the conveying assembly (1) through the etching assembly (2) in the etching process, opening the liquid suction assembly (4) to suck the etching liquid, and respectively acquiring a negative pressure detection value of a negative pressure sensor (411) corresponding to each liquid suction roller (11);

when the negative pressure detection value corresponding to the liquid suction roller (11) is larger than a preset negative pressure value, a liquid spraying valve (32) corresponding to the liquid suction roller (11) is opened, and etching liquid is sprayed to the liquid suction roller (11) to clean the liquid suction roller (11).

8. The etching method for circuit board fabrication of claim 7, further comprising:

when the negative pressure detection value corresponding to the liquid suction roller (11) is smaller than or equal to a preset negative pressure value, a liquid spraying valve (32) corresponding to the liquid suction roller (11) is closed, and etching liquid is stopped from being sprayed to the liquid suction roller (11).

9. The etching method for circuit board fabrication of claim 8, further comprising:

dividing the conveying assembly (1) into a pre-etching section and an etching section according to the etching thickness of a circuit board to be etched, and respectively configuring the liquid suction assembly (4) for the pre-etching section and the etching section;

spraying etching liquid to the circuit board on the conveying assembly (1) through the etching assembly (2) in the pre-etching section, closing a liquid suction assembly (4) corresponding to the pre-etching section, and opening a liquid spraying valve (32) corresponding to the liquid suction roller (11) corresponding to the pre-etching section to supplement the etching liquid to the circuit board in the pre-etching section;

spraying etching liquid to the circuit board on the conveying assembly (1) through the etching assembly (2) in the etching section, opening a liquid suction assembly (4) corresponding to the etching section, and cleaning the liquid suction hole (112) through the cleaning assembly (3) in the etching section;

The etching liquid pressure value of the cleaning component (3) corresponding to the pre-etching section is smaller than that of the cleaning component (3) corresponding to the etching section.