CN104231994B - 黏合材料 - Google Patents
黏合材料 Download PDFInfo
- Publication number
- CN104231994B CN104231994B CN201310682272.XA CN201310682272A CN104231994B CN 104231994 B CN104231994 B CN 104231994B CN 201310682272 A CN201310682272 A CN 201310682272A CN 104231994 B CN104231994 B CN 104231994B
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- epoxy resin
- rubber
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- 239000000463 material Substances 0.000 title claims abstract description 89
- 230000001070 adhesive effect Effects 0.000 title abstract description 10
- 239000000853 adhesive Substances 0.000 title abstract 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 54
- 239000003822 epoxy resin Substances 0.000 claims abstract description 53
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 30
- 239000005060 rubber Substances 0.000 claims abstract description 26
- 229920001971 elastomer Polymers 0.000 claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 20
- 229920000642 polymer Polymers 0.000 claims abstract description 17
- 239000000203 mixture Substances 0.000 claims abstract description 11
- 229920000459 Nitrile rubber Polymers 0.000 claims description 20
- 229920002521 macromolecule Polymers 0.000 claims description 20
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 16
- 239000004593 Epoxy Substances 0.000 claims description 14
- 230000004048 modification Effects 0.000 claims description 14
- 238000012986 modification Methods 0.000 claims description 14
- 238000011049 filling Methods 0.000 claims description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 12
- 239000007769 metal material Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical group NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 7
- 150000004767 nitrides Chemical class 0.000 claims description 7
- 238000007711 solidification Methods 0.000 claims description 7
- 230000008023 solidification Effects 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 239000004202 carbamide Substances 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 229910017083 AlN Inorganic materials 0.000 claims description 4
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 238000005191 phase separation Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 125000003368 amide group Chemical group 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- 238000005088 metallography Methods 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 claims description 3
- IRLQAJPIHBZROB-UHFFFAOYSA-N buta-2,3-dienenitrile Chemical compound C=C=CC#N IRLQAJPIHBZROB-UHFFFAOYSA-N 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 125000004356 hydroxy functional group Chemical group O* 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 abstract description 21
- 239000000945 filler Substances 0.000 abstract description 4
- 238000005286 illumination Methods 0.000 abstract description 3
- 229920002725 thermoplastic elastomer Polymers 0.000 abstract description 2
- 229920003023 plastic Polymers 0.000 description 15
- 239000004033 plastic Substances 0.000 description 15
- 239000004416 thermosoftening plastic Substances 0.000 description 15
- 239000004568 cement Substances 0.000 description 14
- 239000013034 phenoxy resin Substances 0.000 description 11
- 229920006287 phenoxy resin Polymers 0.000 description 11
- -1 acryl Chemical group 0.000 description 10
- 229940106691 bisphenol a Drugs 0.000 description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- 229920003006 Polybutadiene acrylonitrile Polymers 0.000 description 6
- 239000004697 Polyetherimide Substances 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 229920001601 polyetherimide Polymers 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 239000004952 Polyamide Substances 0.000 description 5
- 239000004793 Polystyrene Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 5
- 229920002647 polyamide Polymers 0.000 description 5
- 229920002223 polystyrene Polymers 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- LRWZZZWJMFNZIK-UHFFFAOYSA-N 2-chloro-3-methyloxirane Chemical compound CC1OC1Cl LRWZZZWJMFNZIK-UHFFFAOYSA-N 0.000 description 4
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 4
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004695 Polyether sulfone Substances 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 229920001400 block copolymer Polymers 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920002492 poly(sulfone) Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229920006393 polyether sulfone Polymers 0.000 description 3
- 239000004848 polyfunctional curative Substances 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- PISLZQACAJMAIO-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine Chemical compound CCC1=CC(C)=C(N)C(CC)=C1N PISLZQACAJMAIO-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 2
- 229910015900 BF3 Inorganic materials 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 229940015043 glyoxal Drugs 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- IHHCJKNEVHNNMW-UHFFFAOYSA-N methane;phenol Chemical compound C.OC1=CC=CC=C1 IHHCJKNEVHNNMW-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 150000002924 oxiranes Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XLLXMBCBJGATSP-UHFFFAOYSA-N 2-phenylethenol Chemical compound OC=CC1=CC=CC=C1 XLLXMBCBJGATSP-UHFFFAOYSA-N 0.000 description 1
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 1
- AOFIWCXMXPVSAZ-UHFFFAOYSA-N 4-methyl-2,6-bis(methylsulfanyl)benzene-1,3-diamine Chemical compound CSC1=CC(C)=C(N)C(SC)=C1N AOFIWCXMXPVSAZ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229940123208 Biguanide Drugs 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
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- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 150000004662 dithiols Chemical class 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- JESXATFQYMPTNL-UHFFFAOYSA-N mono-hydroxyphenyl-ethylene Natural products OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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- 239000002002 slurry Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
- DSROZUMNVRXZNO-UHFFFAOYSA-K tris[(1-naphthalen-1-yl-3-phenylnaphthalen-2-yl)oxy]alumane Chemical compound C=1C=CC=CC=1C=1C=C2C=CC=CC2=C(C=2C3=CC=CC=C3C=CC=2)C=1O[Al](OC=1C(=C2C=CC=CC2=CC=1C=1C=CC=CC=1)C=1C2=CC=CC=C2C=CC=1)OC(C(=C1C=CC=CC1=C1)C=2C3=CC=CC=C3C=CC=2)=C1C1=CC=CC=C1 DSROZUMNVRXZNO-UHFFFAOYSA-K 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/02—Copolymers with acrylonitrile
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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Abstract
一种黏合材料，包含高分子成分、导热填料及固化剂。高分子成分占该黏合材料的体积百分比介于29%至60%之间，且包含热固型环氧树脂及可改善热固性环氧树脂耐冲击性的改质聚合物。该改质聚合物包含热塑型塑胶、橡胶或其混合物，且该改质聚合物占该高分子成分的体积百分比介于4%至45%之间。导热填料均匀分散于该高分子成分中，且占该黏合材料的体积百分比介于39%至70%之间。固化剂可在低于140℃的温度固化该热固型环氧树脂，占所述黏合材料的体积百分比介于0.1%至3%之间。该黏合材料的导热率大于3W/m‑K，具有高导热率及强黏着力，因此适用于例如LED照明的高导热需求。
Description
技术领域
本发明涉及一种黏合材料，特别是一种具有高导热率和耐冲击特性的绝缘黏合材料。
背景技术
当发光二极体(LED)于60年代被使用后，过去因使用功率不高，只拿来作为显示灯及讯号灯，故封装散热问题并未产生。但近年来使用于TV背光或照明用途的LED，其亮度、功率皆持续提升，因此散热逐渐成为LED照明产业的首要问题。
传统白炽灯有70%以红外线辐射方式进行散热，所以灯泡本体热累积现象轻微。而LED产生的光，大多分布在以可见光或紫外光居多，不容易以辐射方式帮助散热，又因LED封装面积较小，难以将热有效散出，导致LED容易热衰减，由此得知LED热能是目前急待解决的问题。
早期LED热源透过金属架往基板散热，传统的封装热阻相当大，约达250～350℃/W。之后，进而由表面贴合方式(SMD)于PCB基板上封装，主要是通过与基板贴合一起的FR4载板来导热，利用增加散热面积的方式来大幅降低其热阻值。但FR4本身热传导系数较低，在高功率的LED封装材料上不太适用。对于LED或其他发热元件或电子零件而言，目前亦有使用一片热传介面材料(thermal interface material)，将上述电子零部件与散热模组结合。传统上，热传介面材料是采用有机硅高分子系统，传统硅高分子虽然具有良好的低黏度与信赖性，但是硅高分子的成本较高。另外，虽然硅高分子具有较高的耐温性，但是使用一段时间后，会产生流油与劣化等缺点，产生更换维护的需求。
发明内容
本发明公开一种黏合材料，可制作成片状，除了具有高导热性外，同时具有绝缘和黏着特性，可以将金属与金属材料间黏合，或是电子零件与金属材料间黏合，而无需使用其他固定材料。
本发明公开一种黏合材料，其包含高分子成分、导热填料及固化剂。高分子成分占该黏合材料的体积百分比介于29%至60%之间，且包含热固型环氧树脂及可改善热固性环氧树脂耐冲击性的改质聚合物。该改质聚合物包含热塑型塑胶、橡胶或其混合物，且该改质聚合物占该高分子成分的体积百分比介于4%至45%之间。导热填料均匀分散于该高分子成分中，且占该黏合材料的体积百分比介于39%至70%之间。固化剂用以在低于温度140℃固化该热固型环氧树脂，且占所述黏合材料的体积百分比介于0.1%至3%之间。该黏合材料的导热率大于3W/m-K。
一实施例中，该改质聚合物包含橡胶，且其中橡胶占该黏合材料的体积百分比约介于1.5%至12%。
一实施例中，该黏合材料在制作成200μm厚度片材下的热阻率小于0.5℃/W。
一实施例中，该黏合材料与金属材料压着固化后，黏着力大于300g/cm2。
一实施例中，该固化剂可于80～105℃的温度下固化该热固型环氧树脂。
一实施例中，该热固型环氧树脂包括末端环氧官能团的环氧树脂、侧链型环氧官能团、或四官能团的环氧树脂或其混合物，例如：双酚A环氧树脂。
一实施例中，该热塑型塑胶包含苯氧树脂、聚砜、聚醚砜、聚苯乙烯、聚氧化二甲苯、聚苯硫醚、聚酰胺、聚亚酰胺、聚醚酰亚胺、聚醚酰亚胺与硅酮的嵌段共聚合物、聚氨酯、聚酯树脂、聚碳酸酯、聚甲基丙烯酸甲酯(压克力)树脂、聚苯乙烯/聚丙烯/聚苯乙烯嵌段共聚合物中的一种或多种。
一实施例中，该橡胶可选自丁腈橡胶。例如：端羧基丁腈橡胶、端胺基丁腈橡胶、端羟基丁腈橡胶、端环氧基丁腈橡胶、端乙烯基丁腈橡胶、端甲基丙烯酸基丁腈橡胶或其组合。
一实施例中，该导热填料包含氮化物、氧化物或其混合物。例如：氮化锆、氮化硼、氮化铝、氮化硅、氧化铝、氧化镁、氧化锌、二氧化硅、二氧化钛或其混合物。
一实施例中，该固化剂选自双氰胺。
一实施例中，该黏合材料依据ASTM D2240A规范所测得的硬度介于65A～98A。
一实施例中，黏合材料另包含固化加速剂，固化加速剂为尿素或其化合物。
本发明的黏合材料并无传统硅高分子的流油和劣化等缺点，且其中的高分子成分在25℃下利用200倍的金相显微镜观察无相分离现象。本发明的黏合材料具有高导热率及强黏着力，因此适用于例如LED照明的高导热需求。
具体实施方式
为让本发明的上述和其他相关技术内容、特征和优点能更明显易懂，下文特举出相关实施例，作详细说明如下。
本发明的黏合材料主要于高分子成分中添加导热填料而成。高分子成分包括热固性环氧树脂，并搭配热塑性塑胶、橡胶或其组合的之改质聚合物，以针对热固性环氧树脂进行耐冲击性质改善。换言之，热固性环氧树脂为必要材料，热塑性塑胶和橡胶可择一使用或一起和热固性环氧树脂加以混合。表1记载本发明黏合材料实施例中的成分和其体积百分比。另外也测试纪录了各实施例中硬度、导热率和相分离观察的结果。
[表1]
表1中的热固型环氧树脂采用采用陶氏化学公司(Dow Chemical Company)的DER331TM及长春公司(Chang Chun Group)的BNE200TM。DER331TM是一种液态双酚A环氧树脂。BNE200TM是一种侧链型环氧官能团环氧树脂(双酚A酚醛树脂)，在室温下为固态，其和DER331TM混合可提高黏度。热塑型塑胶采用苯氧树脂(phenoxy resin PKHHTM fromPhenoxy Associates)，其分子量(weight average MW)优选为大于30000。橡胶采用端羧基丁腈橡胶(carboxy-teminatedpolybutadieneacrylonitrile；CTBN)，以增加材料的强度和耐冲击等特性。导热填料包含氧化铝、氮化硼、氮化铝或其组合，其填料颗粒平均粒径大小分布于5至45μm之间。以上实施例另加入固化剂(curing agent)以进行高分子聚合物的固化反应。表1的实施例采用Degussa Fine Chemicals公司的双氰胺(dicyandiamide，Dyhard100STM)作为固化剂，可在温度140℃以下固化该热固型环氧树脂。此外，优选地可加入加速剂，例如UR-500TM以加速固化反应。固化剂和加速剂占所述黏合材料的体积百分比一般都在约3%以下，例如固化剂占所述黏合材料的体积百分比介于0.1%至3%之间，因所占的体积百分比不高，故在表1中省略不计。
本发明的黏合材料的制作方法例示如下。首先将该热固型环氧树脂、以及热塑型塑胶及/或橡胶等高分子材料以200℃加热混合大约30分钟以生成一均匀胶体。维持在约200℃下再将导热填料加入该均匀胶体后混合均匀以形成一均匀橡胶状材料。之后，固化剂于80℃温度下加入该均匀橡胶状材料。接着利用一热压机以100℃将该均匀橡胶状材料置于二离形膜之间，并以30kg/cm2的压力整平以形成片状的黏合材料，在此100℃的温度下即产生固化反应。
在本发明的实施例1-7中，黏合材料的粘滞系数高(约105至107泊(poise))，故不会发生分层(separation)现象。该片状黏合材料的外观呈现橡胶状(rubbery)而非树脂浆状(slurry)，因而具有方便储存、加工的特性。此外，该黏合材料可利用一般使用于热塑型塑胶的加工方法，例如:挤押出片(extrusion)，轮压出片(calendaring)或射出(injectionmolding)成型法等，借此提高其可加工性。总而言之，因BNE200TM和PKHHTM(苯氧树脂)均可增加材料的黏度，使该黏合材料可以经由上述热塑型塑胶制程成形。在实施例4-7中，热固型环氧树脂和热塑性塑胶在高温下得以固化交联，而形成一交互穿透(Inter-PenetrationNetwork；IPN)的结构，此结构不但可以有耐高温不变型的热固型塑胶特性，又拥有强韧不易脆裂的热塑型塑胶的特性，并可与金属电极或基板产生强力接着。
相较于比较例，本发明实施例1-7添加苯氧树脂及/或橡胶等改质聚合物者具有较低的硬度和较低的玻璃转换温度Tg，因而具有较佳的耐冲击特性。
本发明的黏合材料中的固化剂的固化温度低于140℃，或优选地在80～105℃即可产生固化反应，用以固化(即交联(crosslink)或催化聚合(catalyze polymerization))该热固型环氧树脂。
上述的热固型环氧树脂可包含未固化的液态环氧树脂、聚合环氧树脂、酚醛环氧树脂或酚甲烷树脂。热固型环氧树脂亦可由多种环氧树脂混合而成，其中，至少包括末端环氧官能团的环氧树脂、侧链型环氧官能团、或四官能团的环氧树脂或其组合物。除上述的BNE200TM外，侧链型环氧官能团的环氧树脂可采用NAN YA Plastic corporation NPCN系列(例如NPCN-703)。热固型环氧树脂占该黏合材料的体积百分比系介于29%至60%之间，其亦可为30%、35%、40%、45%、50%或55%。于室温之下，该热固型环氧树脂呈现液态或固态。较佳的热固型环氧树脂为一未固化环氧树脂(uncured epoxy resin)，特别是定义于ASTM D1763的未固化的液态环氧树脂。有关“环氧树脂”一词是指包含至少两个环氧官能团(epoxyfunctional group)的传统二聚环氧树脂(dimeric epoxy)、单体环氧树脂(oligomericepoxy)或聚合环氧树脂(polymeric epoxy)。该环氧树脂的种类可以是双酚A(bisphenolA)与环氧氯丙烷(epichlorohydrin)的生成物、酚(phenol)与甲醛(formaldehyde，其系一种酚醛清漆树脂(novolac resin))的生成物、环氧氯丙烷,脂环族(cycloaliphatic)及过酸(peracid)环氧树脂,缩水甘油酯(glycidyl esters)、环氧氯丙烷与对氨基苯酚(p-amino phenol)的生成物、环氧氯丙烷与乙二醛四苯酚(glyoxal tetraphenol)的生成物、酚酫环氧树脂(novolac epoxy)或酚甲烷树脂(bisphenol A epoxy)。
如前述实施例，热塑型塑胶可为一苯氧树脂，其中苯氧树脂的分子量可大于30000。热塑型塑胶亦可包含一羟基-苯氧基树脂醚高分子结构，其中该羟基-苯氧基树脂醚高分子结构可由一双环氧化物(diepoxide)与一双官能团物种(difunctional species)经聚合反应(polymerization)而成。该双环氧化物为一具环氧当量(epoxy equivalentweight)约自100至10000的环氧树脂。该双官能团物种为二元酚(dihydric phenol)、二羧酸(dicarboxylic acid)、一级胺(primary amine)、二胇基化物(dithiol)、disulfonamide或双二级胺(bis-secondary amine)。此外，该双官能团物种亦可是包含两种可与环氧基团(epoxide group)反应的不同功能团(functionality)的混合物；例如；水杨酸(salicylicacid)及4-羟基苯甲酸(4-hydroxybenzoic acid)。该热塑型塑胶又可分别由液态环氧树脂与双酚A(bisphenol A)、双酚F(bisphenol F)或双酚S(bisphenol S)、液态环氧树脂与二价酸(diacid)、液态环氧树脂与胺类(amine)等方式反应而成。
进一步言之，本发明黏合材料中的热塑型塑胶可选自一实质非结晶热塑型树脂(essentially amorphous thermoplastic resin)，例如：苯氧树脂(phenoxy resin)、聚砜(polysulfone)、聚醚砜(polyethersulfone)、聚苯乙烯(polystyrene)、聚氧化二甲苯(polyphenylene oxide)、聚苯硫醚(polyphenylene sulfide)、聚酰胺(polyamide)、聚亚酰胺(polyimide)、聚醚酰亚胺(polyetherimide)、聚醚酰亚胺与硅酮的嵌段共聚合物(polyetherimide/silicone block copolymer)、聚氨酯(polyurethane)、聚酯树脂(polyester)、聚碳酸酯(polycarbonate)、压克力树脂(acrylic resin)(例如：聚甲基丙烯酸甲酯(polymethyl methacrylate)、苯乙烯(styrene)/丙烯(Acrylonitrile)及苯乙烯嵌段共聚合物(styrene block copolymers))。
本发明的橡胶可选自丁腈橡胶((Nitrile-Butadiene Rubber；BNR)，例如：端羧基丁腈橡胶(carboxy-teminated polybutadieneacrylonitrile；CTBN)、端胺基丁腈橡胶(amino-terminated polybutadieneacrylonitrile；ATBN)、端羟基丁腈橡胶(hydroxy-terminated polybutadieneacrylonitrile；HTBN)、端环氧基丁腈橡胶(epoxy-teminatedpolybutadieneacrylonitrile;；ETBN)、端乙烯基丁腈橡胶(vinyl-terminatedpolybutadieneacrylonitrile；VTBN)、端甲基丙烯酸基丁腈橡胶(methacrylic-terminated polybutadieneacrylonitrile)等。
针对热固型环氧树脂而言，一较佳的固化剂为上述的双氰胺(dicyandiamide)，且可配合固化加速剂(curing accelerator)使用。常用的固化加速剂包含尿素(urea)、尿素的化合物(urea compound)、咪唑(imidazole)或三氟化硼(boron trifluoride)等。另外，固化剂可选自间苯二甲酰肼(isophthaloyl dihydrazide)、二苯酮四甲酸二酐(benzophenone tetracarboxylic dianhydride)、二乙基甲苯二胺(diethyltoluenediamine)、2,4-二氨基-3,5-二甲硫基甲苯(3,5-dimethylthio-2,4-toluene diamine)、双氰胺(dicyandiamide)或DDS(diaminodiphenyl sulfone)。该固化剂亦可选自取代双氰胺(substituted dicyandiamides，例如2,6-xylenyl biguanide)、固态聚酰胺(solidpolyamide)、固态芳香胺(solid aromatic amine)、固态酐硬化剂(solid anhydridehardener)、酚醛树脂硬化剂(phenolic resin hardener，例如：聚对氢氧基苯乙烯(poly(p-hydroxy styrene)))、胺基复合物(amine complex)或三甲醇基丙烷三丙稀酸脂(trimethylol propane triacrylate)。
该导热填料可包含一种或多种陶瓷粉末，陶瓷粉末可选自氮化物、氧化物或前述氮化物与前述氧化物的混合物。该氮化物可以使用氮化锆、氮化硼、氮化铝或氮化硅。该氧化物可以使用氧化铝、氧化镁、氧化锌、二氧化硅或二氧化钛。一般而言，氧化物的导热性较差，而氮化物则填充量不高，因此若同时混合氧化物及氮化物，可具互补效果。导热填料均匀分散于该高分子成分中，且占该黏合材料的体积百分比介于39%至70%之间，或40%至68%，较佳地在50%至65%之间，例如50%、55%、60%或65%。
由表1可知，包含热塑型塑胶及/或橡胶的改质聚合物占该高分子成分(包括热塑性塑胶、热固性环氧树脂和橡胶)的体积百分比系介于4%至45%之间，例如10%、20%或30%。在包含橡胶的实施例3中，当橡胶占该黏合材料的体积百分比为15%时，在25℃温度下，利用200倍的金相显微镜观察，发现高分子成分中的不同聚合物间有相分离现象。当相分离现象发生时，会造成聚合物混合的均匀性不佳，因此亦将影响到高分子成分的性质。因此，橡胶的比例不能过多，一般而言，橡胶占该黏合材料的体积百分比约小于12%，或介于1.5%至12%，或优选地在4%～10%之间。
本发明的黏合材料的导热率约在3W/m-K～15W/m-K，例如5W/m-K、7W/m-K、10W/m-K或12W/m-K。将黏合材料制成200μm厚度的片状材料，其热阻率小于0.5℃/W或0.4℃/W。依据ASTM D2240A的规范，本发明的黏合材料的硬度约在65A至98A之间，例如75A、85A或95A，具有良好的耐冲击特性，非常适合于作为与金属材料间的黏合应用。金属材料可以为铜、铝、镍、铁、锡、金、银或其合金。当黏合材料与金属材料压着固化后，其间的黏着力大于300kg/cm2。其中又以添加有热塑性塑胶的黏合材料对于提升黏着力更为明显。因热塑型塑胶的特性使该黏合材料可以拥有强韧不易脆裂的热塑型塑胶的特性，故可与金属材料，例如金属电极或基板产生强力接着，其黏着力甚至可大于350kg/cm2或400kg/cm2。该金属材料包含铁、铝、铜或其合金。
综上所述，本发明的黏合材料包含高分子成分、导热填料及固化剂。高分子成分占该黏合材料的体积百分比介于29%至60%之间，且包含一热固型环氧树脂及一改质聚合物。该改质聚合物包含热塑型塑胶、橡胶或其组合物，且该改质聚合物占该高分子成分之体积百分比系介于4%至45%之间。导热填料均匀分散于该高分子成分中，且占该黏合材料之体积百分比介于39%至70%之间。固化剂用以在低于温度140℃固化该热固型环氧树脂。该黏合材料的导热率大于3W/m-K，且依据ASTM D2240A规范所测得的硬度介于65A～98A。优选地，黏合材料制作成200μm厚度的片状材料时，其热阻率小于0.5℃/W，且具有良好的绝缘特性可耐大于500伏特或600伏特的电压。
本发明的技术内容及技术特点已揭示如上，然而本领域技术人员仍可能基于本发明的教示及揭示而作种种不背离本发明精神的替换及修饰。因此，本发明的保护范围应不限于实施例所揭示者，而应包括各种不背离本发明的替换及修饰，并为本发明权利要求的范围所涵盖。
Claims (13)
1.一种黏合材料，包含：
一高分子成分，占所述黏合材料的体积百分比介于29％至60％之间，且包含热固型环氧树脂及可改善热固性环氧树脂耐冲击性的改质聚合物，该改质聚合物包含橡胶，且该橡胶占所述高分子成分的体积百分比介于5％至30％之间；
一导热填料，均匀分散于所述高分子成分中，且占所述黏合材料的体积百分比介于39％至70％之间；以及
一固化剂，用于在低于140℃的温度下固化所述热固型环氧树脂，且占所述黏合材料的体积百分比介于0.1％至3％之间；
其中，所述橡胶占所述黏合材料的体积百分比介于4％至10％；
所述黏合材料的依据ASTM D2240A规范所测得的硬度介于65A～98A；
所述高分子成分固化后在25℃下利用200倍的金相显微镜观察无相分离现象；
所述黏合材料的导热率大于3W/m· K。
2.根据权利要求1的黏合材料，其中，所述黏合材料在200μm厚度下的热阻率小于0.5℃/W。
3.根据权利要求1的黏合材料，其中，所述黏合材料与金属材料压着固化后，黏着力大于300g/cm2，所述金属材料包含铁、铝、铜或其合金。
4.根据权利要求1的黏合材料，其中，所述固化剂可于80～105℃固化所述热固型环氧树脂。
5.根据权利要求1的黏合材料，其中，所述热固型环氧树脂包括末端含环氧官能团的环氧树脂、侧链型环氧官能团、或四官能团的环氧树脂或其混合物。
6.根据权利要求1的黏合材料，其中，所述热固型环氧树脂包含双酚A环氧树脂。
7.根据权利要求1的黏合材料，其中，所述橡胶选自丁腈橡胶。
8.根据权利要求1的黏合材料，其中，所述橡胶选自端羧基丁腈橡胶、端胺基丁腈橡胶、端羟基丁腈橡胶、端环氧基丁腈橡胶、端乙烯基丁腈橡胶、端甲基丙烯酸基丁腈橡胶或其组合。
9.根据权利要求1的黏合材料，其中，所述固化剂选自双氰胺。
10.根据权利要求1的黏合材料，其中，所述导热填料包含氮化物、氧化物或其混合物。
11.根据权利要求1的黏合材料，其中，所述导热填料选自氮化锆、氮化硼、氮化铝、氮化硅、氧化铝、氧化镁、氧化锌、二氧化硅、二氧化钛或其混合物。
12.根据权利要求1的黏合材料，其中，所述导热填料占所述黏合材料的体积百分比介于50％至65％之间。
13.根据权利要求1的黏合材料，其中，还包含固化加速剂，所述固化加速剂为尿素或其化合物。
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| CN105907357A (zh) * | 2016-05-06 | 2016-08-31 | 金宝丽科技（苏州）有限公司 | 一种光固化和热固化的耐热导电胶材料及其制备工艺 |
| CN106995673A (zh) * | 2017-04-14 | 2017-08-01 | 广东工业大学 | 一种低比重复合导热绝缘胶及其制备方法 |
| CN107118726A (zh) * | 2017-05-16 | 2017-09-01 | 昆山兆科电子材料有限公司 | 一种导热胶及其制备方法 |
| CN107820507B (zh) * | 2017-06-01 | 2020-09-15 | 苏州佳亿达电器有限公司 | 高硬度led封装材料及其制备方法 |
| CN107286584A (zh) * | 2017-06-30 | 2017-10-24 | 徐州市耐力高分子科技有限公司 | 一种高分子合金耐磨修补材料及其制备方法 |
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