CN104220239B - 连接塑料的方法和拆开塑料复合物中连接的方法和塑料复合物 - Google Patents

连接塑料的方法和拆开塑料复合物中连接的方法和塑料复合物 Download PDF

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CN104220239B
CN104220239B CN201380018592.3A CN201380018592A CN104220239B CN 104220239 B CN104220239 B CN 104220239B CN 201380018592 A CN201380018592 A CN 201380018592A CN 104220239 B CN104220239 B CN 104220239B
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plastics
electromagnetic field
method described
alternating electromagnetic
exposed
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CN104220239A (zh
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科迪莉亚·齐默勒
格拉尔德·施泰纳
格特·海因里希
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Leibniz Institut fuer Polymerforschung Dresden eV
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Leibniz Institut fuer Polymerforschung Dresden eV
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/36—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
    • B29C65/3604—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint
    • B29C65/362—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint comprising at least a single wire, e.g. in the form of a winding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/36—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
    • B29C65/3604—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint
    • B29C65/3608—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint comprising single particles, e.g. fillers or discontinuous fibre-reinforcements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
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    • B29C66/45—Joining of substantially the whole surface of the articles
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    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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    • B32B27/00—Layered products comprising a layer of synthetic resin
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C08J5/121—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives by heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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Abstract

本发明涉及一种连接塑料(1、2)的方法以及一种拆开塑料复合物中的连接的方法和塑料复合物。本发明的目的在于提供一种方法，以该方法实现了塑料(1、2)的处于直接接触的区域中的连接。通过一种连接塑料(1、2)的方法实现了该目的，其中，将材料(3)施布在待连接塑料(1、2)中的至少一块上，该材料包含至少一种导电材料而且仅部分地覆盖该塑料(1、2)，接着，该塑料(1、2)至少在该区域中与该材料(3)彼此形成接触，而且此后，把至少这个区域暴露于交变电磁场(4)中至少一次。

Description

连接塑料的方法和拆开塑料复合物中连接的方法和塑料复 合物
技术领域
本发明涉及化学领域，并涉及一种连接塑料的方法，譬如在众多的工业应用中，像在汽车工业、飞机制造中以及在日用品和消耗品生产中、在包装工业中可以为改进半成品和部件的使用性能而得到采用的方法。本发明还涉及拆开塑料复合物的连接的方法，譬如针对安全技术或者在回收工艺中所需的方法。
背景技术
对于塑料表面的连接，已知各种技术。在此，特别重要的是塑料焊接。
在焊接塑料边界层时，原则上必须将热能引入到两块塑料之间的边界层中。边界的像可抵达性和几何形状这样的特性是采用各种方法的关键标准。对于已知的塑料焊接技术，只能采用热塑性塑料，这是因为，它通过直接加温热塑性塑料(红外焊接、通过加热元件或加热线圈焊接)造成两块塑料中至少一块的流变学变化(熔体形成)并仅能由此实现焊接。在熔融区域冷却和凝固之后，构造出新的材料结构，并通常导致两块塑料之间的持久粘附。把能量输入到待接合的边界层(接缝)中是塑料之间的固定连接的关键步骤。在实践中，除了接缝之外，塑料的可观的份额也被一起塑化或者在所期望的性能方面受到负面影响。
根据应用领域，采用不同的焊接方法，譬如激光焊接、热板焊接、振动焊接或超声波焊接。
对于激光焊接(DE 102008038014 A1；DE 112007002109 T5)，为至少一种塑料组分添加了传导性填料，譬如碳黑。通过碳黑颗粒对光能的吸收导致了对周围的塑料的加温。该塑料组分局部地熔融，并且和第二塑料组分焊接在一起。
振动焊接一般利用固体摩擦和高压，以便在塑料之间产生熔融区(EP 1346817A1；EP 1772253 B1；DE 10211875 A1；DE 60207248T2)。该振动既可以直线地又可以轨道式地实施。
对于旋转焊接，通过接合件彼此的相对运动进行必要的能量输入。两个接合件的至少一个必须具有旋转对称性，并且必须在塑料间使用高的压力(EP 110914 A1；WO002009018804 A2)。
在摩擦焊接方法的组中的另一方法利用了通过高频机械振动产生的分子摩擦。这也被称作超声波焊接。在此，在压力下将振动传递至塑料上，有利地传递至薄膜或较小的接合面上(AT 333979 E；DE 69528314 T2)。
同样已知的是另一接合塑料的方法，热气焊接。在此使用热的气体，通常是空气，以便实现对塑料的塑化(AU 3094371 A；AU 2882189A；EP 521755 A1；CH 702860 A1)。
另外由DE 2851612 A1已知的是，通过电流的塑料焊接和塑料液化。在此，为了借助在塑料中作为直接电流的电流并用在塑料中产生局部提高的电场情况下进行塑料焊接和塑料液化，引入并涂覆导电材料以便实现流动的电流，并且通过为了使电场线的局部集中而地点确定地引入的金属屑引起地点确定的介电损耗，并且进而引起加温。
代替简单的塑料焊丝，在此，在热空气焊接时，将焊丝置入整个焊缝，该焊缝通过引入导电材料，譬如金属屑或金属粉而变成导电的。置于焊丝上的电压在变为导电的塑料中产生电流，该导电的塑料例如通过镀上金属而在塑料表面产生。在介电焊接的情况下，局部地将金属屑引入塑料焊丝或者焊缝导致电场线集中在金属屑的位置，并因而导致在局部集中的损耗，以及因而有针对性的加温。
该方法的缺陷在于，一方面要求直接的通过电流，并且必须要求对通过电流极为精确的控制，以便维持足够的加温，这是因为，在焊缝中的塑料表面没有彼此的直接接触，并且必须尽可能避免对塑料的热损伤。
发明内容
本发明的目的在于，提供一种连接塑料的方法，其中，实现了待连接塑料的部分直接接触，并同时实现了对塑料的该区域的连接，还在于，提供一种拆开塑料复合物中的连接的方法，其以简单的方式和方法实现，还在于，提供一种塑料复合物，其实现了在塑料表面的持续稳定的连接。
该目的通过在权利要求书中给出的发明得以解决。有利的设计方案是从属权利要求的主题。
对于根据本发明的连接塑料的方法，将材料施布在待连接塑料中的至少一块上，该材料包含至少一种导电材料而且仅部分地覆盖该塑料，接着，该塑料至少在该区域中与该材料彼此形成接触，而且此后，至少这个区域暴露于交变电磁场中至少一次。
有利地采用热塑性塑料，更有利地采用聚碳酸酯和聚酯作为塑料。
进而有利地，采用结构化形式的，更有利地，采用闭合的导体回线的形式的，规则或不规则的形式的或回形的材料，另外有利地采用带有100μm至10mm的尺寸的材料。
同样有利地，采用球形的、椭球形的、小棒形的或星形的颗粒、更有利地带有5-500nm平均直径的颗粒作为材料。
而且还有利地，采用下述材料：该材料是薄膜组分。
有利的还有，采用由金属制成的材料，有利地由金或银制成的材料。
同样有利的是，施布最大覆盖了塑料的50％的材料。
进而有利的是，处于接触状态的塑料暴露于短暂且强烈的交变电磁场中。
而且还有利的是，处于接触状态的塑料暴露于交变电磁场中，该交变电磁场具有一次脉冲式的场强，或者更多次短暂相继的脉冲式的场强，或者是其他随时间变化的形式的场强。
有利的还有，处于接触状态的塑料暴露于至少30T的交变电磁场中，更有利地在1μs至10ms之内暴露于至少30T的交变电磁场中。
同样有利的是，处于接触状态的表面暴露于如下交变电磁场中，其带有在更短时间内的更高的场强，或带有在相同时间内更多次脉冲的更小的场强。
此外，在根据本发明的拆开塑料复合物的连接的方法中，为连接塑料，将材料施布在待连接的塑料中的至少一块上，该材料包含至少一种导电材料而且仅部分地覆盖该塑料，接着，该塑料至少在该区域中与该材料彼此形成接触，而且此后，至少这个区域暴露于交变电磁场中至少一次，为拆开该连接，这个区域暴露于交变电磁场中至少一次，其中，该区域暴露于如下交变电磁场中，该交变电磁场带有比连接时更高的场强，或者在同样的场强和同样的时间采用比连接时更多数量的脉冲。
根据本发明的塑料复合物由至少两块塑料组成，这至少两块塑料至少材料锁合地并且在其连接区域中至多部分地彼此连接，其中，在它的连接区域中存在含有至少一种导电材料的材料。
有利地，材料锁合的连接通过化学反应进行。
通过本发明，第一次给出了一种方法，其中，实现了对待连接塑料的部分直接接触，而且同时，实现了塑料的这些区域的连接。同样，本发明第一次给出了拆开在该塑料复合物中的连接的方法，其中，对该连接的拆开以简单且没有残留的方式和方法实现。此外，通过根据本发明的解决方案，第一次知道了以下塑料复合物，即，在其中实现了对塑料表面的持续稳定连接。
这一点如此实现，其方式为，将材料施布在待连接塑料中的至少一块上，该材料包含至少一种导电材料而且仅部分地覆盖该塑料。接着，该塑料至少在该区域中与该材料彼此形成接触，而且至少这个区域暴露于交变电磁场中至少一次。
根据本发明，应用这些材料作为塑料，其既不导电，又不导热。有利地，适合的是热塑性塑料和那些针对本发明的解决方案额外含有功能性耦联基团的塑料。有利地，可以采用聚碳酸酯和聚酯。
采用包含至少一种导电材料的那些作为材料。有利地，它可以为金属材料。
该材料可以以未经结构化或者经结构化的形式存在和/或施布。
未经结构化形式的材料可以例如为颗粒，这些颗粒是球形的、椭球形的、小棒形的或星形的并且有利地具有5-500nm平均直径。于是，这种未经结构化的颗粒可以以经结构化的形式施布到塑料上。
另外，可以将结构化形式的材料施布到塑料上，例如闭合的导体回线的形式的材料，规则或不规则的形式的或回形的材料，另外有利地带有100μm至10mm的尺寸的材料。材料的平均直径可以有利地位于待焊接塑料的粗糙度区域中。
该材料还可以是薄膜组分，其施布到塑料上。由此，可以更好地调整材料在塑料上的分布和布置或者结构取向。
无论如何，该材料仅部分地覆盖塑料，由此使位于其间的塑料区域可以彼此连接。有利地，覆盖率为相应塑料的最高50％。
接着，塑料至少在此(材料所在的地方)形成接触，而且此后，至少这个区域暴露于交变电磁场中至少一次，或多次。
有利地，该区域在短时间(1-10μs)内暴露在强的(60-100T)交变电磁场下。
根据本发明还有可能，整个待连接的塑料暴露于交变电磁场下。
在此，交变电磁场的场强的施加可以是一次脉冲式的，或者更多次短暂相继的脉冲式的，或者其他随时间变化的形式的。
有利地，处于接触状态的塑料暴露于交变电磁场下，其中，磁场强度的变化有利地在1T/ms至40T/ms之间。
根据本发明，进而有利的是，处于接触状态的塑料暴露于带有在更长时间内的更高场强的电磁场的变化之中，或者暴露于带有在更短时间内的更小场强的电磁场的变化之中。此外还有利的是，处于接触状态的塑料经更长时间暴露于带有更小的场强变化的、周期性变化的电磁场中。
此外，该任务通过一种拆开塑料的连接的方法得到解决。在此，格外重要的是，该连接是根据上述的连接塑料的方法实现的。通过根据本发明的拆开塑料的连接的方法，可以把这样的连接拆开。
根据本发明实现这一点，其方式为，至少连接的塑料的区域暴露于如下交变电磁场中，其带有比建立连接时更高的场强，或者在同样的场强下比建立连接时采用更短的时间。
由此打断了所生成的连接。
特别有利的是，如此拆开的连接可以通过重新施布材料和施加电场可以再次建立。
所生成的根据本发明的塑料复合物由至少两块塑料组成，这至少两块塑料至少材料锁合地并且在其连接区域至多部分地彼此连接。该复合物在它的连接区域具有含有至少一种导电材料的材料。
有利地，材料锁合的连接通过塑料彼此的化学反应进行。
两种或多种聚合物通常不能彼此连接。化学反应以及由此可能的对共价键的构造只能通过功能性耦联基团的存在并在达到活化能后得以实现。通常，活化能仅可以通过引入热能来达到。由于聚合物基本上是热的不良导体，必须施加巨大的能量，以便在大多是隐藏的聚合物-聚合物边界层上达到必需的温度。这经常导致聚合物材料的热损伤，从而以该方式不能实现聚合物之间的热学诱导的反应。
以根据本发明的方案，仅在塑料-塑料边界层区域有针对性地引入热能，而不会导致塑料的损伤或热负载。
在此，根据本发明，通过交变电磁场进行：耦合入必需的活化能，通过该交变电磁场在含有至少一种导电材料的材料中诱导出等离子体振动和/或涡流，而不会通过直接将电流施加到材料上(该材料含有至少一种导电材料)。
在接合至少两块塑料之前，将材料施布在至少一块塑料上，而且在塑料接合之后该材料位于塑料-塑料边界层。由于电阻，一次性诱导出的等离子体振动或涡流导致限制在局部的短时加温。如果达到了塑料的活化能，则会发生化学反应以及构造出塑料之间的共价键。
不会发生剩余塑料材料的热学变化。
如果不通过化学键生成共价耦联，则根据本发明，通过物理相互作用进行塑料表面的连接。
通过根据本发明的方案，能量输入仅在塑料边界层实现，并且不会对塑料体造成能量负载、特别是热学负载。
根据本发明的方案的优势在于：
-更小的热学导致的翘曲，
-有针对性把能量输入到塑料-塑料边界层
-短的交变电磁场作用时间，
-准同步焊接，
-在内边界层的塑料厚度不发生限制，这是因为交变电磁场不与塑料起相互作用，
-环境气氛可以自由选择，
-不复杂的反应建立和反应结束，
-可以实现很大的工作距离，
-能够大范围地对方法进行变化，而且能够通过调整电磁场(像强度、脉冲长度、脉冲重复率)和材料的设计(像材料、大小、形状)来对相应的塑料进行调整，
-无需另外的化学添加剂和催化剂，
-不限制连接区域和边界层的几何形状(像大小、形状)，
-稳定、永久复合粘附—不仅基于物理效应，而且通过在边界层形成共价键，
-经塑料-塑料边界层的化学反应，而没有对聚合物材料的反作用，
-建立带有新的性能的新的聚合物复合物。
相对于已知的塑料焊接方法，根据本发明的解决方案的目的一方面在于固定而永久的复合物形成。该方法可以很灵活地应用于极为不同的塑料系统。在冷却时，塑料不会发生热学收缩。这是因为，根据本发明的方法以准同步方式工作，它具有很短的接合时间，并且还拥有对接合缝几何形状的自由选择。
然而同时，可以通过电磁场作用方式的变化，根据本发明实现这种连接的连接和拆开，并且同时，这个过程可以相继地重复多次。
附图说明
通过实施例进一步阐明本发明。附图中：
图1以横截面图示出了根据本发明的复合物形成的图解。
图解1为用于在聚碳酸酯和聚乙烯胺之间的化学复合物形成的反应实施例
图解2为用于拆开聚碳酸酯和聚乙烯胺之间的化学耦联复合物的反应实施例
具体实施方式
实施例1
尺寸为1cm×1cm的、由基于双酚A的聚碳酸酯(PC)制成的塑料成型体试样应当与尺寸为1cm×1cm的、由以氨基功能化的聚乙烯胺(PVAm)制成的塑料成型体连接。聚碳酸酯(PC)的玻璃化转化温度为大约145℃，而聚乙烯胺(PVAm)的为大约130℃。
在由PC制成的塑料体上施布由金制成的环，其尺寸为：外直径5mm、环厚度(Ringdicke)1mm、环高度150nm。由此实现了10％的塑料的覆盖率。
然后，由PC和PVAm制成的待连接的塑料体在环所处的区域彼此形成接触，并且，两个体暴露于60T的电磁脉冲下7ms。
在达到活化能后触发的耦联反应如下所示地进行：
图解1
Bisphenol-A＝双酚A
Urethan＝尿烷
所生成的PC和PVAm的复合物在边界层具有未改变的环，并且在直接接触区域通过化学反应实现两块塑料的共价键。该复合物是粘附牢固且持久的。
这个化学耦联的塑料复合物的拆开在如下条件下进行：交变电磁场重新作用两次，每次分别为10T/ms。
在此，在塑料复合物的边界层内部会发生化学键的断裂。两个塑料成型件的分离在加温状态下的能量达到的时候或者之后马上进行。
图解2
Urethan＝尿烷
Polycarbonat＝聚碳酸酯
Isocyanate＝异氰酸酯
附图标记说明
1 塑料1
2 塑料2
1’ 与塑料2装配在一起
2’ 与塑料1装配在一起
3 表面上的材料
3’ 边界层中的材料
4 交变电磁场
Ⅰ 连接前的塑料
Ⅱ 装配在一起但还未连接的塑料
Ⅲ 交变电磁场的作用

Claims (20)

1.一种连接塑料的方法，其中，将材料施布到待连接的塑料中的至少一块上，所述材料包含至少一种导电材料而且在连接区域中仅部分地覆盖所述塑料，接着，所述塑料至少在所述连接区域中与所述材料彼此形成接触，而且此后，至少这个连接区域被暴露于交变电磁场中至少一次，其中，待连接的塑料部分地直接接触，并且其中，已连接的塑料的部分的直接接触能够再次在交变电磁场中被拆开。
2.根据权利要求1所述的方法，其中，采用热塑性塑料作为塑料。
3.根据权利要求1所述的方法，其中，采用结构化形式的，规则或不规则的形式的或回形的材料。
4.根据权利要求1所述的方法，其中，采用球形的、椭球形的、小棒形的或星形的颗粒作为材料。
5.根据权利要求1所述的方法，其中，采用下述材料，即：所述材料是薄膜组分。
6.根据权利要求1所述的方法，其中，采用由金属材料制成的材料。
7.根据权利要求1所述的方法，其中，施布最大覆盖了塑料的50％的材料。
8.根据权利要求1所述的方法，其中，处于接触状态的所述塑料暴露于短暂且强烈的交变电磁场中。
9.根据权利要求1所述的方法，其中，处于接触状态的所述塑料暴露于交变电磁场中，所述交变电磁场具有一次脉冲式的场强，或者更多次短暂相继的脉冲式的场强，或者其它随时间变化的形式的场强。
10.根据权利要求1所述的方法，其中，处于接触状态的所述塑料暴露于至少30T的交变电磁场中。
11.根据权利要求1所述的方法，其中，处于接触状态的表面暴露于如下交变电磁场中：所述交变电磁场带有在更短时间内更高的场强，或带有在相同时间内更多次脉冲的更小的场强。
12.根据权利要求1所述的方法，其中，采用聚碳酸酯或聚酯作为塑料。
13.根据权利要求3所述的方法，其中，采用闭合的导体回线的形式的材料。
14.根据权利要求3所述的方法，其中，采用带有100μm至10mm的尺寸的材料。
15.根据权利要求4所述的方法，其中，采用带有5-500nm平均直径的颗粒作为材料。
16.根据权利要求6所述的方法，其中，采用由金或银制成的材料。
17.根据权利要求1所述的方法，其中，处于接触状态的所述塑料在1μs至10ms之内暴露于至少30T的交变电磁场中。
18.一种拆开塑料复合物的连接的方法，其中，为了连接塑料，将材料施布在待连接的塑料中的至少一块上，所述材料包含至少一种导电材料而且在连接区域中仅部分地覆盖所述塑料，接着，所述塑料至少在所述连接区域中与所述材料彼此形成接触，并且，待连接的塑料部分地直接接触，而且此后，至少这个连接区域被暴露于交变电磁场中至少一次，并且为了拆开该连接，这个区域被暴露于交变电磁场中至少一次，其中，所述区域暴露于如下交变电磁场中：所述交变电磁场要么带有比连接时更高的场强，要么在同样的场强和同样的时间采用比连接时更多数量的脉冲。
19.一种塑料复合物，塑料复合物由至少两块塑料组成，所述塑料至少材料锁合地并且在其连接区域至多部分地彼此连接，其中，所述塑料部分地直接接触，其中，在所述塑料的连接区域存在含有至少一种导电材料的材料，并且其中，所述塑料的部分的直接接触能够在交变电磁场中被拆开。
20.根据权利要求19所述的塑料复合物，其中，材料锁合的连接通过化学反应进行。
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