CN104134699A - 一种薄膜晶体管、阵列基板及显示装置 - Google Patents

一种薄膜晶体管、阵列基板及显示装置 Download PDF

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CN104134699A
CN104134699A CN201410337121.5A CN201410337121A CN104134699A CN 104134699 A CN104134699 A CN 104134699A CN 201410337121 A CN201410337121 A CN 201410337121A CN 104134699 A CN104134699 A CN 104134699A
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semiconductor layer
film transistor
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韩帅
张琨鹏
高鹏飞
王凤国
白妮妮
康峰
刘宇
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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Ordos Yuansheng Optoelectronics Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42356Disposition, e.g. buried gate electrode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42384Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor

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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

本发明提供一种薄膜晶体管、阵列基板及显示装置,该薄膜晶体管包括:栅电极、栅绝缘层、半导体层、源电极及漏电极,栅电极包括位于源电极侧的第一区域,位于漏电极侧的第二区域及位于第一区域和第二区域之间的中间区域,其中,所述中间区域完全覆盖与所述中间区域对应设置的所述半导体层,所述第一区域或所述第二区域覆盖对应设置的所述半导体层的部分区域。

Description

一种薄膜晶体管、阵列基板及显示装置
技术领域
本发明涉及薄膜晶体管领域,尤其涉及一种薄膜晶体管、阵列基板及显示装置。
背景技术
LTPS(低温多晶硅)工艺中,漏电流是导致其良率降低的主要原因之一,目前,在LTPS TFT-LCD(薄膜晶体管液晶显示器)工艺中,通常采用轻掺杂漏极的方式(LDD,Light Doped Drain)来抑制异常增加的漏电流,这种方法需要进行离子掺杂,容易导致离子的污染,发生晶格畸变等问题,另外离子掺杂也增加了工序及原材料(如光刻胶及掺杂离子等),提高了生产成本。
发明内容
有鉴于此,本发明提供一种薄膜晶体管、阵列基板及显示装置,以解决现有的采用轻掺杂漏极的方式来抑制薄膜晶体管的漏电流容易导致离子的污染,且成本高的问题。
为解决上述技术问题,本发明提供一种薄膜晶体管,包括:栅电极、栅绝缘层、半导体层、源电极及漏电极,其特征在于,所述栅电极包括:位于所述源电极侧的第一区域,位于所述漏电极侧的第二区域,以及位于所述第一区域和所述第二区域之间的中间区域,其中,所述中间区域完全覆盖与所述中间区域对应设置的所述半导体层,所述第一区域或所述第二区域覆盖对应设置的所述半导体层的部分区域。
优选地,所述中间区域在第一方向上的宽度大于或等于对应设置的所述半导体层在所述第一方向上的宽度,所述第一方向为与所述源电极和所述漏电极之间形成的导电沟道的长度方向相垂直的方向。
优选地,所述中间区域为矩形,所述第一区域和所述第二区域均为三角形。
优选地,所述半导体层为低温多晶硅半导体层。
本发明还提供一种阵列基板,包括上述薄膜晶体管。
本发明还提供一种显示装置,包括上述阵列基板。
本发明的上述技术方案的有益效果如下:
由于栅电极两端较窄,不能完全覆盖对应设置的半导体层,因而当薄膜晶体管关断时,未被栅电极覆盖的半导体层的边缘部分没有被施加上电压,在不加电压的情况下,半导体层的边缘部分相当于绝缘,其电阻非常大,从而具有阻断漏电流的作用,使得薄膜晶体管中的漏电流会非常小,从而提高了薄膜晶体管的特性,且不存在因离子掺杂而产生离子污染的问题,同时在制备过程中也不需要增加任何工序,降低了生产成本。
附图说明
图1为本发明实施例的薄膜晶体管的俯视图。
图2为图1中的薄膜晶体管的栅电极及半导体层的俯视图。
图3为本发明另一实施例的薄膜晶体管的俯视图。
具体实施方式
首先对本发明实施例的薄膜晶体管的实现原理进行简单说明。
薄膜晶体管通常包括:栅电极、栅绝缘层、半导体层、源电极和漏电极,当薄膜晶体管打开时,栅电极施以电压,栅电压在栅绝缘层中产生电场,电力线由栅电极指向半导体层表面,并在表面处产生感应电荷。随着栅电压增加,半导体层表面将由耗尽层转变为电子积累层,形成反型层,当达到强反型时(即达到开启电压时),源电极和漏电极间加上电压就会有载流子通过导电沟道。
当薄膜晶体管关断时,由于自由电子的存在,使得源电极和漏电极之间存在漏电流,漏电流会导致薄膜晶体管的性能降低。
本发明实施例中,可改变栅电极的形状,使得栅电极位于源电极侧的部分区域或位于漏电流侧的部分区域变窄,不完全覆盖对应的半导体层,使得未被栅电极覆盖的半导体层的边缘部分不会被施加上电压,在不加电压的情况下,半导体层的边缘部分相当于绝缘,其电阻非常大,从而具有阻断漏电流的作用。
为使本发明要解决的技术问题、技术方案和优点更加清楚,下面将结合附图及具体实施例进行详细描述。
请参考图1和图2,本发明实施例的薄膜晶体管包括:栅电极11、栅绝缘层(图未示出)、半导体层12、源电极13及漏电极14。
所述栅电极11包括:位于所述源电极13侧的第一区域111,位于所述漏电极14侧的第二区域112,以及位于所述第一区域111和所述第二区域112之间的中间区域113(图2中虚线部分表示各个不同区域的分界线),其中,所述中间区域113完全覆盖与所述中间区域113对应设置的所述半导体层,所述第一区域111覆盖与所述第一区域111对应设置的所述半导体层的部分区域,即所述第一区域111不完全覆盖与所述第一区域111对应设置的所述半导体层,所述第二区域112覆盖与所述第二区域112对应设置的所述半导体层的部分区域,即所述第二区域112不完全覆盖与所述第二区域112对应设置的所述半导体层。
从图2中可以看出,所述半导体层12在位于所述源电极13侧的、与所述第一区域111对应的左侧区域中,区域A1被第一区域111覆盖,区域A2和A3未被第一区域111覆盖,所述半导体层12在位于所述漏电极14侧的、与所述第二区域112对应的右侧区域中,区域B1被第二区域112覆盖,区域B2和B3未被第二区域112覆盖。
当薄膜晶体管关断时,未被栅电极11覆盖的半导体层12的边缘部分(区域A2、A3、B2和B3)没有被施加上电压,在不加电压的情况下,半导体层12的边缘部分相当于绝缘,其电阻非常大,从而具有阻断漏电流的作用,使得薄膜晶体管中的漏电流会非常小,从而提高了薄膜晶体管的特性,且不存在因离子掺杂而产生离子污染的问题,同时在制备过程中也不需要增加任何工序,降低了生产成本。
上述实施例中,所述第一区域111不完全覆盖与所述第一区域111对应设置的所述半导体层,所述第二区域112不完全覆盖与所述第二区域112对应设置的所述半导体层,即半导体层12的两侧均存在未被栅电极11覆盖的部分。当然,在本发明的其他实施例中,所述栅电极11也可以为下述结构:所述第一区域111不完全覆盖与所述第一区域111对应设置的所述半导体层,所述第二区域112完全覆盖与所述第二区域112对应设置的所述半导体层;或者,所述第一区域111不完全覆盖与所述第一区域111对应设置的所述半导体层,所述第二区域112不完全覆盖与所述第二区域112对应设置的所述半导体层。即,半导体层12仅一侧存在未被栅电极11覆盖的部分。
上述实施例中,所述中间区域113在第一方向上的宽度大于对应设置的所述半导体层在所述第一方向上的宽度,所述第一方向为与所述源电极13和所述漏电极14之间形成的导电沟道的长度方向相垂直的方向。
当然,在本发明的其他实施例中,所述中间区域113在第一方向上的宽度也可以等于对应设置的所述半导体层在所述第一方向上的宽度。
上述实施例中,所述中间区域113为矩形,所述第一区域111和所述第二区域112的形状相同,均为三角形。当然,所述栅电极11的形状并不限于此,在本发明的其他实施例中,所述栅电极也可以为其他形状,请参见附图3。
本发明实施例中,所述半导体层12可以为低温多晶硅半导体层,也可以为非晶硅半导体层等。
本发明实施例还提供一种阵列基板,包括上述薄膜晶体管。
本发明实施例还提供一种显示装置,包括上述阵列基板。
以上所述是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明所述原理的前提下,还可以作出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。

Claims (6)

1.一种薄膜晶体管,包括:栅电极、栅绝缘层、半导体层、源电极及漏电极,其特征在于,所述栅电极包括:位于所述源电极侧的第一区域,位于所述漏电极侧的第二区域,以及位于所述第一区域和所述第二区域之间的中间区域,其中,所述中间区域完全覆盖与所述中间区域对应设置的所述半导体层,所述第一区域或所述第二区域覆盖对应设置的所述半导体层的部分区域。
2.根据权利要求1所述的薄膜晶体管,其特征在于,所述中间区域在第一方向上的宽度大于或等于对应设置的所述半导体层在所述第一方向上的宽度,所述第一方向为与所述源电极和所述漏电极之间形成的导电沟道的长度方向相垂直的方向。
3.根据权利要求1所述的薄膜晶体管,其特征在于,所述中间区域为矩形,所述第一区域和所述第二区域均为三角形。
4.根据权利要求1-3任一项所述的薄膜晶体管,其特征在于,所述半导体层为低温多晶硅半导体层。
5.一种阵列基板,其特征在于,包括如权利要求1-4任一项所述的薄膜晶体管。
6.一种显示装置,其特征在于,包括如权利要求5所述的阵列基板。
CN201410337121.5A 2014-07-15 2014-07-15 一种薄膜晶体管、阵列基板及显示装置 Pending CN104134699A (zh)

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