CN104097270B - 线锯及线锯的制造方法 - Google Patents

线锯及线锯的制造方法 Download PDF

Info

Publication number
CN104097270B
CN104097270B CN201410126245.9A CN201410126245A CN104097270B CN 104097270 B CN104097270 B CN 104097270B CN 201410126245 A CN201410126245 A CN 201410126245A CN 104097270 B CN104097270 B CN 104097270B
Authority
CN
China
Prior art keywords
abrasive grains
scroll saw
heart yearn
electrodeposited coating
nickel dam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410126245.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN104097270A (zh
Inventor
宫坂四志男
加藤修
笹部博史
西尾隆秀
坂田慎一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WIRE ENGINEERING PRODUCTIVITY LLC
Fuji Kihan Co Ltd
Original Assignee
WIRE ENGINEERING PRODUCTIVITY LLC
Fuji Kihan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WIRE ENGINEERING PRODUCTIVITY LLC, Fuji Kihan Co Ltd filed Critical WIRE ENGINEERING PRODUCTIVITY LLC
Publication of CN104097270A publication Critical patent/CN104097270A/zh
Application granted granted Critical
Publication of CN104097270B publication Critical patent/CN104097270B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201410126245.9A 2013-04-11 2014-03-31 线锯及线锯的制造方法 Active CN104097270B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-083332 2013-04-11
JP2013083332A JP6245833B2 (ja) 2013-04-11 2013-04-11 ワイヤソーの製造方法

Publications (2)

Publication Number Publication Date
CN104097270A CN104097270A (zh) 2014-10-15
CN104097270B true CN104097270B (zh) 2016-03-30

Family

ID=51666008

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410126245.9A Active CN104097270B (zh) 2013-04-11 2014-03-31 线锯及线锯的制造方法

Country Status (4)

Country Link
JP (1) JP6245833B2 (enExample)
KR (1) KR101563418B1 (enExample)
CN (1) CN104097270B (enExample)
TW (1) TWI566864B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104908500B (zh) * 2015-05-18 2017-08-25 刘肖梅 一种钢丝纹理加工装置的雕刻轮
CN104849211B (zh) * 2015-05-27 2017-11-17 深圳市常兴技术股份有限公司 电镀磨具表面金刚石加厚程度的检测方法
CN106086950B (zh) * 2016-06-24 2018-12-18 中国有色桂林矿产地质研究院有限公司 一种齿缝镶嵌金刚石的内圆刀片的制备方法
CN108527664A (zh) * 2018-02-09 2018-09-14 江苏中博钻石科技有限公司 环形金刚石线锯切割装置
CN110091435A (zh) * 2019-06-12 2019-08-06 成都易德莱斯科技有限公司 负反馈自动调控绳锯及调控方法
CN110704985A (zh) * 2019-10-16 2020-01-17 北京航空航天大学 一种渐开线砂轮磨削表面形貌仿真方法
CN115648074A (zh) * 2022-10-31 2023-01-31 福建晶安光电有限公司 一种金刚石线开刃方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10100070A (ja) * 1996-09-26 1998-04-21 Toyota Banmotsupusu Kk メタルボンド砥石
KR100299102B1 (ko) * 1998-11-24 2001-11-22 홍영철 취성재료절단용다이아몬드전착와이어및그제조방법
JP2002075767A (ja) * 2000-08-31 2002-03-15 Sumitomo Special Metals Co Ltd 耐食性被膜を有する希土類系永久磁石およびその製造方法
TW571000B (en) * 2001-10-19 2004-01-11 Nihon Parkerizing Methods of preparing metal wires for plastic processing
JP2004009238A (ja) * 2002-06-10 2004-01-15 Kanai Hiroaki ソーワイヤ製造方法及びソーワイヤ
JP2007152485A (ja) * 2005-12-05 2007-06-21 Kanai Hiroaki ソーワイヤの製造方法
US8206472B2 (en) * 2005-12-27 2012-06-26 Japan Fine Steel Co., Ltd. Fixed abrasive wire
JP2007268627A (ja) * 2006-03-30 2007-10-18 Noritake Super Abrasive:Kk 電着ワイヤソー
JP5356071B2 (ja) * 2009-03-02 2013-12-04 住友電気工業株式会社 ダイヤモンドワイヤーソー、ダイヤモンドワイヤーソーの製造方法
KR101548147B1 (ko) * 2009-08-14 2015-08-28 생-고뱅 어브레이시브즈, 인코포레이티드 연신체에 연마입자가 결합된 연마제품
JP5576177B2 (ja) * 2010-04-28 2014-08-20 株式会社リード 固定砥粒ワイヤーソー及びその製造方法
JP2012157908A (ja) * 2011-01-28 2012-08-23 Sumco Corp 硬脆性材料のスライス方法
JP5863170B2 (ja) * 2011-01-31 2016-02-16 サンコール株式会社 固定砥粒ワイヤの製造方法
TWM412050U (en) * 2011-03-17 2011-09-21 Tomohiko Sinosaki Wire saw structure with fixed abrasive particle
KR20120117594A (ko) * 2011-04-16 2012-10-24 다이섹(주) 엔드리스 와이어 톱용 컷팅 비드
US9375826B2 (en) * 2011-09-16 2016-06-28 Saint-Gobain Abrasives, Inc. Abrasive article and method of forming

Also Published As

Publication number Publication date
JP6245833B2 (ja) 2017-12-13
KR101563418B1 (ko) 2015-10-26
KR20140122999A (ko) 2014-10-21
JP2014205211A (ja) 2014-10-30
TWI566864B (zh) 2017-01-21
TW201438833A (zh) 2014-10-16
CN104097270A (zh) 2014-10-15

Similar Documents

Publication Publication Date Title
CN104097270B (zh) 线锯及线锯的制造方法
TWI517919B (zh) 有研磨粒部份嵌入金屬線且部份以有機黏合劑固持之鋸線
CN107513696B (zh) 金刚石涂层钻/铣刀具研磨预处理的方法
JP2009066689A (ja) 固定砥粒ワイヤーソー
KR20040086082A (ko) 엣지 연마한 질화물 반도체 기판과 엣지 연마한 ＧａＮ자립 기판 및 질화물 반도체 기판의 엣지 가공 방법
CN102700014A (zh) 金刚石微粉镀钛、镍磷和镍复合体金刚石线锯及制备方法
EP2334471B1 (en) Electroformed thin-wall cutting saws impregnated with abrasives
JP4073328B2 (ja) 単層固定砥粒ワイヤーソー及びその製造方法並びに切断方法
KR20110089263A (ko) 잉곳 절단 장치 및 절단 방법
JP2010234597A (ja) 切断ブレード、切断ブレードの製造方法及び切断加工装置
US8191545B2 (en) Electroformed thin-wall core drills impregnated with abrasives
KR101237195B1 (ko) 휴대폰용 유리의 연삭 가공 방법
CN105873723A (zh) 加工件的切断方法
WO2009107272A1 (ja) 薄刃砥石
US20240234125A9 (en) Method for producing discs from a cylindrical rod made of a semiconductor material
US7614395B2 (en) Electroformed thin-wall cutting saw impregnated with abrasives
JP2012228771A (ja) 樹脂製保護層を有するワイヤソー、ワイヤソーを用いた切断方法
CN104647618B (zh) 一种用于多线切割的异构固结磨料锯线
JP2014188655A (ja) 多結晶シリコン切削用ワイヤ工具、および、多結晶シリコンの切断方法
JP5510935B2 (ja) 半導体ウェハの製造方法
WO2014155624A1 (ja) 半導体ウェハの製造方法及び半導体ウェハ
CN205237856U (zh) 一种具有等磨耗结构的金刚石柔性磨带
US8567385B2 (en) Fret saw including a cutting wire provided with fixed abrasive grains each including a core coated with a hard film
CN104647617A (zh) 一种多线切割用异构固结磨料锯线及其制造设备和方法
KR101402214B1 (ko) 다결정 다이아몬드를 사용한 다층 전착 연삭 에지공구

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant