CN104091860B - Led封装光源及其生产工艺 - Google Patents
Led封装光源及其生产工艺 Download PDFInfo
- Publication number
- CN104091860B CN104091860B CN201410310966.5A CN201410310966A CN104091860B CN 104091860 B CN104091860 B CN 104091860B CN 201410310966 A CN201410310966 A CN 201410310966A CN 104091860 B CN104091860 B CN 104091860B
- Authority
- CN
- China
- Prior art keywords
- substrate
- offset plate
- light source
- led
- packaged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 238000004806 packaging method and process Methods 0.000 title abstract 12
- 239000000758 substrate Substances 0.000 claims abstract description 108
- 239000011521 glass Substances 0.000 claims abstract description 64
- 238000005516 engineering process Methods 0.000 claims description 22
- 239000000843 powder Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- 229910002114 biscuit porcelain Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000005253 cladding Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 239000012780 transparent material Substances 0.000 abstract description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 206010054949 Metaplasia Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- -1 e.g. Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000015689 metaplastic ossification Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012946 outsourcing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410310966.5A CN104091860B (zh) | 2014-07-01 | 2014-07-01 | Led封装光源及其生产工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410310966.5A CN104091860B (zh) | 2014-07-01 | 2014-07-01 | Led封装光源及其生产工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104091860A CN104091860A (zh) | 2014-10-08 |
CN104091860B true CN104091860B (zh) | 2017-01-11 |
Family
ID=51639558
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410310966.5A Expired - Fee Related CN104091860B (zh) | 2014-07-01 | 2014-07-01 | Led封装光源及其生产工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104091860B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105342048A (zh) * | 2015-12-10 | 2016-02-24 | 深圳前海零距物联网科技有限公司 | 新型发光头盔及制造方法 |
CN109755355B (zh) * | 2017-11-02 | 2021-12-07 | 深圳光峰科技股份有限公司 | 波长转换元件及其制备方法 |
CN109950386B (zh) * | 2019-04-10 | 2020-11-24 | 东莞市光志光电有限公司 | 一种基于量子点全彩发光Mini或Micro LED的结构及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0684648B1 (en) * | 1994-05-24 | 2000-09-13 | Sharp Kabushiki Kaisha | Method for producing semiconductor device |
CN1816232A (zh) * | 2005-01-31 | 2006-08-09 | 悠景科技股份有限公司 | 有机电激发光显示面板封装结构 |
CN103247740A (zh) * | 2012-02-14 | 2013-08-14 | 信越化学工业株式会社 | 光学半导体装置用封装体及其制造方法、以及光学半导体装置及其制造方法 |
-
2014
- 2014-07-01 CN CN201410310966.5A patent/CN104091860B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0684648B1 (en) * | 1994-05-24 | 2000-09-13 | Sharp Kabushiki Kaisha | Method for producing semiconductor device |
CN1816232A (zh) * | 2005-01-31 | 2006-08-09 | 悠景科技股份有限公司 | 有机电激发光显示面板封装结构 |
CN103247740A (zh) * | 2012-02-14 | 2013-08-14 | 信越化学工业株式会社 | 光学半导体装置用封装体及其制造方法、以及光学半导体装置及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104091860A (zh) | 2014-10-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN202111151U (zh) | 新型top led支架及由其制造的top led器件 | |
CN105047793B (zh) | 发光二极管封装结构的制作方法 | |
CN105720166A (zh) | 一种白光led芯片的制备方法 | |
CN103840071A (zh) | 一种led灯条制作方法及led灯条 | |
CN103872224A (zh) | 新型led发光元件 | |
CN108987549A (zh) | 一种白光芯片制备方法 | |
CN104091860B (zh) | Led封装光源及其生产工艺 | |
CN107871809A (zh) | 一种四周围白胶芯片的制备方法及一种led器件 | |
WO2016078002A1 (zh) | Led点胶辅助治具 | |
CN202513204U (zh) | 一种白光表面贴装发光二极管封装结构 | |
CN203941950U (zh) | 一种led封装组件 | |
CN203940289U (zh) | 全方位发光led光源 | |
CN203707188U (zh) | 一种提高光源光效的镜面铝基板 | |
CN207883721U (zh) | 一种具有良好散热性能的led灯条 | |
CN103117352B (zh) | 一种led封装结构及基于其实现荧光粉保形涂覆的方法 | |
CN104218141A (zh) | 一种倒装led芯片的封装结构 | |
CN104124324A (zh) | 一种led封装玻璃及其制备方法和应用 | |
CN204857777U (zh) | 一种led封装结构 | |
CN103474564A (zh) | Cob封装结构及cob封装方法 | |
CN102332450B (zh) | 一种大功率半导体元件模组封装结构 | |
CN203055985U (zh) | 一种led封装结构 | |
CN204927347U (zh) | 改善灯珠黄圈的led封装结构 | |
CN105588027B (zh) | 发光二极管光条、平面光源装置以及其制造方法 | |
CN204130579U (zh) | 一种led封装玻璃及其封装结构 | |
CN204558523U (zh) | 一种led贴片无机支架结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180810 Address after: 528478 two, 7, 125, inner street, Heping Road, Zhongshan, Guangdong. Patentee after: ZHONGSHAN SENAO OPTOELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 510000 Guangdong science and Technology Industrial Development Zone, Guangzhou, 231 and 233 podium B1B2 Building 1, two, three, four Patentee before: BOAO ZONGHENG NETWORK TECHNOLOGY Co.,Ltd. Effective date of registration: 20180810 Address after: 510000 Guangdong science and Technology Industrial Development Zone, Guangzhou, 231 and 233 podium B1B2 Building 1, two, three, four Patentee after: BOAO ZONGHENG NETWORK TECHNOLOGY Co.,Ltd. Address before: 523000 No. three, third industrial zone, Shida Road, Shui Lang village, Daling Shan town, Dongguan, Guangdong Patentee before: Dongguna Wangfeng Nanometer Material Co.,Ltd |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170111 Termination date: 20190701 |
|
CF01 | Termination of patent right due to non-payment of annual fee |