CN105588027B - 发光二极管光条、平面光源装置以及其制造方法 - Google Patents
发光二极管光条、平面光源装置以及其制造方法 Download PDFInfo
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Abstract
本发明提供一种发光二极管光条、平面光源装置以及其制造方法。该发光二极管光条,包含一光条基板、至少一接合层、至少一发光二极管芯片、至少一第一导线、至少一第二导线以及至少一封装体。光条基板界定出一容置空间且包含互相绝缘的一中间金属板、一第一侧金属板及一第二侧金属板。发光二极管芯片被接合层接合于中间金属板的出光面。第一导线及第二导线分别耦接于发光二极管芯片的正负极端与第一侧金属板及第二侧金属板之间。封装体用以封装发光二极管芯片。通过实施本发明,可有效降低发光二极管的操作温度,进而提高发光二极管的发光效率及使用寿命。
Description
技术领域
本发明是关于一种发光二极管光条、平面光源装置以及其制造方法,特别是关于一种简化工艺且改善发光效率的发光二极管光条、平面光源装置以及其制造方法。
背景技术
发光二极管(Light Emitting Diode,LED)由于其反应速度快、体积小、低耗电、低热量、使用寿命长等特点,已逐渐取代白炽灯泡以及卤素灯等传统照明灯具。
图1A为已知一背光结构的示意图;图1B则为图1A所示背光结构的分解图。如图1A及图1B所示,此背光结构包含导光板10、发光模块20、具有第一反光部31及第二反光部32的反射罩30、具有相对的第一表面41及第二表面42的反射片(reflector)40及支撑结构60。导光板10具有入光侧11、出光面12及底面13。第一表面41通过胶层50贴合于导光板10的底面13,第二表面42则贴合于背板61及散热器62。出光面12为导光板10朝向上方的一个表面,底面13则为相对的朝向导光板10下方的另一个表面。入光侧11位于导光板10的侧壁上,出光面12与底面13则分别形成于入光侧11的两个相对端缘,使出光面12及底面13与入光侧11夹有一个角度而相互邻接。
发光模块20包含基板21及发光二极管装置22,设置于基板21上的发光二极管装置22朝入光侧11发光。第一反光部31与发光模块20的表面211相贴合,且其底端的侧边形成有凹口311供发光组件22穿过。发光模块20较佳为采用发光二极管(light-emitting diode,LED)作为发光二极管装置22的光条(light bar)。在不同实施例中,当底面13上形成有光学微结构时,可以保留底面13相对于发光二极管装置22的部分而不形成光学微结构(见图3A,图3B)以避免亮点(hot spot)的形成,进而提高光能利用率。更具体的内容,可以参考中国台湾专利申请案号第100121649号的揭示内容。
现有的发光二极管装置,其封装方法为在固晶(Die Bond)、打线(Wire Bond)之后就直接点胶、封胶(Auto Encapsulate)或压模(Molding)。而传统固晶方式则是利用银胶或透明绝缘胶的方式将芯片(chip)固着于封装体内,且使整个发光二极管装置位于一基板上。发光二极管装置产生的热能则是通过传导的方式从发光二极管装置的元件内部传至元件基板,再经由银胶或透明绝缘胶传递至封装体的基板或热漕(heat sink)上。
图2显示已知发光二极管装置一实施例的示意图。如图2所示,发光二极管装置包含一基座100、一基板200、一支架300、一LED芯片400、一第一混合胶体510以及一封装胶材体800。基板200与支架300是设于基座100上,且第一混合胶体510是涂布于基板200与LED芯片400之间,用以将LED芯片400固着于基板200上。LED芯片400上通过导线900连接至支架300,用以导通电力至LED芯片400向上发光(Face Up)。封装胶材体800是灌注于基座100中用以包覆基板200、LED芯片400以及导线900。第一混合胶体510是设于基板200与LED芯片400之间,通过其接着性固定LED芯片400于基板200上,更利用热传导特性将LED芯片400于发光时所散发的热量通过基板200传至基座100进行散热。更具体的内容,可以参考中国台湾专利申请案号第096127147号的揭示内容。
一般封装用的胶材或树脂,亦即封装胶材体800,其折射率为1.5,空气的折射率为1。由于芯片(chips)、元件(devices)与封装材料;以及导光板10的折射率差异甚大,造成封装后发光二极管装置的光输出因全反射角过小,而使得出光效率减少。此外,于背光模块中,芯片(chips)的光线穿通过封装胶材体800后,进入空气,再射入至导光板10内,由于光线必须穿通过多次不同介质的界面,造成光能的损耗大。
发明内容
依本发明一实施例,提供一种发光二极管光条,包含一光条基板、至少一接合层、至少一发光二极管芯片、至少一第一导线、至少一第二导线以及至少一封装体。光条基板包含一中间金属板、一第一侧金属板及一第二侧金属板,且界定出一容置空间,其中第一侧金属板以绝缘方式贴合于中间金属板的一第一侧面,第二侧金属板以绝缘方式贴合于中间金属板的一第二侧面,中间金属板包含一出光面。发光二极管芯片被接合层接合于中间金属板的出光面。第一导线耦接于发光二极管芯片的正极端与第一侧金属板之间,用以作为发光二极管芯片的正极的导电路径。第二导线耦接于发光二极管芯片的负极端与第二侧金属板之间,用以作为发光二极管芯片的负极的导电路径。封装体包含有多数荧光粉以及一封装材料,用以封装发光二极管芯片。
于一实施例中,中间金属板的出光面为狭长条状且位于中间金属板的第一侧面及第二侧面之间。第一侧金属板及第二侧金属板皆包含一突出部,且突出部突出于中间金属板的出光面,且分别朝远离中间金属板的第一侧面及第二侧面的方向,向外侧以一预定角度弯折,藉以使中间金属板的出光面、第一侧金属板及第二侧金属板的该些突出部的内侧面共同界定出容置空间。
于一实施例中,界定该容置空间的该中间金属板的该出光面;及该第一侧金属板及该第二侧金属板的该些突出部的该些内侧面的表面上皆形成有一光反射层。
于一实施例中,第一侧金属板包含有多个互相分离或绝缘的第一侧金属子板,藉以分别控制不同群组的该些发光二极管芯片。
于一实施例中,第二侧金属板包含有多个互相分离或绝缘的第二侧金属子板,藉以将该些不同群组的该些发光二极管芯片加以串联或并联。
依据本发明一实施例,提供一种平面光源装置,包含一导光板及前述发光二极管光条。导光板由一导光材料所构成。前述发光二极管光条位于导光板的一侧边,而且发光二极管光条的容置空间的至少一部分被嵌入于导光板的该侧边内,导光板直接接触封装体。
于一实施例中,封装体未填满整个容置空间,而导光板的导光材料填入于容置空间内,并直接接触封装体。
依据本发明一实施例,提供一种平面光源装置的制造方法,包含以下步骤。提供一光条基板,其中光条基板界定出一容置空间且包含一中间金属板、一第一侧金属板及一第二侧金属板,第一侧金属板以绝缘方式贴合于中间金属板的一第一侧面,第二侧金属板以绝缘方式贴合于中间金属板的第二侧面。利用至少一接合层将至少一发光二极管芯片接合于中间金属板的一出光面上。通过至少一第一导线及至少一第二导线以打线方式,该至少一发光二极管芯片的正负极端分别耦接于第一侧金属板及第二侧金属板。涂布包含多数荧光粉以及一封装材料的一封装体于容置空间内,藉以将该至少一发光二极管芯片封装,而完成一发光二极管光条。将发光二极管光条的容置空间的部分,置于一模具中,并且将一导光材料注入模具中后,利用热处理使导光材料于模具内聚合成一导光板,以形成发光二极管光条与导光板一体成型的一平面光源装置。
于一实施例中,中间金属板的出光面为狭长条状且位于中间金属板的第一侧面及第二侧面之间。第一侧金属板及第二侧金属板皆包含一突出部,且突出部突出于中间金属板的出光面,且分别朝远离中间金属板的第一侧面及第二侧面的方向,向外侧以一预定角度弯折,藉以使中间金属板的出光面、第一侧金属板及第二侧金属板的该些突出部的内侧面共同界定出容置空间。
于一实施例中,界定该容置空间的该中间金属板的该出光面;及该第一侧金属板及该第二侧金属板的该些突出部的该些内侧面的表面上皆形成有一光反射层。
于一实施例中,第一侧金属板包含有多个互相分离或绝缘的第一侧金属子板,藉以分别控制不同群组的该些发光二极管芯片。
综上所述,本发明所提供的一种发光二极管光条及其应用的平面光源装置以及其制造方法。是在工艺时预先将发光二极管光条放在模具中,得到发光二极管光条与导光板一体成型的平面光源装置,使光线大部分能够进入导光板,大幅提高平面光源装置的效率。此外本发明是将发光二极管芯片直接固着于光条基板上,无已知技术所使用的导线架,因此也不会有导线架的热阻,且发光二极管芯片产生的热能可通过本发明光条基板的中间金属板快速传导散热,故可有效降低发光二极管的操作温度,进而提高发光效率及使用寿命。
附图说明
图1A为已知一背光结构的示意图。
图1B则为图1A所示背光结构的分解图。
图2显示已知发光二极管装置一实施例的示意图。
图3A显示本发明一实施例的一发光二极管光条的立体图。
图3B显示图3A的发光二极管光条的剖面图。
图4A显示本发明一实施例的平面光源装置的侧视图。
图4B显示图4A的平面光源装置的俯视图。
图5显示本发明一实施例的一发光二极管光条的立体图。
图6为本发明一实施例的平面光源装置的制造方法的流程图。
附图标号
10 导光板
100 基座
11 入光侧
12 出光面
13 底面
20 发光模块
200 基板
21 基板
211 表面
22 发光二极管装置
30 反射罩
31 第一反光部
311 凹口
32 第二反光部
300 支架
40 反射片
41 第一表面
42 第二表面
400 LED芯片
50 胶层
510 第一混合胶体
60 支撑结构
61 背板
62 散热器
600 平面光源装置
610 导光板
614 发光二极管芯片
615 接合层
620 发光二极管光条
660 光条基板
661 第一侧金属板
661a 第一侧金属子板
661b 第一侧金属子板
662 第二侧金属板
663 中间金属板
671 封装体
674 容置空间
681 第一导线
682 第二导线
800 封装胶材体
900 导线
具体实施方式
图3A显示本发明一实施例的一发光二极管光条的立体图。图3B显示图3A的发光二极管光条的剖面图。如图3A及图3B所示,发光二极管光条620包含一光条基板660、至少一发光二极管芯片614、一接合层615、至少一第一导线681、至少一第二导线682以及一封装体671。光条基板660包含一中间金属板663、一第一侧金属板661及一第二侧金属板662。
中间金属板663、第一侧金属板661及第二侧金属板662皆为长方形体,中间金属板663较厚且宽,且可以为铝镀银或铜镀银制成以快速传导发光二极管芯片614所产生的热能。第一侧金属板661以绝缘方式贴合于中间金属板663的第一侧面;第二侧金属板662以绝缘方式贴合于中间金属板663的第二侧面。
中间金属板663的一出光面为狭长条状且位于中间金属板663的第一侧面及第二侧面之间。第一侧金属板661及第二侧金属板662皆包含一突出部,且该些突出部突出于中间金属板663的出光面,且分别朝远离中间金属板663的第一侧面及第二侧面的方向,向外侧以一预定角度弯折,藉以使中间金属板663、第一侧金属板661及第二侧金属板662共同界定出一容置空间674。较佳的情况是,界定该容置空间674的每一侧面(包含中间金属板663的出光面及第一侧金属板661及第二侧金属板662的该些突出部的内侧面)的表面上皆形成有一光反射层。于一实施例中,如图4A所示,第一侧金属板661的弯折处,其在第一侧面及光反射层间的角度A,其限定在一最理想角度,该最理想角度能够使发光二极管芯片614所发出的光线I被第二侧金属板662的光反射层反射后,再照射至导光板610的侧面时,会发生全反射。较佳的情况是,前述角度A限定在一最适化角度范围,使大部分(亦即超过50%)的发光二极管芯片614所发出的光线I被第二侧金属板662的光反射层反射后,再照射至导光板610的侧面时,会发生全反射。应了解的是,全反射的现象与导光板610的材质与厚度、封装体671的材质等相关,这是于本领域具有通常知识者可以利用模拟计算求得或进行实验而测得,因此本说明书中省略了最理想角度或最适化角度范围的具体数据的说明。
于本实施例中,至少一发光二极管芯片614、至少一第一导线681及至少一第二导线682皆为多个。该些发光二极管芯片614被接合层615接合于中间金属板663的出光面上,并且被配置成一行。第一导线681耦接于发光二极管芯片614的正极端与第一侧金属板661之间,用以作为发光二极管芯片614的正极的导电路径;第二导线682耦接于发光二极管芯片614的负极端与第二侧金属板662之间,用以作为发光二极管芯片614的负极的导电路径。
封装体671包含有荧光粉以及封装材料,且封装体671填满整个发光二极管光条620的容置空间674内,直接接触该些发光二极管芯片614。于一实施例中该些发光二极管芯片614可以被封装于个别的封装体671中,于一实施例亦可以将该些发光二极管芯片614一起封装在整个封装体671内。于一实施例中,封装体671可以填满整个容置空间674;而于另一实施例中,封装体671可以仅填充于容置空间674的一部分内,而仅将该些发光二极管芯片614封装即可。
图4A显示本发明一实施例的平面光源装置的侧视图。图4B显示图4A的平面光源装置的俯视图。如图4A及图4B所示,平面光源装置600包含一导光板610及一发光二极管光条620。导光板610为一平板形状,发光二极管光条620位于导光板610的一侧边,而且发光二极管光条620的该容置空间674的部分被嵌入于导光板610的该侧边内,导光板610直接接触封装体671,并且导光板610包覆第一侧金属板661及第二侧金属板662的外侧面的至少一部分。如图4A所示,封装体671未填满整个容置空间674,而导光板610的导光材料会填入于容置空间674内,并直接接触封装体671。于本实施例中,第一导线681及第二导线682一部分被封装于封装体671中,另一部分被封装于导光板610或导光材料中。
图5显示本发明一实施例的一发光二极管光条的立体图。图5所示实施例与图3A所示实施例大致相同,因此相同的元件使用相同的符号并省略其相关说明。如图5所示,本实施例中,第一侧金属板661可以包含有两互相分离或绝缘的第一侧金属子板661a及第一侧金属子板661b,因此可以分别控制不同群组的发光二极管芯片614。此外,于另一实施例中,第二侧金属板662可以包含有多个互相分离或绝缘的第二侧金属子板,因此能够进行该些发光二极管芯片614的各群组的串联或并联。
综合以上,本发明所提供的发光二极管光条具有简洁构造及足够的机械强度,故可在与导光板一体成型时易于安装在模具内(如后述)且成型后可得到稳定的外形尺寸与光学性能。
图6为本发明一实施例的平面光源装置的制造方法的流程图。
步骤S02:提供一光条基板660,其中该光条基板660包含一中间金属板663、一第一侧金属板661及一第二侧金属板662,第一侧金属板661以绝缘方式贴合于中间金属板663的第一侧面;第二侧金属板662以绝缘方式贴合于中间金属板663的第二侧面,而且中间金属板663、第一侧金属板661及第二侧金属板662共同界定出一容置空间674。
步骤S04:利用接合层615将至少一发光二极管芯片614接合于中间金属板663的一出光面上。
步骤S06:通过第一导线681及第二导线682以打线方式,该些发光二极管芯片614的正负极端分别耦接于第一侧金属板661及第二侧金属板662。
步骤S08:涂布包含荧光粉以及封装材料的封装体671于该容置空间674内,藉以将该至少一发光二极管芯片614封装,而完成一发光二极管光条620。
步骤S10:将发光二极管光条620的该容置空间674的部分,置于一模具中,并且将导光板材料注入模具中后,利用热处理使导光板材料于模具内聚合,形成发光二极管光条620与导光板610一体成型的平面光源装置600。
步骤S10的更具体的实施方式,可以说明如下。步骤S22:将发光二极管光条620放置于该模具的一上模具及一下模具的侧边,而且可以依据模具形状可选择放置不同数量的光条,例如楔型导光板仅有一光条。于一实施例中,凹型导光板及平板导光板可以皆设有二光条。步骤S24:将多原料调和成一调和物,作为该导光板材料,该些原料包括甲基丙烯酸甲酯及聚合开始剂。步骤S26:令调和物预备聚合,此是让调和物的单量体(monomer)发生初步的聚合,并施加热处理,以将调和物浆化。步骤S28:为上模具及下模具组合成一个完整模具后,将浆化后的调和物注入模具中(注模步骤)。步骤S30:利用热处理使调和物于模具内聚合,此步骤需施以热处理以增进聚合的速度及效果。步骤S32:冷却后再脱模形成发光二极管光条620与导光板610一体成型的平面光源装置600。
由于注入聚合法是将流体的甲基丙烯酸甲酯(MMA)经数小时缓慢聚合成固体压克力(PMMA),过程中工作温度在110℃以下且压力极低(于一实施例中,温度及压力可以皆小于射出成型法所需要的温度及压力),故可将已装设有多发光二极管芯片614的光条620先预置于上下模具之间,依前述流程即可得到发光二极管光条620与导光板610一体成型的平面光源装置600。
综上所述,本发明所提供的一种发光二极管光条620及其应用的平面光源装置600以及其制造方法。是在工艺时预先将发光二极管光条620放在模具中,得到发光二极管光条620与导光板610一体成型的平面光源装置600,使光线大部分能够进入导光板610,大幅提高平面光源装置的效率。此外本发明是将发光二极管芯片614直接固着于光条基板660上,无已知技术所使用的导线架,因此也不会有导线架的热阻,且发光二极管芯片614产生的热能可通过本发明光条基板660的中间金属板663快速传导散热,故可有效降低发光二极管的操作温度,进而提高发光效率及使用寿命。
另外,本发明所提供的发光二极管光条620的光条基板660,只需简单电镀、贴合及折弯即可由卷状原材料转变而成,故无长度限制且在后续发光二极管芯片614的设置、接合、打线、封装体涂布等工艺依然保持连续状,直至光条完成品。故本发明无论在发光效率、使用寿命、材料成本、制造费用、设备投资及生产效率皆较背景技术有大幅进步。
发光二极管光条620与导光板610一体成型后实施例的前视图及俯视图,该光条的中间金属板663前端设有多发光二极管芯片614的出光面设在导光板610之内,后端则在导光板610侧边之外以作为发光二极管散热器或外接散热器端点,正负极导电轨迹的左金属板661及右金属板662,除顶端部份在导光板610之外设为电源接点70,其余皆设在导光板610内以隔绝外部环境对发光二极管影响。
综上所述,本发明所提供的平面光源装置本身即可作为照明用的平面光源,亦可作为液晶显示器的背光模块。
唯以上所述者,仅为本发明的较佳实施例而已,并非用来限定本发明实施的范围。故即凡依本发明申请范围所述的特征及精神所为的均等变化或修饰,均应包括于本发明的申请专利范围内。
Claims (11)
1.一种发光二极管光条,其特征在于,所述发光二极管光条用以与一导光板形成一体成型的结构,包含:
一光条基板,包含一中间金属板、一第一侧金属板及一第二侧金属板,且界定出一容置空间,其中该第一侧金属板以绝缘方式贴合于该中间金属板的一第一侧面,该第二侧金属板以绝缘方式贴合于该中间金属板的一第二侧面,该中间金属板包含一出光面;
至少一接合层;
至少一发光二极管芯片,被该至少一接合层接合于该中间金属板的该出光面;
至少一第一导线,耦接于该发光二极管芯片的正极端与该第一侧金属板之间,用以作为该发光二极管芯片的正极的导电路径;
至少一第二导线,耦接于该发光二极管芯片的负极端与该第二侧金属板之间,用以作为该发光二极管芯片的负极的导电路径;
至少一封装体,包含有多数荧光粉以及一封装材料,用以封装该至少一发光二极管芯片;以及
一导光材料,填入于该容置空间内,并直接接触该至少一封装体,其中该导光材料与构成该导光板的导光材料为一体成型,藉以使该发光二极管光条与该导光板为一体成型。
2.如权利要求1所述的发光二极管光条,其特征在于,
该中间金属板的该出光面为狭长条状,
该至少一发光二极管芯片的个数为多数个,
该第一侧金属板及该第二侧金属板皆包含一突出部,且所述突出部突出于该中间金属板的该出光面,且分别朝远离该中间金属板的该第一侧面及该第二侧面的方向,向外侧以一预定角度弯折,藉以使该中间金属板的该出光面、该第一侧金属板及该第二侧金属板的所述突出部的内侧面共同界定出该容置空间。
3.如权利要求2所述的发光二极管光条,其特征在于,界定该容置空间的该中间金属板的该出光面;及该第一侧金属板及该第二侧金属板的所述突出部的所述内侧面的表面上皆形成有一光反射层。
4.如权利要求1所述的发光二极管光条,其特征在于,
该至少一发光二极管芯片的个数为多数个,且区分成多数不同群组,
该第一侧金属板包含有多个互相分离或绝缘的第一侧金属子板,藉以分别控制所述不同群组的所述发光二极管芯片。
5.如权利要求4所述的发光二极管光条,其特征在于,该第二侧金属板包含有多个互相分离或绝缘的第二侧金属子板,藉以将所述不同群组的所述发光二极管芯片加以串联或并联。
6.一种平面光源装置,其特征在于,该平面光源装置包含:
一如权利要求1至5中任一权利要求所述的发光二极管光条;及
一导光板,由该导光材料所构成,
其中该发光二极管光条位于该导光板的一侧边,而且该发光二极管光条的该容置空间的至少一部分被嵌入于该导光板的该侧边内,该导光板直接接触该至少一封装体。
7.如权利要求6所述的平面光源装置,其特征在于,该封装体未填满整个该容置空间,而该导光板的该导光材料填入于该容置空间内,并直接接触该封装体。
8.一种平面光源装置的制造方法,其特征在于,该平面光源装置的制造方法包含:
提供一光条基板,其中该光条基板界定出一容置空间且包含一中间金属板、一第一侧金属板及一第二侧金属板,该第一侧金属板以绝缘方式贴合于该中间金属板的一第一侧面,该第二侧金属板以绝缘方式贴合于该中间金属板的该第二侧面;
利用至少一接合层将至少一发光二极管芯片接合于该中间金属板的一出光面上;
通过至少一第一导线及至少一第二导线以打线方式,该至少一发光二极管芯片的正负极端分别耦接于该第一侧金属板及第二侧金属板;
涂布包含多数荧光粉以及一封装材料的一封装体于该容置空间内,藉以将该至少一发光二极管芯片封装,而完成一发光二极管光条;
将该发光二极管光条的该容置空间的部分,置于一模具中,并且将一导光材料注入该模具中后,利用热处理使该导光材料于该模具内聚合成一导光板,以形成该发光二极管光条与该导光板一体成型的一平面光源装置。
9.如权利要求8所述的平面光源装置的制造方法,其特征在于,
该中间金属板的该出光面为狭长条状,
该至少一发光二极管芯片的个数为多数个,
该第一侧金属板及该第二侧金属板皆包含一突出部,且所述突出部突出于该中间金属板的该出光面,且分别朝远离该中间金属板的该第一侧面及该第二侧面的方向,向外侧以一预定角度弯折,藉以使该中间金属板的该出光面、该第一侧金属板及该第二侧金属板的所述突出部的内侧面共同界定出该容置空间。
10.如权利要求9所述的平面光源装置的制造方法,其特征在于,界定该容置空间的该中间金属板的该出光面;及该第一侧金属板及该第二侧金属板的所述突出部的所述内侧面的表面上皆形成有一光反射层。
11.如权利要求10所述的平面光源装置的制造方法,其特征在于,
所述发光二极管芯片区分成多数不同群组,
该第一侧金属板包含有多个互相分离或绝缘的第一侧金属子板,藉以分别控制不同群组的所述发光二极管芯片。
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