CN104072988B - 氮化硼高导热绝缘材料及其制备方法 - Google Patents
氮化硼高导热绝缘材料及其制备方法 Download PDFInfo
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- CN104072988B CN104072988B CN201410272665.8A CN201410272665A CN104072988B CN 104072988 B CN104072988 B CN 104072988B CN 201410272665 A CN201410272665 A CN 201410272665A CN 104072988 B CN104072988 B CN 104072988B
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- mica
- boron nitride
- insulating materials
- aramid fiber
- fibrid
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/32—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from aromatic diamines and aromatic dicarboxylic acids with both amino and carboxylic groups aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/16—Fibres; Fibrils
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Inorganic Fibers (AREA)
- Inorganic Insulating Materials (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
Claims (7)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410272665.8A CN104072988B (zh) | 2014-06-18 | 2014-06-18 | 氮化硼高导热绝缘材料及其制备方法 |
PCT/CN2015/000032 WO2015192641A1 (zh) | 2014-06-18 | 2015-01-20 | 氮化硼高导热绝缘材料及其制备方法 |
US15/317,099 US20170121582A1 (en) | 2014-06-18 | 2015-01-20 | Highly heat conductive boron nitride insulation material and preparation method therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410272665.8A CN104072988B (zh) | 2014-06-18 | 2014-06-18 | 氮化硼高导热绝缘材料及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104072988A CN104072988A (zh) | 2014-10-01 |
CN104072988B true CN104072988B (zh) | 2016-05-25 |
Family
ID=51594610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410272665.8A Active CN104072988B (zh) | 2014-06-18 | 2014-06-18 | 氮化硼高导热绝缘材料及其制备方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20170121582A1 (zh) |
CN (1) | CN104072988B (zh) |
WO (1) | WO2015192641A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104072988B (zh) * | 2014-06-18 | 2016-05-25 | 深圳昊天龙邦复合材料有限公司 | 氮化硼高导热绝缘材料及其制备方法 |
CN106531288B (zh) * | 2016-11-02 | 2018-10-19 | 株洲时代电气绝缘有限责任公司 | 一种少胶云母带及其制备方法 |
CN107541985B (zh) * | 2017-08-10 | 2019-11-15 | 华南理工大学 | 一种高导热绝缘芳纶半固化片及其制造方法 |
CN108978328B (zh) * | 2018-07-26 | 2020-12-29 | 陕西科技大学 | 一种导热型芳纶纳米绝缘纸及其制备方法 |
CN109778585B (zh) * | 2019-01-09 | 2021-08-24 | 苏州巨峰电气绝缘系统股份有限公司 | 一种导热纸及其制备方法 |
CN113461989A (zh) * | 2021-08-06 | 2021-10-01 | 扬中市华龙橡塑电器有限公司 | 一种各向异性导热复合材料及其制备方法 |
CN114045030B (zh) * | 2021-11-25 | 2023-09-15 | 深圳烯湾科技有限公司 | 热塑性导热绝缘复合材料及其制备方法 |
CN114121340A (zh) * | 2021-12-06 | 2022-03-01 | 华为数字能源技术有限公司 | 一种导热绝缘材料和导热绝缘材料的制作方法 |
CN114875709B (zh) * | 2022-05-19 | 2023-01-10 | 烟台民士达特种纸业股份有限公司 | 一种高频高压电气设备用导热型芳纶绝缘纸的制备方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2732822B2 (ja) * | 1995-12-28 | 1998-03-30 | デュポン帝人アドバンスドペーパー株式会社 | 複合体シートおよびその製造方法 |
JP3660765B2 (ja) * | 1996-10-31 | 2005-06-15 | デュポン帝人アドバンスドペーパー株式会社 | アラミド複合体シートの製造方法 |
US7527859B2 (en) * | 2006-10-08 | 2009-05-05 | Momentive Performance Materials Inc. | Enhanced boron nitride composition and compositions made therewith |
CN1974925A (zh) * | 2006-11-10 | 2007-06-06 | 陶世毅 | 含有聚苯硫醚及芳纶纤维的合成纤维纸及其制备方法 |
JP5746519B2 (ja) * | 2011-03-02 | 2015-07-08 | デュポン帝人アドバンスドペーパー株式会社 | 耐熱性電気絶縁シート材料及びその製造方法 |
JP2014109024A (ja) * | 2012-12-04 | 2014-06-12 | Sumitomo Bakelite Co Ltd | 複合樹脂組成物及び絶縁性と熱放散性に優れた成形体 |
CN103236292B (zh) * | 2013-04-22 | 2015-06-10 | 永济优耐特绝缘材料有限责任公司 | 云母带 |
US20150155070A1 (en) * | 2013-12-04 | 2015-06-04 | General Electric Company | Insulation for electrical components |
CN103725004B (zh) * | 2013-12-06 | 2016-06-29 | 四川大学 | 一种聚苯硫醚基导热复合材料及其制备方法 |
CN104072988B (zh) * | 2014-06-18 | 2016-05-25 | 深圳昊天龙邦复合材料有限公司 | 氮化硼高导热绝缘材料及其制备方法 |
-
2014
- 2014-06-18 CN CN201410272665.8A patent/CN104072988B/zh active Active
-
2015
- 2015-01-20 WO PCT/CN2015/000032 patent/WO2015192641A1/zh active Application Filing
- 2015-01-20 US US15/317,099 patent/US20170121582A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20170121582A1 (en) | 2017-05-04 |
WO2015192641A1 (zh) | 2015-12-23 |
CN104072988A (zh) | 2014-10-01 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: High-heat-conductive boron nitride insulation material and preparation method thereof Effective date of registration: 20180126 Granted publication date: 20160525 Pledgee: Shenzhen high tech investment and financing Company limited by guarantee Pledgor: Longpont Co., Ltd. Registration number: 2018990000084 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20211105 Granted publication date: 20160525 Pledgee: Shenzhen hi tech investment and Financing Guarantee Co., Ltd Pledgor: Shenzhen haotianlongbang composite material Co., Ltd Registration number: 2018990000084 |
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Effective date of registration: 20211223 Address after: 341900 Futian industrial district, Dingnan Industrial Park, Ganzhou City, Jiangxi Province Patentee after: Ganzhou Longbang Material Technology Co.,Ltd. Address before: Room 902, building 11, Shenzhen Software Park (phase 2), No. 1, kekezhong 2nd Road, Nanshan District, Shenzhen, Guangdong Province, 518000 A105 Patentee before: LONGPONT Co.,Ltd. |