CN104057218B - Novel soldering tin purifying agent - Google Patents
Novel soldering tin purifying agent Download PDFInfo
- Publication number
- CN104057218B CN104057218B CN201310095087.0A CN201310095087A CN104057218B CN 104057218 B CN104057218 B CN 104057218B CN 201310095087 A CN201310095087 A CN 201310095087A CN 104057218 B CN104057218 B CN 104057218B
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- CN
- China
- Prior art keywords
- purifying agent
- scolding tin
- amine
- stir
- behenic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
The invention discloses a novel soldering tin purifying agent and relates to the field of chemical products for electrical equipment industry. The novel soldering tin purifying agent comprises the following components by weight percent: 35%-55% of dipentaerythritol ester, 5%-20% of octadecadienoic acid, 15%-30% of behenic acid, 5%-15% of octadecylamine and 5%-10% of octadecanamide. A preparation process of the novel soldering tin purifying agent comprises the following steps: heating octadecadienoic acid and dipentaerythritol ester to 200 DEG C, stirring for 2-3 hours under the circumstance that nitrogen is charged for oxygen isolation, cooling to 60 DEG C, adding a dispersant-octadecanamide for mixing, stirring until a mixture is completely dissolved, heating to 100 DEG C, adding octadecylamine and behenic acid, continuously stirring for 2-4 hours, decolorizing, and filtering to obtain almost completely transparent liquid or light yellow liquid, namely the novel soldering tin purifying agent. The novel soldering tin purifying agent has the advantages of good thermal stability in use and high reduction efficiency, and the solder splash quantity can be reduced by more than 95%.
Description
Technical field
The present invention relates to electrical equipment industry field of chemicals is and in particular to a kind of new scolding tin purifying agent and its preparation side
Method.
Background technology
In the production process of electronic product, using scolding tin, electronic component being carried out with welding is necessary operation, welding
Quality reliability that product is used there is important impact, in various welding methods, wave-soldering is that one kind is widely used
Welding manner, when being welded using this technique, solder is exposed in the air, due in the air oxygen easily with have also
The solder of original work occurs chemical reaction to form the oxide of solder, and its Main Ingredients and Appearance is the oxide of stannum.These oxides
Increase with the prolongation of wave-soldering time, growing number of oxide swims in the surface of solder, these oxides not only shadow
Ring the mobility of solder, also affect quality of welding spot simultaneously and affect the dependability of electronic product.At present, with lead-free solder
Progressively application, in solder, the consumption of stannum increases, and the welding temperature of solder raises, because stannum itself is oxidizable, consequent
The oxidation quantity of slag is bigger, and in actual application, the loss rate of solder has reached 30% ~ 50%.Therefore, how to reduce oxidation welding slag
Generation, reduction-oxidation welding slag is useful solder is the problem solving required for use for electronic products Material Field.
In order to reduce the generation of oxidation welding slag, the mode protected using nitrogen is by solder and air exclusion, so that welding
Technique is carried out in the atmosphere of nitrogen, but the operating cost of this mode is high, increased PCB surface simultaneously and forms the general of stannum ball
Rate, using antioxidized solder can play reduce oxidation welding slag growing amount, domestic at present mainly by add P element come reality
Existing, but antioxidant effect prolongation generally over time, the consumption of trace element and be deteriorated.Compared using reducing agent also one kind and subtract
Aoxidize the effective ways of solder growing amount less, during use, do not change the composition of solder, meanwhile, there is easy to use, operation
The advantage of low cost.But the current solder reducing agent using there is also some shortcomings, as low in reduction efficiency, use during generation
Smog big, be also easy to produce the product with penetrating odor, impact operator's is healthy, therefore, develops and has relatively
High reduction effect, has the scolding tin reducing agent product of good environmental protection characteristic, for crest welder simultaneously in use
Skill is very necessary.
Content of the invention
It is an object of the invention to provide a kind of new scolding tin purifying agent, it can effectively reduce stannum during solder wave process
The generation of oxidizing slag, improves the service efficiency of solder, reduces the defect of welding, improves the dependability of electronic product, simultaneously
Do not change the production technology of wave-soldering, do not produce thick smoke and penetrating odor in welding, welding operation environment can be improved.
In order to solve the problems of background technology, the composition of the present invention and percentage by weight are respectively：Double Ji Wusi
Alcohol ester 35 ~ 55%, octadecene diacid 5 ~ 20%, behenic acid 15% ~ 30%, 18-amine. 5 ~ 15%, stearic amide 5 ~ 10%.
Its preparation technology is：Octadecene diacid and pentaerythritol fatty acid ester are warming up to 200 DEG C, in nitrogen charging starvation
In the case of stir 2-3h, be then cooled to 60 DEG C, add dispersant stearic amide mixing, stir and be completely dissolved to it, rise
Temperature, to 100 DEG C about, adds 18-amine. and behenic acid afterwards, carries out decolouring, filters, obtain almost complete after continuing stirring 2-4h
The liquid of all-transparent or weak yellow liquid, as described scolding tin purifying agent product.
The invention has the advantages that：There is good thermal stability during use, the high advantage of reduction efficiency, can reduce
Scruff amount reaches more than 95%, and meanwhile, reduction reaction is gentle, and the volatility smog of generation is less, does not produce air pollution and stimulation
Property abnormal smells from the patient, improve operating environment, effectively reduce the growing amount of scruff, reduce the production cost of enterprise.
Specific embodiment：
Specific embodiment one：The composition of this specific embodiment and weight ratio are respectively：Pentaerythritol fatty acid ester 50g, ten
Eight carbene diacid 15g, behenic acid 20g, 18-amine. 10g, stearic amide 5g part.
Its preparation technology is：Octadecene diacid 15g is mixed with pentaerythritol fatty acid ester 50g, is warming up to 200 DEG C,
Stir 3h in the case of nitrogen charging starvation, be then cooled to 60 DEG C, add the mixing of 5g dispersant stearic amide, stir to it
It is completely dissolved, is warming up to 100 DEG C about, add 10g 18-amine. and 20g behenic acid afterwards, carry out after continuing stirring 4h decolouring,
Filter, obtain almost fully transparent liquid or weak yellow liquid, as described scolding tin purifying agent product.
This specific embodiment adds a small amount of scolding tin purifying agent so as to form the liquid of 2mm on scolding tin surface in stannum stove
Layer, after 24 hours, and is not compared using heretofore described product, the scolding tin quantity of slag few 93%.During use, no
Obvious smoke produces, persistently using 24h, still no obvious smoke.
Specific embodiment two：The composition of this specific embodiment and weight ratio are respectively：Pentaerythritol fatty acid ester 45g, ten
Eight carbene diacid 20g, behenic acid 16g, 18-amine. 9g, stearic amide 10g part.
Its preparation technology is：Octadecene diacid 20g and pentaerythritol fatty acid ester 45g is heated up 200 DEG C, in nitrogen charging isolation
Stir 3h in the case of oxygen, be then cooled to 60 DEG C, add the mixing of 10g dispersant stearic amide, stir completely molten to it
Solution, is warming up to 100 DEG C about, adds 9g 18-amine. and 16g behenic acid afterwards, carries out decolouring, filters, obtain after continuing stirring 4h
Arrive almost fully transparent liquid or weak yellow liquid, as described scolding tin purifying agent product.
This specific embodiment adds a small amount of scolding tin purifying agent so as to form the liquid of 2mm on scolding tin surface in stannum stove
Layer, after 24 hours, and is not compared using heretofore described product, the scolding tin quantity of slag few 96%.Have micro- at the addition initial stage
Amount smog, the phenomenon producing smog in 2min disappears, persistently using 24h, no obvious smoke.
Claims (2)
1. a kind of new scolding tin purifying agent is it is characterised in that the composition of scolding tin purifying agent and percentage by weight are respectively：Double seasons penta
Four alcohol esters 35 ~ 55%, octadecene diacid 5 ~ 20%, behenic acid 15% ~ 30%, 18-amine. 5 ~ 15%, stearic amide 5 ~
10%；
Its preparation technology is：Octadecene diacid and pentaerythritol fatty acid ester are warming up to 200 DEG C, in the feelings of nitrogen charging starvation
Stir 2-3h under condition, be then cooled to 60 DEG C, add the mixing of dispersant stearic amide, stir and be completely dissolved to it, be warming up to
100 DEG C, add 18-amine. and behenic acid afterwards, carry out decolouring after continuing stirring 2-4h, filter, obtain almost fully transparent
Liquid or weak yellow liquid, as described scolding tin purifying agent product.
2. a kind of new scolding tin purifying agent according to claim 1 is it is characterised in that the composition of scolding tin purifying agent and weight
Ratio is respectively：Pentaerythritol fatty acid ester 50g, octadecene diacid 15g, behenic acid 20g, 18-amine. 10g, stearic amide
5g；
Its preparation technology is：Octadecene diacid 15g is mixed with pentaerythritol fatty acid ester 50g, is warming up to 200 DEG C, in nitrogen charging
Stir 3h in the case of starvation, be then cooled to 60 DEG C, add the mixing of 5g dispersant stearic amide, stir complete to it
Dissolving, is warming up to 100 DEG C, adds 10g 18-amine. and 20g behenic acid afterwards, carries out decolouring, filters, obtain after continuing stirring 4h
Arrive almost fully transparent liquid or weak yellow liquid, as described scolding tin purifying agent product.
3. a kind of new scolding tin purifying agent according to claim 1 is it is characterised in that the composition of scolding tin purifying agent and weight
Ratio is respectively：Pentaerythritol fatty acid ester 45g, octadecene diacid 20g, behenic acid 16g, 18-amine. 9g, stearic amide
10g；
Its preparation technology is：Octadecene diacid 20g and pentaerythritol fatty acid ester 45g is heated up 200 DEG C, in nitrogen charging starvation
In the case of stir 3h, be then cooled to 60 DEG C, add 10g dispersant stearic amide mixing, stir and be completely dissolved to it, rise
Temperature, to 100 DEG C, adds 9g 18-amine. and 16g behenic acid afterwards, carries out decolouring, filters, obtain almost complete after continuing stirring 4h
The liquid of all-transparent or weak yellow liquid, as described scolding tin purifying agent product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310095087.0A CN104057218B (en) | 2013-03-22 | 2013-03-22 | Novel soldering tin purifying agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310095087.0A CN104057218B (en) | 2013-03-22 | 2013-03-22 | Novel soldering tin purifying agent |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104057218A CN104057218A (en) | 2014-09-24 |
| CN104057218B true CN104057218B (en) | 2017-02-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310095087.0A Active CN104057218B (en) | 2013-03-22 | 2013-03-22 | Novel soldering tin purifying agent |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116174996B (en) * | 2023-01-18 | 2023-11-03 | 宁成新材料科技(苏州)有限责任公司 | Slag removing agent and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101608262A (en) * | 2009-06-30 | 2009-12-23 | 何光宁 | Antioxidation chelation reductant for molten metal |
| CN101613807A (en) * | 2009-08-03 | 2009-12-30 | 黄俊凯 | Solder dross reducing agent |
| CN101798628A (en) * | 2010-01-15 | 2010-08-11 | 何光宁 | Antioxidation chelation reductant for molten metal, and production process |
| TW201127940A (en) * | 2010-02-06 | 2011-08-16 | wen-jie Gao | Anti-oxidative chelating reducing agent for molten metal |
| CN102162039A (en) * | 2010-02-24 | 2011-08-24 | 诸葛秀英 | Super tin slag reducing agent |
| CN102352446A (en) * | 2011-08-19 | 2012-02-15 | 帅鹏 | Antioxidation reducing agent for tin or tin alloy |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649982B2 (en) * | 1973-07-18 | 1981-11-26 |
-
2013
- 2013-03-22 CN CN201310095087.0A patent/CN104057218B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101608262A (en) * | 2009-06-30 | 2009-12-23 | 何光宁 | Antioxidation chelation reductant for molten metal |
| CN101613807A (en) * | 2009-08-03 | 2009-12-30 | 黄俊凯 | Solder dross reducing agent |
| CN101798628A (en) * | 2010-01-15 | 2010-08-11 | 何光宁 | Antioxidation chelation reductant for molten metal, and production process |
| TW201127940A (en) * | 2010-02-06 | 2011-08-16 | wen-jie Gao | Anti-oxidative chelating reducing agent for molten metal |
| CN102162039A (en) * | 2010-02-24 | 2011-08-24 | 诸葛秀英 | Super tin slag reducing agent |
| CN102352446A (en) * | 2011-08-19 | 2012-02-15 | 帅鹏 | Antioxidation reducing agent for tin or tin alloy |
Non-Patent Citations (1)
| Title |
|---|
| 锡渣还原剂在波峰焊工艺中的使用;罗时中等;《2008中国电子制造技术论坛论文集》;20081011;第171-176页 * |
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| CN104057218A (en) | 2014-09-24 |
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Address after: 518000 1606-1, block a, Zhongji LEO Satellite Internet of things Industrial Park, Keneng Road, Dongkeng community, Fenghuang street, Guangming District, Shenzhen, Guangdong Patentee after: SHENZHEN FEINIDI TECHNOLOGY CO.,LTD. Address before: 518000 1128, 11th floor, building 2, Shanghenglang new industrial zone, Tongsheng community, Dalang street, Bao'an District, Shenzhen, Guangdong Province (office space) Patentee before: SHENZHEN FEINIDI TECHNOLOGY CO.,LTD. |