CN104052308B - 驱动电路装置 - Google Patents

驱动电路装置 Download PDF

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Publication number
CN104052308B
CN104052308B CN201410076814.3A CN201410076814A CN104052308B CN 104052308 B CN104052308 B CN 104052308B CN 201410076814 A CN201410076814 A CN 201410076814A CN 104052308 B CN104052308 B CN 104052308B
Authority
CN
China
Prior art keywords
circuit
stage
circuit substrate
switching element
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201410076814.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN104052308A (zh
Inventor
内田修弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JTEKT Corp
Original Assignee
JTEKT Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JTEKT Corp filed Critical JTEKT Corp
Publication of CN104052308A publication Critical patent/CN104052308A/zh
Application granted granted Critical
Publication of CN104052308B publication Critical patent/CN104052308B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Power Steering Mechanism (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
CN201410076814.3A 2013-03-11 2014-03-04 驱动电路装置 Expired - Fee Related CN104052308B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-047828 2013-03-11
JP2013047828A JP6075128B2 (ja) 2013-03-11 2013-03-11 駆動回路装置

Publications (2)

Publication Number Publication Date
CN104052308A CN104052308A (zh) 2014-09-17
CN104052308B true CN104052308B (zh) 2018-05-29

Family

ID=50193371

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410076814.3A Expired - Fee Related CN104052308B (zh) 2013-03-11 2014-03-04 驱动电路装置

Country Status (4)

Country Link
US (1) US9373560B2 (https=)
EP (1) EP2779811A1 (https=)
JP (1) JP6075128B2 (https=)
CN (1) CN104052308B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6115465B2 (ja) * 2013-12-26 2017-04-19 株式会社デンソー 電子制御ユニット、および、これを用いた電動パワーステアリング装置
JP6771447B2 (ja) * 2017-09-29 2020-10-21 日立オートモティブシステムズ株式会社 パワー半導体装置およびそれを用いた電力変換装置
JP7406931B2 (ja) * 2019-07-11 2023-12-28 株式会社マキタ 電動作業機
US11037853B1 (en) * 2019-12-17 2021-06-15 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method of manufacturing the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19726534A1 (de) * 1997-06-23 1998-12-24 Asea Brown Boveri Leistungshalbleitermodul mit geschlossenen Submodulen
JP3673776B2 (ja) * 2002-07-03 2005-07-20 株式会社日立製作所 半導体モジュール及び電力変換装置
US7327024B2 (en) * 2004-11-24 2008-02-05 General Electric Company Power module, and phase leg assembly
JP4446964B2 (ja) * 2006-01-11 2010-04-07 三菱電機株式会社 誘導加熱調理器
JP4930231B2 (ja) * 2006-07-20 2012-05-16 セイコーエプソン株式会社 液体噴射装置
JP4909712B2 (ja) * 2006-11-13 2012-04-04 日立オートモティブシステムズ株式会社 電力変換装置
JP5326269B2 (ja) * 2006-12-18 2013-10-30 大日本印刷株式会社 電子部品内蔵配線板、及び電子部品内蔵配線板の放熱方法
US20090141456A1 (en) * 2007-11-30 2009-06-04 Itt Manufacturing Enterprises, Inc. Multilayer, thermally-stabilized substrate structures
JP5444619B2 (ja) * 2008-02-07 2014-03-19 株式会社ジェイテクト 多層回路基板およびモータ駆動回路基板
JP2009277726A (ja) * 2008-05-12 2009-11-26 Jtekt Corp 積層回路基板、モータ制御装置および車両用操舵装置
JP5067267B2 (ja) * 2008-06-05 2012-11-07 三菱電機株式会社 樹脂封止型半導体装置とその製造方法
DE102008040906A1 (de) 2008-07-31 2010-02-04 Robert Bosch Gmbh Leiterplatine mit elektronischem Bauelement
CN102339818B (zh) * 2010-07-15 2014-04-30 台达电子工业股份有限公司 功率模块及其制造方法
JP5447453B2 (ja) 2010-11-03 2014-03-19 株式会社デンソー スイッチングモジュール

Also Published As

Publication number Publication date
US20140254105A1 (en) 2014-09-11
JP6075128B2 (ja) 2017-02-08
US9373560B2 (en) 2016-06-21
JP2014176225A (ja) 2014-09-22
EP2779811A1 (en) 2014-09-17
CN104052308A (zh) 2014-09-17

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180529

Termination date: 20200304