CN104051926B - The manufacture method of connector and the connection method of electronic unit - Google Patents
The manufacture method of connector and the connection method of electronic unit Download PDFInfo
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- CN104051926B CN104051926B CN201410093396.9A CN201410093396A CN104051926B CN 104051926 B CN104051926 B CN 104051926B CN 201410093396 A CN201410093396 A CN 201410093396A CN 104051926 B CN104051926 B CN 104051926B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1313—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells specially adapted for a particular application
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
- Combinations Of Printed Boards (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Liquid Crystal (AREA)
Abstract
The manufacture method of connector of the present invention and the connection method of electronic unit, suppress the cure shrinkage of light-cured type binding agent, improve the bad connection of electronic unit.Have：Via light-cured type binding agent (3), the process that electronic unit (18) is configured on substrate (12)；And the process for solidifying it to binding agent (3) irradiation light, substrate (12) is divided into multiple join domain CH1~CH5 with the region that electronic unit (18) is connected, to each join domain CH1~CH5, change the exposure intensity of light to be solidified.
Description
Technical field
It the present invention relates to the use of the manufacture method that light-cured type binding agent is connected to the connector of electronic unit etc., Yi Jili
The connection method of electronic unit etc. is connected with light-cured type binding agent.
Background technology
All the time, liquid crystal display device is as TV and PC displays, portable phone, portable game machine, tablet PC
Or the various display devices such as vehicle-mounted display and be widely used.In recent years, in such liquid crystal display device, from narrow
Angle away from change, lightening etc. is set out, using the institute that liquid crystal drive IC is mounted directly on the substrate of liquid crystal display panel
Call COG (chip on glass：Glass flip chip) and be mounted directly on the substrate of liquid crystal display panel formed with liquid crystal drive electricity
So-called FOG (the film on glass of the flexible base board on road：Glass film).
For example, using the liquid crystal display device 100 of COG mounting means, have complete for liquid crystal display as shown in Figure 8
The liquid crystal display panel 104 of the function of tonic chord, the liquid crystal display panel 104 have mutually opposing two being made up of glass substrate etc.
Transparency carrier 102,103.Moreover, liquid crystal display panel 104 is provided with panel display unit 107, the panel display unit 107 is to pass through
The two transparency carriers 102,103 are bonded to each other by frame-shaped seal 105, and by two transparency carriers 102,103 and
Enclose what liquid crystal 106 formed in the space that seal 105 surrounds.
Transparency carrier 102,103 is on two mutually opposing inner surfaces, formed with by ITO in a manner of cross one another
A pair of transparency electrodes 108,109 of the striated of compositions such as (tin indium oxides).Then, two transparency carriers 102,103, pass through this
The crossover sites of two transparency electrodes 108,109 form the pixel of the least unit as liquid crystal display.
Among two transparency carriers 102,103, it is transparent more than another that a transparency carrier 103 is formed as planar dimension
Substrate 102, in the edge part 103a for the transparency carrier 103 that this is significantly formed, the portion of terminal formed with transparency electrode 109
109a.In addition, in two transparency electrodes 108,109, formed with the alignment films 111,112 for implementing set friction treatment, liquid
The initial orientation of brilliant molecule is provided by the alignment films 111,112.Further, in the outside of two transparency electrodes 108,109, arrange
Have a pair of Polarizers 118,119, the direction of vibration of the transmitted light of the light source 120 from backlight etc. by the two Polarizers 118,
119 provide.
On portion of terminal 109a, liquid crystal drive IC115 is connected to via the hot pressing of anisotropic conductive film 114.Anisotropy
Conducting film 114 is that electroconductive particle is mixed in heat-curing type adhesive resin and does film-like, by two conductors it
Between be heated during crimping and obtain conducting between conductor using conducting particles, kept using adhesive resin between conductor
Mechanical connection.Liquid crystal drive can make liquid crystal with IC115 by for pixel selection applying liquid crystal drive voltage
Alignment portion changes and carries out set liquid crystal display.In addition, the binding agent as composition anisotropic conductive film 114, typically
Using the high thermosetting adhesive of most reliability.
It is first when liquid crystal drive is connected into portion of terminal 109a with IC115 via such anisotropic conductive film 114
First, by pre-crimping equipment (not shown), the pre-crimping anisotropic conductive film 114 on the portion of terminal 109a of transparency electrode 109.
Then, liquid crystal drive is placed in anisotropic conductive film 114 with after IC115, passes through the first-class heat of thermo-compression bonding as shown in Figure 9
Crimping apparatus 121, liquid crystal drive is pressed against portion of terminal 109a sides together with anisotropic conductive film 114 with IC115, and made
Thermal pressure welding equipment 121 generates heat.Generated heat using caused by the thermal pressure welding equipment 121, it is anti-that anisotropic conductive film 114 produces heat cure
Should, thus, liquid crystal drive is adhered on portion of terminal 109a with IC115 via anisotropic conductive film 114.
But in such connection method using anisotropic conductive film, hot pressed temperature height is hence for liquid crystal
Driving becomes big with the thermal shock of the electronic units such as IC115 and transparency carrier 103.
Therefore, it is also proposed that substitution is such to be used the anisotropic conductive film 114 of thermohardening type binding agent and use purple
The connection method of outside line curing type binding agent.In the connection method using ultraviolet hardening binding agent, binding agent is because heated
And soften flowing, it is limited to be heated to enough between the portion of terminal 109a and liquid crystal drive of transparency electrode 109 use the electrode with IC115
Untill the temperature for clamping electroconductive particle, irradiated using ultraviolet and solidify binding agent.
But in the connection method using this ultraviolet hardening binding agent, along with what is irradiated using ultraviolet
The contraction of binding agent also occurs for solidification.Therefore, it has been punctured into this and has thus been connected in the IC of the transparency carrier 103 of clamping liquid crystal 106
Socket part produces warpage, it is thereby possible to which the face for losing the gap between the transparency carrier 102,103 of panel display unit 107 is equal
While even property, cause the disorder of liquid crystal aligning, show the failure such as uneven.Also, it is also possible to because in transparency carrier 103
Warpage caused by IC connecting portions and cause liquid crystal drive IC115 bad connection.
Current art document
Patent document
Patent document 1：WO00/46315 publications.
The content of the invention
Therefore, the present invention be to solve above-mentioned problem, its object is to a kind of, there is provided the manufacture method of connector and
The connection method of electronic unit, this method carry out the company of electronic unit by using ultraviolet hardening binding agent at low temperature
While connecing, suppress as the deformation caused by the cure shrinkage of binding agent, to improve the bad connection of electronic unit.
In order to solve above-mentioned problem, the manufacture of connector that is involved in the present invention, being connected on substrate electronic unit
Method has：The process of electronic unit is configured via light-cured type binding agent and the binding agent irradiation light is made on substrate
Its process solidified.Then, the region segmentation substrate being connected with the electronic unit is multiple join domains, to every
The individual join domain changes the exposure intensity of the light and makes its solidification.
In addition, method of connecting electrical components that is involved in the present invention, connecting electronic unit on substrate has：In substrate
On via light-cured type binding agent configure electronic unit process and the binding agent irradiation light is made its solidify process.So
Afterwards, the region segmentation substrate being connected with the electronic unit is multiple join domains, to each join domain
Change the exposure intensity of the light to make its solidification, connect the electronic unit on the substrate.
According to the present invention, by changing exposure intensity, the solidification opportunity of each join domain can be made different, inhaled successively
Receive the connection that electronic unit and substrate are sought while the deformation caused by the cure shrinkage of each join domain.
Brief description of the drawings
Fig. 1 is the sectional view for showing to apply the installation procedure of the present invention；
Fig. 2 is the sectional view for showing anisotropic conductive film；
Fig. 3 is the oblique view of join domain for showing to be connected and formed by electronic unit and glass substrate；
Fig. 4 is the top view for the ultraviolet irradiation intensity for showing the 1st~the 5th join domain；
Fig. 5 is the figure for illustrating the assay method of the warpage of embodiment and the glass substrate involved by comparative example；
Fig. 6 is the figure for illustrating the measuring method of embodiment and the conducting resistance involved by comparative example；
Fig. 7 is the figure for showing the relation between the ultraviolet irradiation time of each ultraviolet irradiation intensity and reactivity；
Fig. 8 is the sectional view for showing existing liquid crystal display panel；
Fig. 9 is the sectional view for the COG installation procedures for showing existing liquid crystal display panel.
Description of reference numerals
1 anisotropic conductive film；2 stripping films；3 electroconductive particles contain layer；4 electroconductive particles；10 liquid crystal displays
Panel；11 transparency carriers；12 transparency carriers；13 seals；14 liquid crystal；15 panel display units；16 transparency electrodes；17
Transparency electrode；17a portion of terminal；18 electronic units；20 COG installation portions；21 flexible base boards；22 FOG installation portions；24 orientations
Film；25 Polarizers；26 Polarizers；30 thermal heads；31 ultraviolet radiation devices.
Embodiment
Below, the manufacture method and connection method that apply connector of the invention are carried out specifically referring to the drawings
It is bright.In addition, the present invention is not limited in following embodiment, certainly, can enter without departing from the spirit and scope of the invention
Row various changes.Further, accompanying drawing is schematical that ratio of each size etc. can be with actual difference.Specific size etc. should refer to
Following explanation and judge.In addition, certainly, in accompanying drawing, also the relation comprising mutual size is different with ratio between each other
Part.
Below, as connecting object thing and connected object, the situation that electronic unit is connected to substrate is
Example explanation, but this technology can also apply to beyond the connection of substrate and electronic unit.For example, carry out in liquid crystal display panel
So-called COG (the chip on glass) installations of liquid crystal drive IC chip are installed on glass substrate.The liquid crystal display panel
10, as shown in figure 1, two transparency carriers 12,13 being made up of glass substrate etc. are arranged opposite, and these transparency carriers 11,
12 are bonded to each other using frame-shaped seal 13.Then, liquid crystal display panel 10 passes through the space that is surrounded by transparency carrier 11,12
It is interior to enclose liquid crystal 14 to form panel display unit 15.
Transparency carrier 11,12 is in two mutually opposing inner surfaces, formed with by ITO (oxygen in a manner of cross one another
Change indium tin) etc. the striated of composition a pair of transparency electrodes 16,17.Then, two transparency electrodes 16,17 are transparent by the two
The crossover sites of electrode 16,17 form the pixel of the least unit as liquid crystal display.
Among two transparency carriers 11,12, a transparency carrier 12 is formed as planar dimension and is more than another transparent base
Plate 11, and in the edge part 12a of the transparency carrier 12 significantly formed, setting installation liquid crystal drive IC etc. electronic unit
18 COG installation portions 20, in addition near the outside of COG installation portions 20, it is provided with the flexibility that installation forms liquid crystal display drive circuit
The FOG installation portions 22 of substrate 21.
In addition, liquid crystal drive IC and liquid crystal display drive circuit, by the application liquid crystal drive voltage to pixel selection, make
Liquid crystal aligning part changes and carries out set liquid crystal display.
In each installation portion 20,22, the portion of terminal 17a formed with transparency electrode 17.On portion of terminal 17a, as electric conductivity
Binding agent connect liquid crystal drive IC etc. electronic unit 18 and flexible base board 21 using anisotropic conductive film 1.Respectively to
Anisotropic conductive film 1 contains electroconductive particle 4, and the electrode and formation of electronic unit 18 and flexible base board 21 are on the side of transparency carrier 12
The portion of terminal 17a of edge 12a transparency electrode 17 is electrically connected via electroconductive particle 4.The anisotropic conductive film 1 is
Ultraviolet hardening binding agent, by being existed by the thermal head 30 described below to be thermally compressed and fluidization and electroconductive particle 4
It is crushed between each electrode of portion of terminal 17a and electronic unit 18 and flexible base board 21, by being shone by ultraviolet radiation device 31
Ultraviolet is penetrated, so as to which electroconductive particle 4 solidifies in the state of being crushed.Thus, anisotropic conductive film 1 is by transparency carrier 12
Electrically, mechanically it is connected with electronic unit 18 or flexible base board 21.
In addition, formed with the alignment films 24 for implementing set friction treatment, liquid crystal molecule in two transparency electrodes 16,17
Initial orientation provided by the alignment films 24.Further, in the outside of two transparency carriers 11,12, be equipped with a pair of Polarizers 25,
26, the direction of vibration of the transmitted light from the light sources such as backlight (not shown) is provided by the two Polarizers 25,26.
[anisotropic conductive film]
Anisotropic conductive film (ACF:Anisotropic Conductive Film) 1 as shown in Fig. 2 generally as
Electroconductive particle is formed on the stripping film 2 of substrate and contains layer 3.As shown in figure 1, anisotropic conductive film 1 is used for following purpose：It is logical
Cross make electroconductive particle contain layer 3 intervene in formed liquid crystal display panel 10 transparency carrier 12 transparency electrode 17 and electronics
Between part 18 or flexible base board 21, to connect liquid crystal display panel 10 and electronic unit 18 or flexible base board 21 and lead it
It is logical.
Usually used such as polyethylene terephthalate in anisotropic conductive film can be used as stripping film 2
The base material of ester film etc..
Electroconductive particle contain layer 3 by adhesive dispersed electro-conductive particle 4 form.Adhesive contains film forming tree
Fat, curable resin, curing agent and silane coupler etc. are identical with the adhesive for being used in common anisotropic conductive film.
As the resin that the preferred mean molecule quantity of film-forming resin is 10000 ~ 80000 or so.As film-forming resin, can enumerate
Phenoxy resin, epoxy resin, the deformation various resins such as epoxy resin and urethane resin.Wherein, from film-forming state,
From the point of view of connection reliability etc., particularly preferred phenoxy resin.
It is not particularly limited as curable resin, epoxy resin, allyl resin etc. can be enumerated.
As epoxy resin, it is not particularly limited, can be suitably selected according to purpose.As concrete example, for example, naphthalene can be enumerated
Type epoxy resin, biphenyl type epoxy resin, phenol novolak type epoxy, bisphenol-type epoxy resin, stilbene type ring
Oxygen tree fat, triphenol methane type epoxy resin, phenol aralkyl type epoxy resin, naphthol type epoxy resin, dicyclopentadiene type epoxy
Resin, triphenylmenthane type epoxy resin etc..These can be single, can also mix two or more.
As allyl resin, it is not particularly limited, can be suitably selected according to purpose, as specific example, for example, can enumerates
Methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, diacrylate ethylene glycol
Ester, diacrylate diethylene glycol (DEG) ester, three hydrocarbon propane tris, the cyclosilane diacrylate of dihydroxymethyl three, four methylenes
Double [the 4- of base glycol tetraacrylate, 2- hydroxyls -1,3- propane diacrylate, 2,2-（Acryloyl-oxy ylmethoxy）Phenyl] third
Double [the 4- of alkane, 2,2-（Acryloyl-oxyethyl）Phenyl] propane, dicyclopentenyl acrylate, tricyclodecyl methyl acrylate,
Three（Acrylyl oxy-ethyl）Isocyanuric acid ester, urethaneacrylates, epoxy acrylate etc..These can be single
Only or mixing is two or more.
As long as being then not particularly limited as curing agent light-cured type, can suitably be selected according to purpose, still, curability
Preferred cationic class curing agent when resin is epoxy resin, curable resin preferred radical type curing agent when being allyl resin.
Be not particularly limited, can suitably be selected according to purpose as cationic curing agent, for example, can enumerate sulfonium salt,
Salt etc., among these, it is also preferred that aromatic series sulfonium salt.As radical type curing agent, it is not particularly limited, can be fitted according to purpose
Work as selection, such as organic peroxide can be enumerated.
As silane coupler, epoxies, amino, mercaptol/sulfide-based and ureide derivative etc. can be enumerated.By adding
Add silane coupler, the cementability at the interface of organic material and inorganic material can be improved.
As electroconductive particle 4, any known electroconductive particle being used in anisotropic conductive film can be enumerated.
As electroconductive particle 4, such as the various metal or metal alloy such as nickel, iron, copper, aluminium, tin, lead, chromium, cobalt, silver, gold can be enumerated
Particle, in the particle of the plating metal on surface of the particles such as metallic compound, carbon, graphite, glass, ceramics, plastics, or in these particles
Surface plate the particle of insulation film again.In the material of the plating metal on surface of resin particle, for example can as resin particle
Enumerate epoxy resin, phenolic resin, allyl resin, acrylonitrile-styrene（AS）Resin, benzoguanamine resin, divinyl
The particle of base benzene resinoid, styrene resin etc..
[manufacture method]
Then, the saturating of transparency carrier 12 is connected to via anisotropic conductive film 1 to electronic unit 18 and flexible base board 21
The manufacturing process of connector on prescribed electrode 17 illustrates.First, the precompressed of anisotropic conductive film 1 is connected to transparency electrode 17
On.The method of pre-crimping anisotropic conductive film 1 is, in the transparency electrode 17 of the transparency carrier 12 of liquid crystal display panel 10,
Anisotropic conductive film 1 is configured in a manner of electroconductive particle contains layer 3 as the side of transparency electrode 17.
Then, electroconductive particle is contained after layer 3 is configured in transparency electrode 17, heat is for example utilized from the side of stripping film 2
Pressure head 30 contains layer 3 to electroconductive particle and is heated and pressurizeed, by taking away thermal head 30 from stripping film 2, and from transparent
Electroconductive particle on electrode 17, which contains layer 3, peels stripping film 2 off, the only precompressed of electroconductive particle oil-bearing layer 3 is connected to transparent electricity
On pole 17.Pre-crimping using thermal head 30 is to transparency electrode 17 with the pressure of very little (such as 0.1MPa~2MPa or so)
Heated while above side pressing stripping film 2.But heating-up temperature is set to the asphalt mixtures modified by epoxy resin in anisotropic conductive film 1
The thermosetting resin such as fat and allyl resin without curing degree temperature (such as 70~100 DEG C or so).
Then, so that the transparency electrode 17 of transparency carrier 12 and electronic unit 18 via electroconductive particle contain layer 3 and it is right
The mode put configures electronic unit 18.
Then, electric conductivity is made in the ultraviolet radiation device 31 of the bottom of transparency carrier 12 to irradiate ultraviolet using configuration
Particle contains layer 3 and solidified, so as to which electronic unit 18 is connected into transparency carrier 12.Now, in this connection process, such as Fig. 3 institutes
Show, the region segmentation that the portion of terminal 17a of transparency electrode 17 is connected with electronic unit 18 is multiple join domains, to each company
Region is connect, changes ultraviolet irradiation intensity and staggers solidification opportunity.
The electrode terminal of electronic unit 18 is suitably divided into the portion of terminal 17a of transparency electrode 17 regions being connected
Multiple join domains, for example, being connected in the electrode terminal by electronic unit 18 with transparency electrode 17 to form multiple passages
When, by each channel segmentation.Or the electrode terminal on electronic unit 18 is connected with the portion of terminal 17a of transparency electrode 17
Region, also multiple regions can be divided into homalographic by region-wide.In figure 3, as one, show electronic unit 18 with
And the portion of terminal 17a of transparency electrode 17, it is provided with connection and forms the 1st~the 5th join domain CH1~CH5's of passage
The situation of five.1st~the 5th join domain CH1~CH5, in the portion of terminal of the portion of terminal and transparency electrode 17 of electronic unit 18
The whole width in the region that 17a is connected via anisotropic conductive film 1, is substantially evenly configured.
In addition, on ultraviolet radiation device 31, such as corresponding to the 1st~the 5th join domain CH1~CH5, it is provided with the 1st
~the 5 ultraviolet irradiation portion 31a~31e.Ultraviolet radiation device 31 can be carried out individually to each ultraviolet irradiation portion 31a~31e
Irradiation control, thus, in this connection process, to each join domain, can change ultraviolet irradiation intensity and solidification of staggering
Opportunity.In addition, each ultraviolet irradiation portion 31a~31e, a part of range of exposures is repeated with adjacent ultraviolet irradiation portion, so as to
Do not have ultraviolet irradiation less than part.
So, by changing ultraviolet irradiation intensity and solidification opportunity of staggering, each join domain can be being absorbed successively
While deformation caused by cure shrinkage, the connection of electronic unit 18 and transparency carrier 12 is sought.Because：In high intensity
When the join domain adhesive of ultraviolet irradiation starts to solidify and produces the cure shrinkage of adhesive, because the purple than this low intensity
The adjacent join domain of outside line irradiation also has high fluidity, so the shape caused by cure shrinkage can be absorbed herein
Become.
Specifically, in the 1st~the 5th join domain CH1~CH5 shown in Fig. 3, as shown in figure 4, by the 3rd ultraviolet
Irradiation portion 31c ultraviolet irradiation intensity is set to big, the ultraviolet of the 2nd and the 4th ultraviolet irradiation portion 31b, 31d is irradiated strong
Degree is set to the 2nd greatly, and the ultraviolet irradiation intensity of the 1st and the 5th ultraviolet irradiation portion 31a, 31e is set into minimum.Thus, with
3 join domain CH3 → the 2nd and the 4th join domain CH2, CH4 → the 1st and the 5th join domain CH1, CH5 order, make to lead
Conductive particles contain layer 3 and solidified.So, according to this connection process, by change to the 1st~the 5th join domain CH1~
The intensity of CH5 ultraviolet irradiation, absorbs position by the adjacent the 2nd, the 4th join domain CH2, CH4 uncured adhesive
Deformation when the 3rd join domain CH3 of pars intermedia is in solidification, by the uncured of the adjacent the 1st, the 5th join domain CH1, CH5
Adhesive come absorb the 2nd, the 4th join domain CH2, CH4 solidification when deformation.
In contrast, in the case where irradiating ultraviolet simultaneously to the 1st~the 5th join domain CH1~CH5, because respectively connecting
Solidification will be started simultaneously at by meeting region CH1~CH5, so the deformation in neighboring connection region domain can not be absorbed.However, according to this connection work
Sequence, can suppress the deformation of transparency carrier 12, and prevent the bad connection of electronic unit 18.
In addition, in this connection process, as long as at least changing ultraviolet irradiation intensity and solidification opportunity of staggering, enter one
Step, in order to finely tune solidification opportunity, the ultraviolet irradiation time started for the 1st~the 5th join domain CH1~CH5 that can also stagger.This
Outside, the end time of ultraviolet irradiation is unanimously or to stagger.
After electronic unit 18 is connected in the transparency electrode 17 of transparency carrier 12, similarly carry out in transparency carrier 12
Transparency electrode 17 on install flexible base board 21 so-called FOG (film on glass) installation.Thereby, it is possible to manufacture via each
Anisotropy conducting film 1 is connected to transparency carrier 12 and electronic unit 18 and the connector of flexible base board 21.Alternatively, it is also possible to simultaneously
Carry out these COG installations and FOG installations.
Installed above with being mounted directly liquid crystal drive IC COG on the glass substrate of liquid crystal display panel, Yi Ji
Be mounted directly on the substrate of liquid crystal display panel flexible base board FPG installation exemplified by be illustrated, still, this technology can make
For other various connections beyond COG installations, FOG installations.
In addition, in the above embodiment, the adhesive of ultraviolet hardening is used, still, as long as can make by irradiation
Adhesive solidifies, and the light beyond ultraviolet can also be used in the present invention.In addition, in the above embodiment, as the binding agent of electric conductivity,
To being illustrated with membranaceous anisotropic conductive film 1, even if also out of question for paste.In this application, will contain
The membranaceous conductive adhering film of the grade of anisotropic conductive film 1 of electroconductive particle 4, or the conductive adhesive cream of paste are defined as
" binding agent ".
[embodiment 1]
Then, embodiments of the invention are illustrated.In the present embodiment, formed and be provided with the 1st~the 5th join domain
CH1~CH5 connector sample (reference picture 3), wherein the 1st~the 5th join domain CH1~CH5 is by being arranged at glass substrate
Transparency electrode be connected with the electrode terminal for being arranged at IC chip and form five passages, to each connector sample, by leading
Energization resistance (Ω) evaluates the connection status of IC chip and substrate, by determining the amount of warpage (μm) of substrate come aobvious instead of evaluation
Show uneven.
For the ultraviolet setting anisotropic conductive film of imparting of connection, contained by the electroconductive particle of 18 μm of thickness
Layer (ACF layers) form adhesive layer and form.ACF layers be by
Phenoxy resin (YP-70：Nippon Steel Chemical Co., Ltd produces)：20 mass parts
Liquid epoxy resin (EP-828：Mitsubishi chemical Co., Ltd produces)：30 mass parts
Solid epoxy resin (YD014：Nippon Steel Chemical Co., Ltd produces)：20 mass parts
Electroconductive particle (AUL704：Sekisui Chemical Co., Ltd produces)：30 mass parts
Cationic curing agent (LW-S1：San-Apro Ltd are produced)：5 mass parts
Be dissolved in solvent and prepare mixed solution, and the mixed solution is coated in PET film and dried in oven and
Be formed as membranaceous.
By the way that the ACF is adjusted and is laminated for 18 μm of thickness to obtain anisotropic conductive film.In embodiment and compare
The anisotropic conductive film used in example is width 4.0m × length 40.0m.
As evaluation element, use
Profile：1.8mm×34.0mm
Thickness：0.5mm
Form conducting measure with connect up evaluation IC.
As connection evaluation IC evaluation base material, thickness of glass has been used to form conductive measure cloth for 0.5mm
The glass substrate of line.
By the way that evaluation is configured on the glass substrate with IC via the anisotropic conductive film, and by using hot pressing
The heat pressurization of head and ultraviolet irradiate and connected, and form connector sample.The hot pressurized plane of thermal head be 10.0m ×
40.0mm, the fluororesin processing to the hot pressurized plane implementation thickness 0.05mm of thermal head are used as padded coaming.The temperature of thermal head
Condition is 110 DEG C, press condition be 70MPa, 5 seconds.
The UV irradiation apparatus (Omron system) of ultraviolet irradiation is carried out, has used intensity MAX (100%) → 500mW/cm2's
Equipment.Using the thermal head for being set as determined temperature and after carrying out pressurized heat pressurization in 5 seconds with IC to evaluation, carry out 5 seconds
Clock ultraviolet irradiates.In the ultraviolet irradiation intensity such as table of each join domain CH1~CH5 involved by embodiment and comparative example
1。
[table 1]
In embodiment 1, the 3rd join domain CH3 ultraviolet irradiation intensity is set to 90%, by the 1st, the 2nd, the 4th and
5th join domain CH1, CH2, CH4, CH5 ultraviolet irradiation intensity is set to 70%.That is, embodiment 1 is, in the 1st~the 5th connection
Among the CH1~CH5 of region, compared to the ultraviolet irradiation intensity for the 3rd join domain CH3 for being radiated at centre, reduce its periphery
1st, the 2nd, the 4th and the 5th join domain CH1, CH2, CH4, CH5 ultraviolet irradiation intensity, and make its consistent example.Separately
Outside, the ratio between exposure intensity is 70/90=78%.
In example 2, the 3rd~the 5th join domain CH3~CH5 ultraviolet irradiation intensity is set to 70%, connected the 1st
The ultraviolet irradiation intensity for meeting region CH1 is set to 30%, the 2nd join domain CH2 ultraviolet irradiation intensity is set into 50%.That is,
Embodiment 2 is ultraviolet irradiation intensity is periodically become big to the other end from as the 1st join domain CH1 of one end,
And the 3rd~the 5th join domain CH3~CH5 ultraviolet irradiation intensity is set to be consistent example.In addition, the ratio between exposure intensity is 30/
70=40%。
In embodiment 3, the 3rd join domain CH3 ultraviolet irradiation intensity is set to 70%, by the 2nd and the 4th connection
Region CH2, CH4 ultraviolet irradiation intensity are set to 50%, irradiate the 1st and the 5th join domain CH1, CH5 ultraviolet by force
Spend for 40%.That is, embodiment 3 is, from the 3rd join domain CH3 of centre to the 1st and the 5th join domain CH1 of two ends,
CH5, the example for making ultraviolet irradiation intensity periodically diminish.In addition, the ratio between exposure intensity is 40/70=57%.
In example 4, the 3rd join domain CH3 ultraviolet irradiation intensity is set to 10%, connected the 2nd and the 4th
Region CH2, CH4 ultraviolet irradiation intensity are set to 30%, irradiate the 1st and the 5th join domain CH1, CH5 ultraviolet by force
Degree is set to 70%.That is, embodiment 4 is the 3rd connection from the 1st and the 5th join domain CH1, CH5 as both ends to centre
Region CH3, the example for making ultraviolet irradiation intensity periodically diminish.In addition, the ratio between exposure intensity is 10/70=14%.
In comparative example 1, the 1st~the 5th join domain CH1~CH5 ultraviolet irradiation intensity is set to 100% and makes one
Cause.
In comparative example 2, the 1st~the 5th join domain CH1~CH5 ultraviolet irradiation intensity is set to 10% and makes one
Cause.
In comparative example 3, the 1st~the 5th join domain CH1~CH5 ultraviolet irradiation intensity is set to 50% and makes one
Cause.
Heating pressing and ultraviolet irradiation are carried out with conditions above and form the company that evaluation is connected to glass substrate with IC
Junctor sample, and to each sample, determine the size and conduction resistance value (Ω) of warpage (μm).
Warpage assay method is using contact pin type surface roughness meter (the small slope research of SE-3H Co., Ltd. is made), such as Fig. 5
It is shown, from 40 times Surface scan contact pilotages 41 of glass substrate of conjugant sample and the glass substrate after connection of the evaluation of measuring with IC
Amount of warpage (μm).
The measure of conduction resistance value is that connector sample is implemented to place 500 hours in the environment of 85 DEG C, 85%RH
After high temperature and humidity test, as shown in fig. 6, ammeter A, voltmeter V are connected to convex with evaluation IC conductive pattern 44
The metal line 43 for the glass substrate 40 that point 42 is connected, and flowed through using digital multimeter with so-called four-terminal method to determine
Conduction resistance value when electric current is 1mA.Table 2 shows result.
First, ultraviolet is irradiated with different ultraviolet irradiation intensities to sample, and investigates the anti-of each irradiation time
Should rate.Figure 7 illustrates the result.It can confirm to irradiate ultraviolet due to changing exposure intensity from Fig. 7, so as on solidification opportunity
There is difference.Thus, it is known that difference occur on solidification opportunity due to changing ultraviolet irradiation intensity.That is, ultraviolet irradiation is got over
It is strong then more can realize high reactivity in a short time.
In addition, show that the anisotropy for ultraviolet irradiation intensity and in embodiment and comparative example is led in table 2
Relation between the cure shrinkage of electrolemma.Cure shrinkage refers to ultraviolet curing and anisotropic conductive film is shunk
Ratio, can be with
Cure shrinkage=(ACF solidfied material proportion-ACF resin liquid proportion)/ACF solidfied material proportion × 100
To obtain.
[table 2]
As shown in table 2, in embodiments, stagger ultraviolet irradiation intensity to the 1st~the 5 join domain CH1~CH5 and
Stagger solidification opportunity, therefore, absorb the big connection of ultraviolet irradiation intensity by the incured adhesives of adjacent join domain
Deformation of the region in solidification.Therefore, according to each embodiment, amount of warpage control can be made in 12.7 μm of maximum, also make company in addition
Connecting resistance is controlled in 11.6 Ω of maximum.It is therefore to be understood that according to this connection process, the deformation of glass substrate can be suppressed, and
Prevent evaluation IC bad connection.
Each embodiment is seen, ultraviolet is irradiated simultaneously with maximal ultraviolet line exposure intensity in the 3rd join domain CH3 to centre
Periodically irradiate the embodiment 3 of the ultraviolet of small ultraviolet irradiation intensity successively to end, and to attached end region CH1~
CH5 is irradiated ultraviolet and is periodically irradiated small ultraviolet irradiation intensity successively to pars intermedia with maximal ultraviolet line exposure intensity
Ultraviolet embodiment 4 in, amount of warpage and connection resistance ratio it is better.This may be considered because in irradiation ultraviolet
Join domain is provided with the non-irradiated join domain of ultraviolet certainly, so in multiple join domains, has accomplished by adjacent
Join domain uncured adhesive to absorb solidification when deformation reason.Particularly because glass has from centre
The tendency that portion deforms laterally, so irradiating purple to join domain CH1~CH5 of end with maximal ultraviolet line exposure intensity
In the embodiment 4 of outside line, warpage quantitative change can be made minimum.
In addition, in embodiments, more big with cure shrinkage, amount of warpage more becomes big tendency, as a result turn into easy
It is set to produce display quality and show uneven etc..Therefore, in embodiment, it can also be seen that control cure shrinkage diminishes to be excellent
Choosing.
In contrast, the 1st~the 5th join domain CH1~CH5 is being irradiated with 100% identical ultraviolet irradiation intensity
Comparative example 1 in, each join domain CH1~CH5 will start simultaneously at solidification, moreover, cure shrinkage also be larger 4.1%, because
This, the deformation of adjacent join domain can not be absorbed and amount of warpage becomes maximum 18.1 μm, in addition, connection resistance be also changed into compared with
19.8 big Ω.In addition, in comparative example 3, ultraviolet irradiation intensity is set to 50% and ultraviolet irradiation intensity is diminished, but
Be, because each join domain CH1~CH5 will start simultaneously at solidification, so can not also absorb the deformation of adjacent join domain and
Amount of warpage is changed into larger 13.5 μm, in addition, connection resistance is also changed into 13.3 larger Ω.
In addition, make the comparative example 2 that ultraviolet irradiation intensity is unanimously 10% to the 1st~the 5th join domain CH1~CH5
In, it is 1.0% thus by warpage control at 4.8 μm that curing shrinkage rate is smaller, but insufficient as hardening, after hot and humid experiment
Connection resistance become to be greatly 110.8 Ω.
In addition, when seeing accumulated light, implementation column 3 and comparative example 3 are identical.However, amount of warpage be embodiment 3 compare than
It is small compared with example 3.Thus, even if the light quantity suffered by pressure contact portion entirety is identical, also it is able to confirm that strong by changing ultraviolet irradiation
The control of degree and amount of warpage is changed.And then be able to confirm that to each join domain, it is strong by changing ultraviolet irradiation
Degree, can make solidification opportunity stagger, warpage is diminished.
In addition, when seeing the ratio between exposure intensity, 1~embodiment of embodiment 4 is about 10%~80%.In contrast, comparative example 3
The ratio between exposure intensity be 100%, amount of warpage is changed into very big, in addition, the exposure intensity of comparative example 2 all 10% and be changed into connection not
It is good.That is, in embodiment 1~4, by making the ratio between exposure intensity substantially be set to 10%~80%, good electrical connection can be realized
While obtain and because of the difference of curing rate reduce warping effect.
Claims (7)
1. a kind of manufacture method of connector, has：
Via light-cured type binding agent, the process that electronic unit is configured on substrate；And
Thermal head is set to be thermally compressed the whole region of the electronic unit, and and make it solid to the binding agent irradiation light
The process of change,
In the manufacture method of the connector of electronic unit connection on the substrate, the substrate and the electronics
The region that part is connected is divided into multiple join domains, to each of the plurality of join domain, corresponding to the connection
Region and the irradiation portion of the irradiation light is repeated a part of range of exposures with adjacent irradiation portion, with least one connection
The region mode different from the luminous intensity of other join domains, change the exposure intensity of the light to make its solidification.
2. the manufacture method of connector as claimed in claim 1, among multiple join domains is divided into, compare
The exposure intensity of the light of the join domain irradiation of the centre in the region being connected to the substrate and the electronic unit, subtracts
The intensity of the light of join domain irradiation beyond the small join domain to the centre solidifies.
3. the manufacture method of connector as claimed in claim 2, from the join domain of the centre towards the substrate and institute
The join domain of the end in the region that electronic unit is connected is stated, is gradually reduced the intensity of the light to be solidified.
4. the manufacture method of connector as claimed in claim 1, compared to what is be connected to the substrate with the electronic unit
The exposure intensity of the light of the join domain irradiation of one or more ends in region, reduces to one or more of
The intensity of the light of join domain irradiation beyond the join domain of end is solidified.
5. the manufacture method of connector as claimed in claim 4, from the region that the substrate is connected with the electronic unit
An end the join domain, the institute of other ends in the region being connected towards the substrate with the electronic unit
Join domain is stated, is gradually reduced the exposure intensity of the light to be solidified.
6. the manufacture method of connector as claimed in claim 1, from the region that the substrate is connected with the electronic unit
Multiple ends the join domain, the company of the centre in the region being connected towards the substrate and the electronic unit
Region is connect, is gradually reduced the exposure intensity of the light to be solidified.
7. a kind of connection method of electronic unit, has：
Via light-cured type binding agent, the process that electronic unit is configured on substrate；And
Thermal head is set to be thermally compressed the whole region of the electronic unit, and and make it solid to the binding agent irradiation light
The process of change,
By in the connection method of the electronic unit connection electronic unit on the substrate, the substrate with it is described
The region that electronic unit is connected is divided into multiple join domains, to each of the plurality of join domain, corresponding to described
Join domain and the irradiation portion of the irradiation light is repeated a part of range of exposures with adjacent irradiation portion, with least one described
The join domain mode different from the luminous intensity of other join domains, change the exposure intensity of the light to be solidified.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013053013A JP6291165B2 (en) | 2013-03-15 | 2013-03-15 | Manufacturing method of connecting body and connecting method of electronic component |
| JP2013-053013 | 2013-03-15 |
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| CN104051926A CN104051926A (en) | 2014-09-17 |
| CN104051926B true CN104051926B (en) | 2018-02-16 |
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| JP (1) | JP6291165B2 (en) |
| KR (1) | KR102212012B1 (en) |
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| JP6490999B2 (en) * | 2015-03-16 | 2019-03-27 | デクセリアルズ株式会社 | Connection structure and method for manufacturing connection structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1282951A (en) * | 1999-08-03 | 2001-02-07 | 美能达株式会社 | Manufacturing mathod of liquid crystal display element |
| CN101160650A (en) * | 2005-04-14 | 2008-04-09 | 松下电器产业株式会社 | Electronic circuit device and method for manufacturing same |
| CN102948265A (en) * | 2010-06-22 | 2013-02-27 | 迪睿合电子材料有限公司 | Bonded material, and process for production thereof |
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| JP3152449B2 (en) * | 1991-05-23 | 2001-04-03 | 松下電器産業株式会社 | Lead bonding apparatus and method for IC parts |
| JP3801666B2 (en) * | 1995-05-22 | 2006-07-26 | 日立化成工業株式会社 | Electrode connection method and connection member used therefor |
| AU2327400A (en) * | 1999-02-08 | 2000-08-25 | Hitachi Chemical Co. Ltd. | Adhesive, electrode-connecting structure, and method of connecting electrodes |
| JP2007298608A (en) * | 2006-04-28 | 2007-11-15 | Victor Co Of Japan Ltd | Method for manufacturing optical component |
| JP4957438B2 (en) * | 2007-07-31 | 2012-06-20 | パナソニック株式会社 | Conductive bump, manufacturing method thereof, and electronic component mounting structure |
| JP2009224395A (en) * | 2008-03-13 | 2009-10-01 | Omron Corp | Jointing method and jointing apparatus |
| JP2009224394A (en) * | 2008-03-13 | 2009-10-01 | Omron Corp | Jointing apparatus and jointing method |
| JP5745944B2 (en) * | 2011-06-06 | 2015-07-08 | デクセリアルズ株式会社 | Connection method, connection body manufacturing method, connection body |
| JP5926590B2 (en) * | 2012-03-23 | 2016-05-25 | デクセリアルズ株式会社 | Manufacturing method of connecting body and connecting method of electronic component |
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2013
- 2013-03-15 JP JP2013053013A patent/JP6291165B2/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1282951A (en) * | 1999-08-03 | 2001-02-07 | 美能达株式会社 | Manufacturing mathod of liquid crystal display element |
| CN101160650A (en) * | 2005-04-14 | 2008-04-09 | 松下电器产业株式会社 | Electronic circuit device and method for manufacturing same |
| CN102948265A (en) * | 2010-06-22 | 2013-02-27 | 迪睿合电子材料有限公司 | Bonded material, and process for production thereof |
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| JP2014179498A (en) | 2014-09-25 |
| TW201504735A (en) | 2015-02-01 |
| KR20140113416A (en) | 2014-09-24 |
| KR102212012B1 (en) | 2021-02-05 |
| TWI603136B (en) | 2017-10-21 |
| JP6291165B2 (en) | 2018-03-14 |
| CN104051926A (en) | 2014-09-17 |
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