CN104051285A - 两步直接接合工艺及其实施工具 - Google Patents
两步直接接合工艺及其实施工具 Download PDFInfo
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Abstract
方法包括在第二封装部件上方放置多个第一封装部件,第二封装部件包括第三封装部件。第一封装部件中的第一金属连接件与第二封装部件的相应的第二金属连接件对准。在放置多个第一封装部件之后,实施金属与金属接合以将第一金属连接件接合至第二金属连接件。本发明还提供了两步直接接合工艺及其实施工具。
Description
相关申请的交叉引用
本申请要求于2013年3月12日提交的标题为“Two-Step Direct BondingProcesses and Tools for Performing the Same”的美国临时专利申请第61/778,277号的优先权,其全部内容结合于此作为参考。
技术领域
本发明一般地涉及半导体技术领域,更具体地来说,涉及半导体接合工艺及其实施装置。
背景技术
直接接合是制造集成电路的通常使用的接合方法。在直接接合的过程中,两个金属凸块接合在一起而没有设置在其中焊料。例如,直接接合可以是铜与铜接合或金与金接合。实施直接接合的方法包括热压缩接合(TCB,有时被称为热压缩接合)。在直接接合工艺的过程中,器件管芯的金属凸块与封装衬底的金属凸块对准且相对放置。施加压力以彼此相对地挤压器件管芯和封装衬底。在接合工艺的期间,还对器件管芯和封装衬底进行加热。通过压缩和升高的温度,器件管芯和封装衬底的金属凸块的表面部分相互扩散,以形成接合件(bond)。厚度小于3μm的焊料层可以添加至器件管芯和封装衬底的金属凸块的每一侧作为相应的金属凸块的顶部。在直接接合的过程中,焊料层彼此相接触,并且与金属凸块的下面的不可流动部分相接合。
为允许相互扩散的发生,直接接合通常是一个漫长的过程,有时需要数小时或数天完成。因此,直接接合的生产率很低。
发明内容
为了解决现有技术中所存在的缺陷,根据本发明的一方面,提供了一种方法,包括:在包括在第三封装部件中的第二封装部件的上方放置多个第一封装部件,其中,所述第一封装部件中的第一金属连接件与所述第二封装部件的相应的第二金属连接件对准;以及在放置所述多个第一封装部件之后,实施金属与金属接合以将所述第一金属连接件接合至所述第二金属连接件。
在该方法中,所述第一金属连接件和所述第二金属连接件没有焊料。
在该方法中,所述第一金属连接件和所述第二金属连接件中的至少一个包括焊料。
该方法进一步包括:在放置所述多个第一封装部件的步骤之前,在底部夹具上方放置所述第三封装部件;在放置所述多个第一封装部件的步骤之后,在所述多个第一封装部件上方放置顶部夹具;以及固定所述底部夹具、所述顶部夹具、所述多个第一封装部件和所述第三封装部件以形成集成夹具装配件。
在该方法中,所述顶部夹具包括含有弹性涂层的部分,并且所述顶部夹具的与所述多个第一封装部件的顶面接触的表面被配置为响应于下方的所述多个第一封装部件中相应的一个封装部件的顶面的倾斜程度而倾斜。
该方法进一步包括:在所述多个第一封装部件上方堆叠多个重量单元,所述多个重量单元中的每一个都被配置为将重量单独地施加在下方的所述多个第一封装部件中相应的一个封装部件上。
该方法进一步包括:放置第一重量件以对所述多个第一封装部件中的第一个施加力;以及放置第二重量件以对所述多个第一封装部件中的第二个施加力,其中,所述第一重量件不同于所述第二重量件。
根据本发明的另一方面,提供了一种方法,包括:放置底部夹具;在所述底部夹具上方放置第一封装部件,其中,所述第一封装部件其中包括多个第二封装部件;在所述多个第二封装部件上方放置多个第三封装部件;在所述多个第三封装部件上方放置顶部夹具;将所述顶部夹具、所述底部夹具、所述第一封装部件和所述多个第三封装部件固定在一起以形成夹具装配件;以及在所述夹具装配件上实施金属与金属接合。
在该方法中,在所述金属与金属接合之后,所述多个第三封装部件中的金属连接件接合至所述多个第二封装部件中的金属连接件以形成接合件,并且所述接合件没有焊料。
在该方法中,所述金属与金属接合的步骤包括:加热所述夹具装配件;以及施加压力以将所述多个第三封装部件压向所述多个第二封装部件。
该方法进一步包括:形成与所述夹具装配件基本相同的附加夹具装配件;以及在所述夹具装配件上方堆叠所述附加夹具装配件,其中,对所述夹具装配件和所述附加夹具装配件同时实施所述金属与金属接合。
该方法进一步包括:在所述金属与金属接合的步骤之前,调节单独施加在所述多个第三封装部件之一上的力。
在该方法中,所述多个第二封装部件包括封装衬底,并且所述多个第三封装部件包括器件管芯。
根据本发明的又一方面,提供了一种装置,包括:至少一个拾取头,被配置为:拾取和放置底部夹具;拾取和放置位于所述底部夹具上方的第一封装部件,所述第一封装部件其中包括多个第二封装部件;拾取和放置位于所述多个第二封装部件上方的多个第三封装部件;拾取和放置位于所述多个第三封装部件上方的顶部夹具;以及将所述顶部夹具、所述底部夹具、所述第一封装部件和所述多个第三封装部件固定在一起以形成夹具装配件;以及控制单元,与所述至少一个拾取头连接,并且被配置为控制所述至少一个拾取头。
在该装置中,所述控制单元被配置为控制所述多个第三封装部件与所述多个第二封装部件中的相应封装部件的对准。
在该装置中,所述至少一个拾取头和所述控制单元是拾取和放置工具的一部分。
在该装置中,所述拾取和放置工具被配置为形成附加夹具装配件,并且所述附加夹具装配件堆叠在所述夹具装配上方。
该装置进一步包括:接合工具,被配置为对所述夹具装配件实施金属与金属接合。
在该装置中,在所述金属与金属接合期间,所述接合工具被配置为施加并调节施加在所述夹具装配件上的力。
在该装置中,在所述金属与金属接合期间,所述接合工具被配置为施加并调节所述夹具装配件的温度。
附图说明
为了更全面地理解实施例及其优势,现将结合附图所进行的以下描述作为参考,其中:
图1至图3是根据一些示例性实施例的在夹具装配堆叠件的形成过程中的中间步骤的截面图;
图4示出了根据一些示例性实施例的在夹具装配堆叠件上实施定向接合的接合工具;
图5示出了根据一些示例性实施例的直接接合工艺;以及
图6至图9C是根据一些示例性实施例的顶部夹具的各种设计。
具体实施方式
下面,详细讨论本发明各实施例的制造和使用。然而,应该理解,本发明提供了许多可以在各种具体环境中实现的可应用的概念。所讨论的具体实施例仅为示例性的,而不用于限制本发明的范围。
根据一些示例性实施例提供了用于实施直接接合的方法和相应的工具。提供了在接合工艺期间的中间步骤。讨论了实施例的变型例。在各个附图和所有的示例性实施例中,相同的参考符号用于指定相同的元件。
图1示出了拾取和放置工具100,其被配置为拾取和放置多个部件,并且将部件组装成为夹具装配件。在一些实施例中,拾取和放置工具100包括控制单元102和多个拾取头。图1示意性地示出了拾取头104来表示通过控制单元102进行控制的多个拾取头,以实施包括拾取、放置以及堆叠图1至图3所示的多个不同部件的相应任务。
图1还示出了底部夹具22、位于底部夹具22上方的底部封装部件24以及位于底部封装部件24上方的顶部封装部件32的拾取和放置。在一些实施例中,底部夹具22包括具有平坦顶面的面板,将底部封装部件24放置在面板的顶面上。底部夹具22可以由陶瓷、不锈钢、铝、铜、它们任意的合金,或其他形成。底部封装部件24可以是封装衬底带,但是底部封装部件24可以是其他类型的封装部件,诸如中介层晶圆、封装晶圆、器件晶圆等。封装部件26包括在底部封装部件24中,封装部件26可以是封装衬底26,但是封装部件可以是其他类型的封装部件。封装部件26可以彼此完全相同。在一些实施例中,封装部件26是层压封装衬底,其中导线28(如图所示)嵌入层压介电层30中。在可选实施例中,封装部件26是逐渐建立的封装衬底,封装衬底包括核心(未示出)和在核心的相对侧上所制造的导线(未示出)。通过核心中的导电部件互连导线。
顶部封装部件32可以是器件管芯,顶部封装部件可以在其中包括诸如晶体管(未示出)的有源器件。在可选实施例中,顶部封装部件32是中介层、封装件等。底部封装部件26包括金属连接件34。顶部封装部件32包括金属连接件36。金属连接件34和金属连接件36可以没有焊料或具有较薄的焊料表面(具有小于3μm的厚度)。根据一些实施例,金属连接件34和金属连接件36中的金属可以包括选自铜、金、镍、钯、铝和它们的组合中的金属或金属合金。
拾取和放置工具100被配置为使用拾取头104拾取和放置底部夹具22、位于底部夹具22上方且与底部夹具22对准的底部封装部件24以及与相应的底部封装部件26对准的顶部封装部件32。此外,拾取和放置工具100控制金属连接件36与相应的金属连接件34对准,使得金属连接件34和金属连接件36可以一一对应地精确对准。在对底部夹具22、底部封装部件24和已经放置的顶部封装部件32未进行加热期间,可以逐个地实施顶部封装部件32的拾取和放置。因此,顶部封装部件32在底部封装部件26上的拾取和放置很快,例如,拾取和放置一个顶部封装部件32需要半秒到几秒。
参见图2,在所有顶部封装部件32的对准和放置之后,将顶部夹具38放置在封装部件32和底部夹具22的上方,且与封装部件32和底部夹具22对准。应该理解,图1和图2示出了顶部夹具38的简化视图,并且可以参考图6到图9C找到顶部夹具38的具体细节。也可以通过拾取和放置工具100实施顶部夹具38的拾取和放置。然后,通过紧固(securing)机械装置固定底部夹具22、顶部夹具38、以及其间的封装部件24和封装部件32以形成夹具装配件40。在一些实施例中,通过分布在底部夹具22和顶部夹具38边缘上的多个夹钳42来固定夹具装配件40。紧固机械装置将底部夹具22、顶部夹具38、以及封装部件24和封装部件32固定在一起作为集成单元,使得金属连接件34和金属连接件36在接下来的接合步骤中保持对准。
图3示出了多个夹具装配件40的形成和组装。在一些实施例中,首先组装多个夹具装配件40,然后堆叠组装的夹具装配件40。夹钳42用于紧固堆叠的夹具装配件40。在通篇描述中,下文中将堆叠的夹具装配件40共同称为夹具装配堆叠件44。在随后的描述中,当提及“夹具装配堆叠件44”时,其可以表示堆叠在一起的多个夹具装配件40,或者其也可以指的是附加夹具装配件40堆叠在其上的单个夹具装配件40。
图4示出了用于直接接合的接合装置200的示意图。根据一些实施例,接合装置200包括拾取和放置工具100,以及用于在夹具装配堆叠件44上实施直接接合的接合工具110。在一些实施例中,拾取和放置工具100以及接合工具110集成在一起作为集成平台,其中拾取和放置工具100以及接合工具110的动作可以是同步的,并通过共同的控制单元(未示出)进行控制。在可选实施例中,拾取和放置工具100以及接合工具110是独立工具,它们可以被放置在一起或彼此分开放置。接合工具110可以包括一个或多个室112。室112包括具有环境压力控制(真空控制)、用于加热夹具装配堆叠件44的热控制、气流控制、和用于彼此相对地挤压金属连接件34和金属连接件36(如图1所示)的压力控制的至少一个室(而有时包括多个室)。室112也可以包括用于实施夹具装配堆叠件44可能需要的附加任务的其他室,附加任务包括而不限于不期望在金属连接件34和金属连接件36(图1)的表面上形成的氧化物的减少。当夹具装配堆叠件44诸如以箭头114的方向在室112之间进行室与室的传送时,可以通过多个室112连续地实施直接接合工艺的不同任务。通过多室设计,可以降低制造工具的成本。例如,多个室112可以共享用于装载和/或卸载夹具装配堆叠件44的共同的装载/卸载工具116。
图5示出了根据示例性实施例的在一个室112中实施的接合工艺。例如,室112被配置为通过出口120连接至泵(未示出)的真空。诸如合成气体(例如,混合的N2、Ar、He和氢)的工艺气体可以通过入口122引入室112内。还原气体用于在接合工艺期间减少形成在连接件34和连接件36的表面上的氧化物。室112进一步被配置为将室112的内部压力保持在期望的范围内。此外,室112可以包括在接合工艺期间可以用于加热夹具装配堆叠件44的加热器124。可以将压力126施加在夹具装配堆叠件44上以通过接合工艺彼此相对地按压金属连接件34和金属连接件36。在一些示例性实施例中,在接合工艺期间,根据管芯的大小和凸块的密度,压力126可以是约0.5牛顿/管芯到约500牛顿/管芯。夹具装配堆叠件44的温度可以介于约120℃和470℃之间,并且接合时间可以介于约30秒到约55小时之间。在接合工艺之后,封装部件32接合下面的封装部件26,金属连接件36通过金属与金属的接合与相应的下面的金属连接件34接合。然后,例如,通过图4中的加载/卸载工具116从接合工具200上卸载夹具装配堆叠件44(图4)。
图6至图9C示出了根据一些示例性实施例的示例性顶部夹具38的具体细节。参见图6,顶部夹具38包括基底板50和附接至基底板50的接合单元52。例如,基底板50可以包括可以选自铜、不锈钢、陶瓷、铝和它们的合金的刚性材料。基底板50包括用于将接合单元52的末端插入其中的多个孔。在一些实施例中,接合单元52包括:刚性的内部部分52A和包裹在内部部分52A的表面上的弹性的外部部分52B。每个接合单元52都可以包括插入基底板50之中的窄部和位于基底板50外部的宽部。窄部可以具有宽度逐渐减小的部分使得该窄部可以插入基底板50。此外,宽部可以具有用于接合封装部件32的平坦底面。
形成内部部分52A的材料可以选自与用于形成基底板50相同的备选材料组,但是可以使用其他材料。弹性外部部分52B比部分52A更具有弹性,并且例如弹性外部部分52B可以由基于硅树脂的材料形成。外部部分52B的厚度T1可以介于约0.2μm和约10μm之间,或介于约0.5μm和5μm之间。在接合单元52插入基底板50中之前,弹性外部部分52B可以覆盖刚性部分52A的整个表面。因此,弹性外部部分52B将刚性部分52A与基底板50间隔开。
弹性外部部分52B的使用可以帮助接合单元52紧固到基底板50的相应的孔中。此外,应该理解,顶部封装部件32的顶面具有变化,且不是处于完全相同的水平面处。因此,如果使用刚性和平坦的顶部夹具,则顶面高于其他顶面的封装部件32可以比其他顶面接收更多的压力。这会导致这些封装部件32的损坏和/或顶面很低的那些封装部件32较差的接合。通过弹性外部部分52B,将施加给顶部封装部件32上的接合力自动调节为更均匀。此外,由于在基底板50的孔中存在弹性外部部分52B,如果封装部件32的顶面稍微倾斜,则响应于顶部封装部件32的顶面倾斜,接合单元52可以将它的顶面自动调节为稍微倾斜(以箭头54的方向)。
图7和8示出了根据可选实施例的顶部夹具38。除了图7和图8中的接合单元52穿透基底板50以及每个接合单元52的一部分均从基底板50的顶面伸出以外,在这些实施例中,外接合单元52类似于图6中的接合单元52。在这些实施例中,接合单元52的顶端可以插入重量单元(weight unit)内,重量单元具有适合接合单元52的顶端部分的孔。因此,每个重量单元56都可以单独地施加压力于相应的下面的接合单元52,而没有施加压力于其他接合单元52。接合单元52将相应的上面的重量单元56的重量传递给下面的顶部装配部件32。通过如图8所示的顶部夹具38,重量单元56可以具有不同的重量,从而可以补偿通过顶部封装部件32所接收到的压力差。因此,通过将重量单元56的重量调节为彼此不同或彼此相同,顶部封装部件32可以接收均匀的压力,且在所有顶部封装部件32上的接合更均匀。图8示出了与图7所示相似的设计。除图7中示出的之外,面板57进一步置于重量单元56的上方。面板57的重量通过重量单元56也施加在封装部件32上。
图9A、图9B和图9C示出了具有各种设计的顶部夹具38。参见图9A,顶部夹具38包括刚性基底板38A、弹性层38B和涂层38C。基底板38A可以由与图6中基底板50材料类似的刚性材料形成。弹性层38B比基底板38A更具有弹性,并且例如可以包括硅树脂,但是也可以使用其他弹性材料。弹性层38B的厚度T2可以介于约0.5μm和约30μm之间,或介于约1μm和5μm之间。外部涂层38C可以由诸如聚四氟乙烯(PTFE,也称为特氟龙,注册商标为DuPont Cororation)形成。通过弹性层38B,自动调节通过顶部夹具38施加在顶部封装部件32(图5)上的力,且因此力更加均匀。在接合工艺期间,表面38′与图5中的封装部件32接触。
图9B示出了根据可选实施例的顶部夹具38。在这些实施例中,形成多个接合单元52作为顶部夹具38的底部部分。每个接合单元52都可以在直接接合工艺期间与一个封装部件32对准。空间53形成在接合单元52之间且将接合单元52彼此间隔开。在顶部夹具38的仰视图中,接合单元52的位置可以被布置为阵列。在一些实施例中,每个接合单元52都由诸如硅树脂、特氟龙或其他弹性材料的同质材料形成。在可选实施例中,每个接合单元52都具有包括核心52A和位于核心52A表面上的涂层52B的异质结构。核心52A和涂层52B中的一个可以由比另一个更具有弹性的材料制成。例如,核心52A可以由诸如铜、不锈钢、陶瓷、铝或它们的合金的刚性材料形成,而涂层52B可以由诸如硅树脂或/和特氟龙的具有高导热性的弹性材料形成。可选地,涂层52B可以由诸如铜、不锈钢、陶瓷、铝或它们的合金的刚性材料形成,而核心52A可以由诸如硅树脂或特氟龙的弹性材料形成。
图9C示出了根据可选实施例的顶部夹具38,除了弹性层38B夹置在两个刚性基底板38A之间以外,这些实施例类似于图9A中的实施例。在这些实施例中,厚度T3可以大于图9A中的厚度T2,并且例如可以介于约1μm和约50μm之间。刚性基底板38A位于弹性层38B上方的部分具有厚度T4,且刚性基底板38A位于弹性层38B下方的部分具有厚度T5,厚度T5小于厚度T4。在一些实施例中,比率T5/T4小于约0.1。由于厚度T5较小,在直接接合工艺过程中,弹性层38B更容易吸收来自下方的封装部件32(未示出)的力。
在本发明的实施例中,显著改进了直接接合工艺的生产量。尽管接合时间较长,但由于多个封装部件24和相应的封装部件32(图5)同时接合,所以总体生产量较高。此外,在所有封装部件32均放置在封装部件24上之后进行加热,并且同时加热所有的封装部件,避免了在传统的直接接合工艺中没有接合的封装部件经受的不期望的加热。
根据一些实施例,方法包括在第二封装部件上方放置多个第一封装部件,第二封装部件包括在第三封装部件中。第一封装部件中的第一金属连接件与第二封装部件中的相应的第二金属连接件对准。在放置多个第一封装部件之后,实施金属与金属接合以将第一金属连接件接合至第二金属连接件。
根据其他实施例,方法包括放置底部夹具,且在底部夹具上方放置第一封装部件,其中第一封装部件包括在其中的多个第二封装部件。在多个第二封装部件上方放置多个第三封装部件。顶部夹具放置在多个第三封装部件上方。顶部夹具、底部夹具、第一封装部件和多个第三封装部件固定在一起以形成夹具装配件。然后,在夹具装配件上实施金属与金属接合。
根据又一些实施例,装置包括至少一个拾取头,拾取头被配置为拾取和放置底部夹具装配件,拾取和放置位于底部夹具上方的第一封装部件,其中第一封装部件包括在其中的多个第二封装部件,拾取和放置位于多个第一封装部件上方的多个第三封装部件,拾取和放置位于多个第三封装部件上方的顶部夹具,兵器将顶部夹具、底部夹具、第一封装部件和多个第三封装部件固定在一起以形成夹具装配件。装置进一步包括控制单元,该控制单元连接至至少一个拾取头并且被配置为控制至少一个拾取头。
尽管已经详细地描述了实施例及其优点,但应该理解,可以在不背离所附权利要求限定的实施例的主旨和范围的情况下,在本文中做各种不同的改变、替换和更改。而且,本申请的范围并不仅限于本说明书中描述的工艺、机器、制造、材料组分、装置、方法和步骤的特定实施例。作为本领域普通技术人员应该理解,通过本发明,现有的或今后开发的用于实施与根据本发明所采用的所述相应实施例基本相同的功能或获得基本相同结构的工艺、机器、制造、材料组分、装置、方法或步骤根据本发明可以被使用。相应地,附加的权利要求意指包括在例如工艺、机器、制造、材料组分、装置、方法或步骤的范围内。此外,每个权利要求构成一个独立的实施例,并且不同权利要求及实施例的组合均在本发明的范围内。
Claims (10)
1.一种方法,包括:
在包括在第三封装部件中的第二封装部件的上方放置多个第一封装部件,其中,所述第一封装部件中的第一金属连接件与所述第二封装部件的相应的第二金属连接件对准;以及
在放置所述多个第一封装部件之后,实施金属与金属接合以将所述第一金属连接件接合至所述第二金属连接件。
2.根据权利要求1所述的方法,其中,所述第一金属连接件和所述第二金属连接件没有焊料。
3.根据权利要求1所述的方法,其中,所述第一金属连接件和所述第二金属连接件中的至少一个包括焊料。
4.根据权利要求1所述的方法,进一步包括:
在放置所述多个第一封装部件的步骤之前,在底部夹具上方放置所述第三封装部件;
在放置所述多个第一封装部件的步骤之后,在所述多个第一封装部件上方放置顶部夹具;以及
固定所述底部夹具、所述顶部夹具、所述多个第一封装部件和所述第三封装部件以形成集成夹具装配件。
5.根据权利要求4所述的方法,其中,所述顶部夹具包括含有弹性涂层的部分,并且所述顶部夹具的与所述多个第一封装部件的顶面接触的表面被配置为响应于下方的所述多个第一封装部件中相应的一个封装部件的顶面的倾斜程度而倾斜。
6.根据权利要求1所述的方法,进一步包括:
在所述多个第一封装部件上方堆叠多个重量单元,所述多个重量单元中的每一个都被配置为将重量单独地施加在下方的所述多个第一封装部件中相应的一个封装部件上。
7.根据权利要求1所述的方法,进一步包括:
放置第一重量件以对所述多个第一封装部件中的第一个施加力;以及
放置第二重量件以对所述多个第一封装部件中的第二个施加力,其中,所述第一重量件不同于所述第二重量件。
8.一种方法,包括:
放置底部夹具;
在所述底部夹具上方放置第一封装部件,其中,所述第一封装部件其中包括多个第二封装部件;
在所述多个第二封装部件上方放置多个第三封装部件;
在所述多个第三封装部件上方放置顶部夹具;
将所述顶部夹具、所述底部夹具、所述第一封装部件和所述多个第三封装部件固定在一起以形成夹具装配件;以及
在所述夹具装配件上实施金属与金属接合。
9.根据权利要求8所述的方法,其中,在所述金属与金属接合之后,所述多个第三封装部件中的金属连接件接合至所述多个第二封装部件中的金属连接件以形成接合件,并且所述接合件没有焊料。
10.一种装置,包括:
至少一个拾取头,被配置为:
拾取和放置底部夹具;
拾取和放置位于所述底部夹具上方的第一封装部件,所述第一封装部件其中包括多个第二封装部件;
拾取和放置位于所述多个第二封装部件上方的多个第三封装部件;
拾取和放置位于所述多个第三封装部件上方的顶部夹具;以及
将所述顶部夹具、所述底部夹具、所述第一封装部件和所述多个第三封装部件固定在一起以形成夹具装配件;以及
控制单元,与所述至少一个拾取头连接,并且被配置为控制所述至少一个拾取头。
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