CN103985658A - Chemical mechanical polished washing unit - Google Patents
Chemical mechanical polished washing unit Download PDFInfo
- Publication number
- CN103985658A CN103985658A CN201410228259.1A CN201410228259A CN103985658A CN 103985658 A CN103985658 A CN 103985658A CN 201410228259 A CN201410228259 A CN 201410228259A CN 103985658 A CN103985658 A CN 103985658A
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- flange
- wafer
- flanged pipe
- cleaning device
- cylinder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a chemical mechanical polished washing unit which comprises a megasonic water trough and a roller which is arranged in the water trough and used for clamping and fixing a wafer. The roller comprises a flange-shaped first roller part and a flange-shaped second roller part, the two roller parts are movably connected to each other in a sleeved mode through flange-shaped flange pipes of the two roller parts, an axial moving guide structure is arranged on the flange pipe sleeved connection faces of the two roller parts, the first roller part is externally connected with a roller rotating driving unit through a flange-shaped flange opening of the first roller part, the second roller part is externally connected with a moving driving unit through a flange-shaped flange opening of the second roller part, so that the distance between the two flange openings used for clamping the wafer is adjustable, lateral squeezing to the wafer due to the fact that the plane height of the wafer is enlarged when the wafer is clamped by the roller is avoided, and thus the problem of the fragmentation of the wafer in the washing process is solved.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, more specifically, while relating to a kind of wafer cleaning after cmp, can prevent the cleaning device of fragmentation in cleaning process.
Background technology
Cmp flatening process (Chemical Mechanical Polishing, CMP) has become the critical process that promotion semiconductor integrated circuit technology node constantly dwindles.At present, CMP has been widely used in shallow trench isolation in the techniques such as (STI) planarization, oxide (such as interlayer dielectric layer ILD) planarization, tungsten plug (W-plug) planarization, copper-connection planarization.In chemical-mechanical planarization technical process, oxide particle in lapping liquid and grinding product can constantly be adsorbed on crystal column surface, although by the rotation of grinding head and grinding pad, and the motion of the radial alignment at the relative grinding pad of grinding head center can be taken away most of lapping liquid and grinding product, but when CMP technique finishes, still have abundant residues lapping liquid and grinding product and be adsorbed on crystal column surface.If without timely cleaning, these particulates will condense in crystal column surface and cannot effectively remove.Therefore, the cleaning after CMP is extremely important, is the important means that promotes wafer yield.
After the main grinding of cmp, the mega sonic wave tank that wafer need to be put into cleaning device is rotated cleaning.During cleaning, wafer is by tank, 3 arrange along wafer circle distribution with the cylinder clamping of draw-in groove radially fixing, and cylinder drives wafer rotation to clean.
On 3 cylinders after existing CMP in the tank of cleaning device for the fixing draw-in groove of wafer, the annular groove that to be the width fixed process along the outer circumference surface of cylinder, the draw-in groove on 3 cylinders is on identical rotational plane.When wafer is after the techniques such as Overheating Treatment, copper plating, certain flexural deformation phenomenon can occur, and the width of draw-in groove is fixed, slightly wider than the thickness of wafer.Therefore, the wafer with certain deflection adds the thickness of himself, and physical plane height will approach or be greater than the width of draw-in groove.In the time of in such wafer is fixed to cylinder draw-in groove, because thering is axial deformation, will be subject to the axial reaction force from draw-in groove.The effect of mega sonic wave during due to cleaning, wafer can produce vibration, under the effect of self-deformation power and draw-in groove axial force, fragmentation easily occurs, and causes wafer loss, and obtains spended time cleaning board.
Because wafer is in the phenomenon that unavoidably can deform after the techniques such as Overheating Treatment, therefore, the notch of the fixed width having on 3 cylinders after existing CMP in the tank of cleaning device, can not adapt to the safety holding requirement to distortion wafer, become distortion wafer when mega sonic wave cleans easily because the stressed problem that fragment phenomenon occurs is originated.
Summary of the invention
The object of the invention is to overcome the above-mentioned defect that prior art exists, cleaning device after providing a kind of capable of regulating to the cmp of the clamping width of wafer, by the cylinder of clamping wafer being improved to the flange shape drum segment of two sockets that can axially relatively move, for the spacing clamping between the flange shape flange oral area of two described drum segments of wafer, can regulate, make the various distortion wafers with Different Plane height can have suitable clamping width to be fixed and to clean, avoided at cylinder clamping morphotropism bowlder, because becoming, the level of wafer greatly wafer is caused to lateral compression, thereby while having solved existing wafer cleaning after cmp, the level producing after the draw-in groove spacing limiting due to cylinder and wafer distortion becomes between large and does not mate, and the problem of wafer fragmentation in the cleaning process causing.
For achieving the above object, technical scheme of the present invention is as follows:
Cleaning device after a kind of cmp, comprise in mega sonic wave tank and described tank, arrange for clamping and the fixing cylinder of wafer, it is characterized in that, described cylinder comprises the first drum segment and the second tin roller part of flange shape, two described drum segments are by the mutual pivot bush unit of flanged pipe portion of its flange shape, in the flanged pipe cover junction of two described drum segments, be provided with and move axially guide frame, described the first drum segment is by the external cylinder rotating drive of the flange oral area unit of its flange shape, described second tin roller is partly by the flange oral area external mobile driver element of its flange shape, wherein, described roller shifting driver element drives described second tin roller partly to do and axially the relatively moving of described the first drum segment, and by adjusting displacement, the limit portion of described wafer is clamped and is fixed between the flange shape flange oral area of two described drum segments, described cylinder rotating drive unit drives described the first drum segment to make radial rotating, meanwhile, described the first drum segment drives described second tin roller partly to do synchronous rotation by the described guide frame that moves axially.
Further, in the flanged pipe of two described drum segment flange shapes that socket-connect, the length that is positioned at the described flanged pipe of inner side is greater than the length of the described flanged pipe that is positioned at outside.
Further, the end of described flanged pipe that is positioned at inner side is provided with guide vane end stop.
Further, the flange shape flange oral area of described the first drum segment is hollow structure, in the flanged pipe of two described drum segment flange shapes that socket-connect, the length that is positioned at the described flanged pipe of inner side is greater than the length of the described flanged pipe that is positioned at outside, the described flanged pipe that is positioned at inner side stretches into the hollow flange shape flange oral area of described the first drum segment, and its end that stretches into part is provided with guide vane end stop.
Further, described in, move axially guide frame for two flanged pipe cover junctions correspondence is provided with respectively the guide groove matching and guide block structures at two described drum segments.
Further, the guide groove matching described in and guide block structure are 1～3 group.
Further, described second tin roller partly rotates external mobile driver element by the flange oral area of its flange shape.
Further, described second tin roller is partly by the flange oral area center rotating external mobile driver element of its flange shape.
Further, described cylinder is at least 3.
Further, the minimum spacing of the flange shape flange oral area of two described drum segments described in each after cylinder socket is separately greater than described wafer thickness, and described in each, inner surface of the flange shape flange oral area of described first drum segment of cylinder is positioned at same plane.
From technique scheme, can find out, the present invention is by being improved to the cylinder of clamping wafer the flange shape drum segment of two sockets that can axially relatively move, for the spacing clamping between the flange shape flange oral area of two described drum segments of wafer, can regulate, make the various distortion wafers with Different Plane height can have suitable clamping width to be fixed and to clean, avoided at cylinder clamping morphotropism bowlder, because becoming, the level of wafer greatly wafer is caused to lateral compression, thereby while having solved existing wafer cleaning after cmp, the level producing after the draw-in groove spacing limiting due to cylinder and wafer distortion becomes between large and does not mate, and the problem of wafer fragmentation in the cleaning process causing.
Accompanying drawing explanation
Fig. 1 is the structural representation of the cleaning device after a kind of cmp of the present invention;
Fig. 2 is the cross-sectional view of flange shape flanged pipe of the drum segment of two sockets of cleaning device after a kind of cmp of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail.
It should be noted that, for each modular construction in following embodiment is explained clearlyer, spy has carried out disproportional deformation process to each modular construction in Fig. 1,2 and mutual alignment relation, Fig. 1,2 is as schematic diagram, under the prerequisite not producing ambiguity, please the disproportional deformation process of figure is ignored.
In the present embodiment, refer to Fig. 1, Fig. 1 is the structural representation of the cleaning device after a kind of cmp of the present invention.As shown in the figure, cleaning device after cmp of the present invention, comprise in mega sonic wave tank 1 and tank 1 that 3 of arranging are for clamping and the fixing cylinder of wafer (figure has only shown wherein 1 in 3 cylinders, and the structure of another 2 cylinders is identical, is omitted).3 cylinders, by being horizontally disposed with, need the wafer (figure slightly) cleaning vertically to place, and wafer is by the cylinder clamping of 3 horizontal directions that arrange at its even circumferential fixing.
Please continue to refer to Fig. 1.Cylinder comprises the first drum segment and the second tin roller part of flange shape, and wherein, the first drum segment comprises flange port 6 and flanged pipe 5, and second tin roller partly comprises flange port 4 and flanged pipe 10.Two drum segments are by flanged pipe 5 and the 10 mutual pivot bush units of its flange shape, and wherein, flanged pipe 10 is inserted in flanged pipe 5.The outer side center of the flange port 6 of the first drum segment is fixedly equipped with the rotating shaft 7 of level, and rotating shaft 7 is connected to cylinder rotational drive motor 8 through the cell wall of tank 1.The outer side center of the flange port 4 of second tin roller part is equipped with the connecting rod 3 of the level that can relatively rotate with it, and connecting rod 3 is connected to roller shifting drive motors 2 through the cell wall of tank 1.
Please continue to refer to Fig. 1.The flange port 6 of the first drum segment is hollow structure, and flanged pipe 10 is inserted in flanged pipe 5, and the length of flanged pipe 10 is greater than the length of flanged pipe 5, so after being inserted in, the end of flanged pipe 10 will extend into flange port 6 inside of hollow.End at flanged pipe 10 is equipped with the vertical positive stop 9 that is greater than flanged pipe 10 and flanged pipe 5 bores.
Please continue to refer to Fig. 1.The inner surface 13 of the flange port 6 of the first drum segment of the cylinder in figure and another 2 cylinders that omission does not show is in the drawings in same vertical plane, and, flanged pipe 5 and flanged pipe 10 covers in the first drum segment of cylinder and second tin roller part receive minimum position, be spacing between the inner surface 14 of flange port 4 of inner surface 13 and second tin roller part in hour, this spacing is greater than the thickness of the wafer being cleaned, wafer can be contained among this spacing, obtain the flange port 6 of two drum segments and the clamping of flange port 4 fixing.
Refer to Fig. 2, Fig. 2 is the cross-sectional view of flange shape flanged pipe of the drum segment of two sockets of cleaning device after a kind of cmp of the present invention.As shown in the figure, flanged pipe socket over glaze at two drum segments is arranged with two pairs guide groove 11 and the guide blocks 12 that move axially guide effect, wherein, inwall at the flanged pipe 5 in outside is provided with 2 guide grooves 11 by axial symmetry, at the outer wall of the flanged pipe 10 of inner side, by axial symmetry, is provided with 2 guide blocks 12 that match with guide groove 11.
Cleaning device after cmp of the present invention in use, first according to the wafer of different-thickness and cylinder clamping surplus, according to the deflection data to every batch of wafer actual measurement, set the aperture pitch (i.e. spacing between the inner surface of two flange ports) of two flange ports of cylinder.For example, choose the wafer that 1 thickness is 0.77mm, according to the deflection measured data 0.35mm to this wafer, obtaining maximum general layout thickness after the distortion of this wafer is 1.12mm; Then, according to the common clamping surplus of cylinder 0.4～0.45mm, the aperture pitch set point of choosing two flange ports of cylinder by lower limit is 1.52mm.Then, start roller shifting drive motors 2, the aperture pitch of two flange ports 6 of cylinder and 4 is adjusted to 1.52mm.In this process, roller shifting drive motors 2 drive link 3 move as horizontal linear, connecting rod 3 drives flange port 4 synchronizing movings, flange port 4 drives again flanged pipe 10 along the cooperation direction of guide groove 11 and guide block 12, to move in flanged pipe 5, thereby can regulate the aperture pitch of two flange ports 6 of cylinder and 4.Two flange ports 6 of cylinder and 4 minimal openings spacing are greater than the thickness of the wafer being cleaned, and wafer can be contained among this spacing; The positive stop 9 that flanged pipe 10 ends are equipped with can play the flanged pipe 10 of two sockets and the effect that flanged pipe 5 departs from of preventing.
After the aperture pitch of two flange ports 6 of 3 cylinders and 4 is adjusted, wafer clamp can be held in the flange port aperture pitch of cylinder, confirm errorless after, start cylinder rotational drive motor 8, start the cleaning of wafer.In this process, cylinder rotational drive motor 8 drives rotating shaft 7 to rotate, rotating shaft 7 drives flange port 6 synchronously to rotate, flange port 6 drives again flanged pipe 5 to rotate, the mating reaction of the guide block 12 that the guide groove 11 that flanged pipe 5 is provided with by its inwall and flanged pipe 10 outer walls that are socketed in it are provided with, flanged pipe 10, flange port 4 are followed together to rotate, and be subject to the restriction of guide groove 11 and guide block 12, flanged pipe 10 can not moved axially, namely can not change the aperture pitch of two flange ports 6 and 4, thereby make the wafer of clamping can not affect cleaning because becoming flexible.
In addition, the inner surface 13 of the flange port 6 of 3 cylinders, in same vertical plane, has guaranteed wafer rotary balance and stress equalization in vertical direction.The outer side center of flange port 4 and connecting rod 3 adopt the mode that is rotationally connected, like this, flange port 4 both can be followed rotation, can make traveling priority again, mutually can not interfere, and be positioned at the motor driving structure of cylinder two sides, cylinder is also played to stable effect, make wafer more steady when cleaning.
The present invention is by being improved to the cylinder of clamping wafer the flange shape drum segment of two sockets that can axially relatively move, for the spacing clamping between the flange shape flange oral area of two described drum segments of wafer, can regulate, make the various distortion wafers with Different Plane height can have suitable clamping width to be fixed and to clean, avoided at cylinder clamping morphotropism bowlder, because becoming, the level of wafer greatly wafer is caused to lateral compression, thereby while having solved existing wafer cleaning after cmp, the level producing after the draw-in groove spacing limiting due to cylinder and wafer distortion becomes between large and does not mate, and the problem of wafer fragmentation in the cleaning process causing.
Above-described is only the preferred embodiments of the present invention; described embodiment is not in order to limit scope of patent protection of the present invention; therefore the equivalent structure that every utilization specification of the present invention and accompanying drawing content are done changes, and in like manner all should be included in protection scope of the present invention.
Claims (10)
1. the cleaning device after a cmp, comprise in mega sonic wave tank and described tank, arrange for clamping and the fixing cylinder of wafer, it is characterized in that, described cylinder comprises the first drum segment and the second tin roller part of flange shape, two described drum segments are by the mutual pivot bush unit of flanged pipe portion of its flange shape, in the flanged pipe cover junction of two described drum segments, be provided with and move axially guide frame, described the first drum segment is by the external cylinder rotating drive of the flange oral area unit of its flange shape, described second tin roller is partly by the flange oral area external mobile driver element of its flange shape, wherein, described roller shifting driver element drives described second tin roller partly to do and axially the relatively moving of described the first drum segment, and by adjusting displacement, the limit portion of described wafer is clamped and is fixed between the flange shape flange oral area of two described drum segments, described cylinder rotating drive unit drives described the first drum segment to make radial rotating, meanwhile, described the first drum segment drives described second tin roller partly to do synchronous rotation by the described guide frame that moves axially.
2. cleaning device as claimed in claim 1, is characterized in that, in the flanged pipe of two described drum segment flange shapes that socket-connect, the length that is positioned at the described flanged pipe of inner side is greater than the length of the described flanged pipe that is positioned at outside.
3. cleaning device as claimed in claim 2, is characterized in that, the end that is positioned at the described flanged pipe of inner side is provided with guide vane end stop.
4. cleaning device as claimed in claim 1, it is characterized in that, the flange shape flange oral area of described the first drum segment is hollow structure, in the flanged pipe of two described drum segment flange shapes that socket-connect, the length that is positioned at the described flanged pipe of inner side is greater than the length of the described flanged pipe that is positioned at outside, the described flanged pipe that is positioned at inner side stretches into the hollow flange shape flange oral area of described the first drum segment, and its end that stretches into part is provided with guide vane end stop.
5. cleaning device as claimed in claim 1, is characterized in that, described in move axially guide frame for the corresponding guide groove matching and the guide block structures that are provided with respectively of two flanged pipes cover junctions at two described drum segments.
6. cleaning device as claimed in claim 5, is characterized in that, described in the guide groove and the guide block structure that match be 1～3 group.
7. cleaning device as claimed in claim 1, is characterized in that, described second tin roller partly rotates external mobile driver element by the flange oral area of its flange shape.
8. cleaning device as claimed in claim 8, is characterized in that, described second tin roller is partly by the flange oral area center rotating external mobile driver element of its flange shape.
9. the cleaning device as described in claim 1～8 any one, is characterized in that, described cylinder is at least 3.
10. cleaning device as claimed in claim 9, it is characterized in that, the minimum spacing of the flange shape flange oral area of two described drum segments described in each after cylinder socket is separately greater than described wafer thickness, and described in each, inner surface of the flange shape flange oral area of described first drum segment of cylinder is positioned at same plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410228259.1A CN103985658B (en) | 2014-05-27 | 2014-05-27 | A kind of cleaning device after cmp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410228259.1A CN103985658B (en) | 2014-05-27 | 2014-05-27 | A kind of cleaning device after cmp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103985658A true CN103985658A (en) | 2014-08-13 |
| CN103985658B CN103985658B (en) | 2016-10-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410228259.1A Active CN103985658B (en) | 2014-05-27 | 2014-05-27 | A kind of cleaning device after cmp |
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| CN (1) | CN103985658B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109860085A (en) * | 2019-03-01 | 2019-06-07 | 若名芯半导体科技(苏州)有限公司 | A kind of silicon wafer CMP downstream equipment and processing flow |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10340873A (en) * | 1997-06-10 | 1998-12-22 | Dainippon Screen Mfg Co Ltd | Apparatus for treating substrate |
| US6678911B2 (en) * | 2000-12-11 | 2004-01-20 | Speedfam-Ipec Corporation | Multiple vertical wafer cleaner |
| CN101271835A (en) * | 2007-03-20 | 2008-09-24 | 富士通株式会社 | Method of manufacturing a semiconductor device and a semiconductor manufacturing equipment |
| CN102437013A (en) * | 2011-08-29 | 2012-05-02 | 上海华力微电子有限公司 | Built-in wafer cleaning device for chemical mechanical polishing (CMP) machine table |
| JP2013506997A (en) * | 2009-10-05 | 2013-02-28 | アプライド マテリアルズ インコーポレイテッド | Roller assembly for brush cleaning device in cleaning module |
-
2014
- 2014-05-27 CN CN201410228259.1A patent/CN103985658B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10340873A (en) * | 1997-06-10 | 1998-12-22 | Dainippon Screen Mfg Co Ltd | Apparatus for treating substrate |
| US6678911B2 (en) * | 2000-12-11 | 2004-01-20 | Speedfam-Ipec Corporation | Multiple vertical wafer cleaner |
| CN101271835A (en) * | 2007-03-20 | 2008-09-24 | 富士通株式会社 | Method of manufacturing a semiconductor device and a semiconductor manufacturing equipment |
| JP2013506997A (en) * | 2009-10-05 | 2013-02-28 | アプライド マテリアルズ インコーポレイテッド | Roller assembly for brush cleaning device in cleaning module |
| CN102437013A (en) * | 2011-08-29 | 2012-05-02 | 上海华力微电子有限公司 | Built-in wafer cleaning device for chemical mechanical polishing (CMP) machine table |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109860085A (en) * | 2019-03-01 | 2019-06-07 | 若名芯半导体科技(苏州)有限公司 | A kind of silicon wafer CMP downstream equipment and processing flow |
| CN109860085B (en) * | 2019-03-01 | 2021-02-19 | 若名芯半导体科技(苏州)有限公司 | Silicon wafer CMP post-processing equipment and processing technology |
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| Publication number | Publication date |
|---|---|
| CN103985658B (en) | 2016-10-26 |
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