CN114843212B - Multifunctional semiconductor cavity type processing equipment - Google Patents
Multifunctional semiconductor cavity type processing equipment Download PDFInfo
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- CN114843212B CN114843212B CN202210469108.XA CN202210469108A CN114843212B CN 114843212 B CN114843212 B CN 114843212B CN 202210469108 A CN202210469108 A CN 202210469108A CN 114843212 B CN114843212 B CN 114843212B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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Abstract
The invention belongs to the technical field of semiconductors, and particularly relates to multifunctional semiconductor cavity type treatment equipment which comprises a magnetofluid abrasive collecting cylinder, wherein a rotating ring is rotatably arranged on the surface of the magnetofluid abrasive collecting cylinder, electric push rods are fixedly arranged on the front side and the rear side of the rotating ring, a top block is fixedly arranged at the top end of each electric push rod, a first motor is fixedly arranged on the surface of the top block on the rear side, a fixed shaft is fixedly connected to an output shaft of the first motor, a magnetic ring is fixedly arranged on the surface of the fixed shaft, a connecting cylinder is fixedly arranged on the outer side of the magnetic ring, the connecting cylinder is rotatably arranged between the two adjacent top blocks, and the front end of the connecting cylinder is mutually communicated with the interior of the magnetofluid abrasive collecting cylinder through a guide pipe; a first bearing plate is arranged inside the shell; the semiconductor processing device can automatically clean grinding fluid in the process of switching the wafer supporting device, and can automatically clean the inside of the grinding cavity when grinding wafers.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to multifunctional semiconductor cavity type processing equipment.
Background
The semiconductor is a material with electric conductivity between a conductor and an insulator at normal temperature, the semiconductor material is widely applied in the fields of communication systems and electricity, the commonly used semiconductor material comprises silicon, germanium, gallium arsenide and the like, semiconductor cavity type processing equipment is required to be used in the production and processing processes of the semiconductor material, and the existing semiconductor processing equipment has some defects when in use;
such as CN201110217259.8, which has a plurality of micro chambers distributed longitudinally on a vertical column, each micro chamber being capable of performing single wafer chemical processing on a plurality of semiconductor wafers simultaneously, the multi-chamber semiconductor processing apparatus comprising at least two micro chambers distributed longitudinally for receiving and processing semiconductor wafers, each micro chamber comprising an upper chamber portion forming an upper working surface and a lower chamber portion forming a lower working surface, the upper chamber portion and the lower chamber portion being movable relative to each other guided by the vertical column extending longitudinally through the edge thereof between an open position for loading or removing a semiconductor wafer and a closed position for receiving and processing a semiconductor wafer, in the closed position, the semiconductor wafer is disposed between the upper working surface and the lower working surface and a gap for flow of a processing fluid is formed with the inner wall of the micro chamber, and the micro chamber comprises at least one inlet for the processing fluid to enter the micro chamber and at least one outlet for the processing fluid to exit the micro chamber. Although the semiconductor processing device can simultaneously and respectively carry out single-wafer chemical processing on a plurality of semiconductor wafers when in use, in the actual use process, the semiconductor processing device cannot carry out classification processing on the semiconductor wafers with different sizes, the application range is narrow, and the existing semiconductor processing equipment cannot automatically remove grinding liquid while switching the semiconductor bearing component in the use process, so that the functionality is poor.
Disclosure of Invention
This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments, and in this section as well as in the abstract and the title of the invention of this application some simplifications or omissions may be made to avoid obscuring the purpose of this section, the abstract and the title of the invention, and such simplifications or omissions are not intended to limit the scope of the invention.
The present invention has been made in view of the problems occurring in the conventional semiconductor processing apparatus.
To solve the above technical problem, according to an aspect of the present invention, the present invention provides the following technical solutions: a multifunctional semiconductor cavity type treatment device comprises a magnetofluid abrasive collecting cylinder, a rotating ring, a supporting plate and a shell, wherein the surface of the magnetofluid abrasive collecting cylinder is rotatably provided with the rotating ring, the front side and the rear side of the rotating ring are fixedly provided with electric push rods, the top ends of the electric push rods are fixedly provided with ejector blocks, the surface of the ejector block at the rear side is fixedly provided with a first motor, an output shaft of the first motor is fixedly connected with a fixed shaft, the surface of the fixed shaft is fixedly provided with a magnetic ring, the outer side of the magnetic ring is fixedly provided with a connecting cylinder, the connecting cylinder is rotatably arranged between two adjacent ejector blocks, and the front end of the connecting cylinder is mutually communicated with the interior of the magnetofluid abrasive collecting cylinder through a guide pipe; the inner part of the shell is provided with a first bearing plate, a second bearing plate is arranged in the first bearing plate, and a third bearing plate is arranged in the second bearing plate.
As a preferable aspect of the multi-functional semiconductor chamber type processing apparatus of the present invention, wherein: the front end of the supporting plate is fixedly provided with a baffle, the outer diameter of the baffle is equal to the inner diameter of the shell, and the shell and the baffle are both semicircular.
As a preferable aspect of the semiconductor chamber type processing apparatus for multi-functions in accordance with the present invention, wherein: the first bearing plate, the second bearing plate and the third bearing plate are mutually attached, the first bearing plate and the second bearing plate are both in a circular ring shape, and the left side and the right side of the lower surfaces of the first bearing plate, the second bearing plate and the third bearing plate are fixedly provided with fixing cylinders.
As a preferable aspect of the multi-functional semiconductor chamber type processing apparatus of the present invention, wherein: the surface of the connecting cylinder is provided with spray holes at equal angles, a first connecting shell is attached to the outer side of the connecting cylinder, a second connecting shell is rotatably mounted below the first connecting shell, a damping pad is arranged at the front end of the first connecting shell, a fixed shaft is fixedly arranged inside the connecting cylinder, a magnetic ring is fixedly connected to the outer side of the fixed shaft, and magnetic blocks are fixedly arranged inside the first connecting shell and the second connecting shell.
As a preferable aspect of the multi-functional semiconductor chamber type processing apparatus of the present invention, wherein: the inside laminating of solid fixed cylinder is provided with the gag lever post, the bottom of gag lever post links to each other with the backup pad, the fixed second connecting rod that is provided with on the solid fixed cylinder of third bearing board below, fixed mounting has the head rod on the solid fixed cylinder of second bearing board below, the front end of head rod and the front end of second connecting rod are all fixed and are provided with the screw thread bush, and the third screw rod is installed to the internal thread of downside screw thread bush, and the second screw rod is installed to the internal thread of upside screw thread bush, the fixed overlap joint pole that is provided with on the solid fixed cylinder of first bearing board below.
As a preferable aspect of the multi-functional semiconductor chamber type processing apparatus of the present invention, wherein: the front end of the overlapping rod is fixedly provided with an overlapping cylinder, the top end of the overlapping cylinder is connected with the first bearing plate, and a first screw rod is installed on the internal thread of the overlapping cylinder.
As a preferable aspect of the multi-functional semiconductor chamber type processing apparatus of the present invention, wherein: the key rods are connected with the inner portions of the first screw rod, the second screw rod and the third screw rod in a key mode, the central axes of the key rods, the central axes of the first screw rod, the central axes of the second screw rod and the central axes of the third screw rod are all on the same straight line, the first screw rod, the second screw rod and the third screw rod form a rotating structure through the key rods and the supporting plate, and the screw pitches of the first screw rod, the second screw rod and the third screw rod are decreased progressively from top to bottom.
As a preferable aspect of the multi-functional semiconductor chamber type processing apparatus of the present invention, wherein: the outer sides of the first screw rod, the second screw rod and the third screw rod are respectively provided with a fixing plate in a bearing mode, the fixing plates are fixedly connected with the shell, the fixing plates are symmetrically distributed on the upper side and the lower side of the second screw rod and the upper side and the lower side of the third screw rod, and the first bearing plate, the second bearing plate and the third bearing plate form a lifting structure through the first screw rod, the key rod, the second screw rod, the third screw rod and the shell.
As a preferable aspect of the semiconductor chamber type processing apparatus for multi-functions in accordance with the present invention, wherein: the bottom fixedly connected with pivot of key pole, the bottom fixedly connected with second belt pulley of pivot, the surface mounting of second belt pulley has the hold-in range, first belt pulley is installed on the right side of hold-in range, the fixed second motor that is provided with in right side of backup pad, the output shaft of second motor links to each other with first belt pulley.
Compared with the prior art, the invention has the beneficial effects that:
1. through the first bearing board on the device, second bearing board and third bearing board and with each bearing board corresponding screw rod, make the second motor of device bottom can drive the bearing board synchronous telescope of three position, and the screw rod that the pitch increases gradually makes the amplitude of rise of the bearing board of most intermediate position increase gradually by inside to outside, thereby make the device carry out the bearing to the semiconductor wafer of unidimensional, can realize adapting to the semiconductor wafer of unidimensional and carry out the function of bearing, the advantage that has application scope wider, the processing apparatus who has solved current semiconductor can not be to the defect of stabilizing the bearing through size semiconductor wafer.
2. Through the inside conversion that sets up of device and the pipe and the telescopic link on conversion surface for the device can be adjusted the high accuracy degree of grinding as required, can carry out the intensive mixing to the magnetic current body grinding agent at the in-process that carries out the rotation type and mix evenly moreover, thereby promotes the grinding effect, can realize carrying out the function of intensive mixing to the magnetic current body grinding agent voluntarily when grinding the wafer, has solved the relatively poor defect of current semiconductor processing apparatus functional.
3. Through connecting cylinder and the orifice on the device, make the device can be through rotary connecting cylinder, can carry out the grinding of higher accuracy to the surface of wafer when making the abrasive particle sweep the wafer surface through throwing away magnetic current body grinding agent, the result of use of device has been promoted, make the orifice of relevant position can be stopped up through first connection shell and the second connection shell on the device, thereby make the device can carry out the high accuracy to the wafer of not unidimensional and grind, the defect that current wafer grinding processing apparatus is not convenient for carry out the high accuracy grinding to the wafer of not unidimensional when using has been solved.
4. Through the synchronous flexible bearing board on the device, make the device can be at synchronous flexible in-process, automatically, clear up the grinding agent, third bearing board at the intermediate position rises when reaching the highest point, the magnetic fluid lapping compound can flow to the outside along third bearing board gradually, thereby realize the function of clearing away to the inside lapping compound of cavity automatically when switching semiconductor bearing subassembly, the practicality of device has been promoted, and the device is when grinding, wafer overall stability when can also guaranteeing to grind under the condition that need not fix the wafer.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor. Wherein:
FIG. 1 is a schematic view of the overall structure of a multi-functional semiconductor chamber type processing apparatus according to the present invention;
FIG. 2 is a schematic view of a structure of a multi-functional semiconductor chamber type processing apparatus of the present invention at A in FIG. 1;
FIG. 3 is a schematic view showing a connecting structure of a supporting plate and a housing of a multifunctional semiconductor chamber type processing apparatus according to the present invention;
FIG. 4 is a schematic view of the connection structure of the first screw, the second screw and the third screw of the multi-functional semiconductor chamber-type processing apparatus according to the present invention;
FIG. 5 is a schematic view of a connection structure of a supporting plate and a limiting rod of the multi-functional semiconductor chamber type processing apparatus according to the present invention;
FIG. 6 is a schematic view of a connection structure of a second supporting plate and a second supporting plate of the multi-functional semiconductor cavity processing apparatus according to the present invention;
FIG. 7 is a schematic view of the connection structure of the first connection housing and the second connection housing of the multi-functional semiconductor chamber type processing apparatus according to the present invention;
FIG. 8 is a schematic view of the connection structure of the second connection shell and the magnetic block of the semiconductor cavity processing apparatus for multi-functions according to the present invention.
Reference numbers in the figures: 1. a magnetofluid abrasive collector cartridge; 2. rotating the ring; 3. a support plate; 4. a housing; 5. a baffle plate; 6. a first support plate; 7. a second support plate; 8. a third bearing plate; 9. an electric push rod; 10. a top block; 11. a first motor; 12. a connecting cylinder; 13. a first connecting shell; 14. a second connection housing; 15. spraying a hole; 16. a magnetic block; 17. a fixed shaft; 18. a magnetic ring; 19. a fixed cylinder; 20. a limiting rod; 21. a lap joint rod; 22. a lap joint drum; 23. a first screw; 24. a key lever; 25. a second screw; 26. a third screw; 27. a fixing plate; 28. a threaded bushing; 29. a first connecting rod; 30. a second connecting rod; 31. a damping pad; 32. a second motor; 33. a first pulley; 34. a synchronous belt; 35. a second pulley; 36. a rotating shaft; 37. a conduit.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described herein, and it will be apparent to those of ordinary skill in the art that the present invention may be practiced without departing from the spirit and scope of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Next, the present invention will be described in detail with reference to the drawings, wherein for convenience of illustration, the cross-sectional view of the device structure is not enlarged partially according to the general scale, and the drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
Examples
To make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1-8, a multifunctional semiconductor cavity processing device comprises a magnetofluid abrasive collecting cylinder 1, a supporting plate 3 and a housing 4, wherein a rotating ring 2 is rotatably mounted on the surface of the magnetofluid abrasive collecting cylinder 1, electric push rods 9 are fixedly arranged on the front side and the rear side of the rotating ring 2, a top block 10 is fixedly mounted at the top end of each electric push rod 9, the electric push rods 9 can adjust the height of the top block 10, so that the subsequent height adjustment of a grinding component is facilitated, the fineness of grinding is changed, the practicability of the device is improved, a first motor 11 is fixedly mounted on the surface of the top block 10 on the rear side, a fixed shaft 17 is fixedly connected to an output shaft of the first motor 11, a magnetic ring 18 is fixedly arranged on the surface of the fixed shaft 17, the magnetic ring 18 is driven to rotate by the rotation of the first motor 11, magnetofluid abrasive can be thrown out by the magnetic ring 18, compared with the existing wafer grinding processing device, the magnetofluid abrasive is ground on the surface of the wafer by the rotation of the magnetic ring 18 in cooperation with the magnetic fluid abrasive, the magnetofluid abrasive collecting cylinder 12, the connecting cylinder 12 is fixedly arranged on the outer side of the connecting cylinder 12, and the connecting cylinder 12 is communicated with the surface of the wafer collecting cylinder 12 on the outer side of the rotating guide tube 12 of the rotating cylinder, and the water pump, and the magnetic fluid abrasive collecting cylinder 12 is used for grinding function of the wafer, and the rotating guide tube 12 is communicated with the rotating of the rotating ring 12.
The inside of shell 4 is provided with first bearing board 6, the internally mounted of first bearing board 6 has second bearing board 7, the internally mounted of second bearing board 7 has third bearing board 8, carry out the bearing to the not unidimensional wafer through first bearing board 6 on the device, second bearing board 7 and third bearing board 8, and can also utilize the wall body that first bearing board 6, second bearing board 7 and third bearing board 8 formed when going up and down to be stable fixed to semiconductor wafer for the device can adapt to the not unidimensional semiconductor wafer and carry out abrasive treatment.
In this example, a baffle 5 is fixedly mounted at the front end of the support plate 3, the outer diameter of the baffle 5 is equal to the inner diameter of the housing 4, and the shape of the housing 4 and the shape of the baffle 5 are both semicircular.
The baffle 5 shields the grinding agent, so that the grinding agent is prevented from influencing the normal work of a driving part in the device, and the stability of the device in use is improved.
In this example, the first, second and third bearing plates 6, 7 and 8 are attached to each other, the first and second bearing plates 6 and 7 are both circular, and the fixing cylinders 19 are fixedly mounted on the left and right sides of the lower surfaces of the first, second and third bearing plates 6, 7 and 8.
The three bearing plates can stably move up and down through the fixed cylinder 19 on the device, and the practicability of the device is improved.
In this example, the surface of the connecting cylinder 12 is provided with the nozzle holes 15 at equal angles, the outer side of the connecting cylinder 12 is provided with the first connecting shell 13 in a fitting manner, the second connecting shell 14 is rotatably mounted below the first connecting shell 13, the front end of the first connecting shell 13 is provided with the damping pad 31, the damping pad 31 can tightly clamp the first connecting shell 13 and the second connecting shell 14, the first connecting shell 13 and the second connecting shell 14 can be conveniently unfolded subsequently, the fixing shaft 17 is fixedly arranged inside the connecting cylinder 12, the outer side of the fixing shaft 17 is fixedly connected with the magnetic ring 18, the magnetic blocks 16 are fixedly arranged inside the first connecting shell 13 and the second connecting shell 14, and the magnetic blocks 18 and the magnetic blocks 16 are arranged.
The arrangement of the structure enables the first connecting shell 13 and the second connecting shell 14 to be automatically adsorbed after moving to the corresponding positions, and ensures that the spray holes 15 on the connecting cylinder 12 can be shielded, so that when the device grinds semiconductor wafers with different sizes, the corresponding number of spray holes 15 can be shielded, and high-precision grinding processing is performed.
In this example, a limiting rod 20 is attached to the inside of the fixed cylinder 19, the bottom end of the limiting rod 20 is connected to the support plate 3, a second connecting rod 30 is fixedly arranged on the fixed cylinder 19 below the third bearing plate 8, a first connecting rod 29 is fixedly arranged on the fixed cylinder 19 below the second bearing plate 7, threaded bushings 28 are fixedly arranged at the front ends of the first connecting rod 29 and the second connecting rod 30, third screws 26 are installed on the internal threads of the lower threaded bushings 28, the threaded bushings 28 can be driven to move up and down by rotation of the third screws 26, so that the height of the bearing plate can be adjusted, second screws 25 are installed on the internal threads of the upper threaded bushings 28, a lapping rod 21 is fixedly arranged on the fixed cylinder 19 below the first bearing plate 6, the lapping rod 21 is matched with the limiting rod 20 to enable the fixed cylinder 19 to move up and down vertically, so that the height of the bearing plate at each position can be adjusted accurately.
In this example, a joint cylinder 22 is fixedly provided at the front end of the joint rod 21, the top end of the joint cylinder 22 is connected to the first support plate 6, and a first screw 23 is installed at the inner thread of the joint cylinder 22.
The height of the first support plate 6 is adjusted by the rotation of the first screw 23, so that the semiconductor wafer having a smaller size is placed.
In this example, the first screw 23, the second screw 25 and the third screw 26 are all keyed with a key rod 24, the central axes of the key rod 24, the first screw 23, the second screw 25 and the third screw 26 are all on the same straight line, the first screw 23, the second screw 25 and the third screw 26 form a rotating structure through the key rod 24 and the support plate 3, and the screw pitches of the first screw 23, the second screw 25 and the third screw 26 decrease from top to bottom.
The first screw 23, the second screw 25 and the third screw 26, which have decreasing pitches, allow the apparatus to perform a polishing process on a semiconductor wafer using a cavity formed between a plurality of support plates by making the lifting speed of the support plates different at each position during the rotation of the key lever 24.
In this example, the fixing plates 27 are respectively mounted on the outer sides of the first screw 23, the second screw 25 and the third screw 26 in a bearing manner, the fixing plates 27 are fixedly connected with the housing 4, the fixing plates 27 are symmetrically distributed on the upper and lower sides of the second screw 25 and the third screw 26, and the first bearing plate 6, the second bearing plate 7 and the third bearing plate 8 form a lifting structure with the housing 4 through the first screw 23, the key lever 24, the second screw 25 and the third screw 26.
In the process of rotating the key rod 24, the first bearing plate 6, the second bearing plate 7 and the third bearing plate 8 can be driven to do lifting motion, so that the device can adapt to semiconductor wafers of different sizes for use, and the using effect of the device is improved.
In this example, a rotating shaft 36 is fixedly connected to the bottom end of the key lever 24, a second belt pulley 35 is fixedly connected to the bottom of the rotating shaft 36, a synchronous belt 34 is mounted on the surface of the second belt pulley 35, a first belt pulley 33 is mounted on the right side of the synchronous belt 34, a second motor 32 is fixedly arranged on the right side of the support plate 3, and an output shaft of the second motor 32 is connected with the first belt pulley 33.
The second motor 32 can drive the key rod 24 to rotate through a belt transmission structure on the device, so that the height of the bearing plate at each position is changed, and the using effect of the device is improved.
It should be noted that, the present invention is a multifunctional semiconductor cavity processing apparatus, first, as shown in fig. 1 and fig. 3-6, when the apparatus is in use, a semiconductor wafer is placed on the surface of a first supporting plate 6, a first belt pulley 33 is driven to rotate by a second motor 32, the first belt pulley 33 drives a second belt pulley 35 to rotate by a synchronous belt 34, the second belt pulley 35 rotates so that a rotating shaft 36 and a key bar 24 rotate synchronously, since the key bar 24 and the first screw 23, the second screw 25 and the third screw 26 are connected in a keyed manner, when the apparatus is in use, the key bar 24 can drive the first screw 23, the second screw 25 and the third screw 26 to rotate simultaneously outside a fixing plate 27, and then the threaded bushing 28 and the lap joint cylinder 22 drive the first supporting plate 6, the second supporting plate 7 and the third supporting plate 8 to move on the supporting plate 3, the fixing cylinder 19 and the limiting rod 20 can ensure that the first supporting plate 6, the second supporting plate 7 and the third supporting plate 8 can move vertically, because the first screw 23 and the third supporting plate 8 can move vertically, and the screw 19 and the third supporting plate 7 can move vertically, and the screw 21 can also move vertically, and the fixing cylinder 7 can be used for fixing the wafer in a fixed position where the first supporting plate 6 and the third supporting plate 7 can change.
As shown in fig. 1-3 and fig. 7-8, after the device finishes placing the wafer, the device starts to grind, firstly rotates the rotary ring 2 according to the position to be ground, the guide pipe 37 can be driven to stir in the magnetic fluid abrasive collecting cylinder 1 during the rotation of the rotary ring 2, thereby realizing the mixing function of the magnetic fluid abrasive, after the position is adjusted, the guide pipe 37 is externally connected with a water pump, then the connecting cylinder 12 is driven by the first motor 11 to rotate, the magnetic fluid abrasive injected in the guide pipe 37 can be sprayed out through the spray holes 15 and scour the surface of the wafer during the rotation of the connecting cylinder 12, thereby realizing the polishing function, when wafers with different sizes are polished, the first connecting shell 13 and the second connecting shell 14 are clamped and installed on the outer surface of the connecting cylinder 12 through the damping pad 31, therefore, the spray holes 15 in the corresponding positions are blocked, the device can adapt to wafers of different sizes to carry out high-precision grinding and polishing work, after the semiconductor processing is finished, the key rod 24 is reversely rotated in the steps, the third bearing plate 8 is in a convex shape, the grinding machine can flow out of the outer side of the device from the surfaces of the first bearing plate 6 and the second bearing plate 7, the magnetic ring 18 on the fixing shaft 17 can be matched with the magnetic block 16 to be used for fixing the first connecting shell 13 and the second connecting shell 14 on the outer side of the connecting cylinder 12, the electric push rod 9 and the ejector block 10 are used for adjusting the height of the connecting cylinder 12, the grinding fineness is changed, the shell 4 and the baffle 5 can prevent grinding agents from entering transmission equipment in the device, and stable operation of the device is guaranteed.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the various features of the disclosed embodiments of the invention may be used in any combination, provided that no structural conflict exists, and the combinations are not exhaustively described in this specification merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (2)
1. A multifunctional semiconductor cavity type treatment equipment comprises a magnetic fluid abrasive collecting cylinder (1), a supporting plate (3) and a shell (4), and is characterized in that: the magnetic fluid abrasive collecting cylinder is characterized in that a rotating ring (2) is rotatably mounted on the surface of the magnetic fluid abrasive collecting cylinder (1), electric push rods (9) are fixedly arranged on the front side and the rear side of the rotating ring (2), a top block (10) is fixedly mounted at the top end of each electric push rod (9), a first motor (11) is fixedly mounted on the surface of the top block (10) on the rear side, a fixed shaft (17) is fixedly connected onto an output shaft of each first motor (11), a magnetic ring (18) is fixedly arranged on the surface of each fixed shaft (17), a connecting cylinder (12) is fixedly arranged on the outer side of each magnetic ring (18), each connecting cylinder (12) is rotatably mounted between every two adjacent top blocks (10), and the front end of each connecting cylinder (12) is mutually communicated with the interior of the magnetic fluid abrasive collecting cylinder (1) through a guide pipe (37); a first bearing plate (6) is arranged inside the shell (4), a second bearing plate (7) is arranged inside the first bearing plate (6), and a third bearing plate (8) is arranged inside the second bearing plate (7);
the first bearing plate (6), the second bearing plate (7) and the third bearing plate (8) are mutually attached, the first bearing plate (6) and the second bearing plate (7) are both in a circular ring shape, and the left side and the right side of the lower surfaces of the first bearing plate (6), the second bearing plate (7) and the third bearing plate (8) are fixedly provided with fixing cylinders (19);
the wafer surface cleaning device is characterized in that spray holes (15) are formed in the surface of the connecting cylinder (12) at equal angles, a first connecting shell (13) is attached to the outer side of the connecting cylinder (12), a second connecting shell (14) is rotatably mounted below the first connecting shell (13), a damping pad (31) is arranged at the front end of the first connecting shell (13), a fixed shaft (17) is fixedly arranged inside the connecting cylinder (12), a magnetic ring (18) is fixedly connected to the outer side of the fixed shaft (17), magnetic blocks (16) are fixedly arranged inside the first connecting shell (13) and the second connecting shell (14), a water pump is externally connected to the guide pipe (37), the first motor (11) drives the connecting cylinder (12) to rotate, and in the rotating process of the connecting cylinder (12), magnetic fluid grinding agents injected into the guide pipe (37) can be sprayed out through the spray holes (15) to wash the surface of a wafer;
a limiting rod (20) is arranged inside the fixed cylinder (19) in a fitting mode, the bottom end of the limiting rod (20) is connected with the supporting plate (3), a second connecting rod (30) is fixedly arranged on the fixed cylinder (19) below the third bearing plate (8), a first connecting rod (29) is fixedly arranged on the fixed cylinder (19) below the second bearing plate (7), threaded bushings (28) are fixedly arranged at the front ends of the first connecting rod (29) and the second connecting rod (30), a third screw (26) is arranged on the internal threads of the lower threaded bushing (28), a second screw (25) is arranged on the internal threads of the upper threaded bushing (28), and a lapping rod (21) is fixedly arranged on the fixed cylinder (19) below the first bearing plate (6);
a lapping cylinder (22) is fixedly arranged at the front end of the lapping rod (21), the top end of the lapping cylinder (22) is connected with the first bearing plate (6), and a first screw rod (23) is arranged in the lapping cylinder (22) through threads;
the key rods (24) are connected with the inner portions of the first screw rod (23), the second screw rod (25) and the third screw rod (26) in a key mode, the central axes of the key rods (24), the first screw rod (23), the second screw rod (25) and the third screw rod (26) are all on the same straight line, the first screw rod (23), the second screw rod (25) and the third screw rod (26) form a rotating structure through the key rods (24) and the supporting plate (3), and the screw pitches of the first screw rod (23), the second screw rod (25) and the third screw rod (26) are decreased progressively from top to bottom;
fixing plates (27) are respectively arranged on the outer sides of the first screw (23), the second screw (25) and the third screw (26) in a bearing mode, the fixing plates (27) are fixedly connected with the shell (4), the fixing plates (27) are symmetrically distributed on the upper side and the lower side of the second screw (25) and the third screw (26), and the first bearing plate (6), the second bearing plate (7) and the third bearing plate (8) form a lifting structure with the shell (4) through the first screw (23), the key rod (24), the second screw (25) and the third screw (26);
the bottom fixedly connected with pivot (36) of key pole (24), the bottom fixedly connected with second belt pulley (35) of pivot (36), the surface mounting of second belt pulley (35) has hold-in range (34), first belt pulley (33) are installed on the right side of hold-in range (34), the fixed second motor (32) that is provided with in right side of backup pad (3), the output shaft and the first belt pulley (33) of second motor (32) link to each other.
2. The multi-functional semiconductor cavity processing apparatus of claim 1, wherein: the front end fixed mounting of backup pad (3) has baffle (5), the external diameter of baffle (5) equals the internal diameter of shell (4), the shape of shell (4) and the shape of baffle (5) are half-circular ring.
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