CN103972375A - 一种免封装且免电路板的发光二极管装置及其制造方法 - Google Patents
一种免封装且免电路板的发光二极管装置及其制造方法 Download PDFInfo
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Abstract
本发明揭露一种免封装且免电路板的发光二极管装置及其制造方法,其不需要任何半导体封装用基板以及印刷电路板,主要在发光二极管芯片上设有两个对外连接电线的电极及一个或多个芯片单元,此两个电极利用电线直接电性连接至一直流电源或交流电源,以供发光二极管直接导通发光。本发明可将元件组成、封装制作过程以及组装制作过程简化至最少,以确实达到有效降低成本以及提高元件可靠度与合格率的功效。
Description
技术领域
本发明有关一种发光二极管(LED)装置,特别是关于一种免封装且无需设计电路板的发光二极管装置及其制造方法。
背景技术
发光二极管的发光原理是利用半导体固有特性,利用电流正向流入半导体的PN结时便会发出光线。由于LED具有高耐久性、寿命长、轻巧、耗电量低且不含水银等有害物质等优点,故可广泛应用于照明设备产业中。
最早期的发光二极管封装结构通常包含一芯片,安装于一导线架上,并利用一封装胶体包覆芯片及部分导线架,使导线架的金属引脚露出封装胶体之外而作为对外接点;进一步在组装成发光二极管阵列时,则将多个发光二极管的封装金属引脚安装至一印刷电路板的金属连线上,以此使多个发光二极管相互电性连接。但此种封装结构受限于发光二极管结构本身的封装尺寸,导致体积无法限缩;且因每一发光二极管仅能通过金属引脚散热,散热效果有限。
基于上述问题,遂有台湾专利前案,专利证书号I281271,提出一种将未封装LED芯片、无需通过封装基板直接连接于印刷电路板的LED装置及制作方法,如图1所示,此LED装置将未封装的LED芯片10直接连接、导通、固定在印刷电路板12上,印刷电路板12上并预设有电路,且此印刷电路板12不包括半导体封装用的基板,据此达成免封装LED装置。然而,即使未使用封装基板,此前案仍然需要使用印刷电路板,所以需要印刷电路板的制造过程,也仍需要LED芯片对位固晶的制造过程,只要有额外的电路板及额外的制造过程,则元件的可靠度及合格率就会受到影响,亦仍需相对应的成本与制造时间。
有鉴于此,本发明提出一种无需利用封装基板,也无需使用印刷电路板的发光二极管装置及其制造方法,以解决存在于先前技术中的该些缺失。
发明内容
本发明的主要目的在于提供一种免封装且免电路板的发光二极管装置及其制造方法,其在制作过程中利用光罩在发光二极管芯片上设置两个可对外连接电线的电极及至少一芯片单元,通过电线与电极的连接,直接电性连接至一直流或交流电源,以使发光二极管芯片直接导通发光;不需要任何半导体封装用基板以及印刷电路板,将元件组成、封装制作过程与组装制作过程简化至最少,以确实达到有效降低成本以及提高元件可靠度及合格率的多重功效。
本发明的另一目的在于提供一种免封装且免电路板的发光二极管装置及其制造方法,其在制作过程中利用光罩直接在发光二极管芯片上设置两个可对外连接电线的电极及设有串联、并联或串并联的多个芯片单元,可依用户需求来变化,以提供更大的使用弹性。
本发明的再一目的在于提供一种免封装且免电路板的发光二极管装置及其制造方法,其可直接安装于散热板上,以达最有效的散热效果。
为达到上述目的,本发明提出免封装且无电路板的发光二极管装置,包括至少一发光二极管芯片,其上设有两个可对外连接电线的电极及设有一个或多个芯片单元,通过电线与此电极连接,直接电性连接至一直流电源或交流电源,以供直接导通发光。
另一方面,本发明提出另一实施例,其为免封装且免电路板的发光二极管装置的制造方法,先准备一发光二极管芯片,在制作过程中利用光罩在此发光二极管芯片上设置两个可对外连接电线的电极及至少一芯片单元,通过电线与此两个电极连接,直接电性连接至一直流电源或交流电源以供直接导通发光。
下面通过具体实施例配合所附的图式详加说明,当更容易了解本发明的目的、技术内容、特点及其所达成的功效。
附图说明
图1为现有LED装置示意图;
图2为本发明第一实施例的结构示意图;
图3为本发明第二实施例的结构示意图;
图4为本发明第三实施例的结构示意图。
附图标记说明:10-LED芯片;12-印刷电路板;20-发光二极管芯片;22-芯片单元;221~227-芯片单元;24、26-可对外连接电线的电极;28、30-电线;32-电源;34-发光二极管芯片;36、38、40、42、44-芯片单元串列。
具体实施方式
发光二极管芯片通常在一氮化镓(GaN)、蓝宝石(sapphire)、磷化镓(GaP)或砷化镓(GaAs)等基板上形成具有PN结的LED磊晶层,并在适当位置分别形成两个电极,以提供LED磊晶层两端足够的电位差,使LED磊晶层上的PN结产生光源并向周围射出。本发明通过此类发光二极管芯片,甚至是未切割的发光二极管芯片,在制作过程中利用光罩在其上制作两个可对外连接电线的电极与至少一芯片单元,将电线直接连接此两个电极,供以电力,即可点亮发光二极管芯片。无需任何封装制作过程、无需制作印刷电路板,也无需将芯片与印刷电路板对准连接的制作过程,即可达到直接导通发光二极管芯片发光的目的。
图2为本发明第一实施例的结构示意图,如图所示,本发明的免封装且免电路板的发光二极管装置包括至少一发光二极管芯片20,其未经过任何封装制作过程,在此发光二极管芯片20上设有至少一芯片单元22,且在制作过程中利用光罩在芯片单元22上设置两个可对外连接电线的电极24、26,此两个电极24、26直接利用两个电线28、30电性连接至一电源32,以供电导通发光二极管芯片而发光。当然,芯片单元22上的电极24、26可于制作发光二极管芯片的半导体过程中直接利用光罩制作成型,亦可在形成发光二极管芯片的制作过程后再利用导电胶于预定电极区域点胶形成,二者皆可达成,可依使用者需求而定。
另一方面,本发明制作此发光二极管装置的流程请同时参阅图2所示,首先,提供一未封装的发光二极管芯片20,其上具有至少一芯片单元22,且在制作过程中利用光罩在此芯片单元22上设置两个可对外连接电线的电极24、26;然后,再将电源32的正负极分别利用电线电性连接至此两个电极24、26,如此,即可完成此发光二极管装置的制作。
再者,前述的发光二极管芯片除了仅具有一个芯片单元之外,本发明更可在制作过程中利用光罩形成具有多个串联、并联或串并联的芯片单元的设计。如图3所示,在发光二极管芯片20上于半导体制作过程中利用光罩直接形成有多个排列成阵列状的芯片单元221~227,这些芯片单元221~227依序以串联方式连接一起,在此些芯片单元221~227的两端则分别设有两个可对外连接电线的电极24、26,亦即芯片单元221这端连接电极24,芯片单元227这端则连接电极26,电极24、26直接连接电线,再接至电源。此两个可对外连接电线的电极,也是在制作过程中利用光罩同时制作完成。
更甚者,发光二极管芯片更可直接为一个未切割的发光二极管芯片,如图4所示,在制作过程中利用光罩在一未切割的发光二极管芯片34上形成两个可对外连接电线的电极24、26及多个排列成阵列状的芯片单元22,在此实施例中,这些芯片单元22中,每三个芯片单元22以串联方式连接在一起,以分别构成芯片单元串列36、38、40、42、44,而芯片单元串列36、38、40、42、44之间则互相并联并连接至电极24、26;如此,当此两个电极24、26利用电线电性连接至电源,以供直接导通供电使芯片单元串列36、38、40、42、44直接发光。
其中,对于上述任何一种发光二极管装置,为了提高发光二极管的散热效果,本发明更可于发光二极管芯片或芯片下表面直接安装一散热板,以有效达到高散热效果。另外,本发明的发光二极管装置亦可直接应用于照明灯具上,可直接装设于灯座上,搭配灯罩与开关的设计,即可作为一个无需任何印刷电路板、无需任何封装结构的照明灯具,应用甚广。再者,为了提供不同颜色的发光源,亦可在芯片单元表面上直接喷涂或涂覆一层荧光层,抑或是直接黏接一荧光片,以提供不同颜色的发光源,进而使发光二极管装置发出特定颜色的光源。
因此,本发明不需要任何半导体封装用基板以及印刷电路板,将元件组成与封装制作过程简化至最少,以确实达到有效降低成本以及提高元件可靠度及合格率的多重功效。再者,本发明的免封装且免电路板的发光二极管装置直接在未封装的发光二极管芯片上直接形成有可对外连接电线的电极及有串联、并联或串并联的多个芯片单元,设计的数量与连接关系可依使用者需求来变化,实足以提供更大的使用弹性。
以上所述实施例仅为说明本发明的技术思想及特点,其目的在使熟习此项技艺的人士能够了解本发明的内容并据以实施,当不能以之限定本发明的专利范围,即大凡依本发明所揭示的精神所作的均等变化或修饰,仍应涵盖在本发明的专利范围内。
Claims (9)
1.一种免封装且免电路板的发光二极管装置,其特征在于,包括至少一发光二极管芯片,在制作过程中利用光罩在该发光二极管芯片上设置两个电极及至少一芯片单元,其中,两个所述电极直接对外连接电线,所述电线连接至一直流或交流电源,以供发光二极管芯片直接导通发光。
2.根据权利要求1所述的免封装且免电路板的发光二极管装置,其中,在制作过程中利用光罩在该发光二极管上设置多个该芯片单元。
3.根据权利要求2所述的免封装且免电路板的发光二极管装置,其中在制作过程中,利用光罩使所述芯片单元以串联、并联或串并联方式形成电性连接。
4.根据权利要求1所述的免封装且免电路板的发光二极管装置,其中该发光二极管芯片为一未切割的发光二极管芯片。
5.根据权利要求1所述的免封装且免电路板的发光二极管装置,其中两个所述电极为制作该发光二极管芯片的过程中直接利用光罩形成,或为后续利用导电胶喷涂形成。
6.一种免封装且免电路板的发光二极管装置的制造方法,包括下列步骤:
提供一发光二极管芯片,在制作过程中利用光罩在发光二极管芯片上设置两个电极及至少一芯片单元,其中,两个所述电极直接对外连接电线;以及
将一电源通过电线电性连接至该两个电极,以供发光二极管芯片直接导通发光。
7.根据权利要求6所述的免封装且免电路板的发光二极管装置的制造方法,其中,在制作过程中利用光罩在该发光二极管上设置多个该芯片单元,且利用光罩使该些芯片单元以串联、并联或串并联方式形成电性连接。
8.根据权利要求6所述的免封装且免电路板的发光二极管装置的制造方法,其中该两个电极为制作该发光二极管芯片的过程中直接利用光罩成型,或为后续利用导电胶点胶成型。
9.根据权利要求6所述的免封装且免电路板的发光二极管装置,其中该发光二极管芯片为一未切割的发光二极管芯片。
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TW102102864A TW201431138A (zh) | 2013-01-25 | 2013-01-25 | 免封裝製程且免電路板式發光二極體裝置及其製造方法 |
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CN1679177A (zh) * | 2002-08-29 | 2005-10-05 | 氮化物半导体株式会社 | 具有多个发光元件的发光装置 |
US20080099772A1 (en) * | 2006-10-30 | 2008-05-01 | Geoffrey Wen-Tai Shuy | Light emitting diode matrix |
US20090321776A1 (en) * | 2008-06-25 | 2009-12-31 | Samsung Electronics Co., Ltd. | Multi-chip package for LED chip and multi-chip package LED device including the multi-chip package |
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US20080099772A1 (en) * | 2006-10-30 | 2008-05-01 | Geoffrey Wen-Tai Shuy | Light emitting diode matrix |
US20090321776A1 (en) * | 2008-06-25 | 2009-12-31 | Samsung Electronics Co., Ltd. | Multi-chip package for LED chip and multi-chip package LED device including the multi-chip package |
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