TWI474523B - - Google Patents

Info

Publication number
TWI474523B
TWI474523B TW102102864A TW102102864A TWI474523B TW I474523 B TWI474523 B TW I474523B TW 102102864 A TW102102864 A TW 102102864A TW 102102864 A TW102102864 A TW 102102864A TW I474523 B TWI474523 B TW I474523B
Authority
TW
Taiwan
Application number
TW102102864A
Other versions
TW201431138A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW102102864A priority Critical patent/TW201431138A/zh
Priority to CN201410014282.0A priority patent/CN103972375A/zh
Priority to JP2014007796A priority patent/JP2014146794A/ja
Priority to US14/159,565 priority patent/US20140209937A1/en
Priority to EP14152207.8A priority patent/EP2760056A3/en
Priority to KR1020140008308A priority patent/KR20140095989A/ko
Publication of TW201431138A publication Critical patent/TW201431138A/zh
Application granted granted Critical
Publication of TWI474523B publication Critical patent/TWI474523B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
TW102102864A 2013-01-25 2013-01-25 免封裝製程且免電路板式發光二極體裝置及其製造方法 TW201431138A (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
TW102102864A TW201431138A (zh) 2013-01-25 2013-01-25 免封裝製程且免電路板式發光二極體裝置及其製造方法
CN201410014282.0A CN103972375A (zh) 2013-01-25 2014-01-13 一种免封装且免电路板的发光二极管装置及其制造方法
JP2014007796A JP2014146794A (ja) 2013-01-25 2014-01-20 パッケージ工程も回路基板も不要な発光ダイオード装置およびその製造方法
US14/159,565 US20140209937A1 (en) 2013-01-25 2014-01-21 Package-free and circuit board-free led device and method for fabricating the same
EP14152207.8A EP2760056A3 (en) 2013-01-25 2014-01-22 Package-free and circuit board-free led device and method for fabricating the same
KR1020140008308A KR20140095989A (ko) 2013-01-25 2014-01-23 패키지공정 및 회로기판이 없는 발광 다이오드장치 및 그의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102102864A TW201431138A (zh) 2013-01-25 2013-01-25 免封裝製程且免電路板式發光二極體裝置及其製造方法

Publications (2)

Publication Number Publication Date
TW201431138A TW201431138A (zh) 2014-08-01
TWI474523B true TWI474523B (zh) 2015-02-21

Family

ID=50028789

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102102864A TW201431138A (zh) 2013-01-25 2013-01-25 免封裝製程且免電路板式發光二極體裝置及其製造方法

Country Status (6)

Country Link
US (1) US20140209937A1 (zh)
EP (1) EP2760056A3 (zh)
JP (1) JP2014146794A (zh)
KR (1) KR20140095989A (zh)
CN (1) CN103972375A (zh)
TW (1) TW201431138A (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201248957A (en) * 2011-05-20 2012-12-01 Huga Optotech Inc Semiconductor light-emitting structure
CN102891140A (zh) * 2012-09-13 2013-01-23 惠州雷曼光电科技有限公司 Led晶片及功率型led

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2362407T3 (es) * 2002-08-29 2011-07-04 Seoul Semiconductor Co., Ltd. Dispositivo emisor de luz provisto de diodos emisores de luz.
EP2733744A1 (en) * 2004-06-30 2014-05-21 Seoul Viosys Co., Ltd Light emitting element comprising a plurality of vertical-type LEDs connected in series on the same carrier substrate
TWI281271B (en) 2004-10-29 2007-05-11 Chiu-Chung Yang Manufacturing method for integrated LED and the structure thereof
US20080099772A1 (en) * 2006-10-30 2008-05-01 Geoffrey Wen-Tai Shuy Light emitting diode matrix
KR101448153B1 (ko) * 2008-06-25 2014-10-08 삼성전자주식회사 발광 다이오드용 멀티칩 패키지 및 멀티칩 패키지 방식의발광 다이오드 소자

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201248957A (en) * 2011-05-20 2012-12-01 Huga Optotech Inc Semiconductor light-emitting structure
CN102891140A (zh) * 2012-09-13 2013-01-23 惠州雷曼光电科技有限公司 Led晶片及功率型led

Also Published As

Publication number Publication date
KR20140095989A (ko) 2014-08-04
CN103972375A (zh) 2014-08-06
EP2760056A3 (en) 2015-08-26
JP2014146794A (ja) 2014-08-14
EP2760056A2 (en) 2014-07-30
TW201431138A (zh) 2014-08-01
US20140209937A1 (en) 2014-07-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees