1281271 九、發明說明： 【發明所屬之技術領域】 本發明係提供-種未經封裝製程即可使用之L E D製造方法 =構’尤知-種將未封裝LED晶片、無需透過封裝基板直接 ，接於卩刷電路板之LED裝置及製作方法，特指LED在製成 LED產品之成品過程中，其LED晶片得直接連結、導通、固 定印刷電路板上，印刷電路板上並職有電路，該印刷電路板不 包括半導^製程封制之基板，藉此方法及結構，達其發光面及 散熱性有尚於覆晶的高效率，並有SMDL ED電極加工便利 ，，但不須經覆晶LED及SMDLED須封裝製程，即可製成 相同效果L ED產品。 【先前技術】 參閱第3圖所示’係為各種形式LED製程之比較圖，兹舉 ，、二種最常見之L E D製程說明如下： ，第-種製程為LED LEMP (燈）之製程，其係將晶 (0)先行固定至支架（1 1 )，再打線（丄2)後，以封膠 >(1 3 )方式進行封裝，如此其使用時，在電路基板（1 *)上 汉孔供^ E D燈穿組並焊接固定，而完成其L E D燈之製程。 其第二種製程為SMD (表面粘貼）lED，其製程亦係將 晶片（2 0 )先行固定到細小基板（2丄），再打線（2 2 )，其 ，封膠（2 3 )封裝，再其使用時將該封裝後產品焊設於電路£ 板（2 4)上使用。 其弟二種製程為覆晶L e D製程，茲舉其申請案號第〇 9 2 2 J 7 6 4 2號案說明，其製程為晶片（3 〇 )，再準備覆晶基板 (3 1 ) ’其晶片（3 0 )與覆晶基板（3 1 )採高週波（3 2 ) ^妾方式，再於晶4 (3 〇)上封膠（3 3)封裝，其後之成品 再焊設於電路基板（3 4)上使用。 例舉習用與本案之最大不同： 1結構上： 5 1281271 f E #為L E D ^ 4加上覆晶基板製成。 式，所以謂a 4 # A f = LED “電辩IUSMD的模 2焊接材i日日片視為已封裝好的s助（結構相同但未封裝）。 =:·，用高週波結合，生產成本相當高。 接由傳統錫爐焊接，成本相當低〗錫次導電膠及錫賞，並可直 3加工機械： 擔?Ϊ高週波加工機械加工製成覆晶，並經裴 岔，用傳統錫爐或導電膠加工在電路基板。 町我 本务明免封裝L E D ··不須封| T f η，# Ω你 於電路基板。 、、 ，使用傳統錫爐即可結合1281271 IX. Description of the Invention: [Technical Field] The present invention provides an LED manufacturing method that can be used without an encapsulation process. </ RTI> It is known that the LED chip is not packaged, and the package substrate is not directly connected. The LED device and the manufacturing method of the brush circuit board specifically refer to the LED chip in the process of manufacturing the finished product of the LED product, the LED chip is directly connected, turned on, and fixed on the printed circuit board, and the circuit board has a circuit. The printed circuit board does not include a semi-conducting process-sealed substrate. The method and structure have high efficiency of flip-chip for its light-emitting surface and heat dissipation, and the SMDL ED electrode is convenient to process, but does not need to be covered. Crystal LEDs and SMDLEDs must be packaged to produce the same effect L ED products. [Prior Art] Refer to Figure 3 for a comparison of various types of LED processes. Here, the two most common LED processes are described as follows: The first process is a LED LEMP process. The crystal (0) is first fixed to the bracket (1 1 ), and after the wire is twisted (丄2), it is packaged in the form of sealant > (1 3 ), so when it is used, it is on the circuit substrate (1 *) The hole is supplied with the ED lamp and fixed by welding, and the process of the LED lamp is completed. The second process is SMD (Surface Bonding) lED, and the process is also to fix the wafer (20) to the small substrate (2丄), then the wire (2 2 ), and the sealing (2 3 ) package. The packaged product is then soldered to the circuit board (2 4) for use. The two processes of the younger brother are the flip-chip L e D process, as described in the application No. 9 2 2 J 7 6 4 2, the process is wafer (3 〇), and then the flip-chip substrate is prepared (3 1 ''The wafer (30) and the flip-chip substrate (3 1) are high-frequency (3 2 ) ^ 妾, and then encapsulated on the crystal 4 (3 〇) (3 3), and then the finished product is re-soldered. It is used on the circuit board (34). The difference between the conventional application and the case is as follows: 1 Structurally: 5 1281271 f E # is made of L E D ^ 4 plus a flip chip substrate. Equation, so a 4 # A f = LED "Electrical argument IUSMD's die 2 solder material i day film is considered to be packaged s help (the same structure but not packaged). =: ·, combined with high frequency, production The cost is quite high. It is connected to the traditional tin furnace welding, the cost is quite low〗 锡 tin conductive adhesive and tin reward, and can be straight 3 processing machinery: Ϊ? Ϊ high frequency processing machining to make flip chip, and through the 裴岔, with the traditional Tin furnace or conductive rubber is processed on the circuit board. machi I have a clear package LED ·· Do not need to seal | T f η, # Ω you on the circuit board.,,, can be combined using a traditional tin furnace
述之三種習用製程，其共通之缺點即製程多而繁瑣封 Hi昴貴，封裝後之L E D散熱效果不佳，而 知、度會因封裝材料受敎產生變質盆 Ά後之LED 其缺點者。U生欠貝及其他麵原因阻擔而減低，為 L 及其相關產品製造業多年深知其 「免封裝製作，終於創作_明之 【發明内容】 本，明之主要目的’即在於消除上述 =’而提供-種未經封裝製程即可使用 尤指-種將未封裝L E D晶片、無需透過封裝基板2= =印=路板之L E D裝置及製作方法，其係L E D晶片 固定在印刷電路板上，印刷電路板並預設有電路，續 ΐ，，不包括半導體封裝用之基板，如此即完成其製法，可 urmii具賴佳、縣低及發解高、高壽命之多 i功效，為其特徵者。 ^ !281271 ρ本喪明之次-目的，在提供-種未經封裝製 ED製造方法及結構，其中該複數LED晶片直接糾使 固定於印刷電路板上，可利用串並聯之連結方 片之連結、導通、固定，且LE：D晶片間得以替主，hD日日 刷電路板空間，得以更能節省空間或得褒設更 效，並可任意作電壓、電流、組合，為其特徵者。 U Η曰片功 有關本發明所採用之技術、手段及其功效， 2並細說明於后’相信本發明上述之“、‘!Ϊ 徵，當可由之得-深入而具體的瞭解。 傅化及特 【圖式之簡單說明】 第1圖 第2圖 第3圖 弟4：圖 第5圖 弟6圖· #丨不+货 【圖式之圖號說明】 (1 〇)晶片 C1 2)打線 (14)電路基板 (21)小基板 Q 3)封膠 (30)晶片 (3 2)高週波焊接 (3 4)電路基板 (41)印刷電路板 (51)晶片背面 (6 1) ρ極 (7 0)印刷電路板 係L E D晶片俯視圖。 係L E D晶片侧剖示圖。 係各種形式LED製程之比較圖。 係本發明料社E D之發光面積比較 係本發明之另一較佳實施例示意圖。 ，，發明之又—較佳實施例示意圖。 圖 (11)支架 (13)封膠 (20)晶片 (2 2 )打線 (2 4)電路基板 (31)覆晶基板 (33)膠 (40)晶片 5 0) LED晶片 (60)LED晶片 (6 2 ) N極 8 0)串並聯複數晶片 7 1281271 9 1 ) L E D晶片 9 3 )導體 (90)LED晶片 (9 2 ) L E D 晶片 (9 4)印刷電路板 【實施方式】 及結提供—縣轉錄辨可之L E D製造方法 式再步瞭解本㈣之結顧計及脑’謹配合圖 曰2圖所示，係為LED晶片之示意圖，該led 二曰μ，的核心部分是由p型半導體和n型半導體組 P二二’ί2ίί體和N型半導體之間有—個過渡層，稱為 鱼多tat 材料的P—N、结中，注人的少數載流子 ^電)會把多餘的能量以光的形式釋放出來，從而 注入為，。P—N結加反向電壓’少數載流子難以 於弁二娜1:严種利用注人式電致發光原理製作的二極體叫 ED。當它處於正向工作狀態時（即兩端加 卜ίί L rf從L E D陽極流向陰極時，半導體晶體就發出 從备、2巧卜*贿色的光線’光的鋪與電流有關。 1- 2ΐ f圖f示，係為各種形式L E D製程之比較圖，兹舉 ^ED$程與本發明之製程說明如下，期能用表 才口化之方式輕易展現出四種製程之差異處·· 片二一?製?"ΕΜΡ (燈)之製程，其係將晶 门（ jit固定至支架（11)，再打線（12)後，以封膠 (13 )方式進行封裝，如此其使用時，在大基板 凡 孔供l^d燈穿組並焊接固定，而完成其led燈之製程；认 曰片程為SMD (表面鑲嵌）LED，其i程亦係將 K S固定，、基ΐ(21)，再打線（22)，其後 (^ 4)上使用衣’再'、使用0$將該封|後產品焊設於電路基板 8 1281271 兹舉其申請案號第0 9 2 (3 0)，再準備覆晶基板 (31)採高週波（3 2) 3)封裝，其後之成品再 其第三種製程為覆晶L ED製程， 217 6 4 2號案說明，其製程為晶片 ^3 1)，其晶片（3〇)與覆晶基板 焊接方式’再於晶片（30)上膠（3 焊設於電路基板（3 4)上使用； 本發明之製程為··晶片（4 〇 )，直接取其晶片（* 〇 )連社、 ίΐ、固定於印刷電路板（4 1)上使用，大量減少製程而降°低 成本，且散熱功效佳。 一 參閱第4圖所示，首先需瞭解到LED晶片之特性，盆係正 Ξίΐΐ發光者，本發明之LED晶片（5〇)採用高透^具 ^蔓曰日片之材質作為背面（5 ! ) ’ f面（5 i )使之全面發光而 2全，，阻擋，正面（5 2)則朝向印刷電路板，正面表面作防 知及抗氧化處理及適當的電極設計，而參看習用者，其Led(6 0)採用正面（6 3)發光，背面（6 4)則作為固定面，其至 少被P、N極（β 1 ) ( 6 2 )之焊接位置阻擋，故而本發明之Ε E D (5 0)較習用有較多的發光面積。 一種未經封裝製程即可使用之LED製造方法，尤指一種將 未封裝L ED晶片、無需透過封裝基板直接連接於印刷電路板之 led裝置及製作方法，主要係針對已經製成lED晶片者，其 不須樹脂封裝即可測試及使用；製造方 法為： a ·印刷電路板上製設電路，該印刷電路板不包括半導體封 裝用之基板； b · L ED晶片置於印刷電路板上，並p、n電極對齊印刷 電路板上對應之電路； c ·直接將P、N電極連結、導通、固定於印刷電路板； 據此完成未經封裝製程即可使用之LED製造方法，其係直 接晶片之P、N電極連結、導通、固定於印刷電路板，達到直接 連結、導通、固定功效，且散熱佳、並因製程簡省而使成本低， 9 1281271 而其沒阻猶其發縣高之功效者。 數可使用之L E D製造方法，係針對複 裂用1基^刷電路板上製設電路，該印刷電路板不包括半導體封 b if數LED晶片置於印刷電路板上，並P、N電極對齊 印刷電路板上對應之電路； 屯往耵月 c ·直接將P、n電極連結、導通、固定於印刷電路板； 據此完成複數整合型L E D之製造方法。 ， ，閱第5圖所示’該一印刷電路板（7〇)上預設有電路， P刷電路板（70)上可以連結、導通、固定複數的晶片（8 曰孙、Γ極力成正極電源’ N極力ϋ以負極電源，其P極串接N極， ^八不复數晶片可利用串並聯之連結方式作多片L E D晶片之連 =、導通、固定，且LED晶片間得以緊靠，並因減少印刷電 板空間，得以更能節省空間或得裝設更多之LED晶片功效，並 可任意作電壓、電流、組合者。 上述串或並聯均可使用，而其串、並聯之晶片均可作 電流、亮度組合。 參閱第6圖所示，其中該分屬R&LED晶片（9〇)、The three common processes described in the common shortcomings are that the process is numerous and complicated, and the L E D heat dissipation effect is not good after the package, and the knowledge and degree will be caused by the deterioration of the LED after the deterioration of the packaging material. U owed to the shell and other reasons for the reduction and reduced, for L and its related products manufacturing industry for many years know that its "free packaging production, and finally created _ Mingzhi [invention content] This, the main purpose of the Ming is to eliminate the above = ' Providing an unpackaged process can be used, in particular, an LED device that does not package an LED chip, does not need to pass through a package substrate, and is mounted on a printed circuit board. Printed circuit board and pre-configured circuit, continued, does not include the substrate for semiconductor packaging, so that the completion of its production method, urmii with Lai Jia, county low and high resolution, high life and long-term effects, its characteristics ^ !281271 ρ 本 丧 之 - 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的 目的The connection, conduction, and fixation, and LE: D wafers can be replaced by the main, hD daily brush circuit board space, can save space or make it more efficient, and can be used for voltage, current, combination, and its characteristics By. U Η曰 功 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关 有关Fu Hua and special [Simple description of the schema] Figure 1 Figure 2 Figure 3 Figure 4: Figure 5 Figure 6 Figure · #丨不+货 [图图图说明] (1 〇) wafer C1 2) Wire bonding (14) Circuit board (21) Small board Q 3) Sealing (30) Wafer (3 2) High-frequency soldering (3 4) Circuit board (41) Printed circuit board (51) Chip back (6 1) The ρ pole (70) printed circuit board is a top view of the LED wafer. A side view of the L E D wafer side. A comparison chart of various forms of LED process. A comparison of the light-emitting areas of the present invention E D is a schematic view of another preferred embodiment of the present invention. Further, the invention is a schematic view of a preferred embodiment. Figure (11) Bracket (13) Sealing (20) Wafer (2 2) Wire (2 4) Circuit Substrate (31) Flip-Chip Substrate (33) Glue (40) Wafer 5 0) LED Wafer (60) LED Wafer ( 6 2) N pole 8 0) Serial-parallel complex chip 7 1281271 9 1 ) LED chip 9 3 ) Conductor (90) LED chip (9 2 ) LED chip (9 4) Printed circuit board [Embodiment] The transcript-recognition LED manufacturing method is further understood by the (4) and the brain, as shown in Figure 2, which is a schematic diagram of the LED chip. The core part of the LED is p-type semiconductor. And the n-type semiconductor group P two two 'ί2ίί body and N-type semiconductor have a transition layer, called P-N of the fish multi-tat material, the knot, the minority carrier of the injection ^ electricity will be redundant The energy is released in the form of light, which is injected into it. P-N junction plus reverse voltage ' Minority carriers are difficult to 弁二娜1: The diode made by the principle of injection-type electroluminescence is called ED. When it is in the forward working state (that is, when the two ends add Bu ίί L rf from the LED anode to the cathode, the semiconductor crystal emits light from the preparation, the light of the bribe color, and the light is related to the current. 1- 2ΐ f Figure f shows a comparison chart of various forms of LED process. The process of the invention is as follows. The process of the invention can be easily displayed in the form of a table, and the difference between the four processes can be easily displayed. The process of "two-to-one system" " 灯 (light), which is to fix the gate (the jit is fixed to the bracket (11), and then the wire (12), and then encapsulated by the sealant (13), so when used, In the large substrate, the hole is supplied with the l^d lamp and fixed by welding, and the process of the LED lamp is completed; the chip process is SMD (surface inlay) LED, and the i process is also fixed by KS, and the base is (21 ), and then hit the line (22), and then use the clothing 're-' on the (^ 4), and use 00 to seal the seal|post-products on the circuit board 8 1281271. The application number is 0 9 2 (3 0 Then, the flip-chip substrate (31) is prepared with a high-frequency (3 2) 3) package, and then the third process is a flip-chip L ED process, as described in the case of 217 6 4 2 The process is a wafer ^3 1), the wafer (3〇) and the flip chip substrate soldering method 'again the wafer (30) is glued (3 is soldered on the circuit substrate (34); the process of the present invention is · The chip (4 〇) is directly used for its wafer (* 〇), ΐ, and fixed on the printed circuit board (4 1), which greatly reduces the process and lowers the cost, and has good heat dissipation. See Figure 4 As shown in the figure, first of all, it is necessary to understand the characteristics of the LED chip, and the LED chip of the present invention (5〇) adopts the material of the high-transparent ^ 曰 曰 曰 film as the back surface (5 ! ) ' f surface ( 5 i) Make it fully luminous and 2 full, block, front (5 2) towards the printed circuit board, front surface for anti-knowledge and anti-oxidation treatment and appropriate electrode design, and refer to the learner, its Led (6 0 The front side (63) emits light, and the back side (6 4) acts as a fixed surface, which is blocked by at least the welding position of the P and N poles (β 1 ) (6 2 ), so the ED (50) of the present invention is There are many light-emitting areas in practice. One method of LED manufacturing that can be used without a packaging process, especially one that will not package L ED chips, The LED device and the manufacturing method for directly connecting to the printed circuit board through the package substrate are mainly for those who have already made the lED wafer, and can be tested and used without the resin package; the manufacturing method is: a) The circuit is formed on the printed circuit board The printed circuit board does not include a substrate for semiconductor packaging; b · the L ED chip is placed on the printed circuit board, and the p and n electrodes are aligned with the corresponding circuits on the printed circuit board; c · the P and N electrodes are directly connected and turned on And fixed on the printed circuit board; thereby completing the LED manufacturing method that can be used without the packaging process, which is the direct connection of the P and N electrodes of the direct chip, the conduction and the fixing on the printed circuit board, and the direct connection, conduction and fixing effects are achieved. And the heat dissipation is good, and the cost is low due to the simple process, 9 1281271 and it does not hinder the high efficiency of the county. The LED manufacturing method that can be used is to manufacture a circuit for a cracking 1 chip circuit board, the printed circuit board does not include a semiconductor package, if number LED chips are placed on a printed circuit board, and P and N electrodes are aligned and printed. Corresponding circuit on the circuit board; 屯 耵 c c · Directly connect P, n electrodes, conduction, fixed to the printed circuit board; According to this, the manufacturing method of the complex integrated LED is completed. , as shown in Figure 5, 'the printed circuit board (7〇) is pre-arranged on the circuit, and the P-brush circuit board (70) can connect, turn on, and fix a plurality of chips (8 曰孙, Γ极力成正The power supply 'N is the power supply of the negative pole, and the P pole is connected in series with the N pole. The eight-in-one chip can be connected in a series-parallel connection to connect, turn on, and fix the LED chips, and the LED chips can be closely connected. And because of reducing the space of the printed circuit board, it can save space or have more LED chip functions, and can be used for voltage, current and combination. The above series or parallel can be used, and the serial and parallel chips can be used. Both current and brightness combinations can be used. See Figure 6, where the subordinate R&LED chip (9〇),
LED晶片（91)、G色LED晶片（92)，將三不同色LE D晶片以層疊並導通、固定，並p、N電極以導體（9 3)直接 焊接至多層印刷電路板（9 4)，據此得以rbg混色成為白光L E D功效及全彩光線功效。 綜上所述，本發明在同類產品中實有其極佳之進步實用性， 同時遍查關·於此_構之技術雜、文獻巾縣發現有相 同的構造存在在先，是以，本發明實已具備發明專利要件，爱 法提出申請。 、上述實施例，僅用以舉例說明本發明，據以在不離本發明精 神之範圍，熟習此項技藝者憑之而作之各種變形、修飾與應用，LED chip (91), G color LED chip (92), three different color LE D wafers are stacked and turned on, fixed, and p, N electrodes are directly soldered to the multilayer printed circuit board with conductors (9 3) (9 4) According to this, rbg color mixing has become a white LED effect and a full color light effect. In summary, the present invention has excellent progress and practicality in the same kind of products, and at the same time, it is found that the same structure exists in the literature. The invention has already possessed the invention patent requirements, and the law of love applied. The above embodiments are merely illustrative of the present invention, and various modifications, modifications, and applications may be made by those skilled in the art without departing from the scope of the invention.