TW200614541A - Manufacturing method for integrated LED and the structure thereof - Google Patents

Manufacturing method for integrated LED and the structure thereof

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Publication number
TW200614541A
TW200614541A TW093133143A TW93133143A TW200614541A TW 200614541 A TW200614541 A TW 200614541A TW 093133143 A TW093133143 A TW 093133143A TW 93133143 A TW93133143 A TW 93133143A TW 200614541 A TW200614541 A TW 200614541A
Authority
TW
Taiwan
Prior art keywords
integrated led
manufacturing
present
led
substrate
Prior art date
Application number
TW093133143A
Other languages
Chinese (zh)
Other versions
TWI281271B (en
Inventor
Chiu-Chung Yang
Original Assignee
Chiu-Chung Yang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38741681&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW200614541(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Chiu-Chung Yang filed Critical Chiu-Chung Yang
Priority to TW93133143A priority Critical patent/TWI281271B/en
Publication of TW200614541A publication Critical patent/TW200614541A/en
Application granted granted Critical
Publication of TWI281271B publication Critical patent/TWI281271B/en

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Abstract

The present invention provides a manufacturing method for integrated LED and the structure thereof, in which unpackaged LED die is directly linked, connected and fixed onto the circuit substrate, and the substrate is configured with circuits, so as to obtain the integrated LED ready-for-use. The present invention can provide multiple effects, such as better heat dissipation, lower cost, long life-span, and high light emitting efficiency.
TW93133143A 2004-10-29 2004-10-29 Manufacturing method for integrated LED and the structure thereof TWI281271B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93133143A TWI281271B (en) 2004-10-29 2004-10-29 Manufacturing method for integrated LED and the structure thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93133143A TWI281271B (en) 2004-10-29 2004-10-29 Manufacturing method for integrated LED and the structure thereof

Publications (2)

Publication Number Publication Date
TW200614541A true TW200614541A (en) 2006-05-01
TWI281271B TWI281271B (en) 2007-05-11

Family

ID=38741681

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93133143A TWI281271B (en) 2004-10-29 2004-10-29 Manufacturing method for integrated LED and the structure thereof

Country Status (1)

Country Link
TW (1) TWI281271B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201431138A (en) 2013-01-25 2014-08-01 zhong-lin Wang Packageless process and circuit board free type light emitting diode device and manufacturing method thereof

Also Published As

Publication number Publication date
TWI281271B (en) 2007-05-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees