CN103951999A - Healant for damage of break point hole position of circuit board and application method thereof - Google Patents
Healant for damage of break point hole position of circuit board and application method thereof Download PDFInfo
- Publication number
- CN103951999A CN103951999A CN201410178657.7A CN201410178657A CN103951999A CN 103951999 A CN103951999 A CN 103951999A CN 201410178657 A CN201410178657 A CN 201410178657A CN 103951999 A CN103951999 A CN 103951999A
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- Prior art keywords
- hole
- healant
- breaking
- broken
- circuit board
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Abstract
The invention relates to a healant for damage of a break point hole position of a circuit board. The healant is a mixture of the following components by weight percent: 50% of resin and 50% of solder resist ink. The broken part of the break point hole is adhered to an adhesive tape, and then a uniform mixture of the resin and the solder resist ink is picked up by a fine needle to fill into the break point hole; each break point hole is tamped and made even without cavities, and then baked for a period of time in a drying oven; finally a hole is made again to obtain a finished product. The joint of a sub-board and the circuit board gets normal by repairing, and the whole circuit board is not scrapped, so that the production cost is saved.
Description
Technical field
The invention belongs to high-density interconnected circuit board production technical field, especially a kind of circuit card is broken healant and the using method thereof that a hole site is damaged.
Background technology
In circuit card processing, when circuit hour, can process a plurality of daughter boards at a circuit card, between these daughter boards and circuit card, by the hole of breaking as in Fig. 3 black oval frame, be connected, due to the small volume of daughter board, 1 millimeter of some thickness less than, so especially easily there is a problem for hole site fracture of breaking as shown in Figure 1 in these daughter boards in artificial taking and placing, circular flow, if directly circuit card is scrapped, certainly will cause waste.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of circuit card that formula is reasonable, repairing effect is good to break the healant that a hole site is damaged.
The technical scheme that the present invention takes is:
Circuit card is broken the healant that a hole site is damaged, and it is characterized in that: comprise the following component of mixing by weight percentage:
Resin 50%
Welding resistance ink 50%.
Another object of the present invention is to provide the using method that a kind of circuit card is broken the healant damaging a hole site, it is characterized in that: comprise the following steps:
(1) by breaking an one side for hole broken positions, be bonded on adhesive tape, flatten;
(2) resin and welding resistance ink are mixed and stirred by metering;
(3) step mixture is (2) filled up to breaking in a hole after step is (1) bonding with fine needle, in each hole, all tamp, can not have cavity;
(4) step product (3) being put into baking box heats;
(5) step product is (4) taken out, be cooled to room temperature;
(6) again bore a first hole of breaking breaking a hole site;
(7) detect qualified after, complete repairing after completing other processing of breaking a hole.
And step (4) middle oven temperature is 150 degrees Celsius, heating duration is 15 minutes.
And, step (6) and (7) to break a bore dia less 0.05 millimeter than original size.
Advantage of the present invention and positively effect are:
In the present invention, will break a place of fractureing, hole and be bonded on adhesive tape, and then with the uniform mixture of fine needle picking resin and welding resistance ink, be filled into and break in a hole, each is broken a Kong Jun and tamps, fills and leads up, the hole of not leaving a blank, then puts into baking box baking for some time, after last redrilling, makes finished product.Through repairing, it is normal that recover the junction of daughter board and circuit card, and whole circuit card need not be scrapped, and saved production cost.
Accompanying drawing explanation
Fig. 1 breaks the photo that a hole site fractures in the present invention;
Fig. 2 is the photo after tamp, fill and lead up at Fig. 1 place of fractureing;
Fig. 3 is the photo after redrilling.
Embodiment
Below in conjunction with embodiment, the present invention is further described, and following embodiment is illustrative, is not determinate, can not limit protection scope of the present invention with following embodiment.
Circuit card is broken the healant that a hole site is damaged, and innovation of the present invention is: comprise the following component of mixing by weight percentage:
Resin 50%
Welding resistance ink 50%.
Above-mentioned resin is the resin that the model of the abundant production in river is ZM-928, and welding resistance ink adopts the conventional ink using, but its color should be consistent or similar with circuit card to be repaired.
Foregoing circuit plate is broken the using method of the healant damaging a hole site, it is characterized in that: comprise the following steps:
(1) by breaking an one side for hole broken positions, be bonded on adhesive tape, flatten;
(2) resin and welding resistance ink are mixed and stirred by metering;
(3) step mixture is (2) filled up to breaking in a hole after step is (1) bonding with fine needle, in each hole, all tamp, can not have cavity;
(4) step product (3) being put into baking box heats;
(5) step product is (4) taken out, be cooled to room temperature;
(6) again bore a first hole of breaking breaking a hole site;
(7) detect qualified after, complete repairing after completing other processing of breaking a hole.
Wherein, step (4) middle oven temperature is 150 degrees Celsius, and heating duration is 15 minutes.Step (6) and (7) to break a bore dia less 0.05 millimeter than original size.
In the present invention, will break a place of fractureing, hole and be bonded on adhesive tape, and then with the uniform mixture of fine needle picking resin and welding resistance ink, be filled into and break in a hole, each is broken a Kong Jun and tamps, fills and leads up, the hole of not leaving a blank, then puts into baking box baking for some time, after last redrilling, makes finished product.The mending course time is short, easy to operate, and after repairing, the junction of daughter board and circuit card recovers normal, and whole circuit card need not be scrapped, and saved production cost.
Claims (4)
1. circuit card is broken the healant that a hole site is damaged, and it is characterized in that: comprise the following component of mixing by weight percentage:
Resin 50%
Welding resistance ink 50%.
2. a kind of circuit card according to claim 1 is broken the using method of the healant damaging a hole site, it is characterized in that: comprise the following steps:
(1) by breaking an one side for hole broken positions, be bonded on adhesive tape, flatten;
(2) resin and welding resistance ink are mixed and stirred by metering;
(3) step mixture is (2) filled up to breaking in a hole after step is (1) bonding with fine needle, in each hole, all tamp, can not have cavity;
(4) step product (3) being put into baking box heats;
(5) step product is (4) taken out, be cooled to room temperature;
(6) again bore a first hole of breaking breaking a hole site;
(7) detect qualified after, complete repairing after completing other processing of breaking a hole.
3. a kind of circuit card according to claim 2 is broken the using method of the healant damaging a hole site, it is characterized in that: step (4) middle oven temperature is 150 degrees Celsius, and heating duration is 15 minutes.
4. the narrowest junction of a kind of high-density interconnected circuit board copper face according to claim 2 rapid detection modification method, is characterized in that: step (6) and (7) to break a bore dia less 0.05 millimeter than original size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410178657.7A CN103951999A (en) | 2014-04-30 | 2014-04-30 | Healant for damage of break point hole position of circuit board and application method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410178657.7A CN103951999A (en) | 2014-04-30 | 2014-04-30 | Healant for damage of break point hole position of circuit board and application method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103951999A true CN103951999A (en) | 2014-07-30 |
Family
ID=51329364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410178657.7A Pending CN103951999A (en) | 2014-04-30 | 2014-04-30 | Healant for damage of break point hole position of circuit board and application method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103951999A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108247919A (en) * | 2017-12-29 | 2018-07-06 | 山东豪迈机械科技股份有限公司 | A kind of tire-mold method for remanufacturing |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244981A (en) * | 2010-08-05 | 2011-11-16 | 北京天亿润达科技发展有限公司 | Novel printed circuit board (PCB) manufacturing technology |
| US20110306703A1 (en) * | 2008-12-30 | 2011-12-15 | Industrial Technology Research Institute | Thermally curable solder resist composition |
| CN102643572A (en) * | 2012-04-21 | 2012-08-22 | 江门市阪桥电子材料有限公司 | Thermocuring solder-mask ink and preparation method thereof |
| CN102717062A (en) * | 2012-05-29 | 2012-10-10 | 金悦通电子（翁源）有限公司 | High-reliability nanometer material for repairing PCB |
| CN102766375A (en) * | 2012-08-10 | 2012-11-07 | 复旦大学 | Method for preparing low viscosity ultraviolet (UV) curing solder resist ink |
-
2014
- 2014-04-30 CN CN201410178657.7A patent/CN103951999A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110306703A1 (en) * | 2008-12-30 | 2011-12-15 | Industrial Technology Research Institute | Thermally curable solder resist composition |
| CN102244981A (en) * | 2010-08-05 | 2011-11-16 | 北京天亿润达科技发展有限公司 | Novel printed circuit board (PCB) manufacturing technology |
| CN102643572A (en) * | 2012-04-21 | 2012-08-22 | 江门市阪桥电子材料有限公司 | Thermocuring solder-mask ink and preparation method thereof |
| CN102717062A (en) * | 2012-05-29 | 2012-10-10 | 金悦通电子（翁源）有限公司 | High-reliability nanometer material for repairing PCB |
| CN102766375A (en) * | 2012-08-10 | 2012-11-07 | 复旦大学 | Method for preparing low viscosity ultraviolet (UV) curing solder resist ink |
Non-Patent Citations (3)
| Title |
|---|
| 何丽梅等: "《SMT-表面组装技术（第2版）》", 31 May 2013, 机械工业出版社 * |
| 林其水: "电路板印刷中阻焊油墨的选用和常见故障的处理", 《印制电路信息》 * |
| 钟名湖: "《电子产品结构工艺（第1版）》", 31 July 2004, 高等教育出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108247919A (en) * | 2017-12-29 | 2018-07-06 | 山东豪迈机械科技股份有限公司 | A kind of tire-mold method for remanufacturing |
| CN108247919B (en) * | 2017-12-29 | 2021-03-12 | 山东豪迈机械科技股份有限公司 | Method for remanufacturing tire mold |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140730 |
|
| RJ01 | Rejection of invention patent application after publication |