CN103924196B - A kind of evaporation coating device - Google Patents
A kind of evaporation coating device Download PDFInfo
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- CN103924196B CN103924196B CN201310753959.8A CN201310753959A CN103924196B CN 103924196 B CN103924196 B CN 103924196B CN 201310753959 A CN201310753959 A CN 201310753959A CN 103924196 B CN103924196 B CN 103924196B
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Abstract
The present invention relates to thin film and form technical field, particularly relate to a kind of evaporation coating device, including: at least one First Line evaporation element, at least one second line evaporation element, first evaporation tank and second evaporation tank; First evaporation tank and second evaporation tank are respectively arranged with fluting, and First Line evaporation element is arranged in the fluting of first evaporation tank, and the second line evaporation element is arranged in the fluting of second evaporation tank; First evaporation tank and second evaporation tank staggered floor are arranged, so that the First Line evaporation element being arranged in first evaporation tank and the second line evaporation element being arranged in second evaporation tank are not at same plane. The present invention provides evaporation coating device, improves the overlapping rate of the film profile that deposition material is formed, and then improves the quality forming thin film.
Description
Technical field
The present invention relates to thin film and form technical field, particularly relate to a kind of evaporation coating device.
Background technology
For the formation of TFT (ThinFilmTransistor, TFT) organic light emission layer film, the evaporation of electrode, or the evaporation of other electronic component thin film, it is necessary to an evaporation coating device completes.
The evaporation coating device structural representation that Fig. 1 is illustrated that in prior art to be made up of linear evaporation source; With reference to Fig. 1, including First Line evaporation element 11 and the second line evaporation element 12, it is provided with the first deposition material nozzle 111 on First Line evaporation element 11, it is arranged on the second deposition material nozzle 121 on the second line evaporation element 12, crucible (not shown) and for transmission of materials will be deposited in crucible to the first passage 112 depositing material nozzle 111 and the second deposition material nozzle 121 and passage 122. In evaporation process, the crucible holding the first deposition material and crucible evaporation the first deposition material and second holding the second deposition material deposit material, transmit to first through passage 121 and passage 122 and deposit material nozzle 111 and the second deposition material nozzle 121, and then after mask plate 13, act on substrate 14 complete evaporation.
Fig. 1 a is illustrated that in prior art evaporation coating device along A-A1Line cross section structure schematic diagram; With reference to Fig. 2, in prior art, the first deposition material nozzle 111 and the second deposition material nozzle 121 are obliquely installed in First Line evaporation element 11 and the second line evaporation element 12.
Fig. 1 b is illustrated that in prior art to be obliquely installed nozzle generation shaded area schematic diagram; With reference to Fig. 1 b, shaded area 1 and 2 size that the first deposition material nozzle spray line 111a and the second deposition material nozzle 121a spray line being obliquely installed in prior art is formed is uneven.
Evaporation coating device of the prior art is primarily present following shortcoming:
1, because First Line evaporation element and the second line evaporation element need to avoid the hot dry impact disturbed each other, both need to keep more remote, causing that the film profile deviation that the first deposition material and the second deposition material are formed on substrate is relatively big, overlapping rate is low, and the membrane quality making formation is poor.Hot dry disturbing refers to because different types of deposition material evaporating temperature is different, and with this, when the evaporation source evaporating two kinds of deposition materials arranges nearer, temperature each other can interfere, and then can affect evaporation effect. Film profile refers to that deposition material is after forming thin film, and the distribution profile presented in the film is used for evaluating the material doped effect of deposition; Depositing material for two kinds, the film profile formed in the thin film formed when two kinds of deposition materials more trends towards overlap, then doping effect is more good.
2, because first deposits material nozzle and the second deposition material nozzle inclination is arranged, though can realize, at First Line evaporation element and the second line evaporation element zone line, effect of adulterating preferably; But First Line evaporation element and the second line evaporation element zone line both sides, doping effect is poor so that forming thin film can not use, and wastes deposition material, and stock utilization is low.
3, the first deposition material nozzle and being obliquely installed of the second deposition material nozzle also make formation thin film shaded area uneven. For the formation of TFT organic light emission layer film, it is unfavorable for the production of high-resolution products. Thin film shade refers to the existence because of mask plate, at mask plate split shed place, because of opening edge block cause can not the region of Effective Doping.
Summary of the invention
It is an object of the invention to propose a kind of evaporation coating device, to improve the overlapping rate of the film profile that deposition material is formed, reduce the deviation of film profile, and then promote the quality forming thin film.
Embodiments provide a kind of evaporation coating device to include: at least one First Line evaporation element, at least one second line evaporation element, first evaporation tank and second evaporation tank;
Described first evaporation tank and described second evaporation tank are respectively arranged with fluting, and described First Line evaporation element is arranged in the fluting of described first evaporation tank, and described second line evaporation element is arranged in the fluting of described second evaporation tank;
Described second evaporation tank is arranged with described first evaporation tank staggered floor, so that the First Line evaporation element being arranged in first evaporation tank and the second line evaporation element being arranged in second evaporation tank are not at same plane.
The evaporation coating device that the embodiment of the present invention provides, second evaporation tank and first evaporation tank staggered floor are arranged, and make the First Line evaporation element being arranged at first evaporation tank and the second line evaporation element being arranged at second evaporation tank be not at same plane with this; First Line evaporation element and the second line evaporation element are not at same plane, make First Line evaporation element and the second line evaporation element avoid each other hot dry disturb while, may remain in nearer distance, and then the first deposition material and the second deposition material can fully be adulterated, therefore, improve the overlapping rate of the film profile that deposition material is formed, reduce the deviation of film profile, and then improve the quality forming thin film.
Accompanying drawing explanation
Accompanying drawing described herein is used for providing a further understanding of the present invention, constitutes the part of the present invention, is not intended that limitation of the invention. In the accompanying drawings:
Fig. 1 is illustrated that in prior art evaporation coating device structural representation;
Fig. 1 a is illustrated that in prior art evaporation coating device A-A along Fig. 11Line schematic cross-section;
Fig. 1 b is illustrated that in prior art to be obliquely installed nozzle generation shaded area schematic diagram;
Fig. 2 is illustrated that in one embodiment of the invention evaporation coating device structural representation;
Fig. 2 a is illustrated that in one embodiment of the invention evaporation coating device STRUCTURE DECOMPOSITION schematic diagram;
Fig. 2 b is illustrated that in one embodiment of the invention First Line evaporation element and first evaporation tank STRUCTURE DECOMPOSITION schematic diagram;
Fig. 2 c is illustrated that in one embodiment of the invention one second line evaporation element B-B along Fig. 2 a1Line cross section structure schematic diagram;
Fig. 2 d be illustrated that in one embodiment of the invention in one second line evaporation element one second deposition material nozzle C-C along Fig. 2 a1Line cross section structure schematic diagram;
Fig. 2 e is illustrated that in one embodiment of the invention vertical nozzle and produces shaded area schematic diagram;
Fig. 3 is illustrated that in another embodiment of the present invention evaporation coating device structural representation;
Fig. 3 a is illustrated that in another embodiment of the present invention in evaporation coating device one second line evaporation element cross section structure schematic diagram;
Fig. 4 is illustrated that in another embodiment of the present invention evaporation coating device structural representation;
Fig. 5 is illustrated that in another embodiment of the present invention evaporation coating device structural representation;
Fig. 6 is illustrated that in another embodiment of the present invention evaporation coating device structural representation;
Fig. 6 a is illustrated that in another embodiment of the present invention evaporation coating device cover plate D-D along Fig. 61Line cross section structure schematic diagram;
Fig. 6 b is illustrated that in another embodiment of the present invention preferred evaporation coating device cover plate D-D along Fig. 61Line cross section structure schematic diagram;
Fig. 7 is illustrated that in another embodiment of the present invention evaporation coating device structural representation.
Detailed description of the invention
Below in conjunction with drawings and the specific embodiments the present invention carried out in further detail with complete explanation. It is understood that specific embodiment described herein is only used for explaining the present invention, but not limitation of the invention. It also should be noted that, for the ease of describing, accompanying drawing illustrate only part related to the present invention but not full content.
Fig. 2 is illustrated that in one embodiment of the invention evaporation coating device structural representation.
Fig. 2 a is illustrated that in one embodiment of the invention evaporation coating device STRUCTURE DECOMPOSITION schematic diagram.
With reference to Fig. 2 and Fig. 2 a, in the present embodiment, evaporation coating device includes: three First Line evaporation element 222, first evaporation tanks 21 of 212, four the second line evaporation elements and second evaporation tank 22. It will be understood by those skilled in the art that in other embodiments, evaporation coating device should include at least one First Line evaporation element 212 and at least one second line evaporation element 222.
First evaporation tank 21 and second evaporation tank 22 are respectively arranged with fluting, slot as holding First Line evaporation element 212 and the second line evaporation element 222 part in Fig. 2 a. First Line evaporation element 212 is arranged in the fluting of first evaporation tank 21, and the second line evaporation element 222 is arranged in the fluting of second evaporation tank 22.
First evaporation tank 21 and second evaporation tank 22 staggered floor are arranged, so that the First Line evaporation element 212 being arranged in first evaporation tank 21 and the second line evaporation element 222 being arranged in second evaporation tank 22 are not at same plane; Wherein, staggered floor is arranged is make first evaporation tank 21 and second evaporation tank 22 be not in same plane.
Optionally, in the present embodiment, first evaporation tank 21 is provided with perforate, and the second line evaporation element 222 upper surface is provided with the second deposition material nozzle 221, for perforate evaporation the second deposition material through first evaporation tank 21; First Line evaporation element 212 upper surface is provided with the first deposition material nozzle 211, for evaporation the first deposition material.
In the present embodiment, the upper surface of the second line evaporation element 222 or First Line evaporation element 212 refers to First Line evaporation element 212 or the second line evaporation element 222 side towards substrate to be deposited.In the present embodiment, First Line evaporation element 212 and the second line evaporation element 222 include target and the housing of this target accommodating respectively; Wherein, the housing of First Line evaporation element 212 is provided with the first deposition material nozzle 211 and for transmitting the first passage 213 of the first deposition material, the housing of the second line evaporation element 222 is provided with the second deposition material nozzle 221 and for transmitting the second deposition material second channel 223. Additionally, evaporation element also includes being positioned at housing, and house the container of target.
The first deposition material nozzle 211 that First Line evaporation element 212 upper surface is arranged evaporates the first deposition material.
Optionally, in the present embodiment, the first deposition spaced arrangement of material nozzle 211 arranged with First Line evaporation element 212 upper surface after the perforate that second deposition material nozzle 221 first evaporation tank 21 of traverse that the second line evaporation element 22 upper surface is arranged is correspondingly arranged. The spaced arrangement of the first deposition material nozzle 211 and the second deposition material nozzle 221, improves doping level, better improves film profile Duplication.
Further, in the present embodiment, the first deposition material crucible and second of the first deposition material deposits material the second crucible and is arranged on first evaporation tank 21 and second evaporation tank 22 outside, deposit material and the second deposition transmission of materials by the first passage 213 opened on First Line evaporation element 212 and the second line evaporation element 222 and second channel 223 by first and deposit material nozzle 211 and the second deposition material nozzle 221 to first, and then on substrate, form thin film. Those skilled in the art should understand that and be, in other detailed description of the invention, first deposition material crucible of the first deposition material and second deposition material the second crucible can also be arranged on first evaporation tank 21 and second evaporation tank 22 is internal, to provide the first deposition material and the second deposition material.
Fig. 2 b is illustrated that in one embodiment of the invention First Line evaporation element and the second evaporation tank STRUCTURE DECOMPOSITION schematic diagram; With reference to Fig. 2 b, three First Line evaporation elements 212 are separately positioned in the fluting 215 in first evaporation tank 21.
Optionally, in the present embodiment, the second line evaporation element 222 can also adopt the mode shown in Fig. 2 b to be arranged in second evaporation tank 22.
Fig. 2 c is illustrated that in one embodiment of the invention one second line evaporation element along Fig. 2 a along B-B1Line cross section structure schematic diagram; With reference to Fig. 2 c, it is arranged on the second deposition material nozzle 221 of the second line evaporation element 222 upper surface, receives the second the second deposition material depositing material crucible evaporation transmitted through second channel 223 and be deposited with.
Optionally, in the present embodiment, First Line evaporation element 212 may be used without the mode shown in Fig. 2 c and is configured.
Fig. 2 d be illustrated that in the embodiment of the present invention one in one second line evaporation element one second deposition material nozzle line C-C cross section structure schematic diagram along Fig. 2 a; With reference to Fig. 2 d, it is arranged on the second deposition material nozzle 221 of the second line evaporation element 222 upper surface, receives the second the second deposition material depositing material crucible evaporation transmitted through second channel 223 and be deposited with.
Optionally, in the present embodiment, First Line evaporation element 212 can also adopt the mode shown in Fig. 2 d to be configured.
Optionally, in the present embodiment, First Line evaporation element 212 upper surface is provided with at least one first deposition material nozzle 211; And/or second line evaporation element 222 upper surface be provided with at least one second deposition material nozzle 221.
Optionally, in the present embodiment, the first deposition material nozzle 211 is vertically arranged in First Line evaporation element 212 upper surface; And/or second deposition material nozzle 221 be vertically arranged in described second line evaporation element 222 upper surface. First deposition material nozzle 211 and second deposits being vertically arranged of material nozzle 221, is effectively reduced the stop because of mask plate, the shaded area formed.
Fig. 2 e is illustrated that in one embodiment of the invention vertical nozzle and produces shaded area schematic diagram; With reference to Fig. 2 e, in the present embodiment, shaded area 3 and 4 size that the spray line 221a of spray line 211a and the second deposition material nozzle of the first deposition material nozzle being vertically arranged is formed is uniform, is beneficial to the manufacture of high-resolution products.
Optionally, in the present embodiment, the second deposition material nozzle that the second line evaporation element upper surface is arranged is provided with heating coil. Because the second deposition material nozzle needs through first evaporation tank, length is longer; With this, arranging of coil of heating can be avoided, because second deposits the long situation of the second deposition material cooling in evaporation process caused of material nozzle. The evaporation coating device that the present embodiment provides, second evaporation tank and first evaporation tank staggered floor are arranged, and make the First Line evaporation element being arranged at first evaporation tank and the second line evaporation element being arranged at second evaporation tank be not at same plane with this; First Line evaporation element and the second line evaporation element are not at same plane, make First Line evaporation element and the second line evaporation element avoid each other hot dry disturb while, may remain in nearer distance, and then the first deposition material and the second deposition material can fully be adulterated, therefore, improve the overlapping rate of the film profile that deposition material is formed, reduce the deviation of film profile, and then improve the quality forming thin film.
Fig. 3 is illustrated that in another embodiment of the present invention evaporation coating device structural representation.
Fig. 3 a is illustrated that in another embodiment of the present invention in evaporation coating device one second line evaporation element cross section structure schematic diagram.
With reference to Fig. 3 and Fig. 3 a, in the present embodiment, evaporation coating device also includes at least one the first deposition material crucible and at least one the second deposition material crucible that match with First Line evaporation element and the second line evaporation element.
Each First Line evaporation element two end in each end be respectively provided with a mouth of pot horizontally toward first deposition material crucible and mouth of pot be vertically oriented to first deposition material crucible; And
Each second line evaporation element two end in each end be respectively provided with a mouth of pot horizontally toward second deposition material crucible and mouth of pot be vertically oriented to second deposition material crucible.
In the present embodiment, the first deposition material crucible and the second deposition material crucible can be arranged on the first evaporation tank 21 and the X region of surrounding of the second evaporation tank 22, Y region, Z region and O region.
In conjunction with Fig. 3 a, for the second line evaporation element 222, in the two ends of the second line evaporation element 222, one end be respectively arranged with mouth of pot horizontally toward second deposition material crucible 224a and mouth of pot be vertically oriented to second deposition material crucible 224b, the other end be respectively arranged with mouth of pot horizontally toward second deposition material crucible 225a and mouth of pot be vertically oriented to second deposition material crucible 225b.
In the present embodiment, evaporation coating device is improving the overlapping rate of the film profile that deposition material is formed, reduce the deviation of film profile, and then while promoting the quality forming thin film, in two ends of each First Line evaporation element and the second line evaporation element, each end is respectively arranged with two deposition crucibles, improve the abundant intensity of deposition material, extend the evaporation time.
Fig. 4 is illustrated that in one embodiment of the invention evaporation coating device structural representation.With reference to Fig. 4, the present embodiment also includes a thermal insulation board 25 having hole 251; Thermal insulation board 25 is arranged between first evaporation tank 21 and second evaporation tank 22, evaporation the second deposition material after the perforate that the second deposition material nozzle 221 that the second line evaporation element 222 upper surface is arranged is correspondingly arranged through the perforate 251 being correspondingly arranged on thermal insulation board 25 and first evaporation tank 21.
Optionally, in the present embodiment, thermal insulation board adopts ceramic material to make.
In the present embodiment, evaporation coating device is improving the overlapping rate of the film profile that deposition material is formed, reduce the deviation of film profile, and then while promoting the quality forming thin film, because of the setting of thermal insulation board, what further avoid between First Line evaporation element and the second line evaporation element hot dry disturbs, and then the more effective overlapping rate improving the film profile that deposition material is formed, reduce the deviation of film profile, promote the quality forming thin film.
Fig. 5 is illustrated that one embodiment of the invention evaporation coating device structural representation; With reference to Fig. 5, the present embodiment also includes: one has the cover plate 26 in hole 261.
Cover plate 26 is arranged on first evaporation tank 21 top, perforate 261 that the second deposition material nozzle 211 that the second line evaporation element 212 upper surface is arranged is correspondingly arranged on the perforate 251 being correspondingly arranged on thermal insulation board 25, cover plate 26 and evaporation the second deposition material after the perforate that first evaporation tank 21 is correspondingly arranged.
After First Line evaporation element 212 upper surface arranges the perforate 261 that the first deposition material nozzle 211 is correspondingly arranged on cover plate 26, evaporation first deposits material.
In the present embodiment, evaporation coating device is improving the overlapping rate of film profile that deposition material is formed, reduce the deviation of film profile, and then while promoting the quality forming thin film, cover plate arranged effectively protect the evaporation material impact on evaporation source.
Fig. 6 is illustrated that in one embodiment of the invention evaporation coating device structural representation; With reference to Fig. 6, in the present embodiment, first evaporation tank and/or second evaporation tank are provided with cooling current circulation passage. And, in the present embodiment, thermal insulation board or cover plate can also be provided with cooling current circulation passage.
Arranging cooling water structure in thermal insulation board in evaporation coating device in the present embodiment, the cooling water circulating channel structure arranged in first evaporation tank, second evaporation tank, cover plate or thermal insulation board illustrates.
Fig. 6 a is illustrated that in one embodiment of the invention evaporation coating device cover plate along D-D1Line cross section structure schematic diagram.
With reference to Fig. 6 a, in the present embodiment, cooling current circulation passage 263 is arranged evenly deposits material nozzle 211 or the second line deposition material nozzle 221 both sides first, is connected with the cooling water water source being arranged on first evaporation tank 21 and second evaporation tank 22 surrounding respectively by cooling down the opening 262 of current circulation passage.
Fig. 6 b is illustrated that in the embodiment of the present invention five a preferred evaporation coating device cover plate along line D-D cross section structure schematic diagram; With reference to Fig. 6 b, in this preferred embodiment, cooling current circulation passage 263, respectively around the first deposition material nozzle 211 or the second deposition material nozzle 221, it is connected with the cooling water water source being arranged on first evaporation tank 21 and second evaporation tank 22 both sides respectively by cooling down the opening 262 of current circulation passage.
In the present embodiment, evaporation coating device is improving the overlapping rate of the film profile that deposition material is formed, reduce the deviation of film profile, and then while promoting the quality forming thin film, because of the cooling current circulation passage arranged in first evaporation tank, second evaporation tank, thermal insulation board or cover plate, the continuous circulation of logical supercooled water, what further avoid between First Line evaporation element and the second line evaporation element hot dry disturbs, and then more effective improve the overlapping rate of film profile that deposition material is formed, reduce the deviation of film profile, promote the quality forming thin film.
Fig. 7 is illustrated that in one embodiment of the invention evaporation coating device structural representation;With reference to Fig. 7, in the present embodiment, including:
At least one the 3rd line evaporation element (not shown) and the 3rd evaporation tank 27.
3rd evaporation tank 27 is provided with fluting, and the 3rd line evaporation element is arranged in described fluting.
3rd evaporation tank 27 and second evaporation tank 22 staggered floor are arranged, so that the third linear evaporation source arranged in the 3rd evaporation tank is not at same plane with the second line evaporation element of setting in second evaporation tank.
Evaporation the 3rd deposition material after perforate that the 3rd deposition material nozzle 271 that 3rd line evaporation element upper surface is arranged is correspondingly arranged through second evaporation tank and the perforate that first evaporation tank is correspondingly arranged.
Optionally, in the present embodiment, the 3rd deposition material nozzle 271 that the 3rd line evaporation element is arranged is provided with heating coil.
Optionally, in the present embodiment, the second deposition spaced arrangement of material nozzle 221 that the first deposition material nozzle 211 arranged with First Line evaporation element upper surface after the perforate that the 3rd deposition material nozzle 271 traverse the first evaporation tank 21 that the 3rd line evaporation element upper surface is arranged is correspondingly arranged and the second line evaporation element upper surface are arranged.
Optionally, in the present embodiment, the 3rd line evaporation element upper surface is provided with at least one the 3rd deposition material nozzle 271.
Optionally, in the present embodiment, the 3rd deposition material nozzle 271 is vertically arranged in the 3rd line evaporation element upper surface.
Optionally, in the present embodiment, the 3rd evaporation tank 27 is provided with cooling current circulation passage.
Optionally, in the present embodiment, it is also possible to a thermal insulation board having hole is set; Thermal insulation board is arranged between second evaporation tank 22 and the 3rd evaporation tank 27, perforate that the 3rd deposition material nozzle 271 that the 3rd line evaporation element upper surface is arranged is correspondingly arranged through the perforate being correspondingly arranged on thermal insulation board, first evaporation tank 21 and evaporation the second deposition material after the perforate that second evaporation tank 22 is correspondingly arranged.
Optionally, in this example, can also arrange at least one the 3rd deposition material crucible, each 3rd line evaporation element two end in each end be respectively provided with a mouth of pot horizontally toward the 3rd deposition material crucible and mouth of pot be vertically oriented to the 3rd deposition material crucible.
The evaporation coating device that the embodiment of the present invention provides, first evaporation tank staggered floor of second evaporation tank is arranged, 3rd evaporation tank and second evaporation tank staggered floor are arranged, and the 3rd line evaporation element of the second line evaporation element and setting and the 3rd evaporation tank that make, with this, the First Line evaporation element being arranged at first evaporation tank, are arranged at second evaporation tank is not at same plane; First Line evaporation element, the second line evaporation element and the 3rd line evaporation element are not at same plane, make First Line evaporation element, the second line evaporation element and the 3rd line evaporation element avoid each other hot dry disturb while, may remain in nearer distance, and then the first deposition material, the second deposition material and the 3rd deposition material can fully be adulterated, therefore, improve the overlapping rate of the film profile that deposition material is formed, reduce the deviation of film profile, and then improve the quality forming thin film.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, to those skilled in the art, the present invention can have various change and change. Any amendment of making within all spirit in the present invention and principle, equivalent replacement, improvement etc., should be included within protection scope of the present invention.
Claims (13)
1. an evaporation coating device, it is characterised in that include at least one First Line evaporation element, at least one second line evaporation element, first evaporation tank and second evaporation tank;
Described first evaporation tank and described second evaporation tank are respectively arranged with fluting, and described First Line evaporation element is arranged in the fluting of described first evaporation tank, and described second line evaporation element is arranged in the fluting of described second evaporation tank;
Described second evaporation tank is arranged with described first evaporation tank staggered floor, so that the First Line evaporation element being arranged in first evaporation tank and the second line evaporation element being arranged in second evaporation tank are not at same plane.
2. evaporation coating device as claimed in claim 1, it is characterised in that described first evaporation tank is provided with perforate, and described second line evaporation element upper surface is provided with the second deposition material nozzle, for perforate evaporation the second deposition material through first evaporation tank; Described First Line evaporation element upper surface is provided with the first deposition material nozzle, for evaporation the first deposition material.
3. evaporation coating device as claimed in claim 2, it is characterised in that described first deposition material nozzle is vertically arranged in described First Line evaporation element upper surface; And/or described second deposition material nozzle be vertically arranged in described second line evaporation element upper surface.
4. the evaporation coating device as described in any one of claim 2-3, it is characterised in that be provided with heating coil on the second deposition material nozzle that described second line evaporation element upper surface is arranged.
5. evaporation coating device as claimed in claim 1, it is characterized in that, the first deposition spaced arrangement of material nozzle arranged with described First Line evaporation element upper surface after the perforate that the second deposition material nozzle described first evaporation tank of traverse that described second line evaporation element upper surface is arranged is correspondingly arranged.
6. evaporation coating device as claimed in claim 1, it is characterised in that described first evaporation tank and/or described second evaporation tank are provided with cooling current circulation passage.
7. the evaporation coating device as described in claim 2-3, any one of 5-6, it is characterised in that also include a thermal insulation board having hole;
Described thermal insulation board is arranged between first evaporation tank and second evaporation tank, evaporation the second deposition material after the perforate that the second deposition material nozzle that described second line evaporation element upper surface is arranged is correspondingly arranged through the perforate being correspondingly arranged on described thermal insulation board and first evaporation tank.
8. evaporation coating device as claimed in claim 7, it is characterised in that also include: has the cover plate in hole;
Described cover plate is arranged on described first evaporation tank top, evaporation the second deposition material after the perforate that perforate that the perforate that the second deposition material nozzle that described second line evaporation element upper surface is arranged is correspondingly arranged on described thermal insulation board, described cover plate are correspondingly arranged and first evaporation tank are correspondingly arranged; And
After described First Line evaporation element upper surface arranges the perforate that the first deposition material nozzle is correspondingly arranged on described cover plate, evaporation first deposits material.
9. evaporation coating device as claimed in claim 8, it is characterised in that also include at least one first deposition material crucible and at least one the second deposition material crucible;
Each First Line evaporation element two end in each end be respectively provided with a mouth of pot horizontally toward first deposition material crucible and mouth of pot be vertically oriented to first deposition material crucible; And
Each second line evaporation element two end in each end be respectively provided with a mouth of pot horizontally toward second deposition material crucible and mouth of pot be vertically oriented to second deposition material crucible.
10. evaporation coating device as claimed in claim 1, it is characterised in that also include: at least one the 3rd line evaporation element and the 3rd evaporation tank;
Described 3rd evaporation tank is provided with fluting, and described 3rd line evaporation element is arranged in described fluting;
Described 3rd evaporation tank and second evaporation tank staggered floor are arranged, so that the third linear evaporation source arranged in described 3rd evaporation tank is not at same plane with the second line evaporation element of setting in second evaporation tank.
11. evaporation coating device as claimed in claim 10, it is characterized in that, perforate that the 3rd deposition material nozzle that described 3rd line evaporation element upper surface is arranged is correspondingly arranged through described second evaporation tank and evaporation the 3rd deposition material after the perforate that first evaporation tank is correspondingly arranged.
12. evaporation coating device as claimed in claim 11, it is characterised in that the 3rd deposition material nozzle arranged on described 3rd line evaporation element is provided with heating coil.
13. evaporation coating device as claimed in claim 11, it is characterized in that, the second deposition spaced arrangement of material nozzle that the first deposition material nozzle arranged with First Line evaporation element upper surface after the perforate that the 3rd deposition material nozzle described first evaporation tank of traverse that described 3rd line evaporation element upper surface is arranged is correspondingly arranged and the second line evaporation element upper surface are arranged.
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| CN201310753959.8A CN103924196B (en) | 2013-12-31 | 2013-12-31 | A kind of evaporation coating device |
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| CN201310753959.8A CN103924196B (en) | 2013-12-31 | 2013-12-31 | A kind of evaporation coating device |
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| JP4175815B2 (en) * | 2002-03-01 | 2008-11-05 | 株式会社アルバック | Thin film forming equipment |
| JP4026449B2 (en) * | 2002-08-30 | 2007-12-26 | ソニー株式会社 | Organic electroluminescence device manufacturing equipment |
| JP5346239B2 (en) * | 2009-05-21 | 2013-11-20 | 株式会社アルバック | Vacuum deposition equipment |
| KR20130010730A (en) * | 2011-07-19 | 2013-01-29 | 삼성디스플레이 주식회사 | Deposition source and deposition apparatus with the same |
| JP2013216955A (en) * | 2012-04-11 | 2013-10-24 | Hitachi High-Technologies Corp | Vacuum vapor deposition apparatus |
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