CN103887240B - 一种逆导型igbt器件的制备方法 - Google Patents
一种逆导型igbt器件的制备方法 Download PDFInfo
- Publication number
- CN103887240B CN103887240B CN201210559699.6A CN201210559699A CN103887240B CN 103887240 B CN103887240 B CN 103887240B CN 201210559699 A CN201210559699 A CN 201210559699A CN 103887240 B CN103887240 B CN 103887240B
- Authority
- CN
- China
- Prior art keywords
- type
- heavily doped
- igbt
- preparation
- district
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 230000008569 process Effects 0.000 claims abstract description 28
- 238000000137 annealing Methods 0.000 claims abstract description 23
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 238000011084 recovery Methods 0.000 claims abstract description 18
- 238000000407 epitaxy Methods 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 5
- 238000001259 photo etching Methods 0.000 claims description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 4
- 229920005591 polysilicon Polymers 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 8
- 239000011888 foil Substances 0.000 abstract description 3
- 238000005468 ion implantation Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 150000002500 ions Chemical class 0.000 description 19
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 5
- 229910052796 boron Inorganic materials 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- OKZIUSOJQLYFSE-UHFFFAOYSA-N difluoroboron Chemical compound F[B]F OKZIUSOJQLYFSE-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8222—Bipolar technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/07—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
- H01L27/0705—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type
- H01L27/0727—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type in combination with diodes, or capacitors or resistors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210559699.6A CN103887240B (zh) | 2012-12-20 | 2012-12-20 | 一种逆导型igbt器件的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210559699.6A CN103887240B (zh) | 2012-12-20 | 2012-12-20 | 一种逆导型igbt器件的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103887240A CN103887240A (zh) | 2014-06-25 |
CN103887240B true CN103887240B (zh) | 2016-08-24 |
Family
ID=50956073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210559699.6A Active CN103887240B (zh) | 2012-12-20 | 2012-12-20 | 一种逆导型igbt器件的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103887240B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105990406A (zh) * | 2015-01-28 | 2016-10-05 | 南京励盛半导体科技有限公司 | 一种制造在外延硅片上功率器件的背面结构 |
CN109427665A (zh) * | 2017-08-25 | 2019-03-05 | 比亚迪股份有限公司 | 半导体器件及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101640186A (zh) * | 2009-07-20 | 2010-02-03 | 无锡凤凰半导体科技有限公司 | 绝缘栅双极型晶体管集成快恢复二极管制作方法 |
CN101887913A (zh) * | 2010-06-04 | 2010-11-17 | 无锡新洁能功率半导体有限公司 | 一种具有改善型集电极结构的igbt |
CN101946324A (zh) * | 2008-02-14 | 2011-01-12 | 丰田自动车株式会社 | 反向导通半导体元件的驱动方法和半导体装置以及供电装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8564097B2 (en) * | 2010-04-15 | 2013-10-22 | Sinopower Semiconductor, Inc. | Reverse conducting IGBT |
-
2012
- 2012-12-20 CN CN201210559699.6A patent/CN103887240B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101946324A (zh) * | 2008-02-14 | 2011-01-12 | 丰田自动车株式会社 | 反向导通半导体元件的驱动方法和半导体装置以及供电装置 |
CN101640186A (zh) * | 2009-07-20 | 2010-02-03 | 无锡凤凰半导体科技有限公司 | 绝缘栅双极型晶体管集成快恢复二极管制作方法 |
CN101887913A (zh) * | 2010-06-04 | 2010-11-17 | 无锡新洁能功率半导体有限公司 | 一种具有改善型集电极结构的igbt |
Also Published As
Publication number | Publication date |
---|---|
CN103887240A (zh) | 2014-06-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105185825A (zh) | 一种改善半导体功率器件中的注入控制方法 | |
CN102592998B (zh) | 一种基于SOI的纵向SiGe双极晶体管及其制备方法 | |
CN102903633A (zh) | 用于制备阳极短路的场阑绝缘栅双极晶体管的方法 | |
CN214848639U (zh) | 半导体器件的元胞结构及半导体器件 | |
WO2012075905A1 (en) | Insulated gate bipolar transistor (igbt) and method for manufacturing the same | |
CN101771088A (zh) | Pn结和肖特基结混合式二极管及其制备方法 | |
CN103887240B (zh) | 一种逆导型igbt器件的制备方法 | |
CN104900718B (zh) | 一种肖特基二极管及其制造方法 | |
CN112820775A (zh) | 一种具有电子积累效应的soi-ldmos器件 | |
CN102800589B (zh) | 一种基于SOI的SiGe-HBT晶体管的制备方法 | |
CN104517832B (zh) | 功率二极管的制备方法 | |
CN102931081B (zh) | 带场阻挡层的半导体器件的制造方法 | |
CN103367396B (zh) | 一种超级结肖特基半导体装置及其制备方法 | |
CN113782586A (zh) | 一种多通道超结igbt器件 | |
CN211605156U (zh) | 一种静电放电保护器件 | |
US20210066288A1 (en) | Bipolar semiconductor device and method for manufacturing such a semiconductor device | |
CN107546276A (zh) | 带有注入式背栅的集成jfet结构 | |
CN113964197A (zh) | 一种低泄漏电流的igbt器件及其制备方法 | |
CN216871974U (zh) | 一种多通道超结igbt器件 | |
CN104617141A (zh) | 半导体器件及其制造方法 | |
CN103107094B (zh) | 一种耗尽型功率场效应晶体管及其制备方法 | |
CN104347398A (zh) | 一种igbt的制造方法 | |
CN104103685A (zh) | 一种具有降低纵向寄生晶体管效应的器件结构及其制作方法 | |
CN116417507B (zh) | 一种集成肖特基接触的igbt器件结构及其制备方法 | |
CN103378170A (zh) | 一种具有超级结肖特基半导体装置及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210127 Address after: Room 810, 8 / F, building 1, 169 shengxia road and 1658 Zhangdong Road, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai, 201210 Patentee after: Shanghai ruobast Semiconductor Co.,Ltd. Address before: Room 219, 560 shengxia Road, Pudong New Area, Shanghai, 201203 Patentee before: SHANGHAI BAOXIN SOURCE POWER SEMICONDUCTOR Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210427 Address after: 518052 building a, Tianxia International Center, No.8 Taoyuan Road, dawangshan community, Nantou street, Nanshan District, Shenzhen, Guangdong, 2008 Patentee after: China micro semiconductor (Shenzhen) Co.,Ltd. Address before: Room 810, 8 / F, building 1, 169 shengxia road and 1658 Zhangdong Road, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai, 201210 Patentee before: Shanghai ruobast Semiconductor Co.,Ltd. |
|
TR01 | Transfer of patent right |