CN103878660A - Silicon wafer grinding device used for silicon wafer treatment - Google Patents
Silicon wafer grinding device used for silicon wafer treatment Download PDFInfo
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- CN103878660A CN103878660A CN201410126640.7A CN201410126640A CN103878660A CN 103878660 A CN103878660 A CN 103878660A CN 201410126640 A CN201410126640 A CN 201410126640A CN 103878660 A CN103878660 A CN 103878660A
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- China
- Prior art keywords
- silicon wafer
- silicon chip
- abrasive disc
- box body
- plastic box
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a silicon wafer grinding device used for silicon wafer treatment. The silicon wafer grinding device comprises a plastic box with an opening in one end, a grinding piece used for grinding a silicon wafer is fixed in the plastic box, and space, above the grinding piece, in the plastic box is filled with mortar. Because the box of the silicon wafer grinding device for silicon wafer treatment is made of light plastic, the silicon wafer grinding device has the advantages of being detachable, capable of being cleaned a plurality of times, convenient to combine and use, safe and reliable, successfully treating silicon wafer edges in a batch mode, improving machined silicon wafer yield, shortening the time for treating silicon wafers with defective edges, and reducing the proportion of unqualified silicon wafers in the production process.
Description
Technical field
The invention belongs to solar silicon wafers manufacturing technology, relate in particular to and a kind ofly defectively collapse limit silicon chip and become after treatment the abrasive disc device of qualified for making.
Background technology
In solar silicon wafers production process, it is shinny that the silicon chip mucilage glue surface at silicon chip square rod two after removing photoresist presents edge, and shinny being of silicon chip edge collapsed limit.Cause silicon chip to collapse the reason on limit a lot, in actual production, being also difficult in control all solve, each line cutting silicon wafer all can produce the defective limit silicon chip that collapses of 1.8%-2%.In defective, account for 38%.Traditional treating method is artificial with the husky mulberry paper silicon chip edge of polishing, and this mode exists treatment effeciency low and easily silicon chip is damaged again the shortcoming that security reliability is low.
Summary of the invention
The object of the present invention is to provide a kind of abrasive disc device for silicon chip processing, it has high, the easy to use and safe and reliable feature for the treatment of effeciency, processes silicon chip edge and collapses the problem existing in limit to solve in prior art.
For reaching this object, the present invention by the following technical solutions:
For an abrasive disc device for silicon chip processing, it comprises the plastic box body of an end opening, is fixed with the abrasive disc for silicon chip is polished in described plastic box body, and is contained with mortar in the top of described abrasive disc in described plastic box body.
Especially, described plastic box body adopts foamed plastics to make.
Especially, the length of described abrasive disc is less than the interior length of described plastic box body, and it is embedded on the inwall of described plastic box body by cushion block.
Especially, described abrasive disc adopts two-sided ground glass, can two-sided Reusability.
Especially, described plastic box body length is 582mm, is highly 117mm, and the degree of depth is 70mm.
Especially, described mortar is by carborundum and PEG(polyethylene glycol) stir and form by 0.9:1 proportioning.
Beneficial effect of the present invention is, compared with prior art the box body of the described abrasive disc device for silicon chip processing adopts light plastic to make, possess detachably, can repeatedly clean combined and instant, the large batch of silicon chip edge phenomenon that solved, improve processing silicon chip qualification rate, shortened the time that solves edge problem silicon chip, reduced the ratio of defective in production process, easy to use, safe and reliable.
Accompanying drawing explanation
Fig. 1 is the structural representation of the abrasive disc device for silicon chip processing that provides of the specific embodiment of the invention 1.
In figure:
1, box body; 2, two-sided ground glass; 3, cushion block; 4, mortar.
The specific embodiment
Further illustrate technical scheme of the present invention below in conjunction with accompanying drawing and by the specific embodiment.
Refer to shown in Fig. 1, Fig. 1 is the structural representation of the abrasive disc device for silicon chip processing that provides of the specific embodiment of the invention 1.
In the present embodiment, a kind of abrasive disc device for silicon chip processing comprises one end opening box body 1, and described box body 1 adopts foamed plastics to make, its specification: length is 582mm, is highly 117mm, and the degree of depth is 70mm.And in described box body 1, be fixed with the two-sided ground glass 2 for silicon chip is polished, the length of described two-sided ground glass 2 is slightly less than the interior length of described box body 1, and it is embedded on the inwall of described box body 1 by cushion block 3.Described cushion block 3 be provided for preventing from preventing the friction between two-sided ground glass 2 and box body 1 inwall in abrasive disc.And in described box body 1, be contained with mortar 4 in the top of described two-sided ground glass 2, described mortar 4 is by carborundum and PEG(polyethylene glycol) stir and form by 0.9:1 proportioning.
When abrasive disc, by the defective top of putting into the two-sided ground glass 2 of box body 1, then operate box body 1 its left and right is rocked back and forth, by two-sided ground glass 2 and mortar 4, the limit that collapses of silicon chip edge is carried out grinding process and become qualified silicon chip.
When dismounting, only need unload the cushion block 3 in lower box body 1, can, by two-sided ground glass 2 from the interior dismounting of box body 1, clean.
The above-mentioned abrasive disc device for silicon chip processing possesses detachably, can repeatedly clean, combined and instant, the large batch of silicon chip edge phenomenon that solved, improve processing silicon chip qualification rate, shortened the time that solves edge problem silicon chip, reduced the ratio of defective in production process, easy to use, safe and reliable.
Above embodiment has just set forth basic principle of the present invention and characteristic; the present invention is not limited by above-mentioned example; without departing from the spirit and scope of the present invention, the present invention also has various variations and change, and these variations and change all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (6)
1. for an abrasive disc device for silicon chip processing, it is characterized in that, it comprises the plastic box body of an end opening, is fixed with the abrasive disc for silicon chip is polished in described plastic box body, and is contained with mortar in the top of described abrasive disc in described plastic box body.
2. the abrasive disc device for silicon chip processing according to claim 1, is characterized in that, described plastic box body adopts foamed plastics to make.
3. the abrasive disc device for silicon chip processing according to claim 1, is characterized in that, the length of described abrasive disc is less than the interior length of described plastic box body, and it is embedded on the inwall of described plastic box body by cushion block.
4. according to the abrasive disc device for silicon chip processing described in claim 1 or 3, it is characterized in that, described abrasive disc adopts two-sided ground glass.
5. the abrasive disc device for silicon chip processing according to claim 1 and 2, is characterized in that, described plastic box body length is 582mm, is highly 117mm, and the degree of depth is 70mm.
6. the abrasive disc device for silicon chip processing according to claim 1 and 2, is characterized in that, described mortar is stirred and forms by 0.9:1 proportioning by carborundum and polyethylene glycol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410126640.7A CN103878660A (en) | 2014-03-31 | 2014-03-31 | Silicon wafer grinding device used for silicon wafer treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410126640.7A CN103878660A (en) | 2014-03-31 | 2014-03-31 | Silicon wafer grinding device used for silicon wafer treatment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103878660A true CN103878660A (en) | 2014-06-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410126640.7A Pending CN103878660A (en) | 2014-03-31 | 2014-03-31 | Silicon wafer grinding device used for silicon wafer treatment |
Country Status (1)
| Country | Link |
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| CN (1) | CN103878660A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105058175A (en) * | 2015-08-14 | 2015-11-18 | 芜湖真空科技有限公司 | Edging method for LOW-E glass |
| CN108437244A (en) * | 2018-03-22 | 2018-08-24 | 山东大学 | Free-fixed grain composite fret saw cutting method of photovoltaic polycrystalline silicon battery plate |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004107428A1 (en) * | 2003-05-27 | 2004-12-09 | Sumco Corporation | Production method for semiconductor wafer |
| CN201177164Y (en) * | 2008-04-02 | 2009-01-07 | 万向硅峰电子股份有限公司 | Device for improving semiconductor monocrystalline silicon grinding silicon chip parallelism |
| CN201432228Y (en) * | 2009-06-25 | 2010-03-31 | 英利能源（中国）有限公司 | Silicon block chamfering processing device |
| CN102433191A (en) * | 2011-10-24 | 2012-05-02 | 江西赛维Ldk太阳能高科技有限公司 | Silicon carbide cutting fluid and using method thereof |
| CN202878046U (en) * | 2012-10-11 | 2013-04-17 | 新疆安泰神州封头有限公司 | Vibrating grinding machine |
| CN202922377U (en) * | 2012-11-27 | 2013-05-08 | 浙江中环赛特光伏科技有限公司 | A metal support cleaning and polishing integration machine |
| CN203817912U (en) * | 2014-03-31 | 2014-09-10 | 高佳太阳能股份有限公司 | Wafer grinding device for silicon wafertreatment |
-
2014
- 2014-03-31 CN CN201410126640.7A patent/CN103878660A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004107428A1 (en) * | 2003-05-27 | 2004-12-09 | Sumco Corporation | Production method for semiconductor wafer |
| CN201177164Y (en) * | 2008-04-02 | 2009-01-07 | 万向硅峰电子股份有限公司 | Device for improving semiconductor monocrystalline silicon grinding silicon chip parallelism |
| CN201432228Y (en) * | 2009-06-25 | 2010-03-31 | 英利能源（中国）有限公司 | Silicon block chamfering processing device |
| CN102433191A (en) * | 2011-10-24 | 2012-05-02 | 江西赛维Ldk太阳能高科技有限公司 | Silicon carbide cutting fluid and using method thereof |
| CN202878046U (en) * | 2012-10-11 | 2013-04-17 | 新疆安泰神州封头有限公司 | Vibrating grinding machine |
| CN202922377U (en) * | 2012-11-27 | 2013-05-08 | 浙江中环赛特光伏科技有限公司 | A metal support cleaning and polishing integration machine |
| CN203817912U (en) * | 2014-03-31 | 2014-09-10 | 高佳太阳能股份有限公司 | Wafer grinding device for silicon wafertreatment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105058175A (en) * | 2015-08-14 | 2015-11-18 | 芜湖真空科技有限公司 | Edging method for LOW-E glass |
| CN108437244A (en) * | 2018-03-22 | 2018-08-24 | 山东大学 | Free-fixed grain composite fret saw cutting method of photovoltaic polycrystalline silicon battery plate |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140625 |