CN201432228Y - Silicon block chamfering processing device - Google Patents
Silicon block chamfering processing device Download PDFInfo
- Publication number
- CN201432228Y CN201432228Y CN2009201590373U CN200920159037U CN201432228Y CN 201432228 Y CN201432228 Y CN 201432228Y CN 2009201590373 U CN2009201590373 U CN 2009201590373U CN 200920159037 U CN200920159037 U CN 200920159037U CN 201432228 Y CN201432228 Y CN 201432228Y
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- Prior art keywords
- silico briquette
- silicon block
- processing method
- workbench
- grinding wheel
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- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model relates to the technical field of silicon block chamfering processing, in particular to a silicon block chamfering processing device which comprises a grinding device and a silicon block fixing device for fixing a silicon block, wherein the grinding device comprises a grinding wheel and a workbench which performs reciprocating motion driven by a power device, the bottom of the silicon block fixing device is fixed on the workbench, and the grinding wheel is positioned over the workbench. During the process of silicon block chamfering processing, the silicon block chamfering processing device avoids the problem of uneven force caused by pushing the silicon block by man, and generates small vibration; and the lateral edges of the silicon block are not easy to collapse, the processed chamfer has high quality, and the newly produced edges have no thin collapsed edges. When silicon blocks processed by the silicon block chamfering processing device are cut, the cut silicon slices have high qualification rate, thereby saving the material and reducing production cost.
Description
Technical field
The utility model relates to silico briquette chamfer machining technical field, relates in particular to a kind of silico briquette chamfer processing method and device.
Background technology
Silicon chip is generally processed by silico briquette, and the silico briquette that is used to be processed into silicon chip generally is rectangular-shaped, and silico briquette is processed into the silicon chip of very thin thickness by the mode of multi-thread cutting.Because there is stress in the seamed edge place of four inclines of silico briquette, directly silico briquette is cut, cause easily on the silico briquette the serious phenomenons such as limit, crackle that collapse to occur, thereby cause the qualification rate of the silicon chip that processes lower, cause the waste of material, increased production cost.
Therefore, before silico briquette is cut, just must carry out chamfered, with the stress at the seamed edge place of eliminating the silico briquette incline to the incline of silico briquette; And the plane that requires silico briquette to carry out after the chamfered must be smooth, and the new seamed edge that produces does not have the tiny limit that collapses.
In the prior art, adopt special-purpose beveler that silico briquette is carried out chamfered usually.Please referring to Fig. 1, Fig. 1 is the structural representation of beveler of the prior art.
As shown in Figure 1, the beveler of this structure comprises an emery wheel 101 that is driven by the V-belt by motor, a V-shaped groove 102 is set directly over emery wheel 101, V-shaped groove 102 is horizontally disposed with, the lower end of V-shaped groove 102 has opening, silico briquette 103 side direction are placed in the V-shaped groove 102, and the incline that needs chamfering of silico briquette 103 inserts in the V-shaped groove, and this incline is aimed at emery wheel 101.101 rotations of driven by motor emery wheel, operating personnel promote silico briquette 103 and move on V-shaped groove 102, one end of the incline of silico briquette 103 contacts with the emery wheel 101 of rotation at a high speed, under the abrasive action of emery wheel 101, form chamfering on the incline of silico briquette 103 gradually, operating personnel continue to promote silico briquette 103 and move back and forth, up to all processed chamfering of the whole piece incline of silico briquette 103, lift silico briquette 103 then, make the opening part of another incline insertion V-shaped groove of silico briquette 103, repeat above-mentioned steps, up to four all processed chamferings of incline.
The beveler of this structure, because emery wheel 101 is by the V-belt transmission, emery wheel 101 vibrates bigger in rotating process, causes silico briquette 103 to collapse the limit easily; In the chamfer machining process, operating personnel promote silico briquette 103 by hand and move on V-shaped groove 102, owing to manually firmly may have inequality, the dimensional requirement of chamfering can not get guaranteeing, causes easily simultaneously and collapses the limit; The precision of emery wheel is lower, be difficult to guarantee the plane quality after silico briquette 103 chamferings, will cause the qualification rate of the silicon chip after the cutting lower, still can cause the waste of material.
The utility model content
The purpose of this utility model provides a kind of silico briquette chamfer processing method and device, to solve the problem that the silico briquette that exists when beveler of the prior art is processed the silico briquette chamfering easily collapses limit, chamfer quality difference.
For solving the problems of the technologies described above, the utility model provides a kind of silico briquette chamfer processing method and device, comprises lapping device, is used for fixing the silico briquette fixture of silico briquette; Described lapping device comprises grinding wheel and workbench, and described workbench moves reciprocatingly under the driving of power set; The bottom of described silico briquette fixture is fixed on the described workbench, described grinding wheel be positioned at described workbench directly over.
Preferably, described lapping device is the grinder with grinding wheel and electromagnetic worktable.
Preferably, described silico briquette fixture comprises base plate and gripper shoe; Described gripper shoe is V-shaped, is fixedly connected on described plate upper surface, and the inner surface of the both sides of described gripper shoe respectively forms a supporting surface.
Preferably, described supporting surface is provided with guide plate.
Preferably, described guide plate is by on the supporting surface that is bolted to described gripper shoe.
Preferably, described guide plate is the nylon guide plate.
Preferably, described base plate is a steel plate.
Preferably, described gripper shoe and described base plate are bolted to connection.
The silico briquette chamfer processing method and device that the utility model provides, comprise lapping device and silico briquette fixture, described lapping device comprises grinding wheel and workbench, the silico briquette fixture is fixed on the described workbench, described grinding wheel be positioned at described workbench directly over and with silico briquette positions aligning to be processed.In the silico briquette chamfer processing method and device of this structure, silico briquette is fixed in the silico briquette fixture, the incline that will carry out chamfer machining of silico briquette is aimed at grinding wheel, workbench can be at the uniform velocity, move back and forth, workbench drives that silico briquette is at the uniform velocity mobile, and the incline of silico briquette contacts with grinding wheel, under the effect of the frictional force of grinding wheel, grinding wheel grinds the incline of silico briquette, makes and forms chamfering on the incline.The silico briquette chamfer processing method and device of this structure is carrying out silico briquette in the process of chamfer machining, avoided because of the people pushes away the firmly uneven problem that causes, and the vibration that produces is little, the incline of silico briquette is not prone to and collapses the limit phenomenon, the quality height of the chamfering that processes, the new seamed edge that produces does not have the tiny limit that collapses.The silico briquette that this silico briquette chamfer processing method and device processes, the silicon chip qualification rate height that is cut to, thus saved material, reduced production cost.
Description of drawings
Fig. 1 is the structural representation of beveler of the prior art;
The front view of the silico briquette chamfer processing method and device that Fig. 2 provides for the utility model;
The side view of the silico briquette chamfer processing method and device that Fig. 3 provides for the utility model;
Fig. 4 is the structural representation of silico briquette fixture among Fig. 2;
Wherein, among Fig. 1-Fig. 4:
Emery wheel 101, V-shaped groove 102, silico briquette 103;
Grinding wheel 201, silico briquette fixture 202, silico briquette 203, base plate 204, gripper shoe 205, guide plate 206.
The specific embodiment
The purpose of this utility model provides a kind of silico briquette chamfer processing method and device, to solve the problem that the silico briquette that exists when beveler of the prior art is processed the silico briquette chamfering easily collapses limit, chamfer quality difference.
Below in conjunction with accompanying drawing content of the present utility model is described, following description only is exemplary and indicative, should any restriction not arranged to protection domain of the present utility model.
Please referring to Fig. 2, Fig. 3, the side view of the silico briquette chamfer processing method and device that the front view of the silico briquette chamfer processing method and device that Fig. 2 provides for the utility model, Fig. 3 provide for the utility model.
As Fig. 2, shown in Figure 3, the silico briquette chamfer processing method and device that the utility model provides comprises lapping device and silico briquette fixture 202, lapping device comprises grinding wheel 201 and workbench, grinding wheel 201 can grind the incline of silico briquette to process required chamfering, workbench can be done at the uniform velocity, move back and forth, and can hold silico briquette in the silico briquette fixture 202.Wherein, workbench fails to show in Fig. 2, Fig. 3.
In a kind of concrete embodiment, as shown in Figure 4, silico briquette fixture 202 comprises base plate 204, gripper shoe 205, base plate 204 is a steel plate, gripper shoe 205 is V-shaped, the inner surface of the both sides of the v-shaped structure of gripper shoe 204 respectively forms a supporting surface, two supporting surfaces can support two adjacent side of silico briquette 203, and can block silico briquette 203, adjustable included angle joint between two supporting surfaces of the v-shaped structure of gripper shoe 205, the bottom of gripper shoe 205 is fixed on the upper surface of base plate 204, and gripper shoe 205 specifically can connect by bolt, modes such as welding are fixed on the upper surface of base plate 204.
In the preferred version, for the vibration that reduces to produce in the chamfer machining process, be respectively arranged with guide plate 206 on two supporting surfaces of gripper shoe 205, guide plate 206 is the nylon guide plate, and guide plate 206 is fixing by bolt and gripper shoe 205.Can be respectively fit with the upper surface of the guide plate 206 of gripper shoe 205 both sides in adjacent two sides of silico briquette 203.In carrying out the chamfer machining process, the vibration that guide plate 206 can absorption systems produces, and can cushion active force between silico briquette 203 and the gripper shoe 205, make silico briquette 203 be difficult for generations and collapse the limit phenomenon.
A kind of concrete be in the embodiment, lapping device is specially grinder, grinder has grinding wheel 201 and electromagnetic worktable, electromagnetic worktable can be fixed the irony part by the electromagnetic force that the solenoid energising produces.The grinding precision height of grinding wheel 201, when silico briquette 203 was carried out chamfer machining, the plane after silico briquette 203 chamfer machining was more smooth, and newly producing seamed edge does not have tiny seamed edge, has higher surface accuracy; Electromagnetic worktable can be done back and forth, uniform motion, and the vibration that produces in the motion process is little.
The base plate 204 of silico briquette fixture 202 is placed on the electromagnetic worktable of grinder, because base plate 204 is a steel plate, after the electromagnetic worktable energising, the electromagnetic force that the electromagnetic coil in the electromagnetic worktable produces can be fixed on base plate 204 on the electromagnetic worktable.
Below introduce the operation principle of the silico briquette chamfer processing method and device that the utility model provides.
Below introduce the advantage of the silico briquette chamfer processing method and device that the utility model provides.
The lapping device of the silico briquette chamfer processing method and device that the utility model provides adopts grinder, and grinder is a kind of high-precision surface grinding machine, the grinding precision height, and also the vibration that produces in the chamfer machining process is little, good stability; Grinder has a high-precision grinding wheel and electromagnetic worktable, electromagnetic worktable can be done back and forth, uniform motion, the silico briquette fixture that is fixed with silico briquette is fixed on the electromagnetic worktable, electromagnetic worktable can drive silico briquette and make reciprocal, uniform motion, and grinding wheel can act on repeatedly to the incline of silico briquette.The silico briquette chamfer processing method and device of this structure is carrying out silico briquette in the process of chamfer machining, avoided pushing away the firmly uneven problem that silico briquette causes because of the people, and the vibration that produces is little, the incline of silico briquette is not prone to and collapses the limit phenomenon, the quality height of the chamfering that processes, the new seamed edge that produces does not have the tiny limit that collapses.The silico briquette that this silico briquette chamfer processing method and device processes, the silicon chip qualification rate height that is cut to, thus saved material, reduced production cost.
The above only is the description of preferred implementation of the present utility model; should be understood that; because the finiteness of literal expression; and objectively have unlimited concrete structure; for those skilled in the art; under the prerequisite that does not break away from the utility model principle, can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (8)
1. a silico briquette chamfer processing method and device is characterized in that, comprises lapping device, is used for fixing the silico briquette fixture of silico briquette; Described lapping device comprises grinding wheel and workbench, and described workbench moves reciprocatingly under the driving of power set; The bottom of described silico briquette fixture is fixed on the described workbench, described grinding wheel be positioned at described workbench directly over.
2. silico briquette chamfer processing method and device according to claim 1 is characterized in that, described lapping device is the grinder with grinding wheel and electromagnetic worktable.
3. silico briquette chamfer processing method and device according to claim 1 and 2 is characterized in that, described silico briquette fixture comprises base plate and gripper shoe; Described gripper shoe is V-shaped, is fixedly connected on described plate upper surface, and the inner surface of the both sides of described gripper shoe respectively forms a supporting surface.
4. silico briquette chamfer processing method and device according to claim 3 is characterized in that described supporting surface is provided with guide plate.
5. silico briquette chamfer processing method and device according to claim 4 is characterized in that, described guide plate is by on the supporting surface that is bolted to described gripper shoe.
6. silico briquette chamfer processing method and device according to claim 4 is characterized in that, described guide plate is the nylon guide plate.
7. silico briquette chamfer processing method and device according to claim 3 is characterized in that, described base plate is a steel plate.
8. silico briquette chamfer processing method and device according to claim 3 is characterized in that, described gripper shoe and described base plate are bolted to connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201590373U CN201432228Y (en) | 2009-06-25 | 2009-06-25 | Silicon block chamfering processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201590373U CN201432228Y (en) | 2009-06-25 | 2009-06-25 | Silicon block chamfering processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201432228Y true CN201432228Y (en) | 2010-03-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201590373U Expired - Fee Related CN201432228Y (en) | 2009-06-25 | 2009-06-25 | Silicon block chamfering processing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201432228Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103878660A (en) * | 2014-03-31 | 2014-06-25 | 高佳太阳能股份有限公司 | Silicon wafer grinding device used for silicon wafer treatment |
| CN105261673A (en) * | 2015-11-09 | 2016-01-20 | 江苏美科硅能源有限公司 | Silicon chip chamfering bright edge processing tool |
| CN107093627A (en) * | 2017-05-31 | 2017-08-25 | 镇江环太硅科技有限公司 | The polysilicon chip and its processing technology of a kind of low damage micro- chamfering of layer |
| CN107671635A (en) * | 2017-09-28 | 2018-02-09 | 江苏指南针自动化科技有限公司 | A kind of full-automatic silicon ingot chamfer equipment |
| CN109420950A (en) * | 2017-08-17 | 2019-03-05 | 南京雄豹精密机械有限公司 | A kind of sliding block beveler |
| CN110614406A (en) * | 2019-10-29 | 2019-12-27 | 常州市奥普泰克光电科技有限公司 | Machining device and machining method for chamfering square blank substrate |
| CN111590460A (en) * | 2020-05-27 | 2020-08-28 | 昆山维信诺科技有限公司 | Edging tool and equipment of polishing |
| CN117161875A (en) * | 2023-10-31 | 2023-12-05 | 四川省卓辰精密机械制造有限公司 | Valve block edge chamfering equipment |
-
2009
- 2009-06-25 CN CN2009201590373U patent/CN201432228Y/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103878660A (en) * | 2014-03-31 | 2014-06-25 | 高佳太阳能股份有限公司 | Silicon wafer grinding device used for silicon wafer treatment |
| CN105261673A (en) * | 2015-11-09 | 2016-01-20 | 江苏美科硅能源有限公司 | Silicon chip chamfering bright edge processing tool |
| CN105261673B (en) * | 2015-11-09 | 2017-05-10 | 江苏美科硅能源有限公司 | Silicon chip chamfering bright edge processing tool |
| CN107093627A (en) * | 2017-05-31 | 2017-08-25 | 镇江环太硅科技有限公司 | The polysilicon chip and its processing technology of a kind of low damage micro- chamfering of layer |
| CN107093627B (en) * | 2017-05-31 | 2023-09-05 | 江苏美科太阳能科技股份有限公司 | Low-damage-layer micro-chamfer polycrystalline silicon wafer and processing technology thereof |
| CN109420950A (en) * | 2017-08-17 | 2019-03-05 | 南京雄豹精密机械有限公司 | A kind of sliding block beveler |
| CN107671635A (en) * | 2017-09-28 | 2018-02-09 | 江苏指南针自动化科技有限公司 | A kind of full-automatic silicon ingot chamfer equipment |
| CN107671635B (en) * | 2017-09-28 | 2023-09-12 | 江苏指南针自动化科技有限公司 | Full-automatic silicon ingot chamfering equipment |
| CN110614406A (en) * | 2019-10-29 | 2019-12-27 | 常州市奥普泰克光电科技有限公司 | Machining device and machining method for chamfering square blank substrate |
| CN111590460A (en) * | 2020-05-27 | 2020-08-28 | 昆山维信诺科技有限公司 | Edging tool and equipment of polishing |
| CN117161875A (en) * | 2023-10-31 | 2023-12-05 | 四川省卓辰精密机械制造有限公司 | Valve block edge chamfering equipment |
| CN117161875B (en) * | 2023-10-31 | 2024-01-23 | 四川省卓辰精密机械制造有限公司 | Valve block edge chamfering equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Baoding Tianwei Yingli New Engergy Co., Ltd. Assignor: Yingli Energy (China) Co., Ltd. Contract record no.: 2010990000902 Denomination of utility model: Silicon block chamfering processing device Granted publication date: 20100331 License type: Exclusive License Record date: 20101116 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100331 Termination date: 20140625 |
|
| EXPY | Termination of patent right or utility model |