CN203817912U - Wafer grinding device for silicon wafertreatment - Google Patents
Wafer grinding device for silicon wafertreatment Download PDFInfo
- Publication number
- CN203817912U CN203817912U CN201420152814.2U CN201420152814U CN203817912U CN 203817912 U CN203817912 U CN 203817912U CN 201420152814 U CN201420152814 U CN 201420152814U CN 203817912 U CN203817912 U CN 203817912U
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- CN
- China
- Prior art keywords
- box body
- silicon
- silicon chip
- abrasive disc
- plastic box
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a wafer grinding device for silicon wafertreatment. The wafer grinding device comprises a plastic box body with one open end, wherein a grinding piece for grinding silicon wafers is fixed in the plastic box body, and mortaris contained above the grinding piece and in the plastic box body. The box body of the wafer grinding device for silicon wafertreatment is made of light plastic, the wafer grinding device is detachable, convenient to combine, convenient to use, safe, reliable and capable of being washed repeatedly, eliminating the silicon waferfringe phenomenon on a large scale, increasing the pass percent for silicon wafermachining, shortening the time for solving the silicon waferfringe problem and reducing the proportion of unqualifiedwafers during production.
Description
Technical field
The utility model belongs to solar silicon wafers manufacturing technology, relates in particular to a kind ofly for making, defectively to collapse limit silicon chip and become after treatment the abrasive disc device of qualified.
Background technology
In solar silicon wafers production process, it is shinny that the silicon chip mucilage glue surface at silicon chip square rod two after removing photoresist presents edge, and shinny being of silicon chip edge collapsed limit.Cause silicon chip to collapse the reason on limit a lot, in actual production, being also difficult in control all solve, each line cutting silicon wafer all can produce the defective limit silicon chip that collapses of 1.8%-2%.In defective, account for 38%.Traditional treating method is artificial with the husky mulberry paper silicon chip edge of polishing, and this mode exists treatment effeciency low and easily silicon chip is damaged again the shortcoming that security reliability is low.
Utility model content
The purpose of this utility model is to provide a kind of abrasive disc device of processing for silicon chip, and it has high, the easy to use and safe and reliable feature for the treatment of effeciency, to solve, processes silicon chip edge collapse the problem existing in limit in prior art.
For reaching this object, the utility model by the following technical solutions:
An abrasive disc device of processing for silicon chip, it comprises the plastic box body of an end opening, is fixed with the abrasive disc for silicon chip is polished in described plastic box body, and in the top of described abrasive disc, is contained with mortar in described plastic box body.
Especially, described plastic box body adopts foamed plastics to make.
Especially, the length of described abrasive disc is less than the interior length of described plastic box body, and it is embedded on the inwall of described plastic box body by cushion block.
Especially, described abrasive disc adopts two-sided ground glass, can two-sided Reusability.
Especially, described plastic box body length is 582mm, is highly 117mm, and the degree of depth is 70mm.
Especially, described mortar is by carborundum and PEG(polyethylene glycol) by 0.9:1 proportioning, stir and form.
The beneficial effects of the utility model are, compared with prior art the box body of the described abrasive disc device of processing for silicon chip adopts light plastic to make, possess detachably, can repeatedly clean combined and instant, the large batch of silicon chip edge phenomenon that solved, improve processing silicon chip qualification rate, shortened the time that solves edge problem silicon chip, reduced the ratio of defective in production process, easy to use, safe and reliable.
Accompanying drawing explanation
Fig. 1 is the structural representation of the abrasive disc device of processing for silicon chip that provides of the utility model specific embodiment 1.
In figure:
1, box body; 2, two-sided ground glass; 3, cushion block; 4, mortar.
The specific embodiment
Below in conjunction with accompanying drawing and by the specific embodiment, further illustrate the technical solution of the utility model.
Refer to shown in Fig. 1, Fig. 1 is the structural representation of the abrasive disc device of processing for silicon chip that provides of the utility model specific embodiment 1.
In the present embodiment, a kind of abrasive disc device of processing for silicon chip comprises one end opening box body 1, and described box body 1 adopts foamed plastics to make, and its specification: length is 582mm, is highly 117mm, and the degree of depth is 70mm.And in described box body 1, be fixed with the two-sided ground glass 2 for silicon chip is polished, the length of described two-sided ground glass 2 is slightly less than the interior length of described box body 1, and it is embedded on the inwall of described box body 1 by cushion block 3.Described cushion block 3 be provided for preventing from preventing the friction between two-sided ground glass 2 and box body 1 inwall in abrasive disc.And in described box body 1, in the top of described two-sided ground glass 2, be contained with mortar 4, described mortar 4 is by carborundum and PEG(polyethylene glycol) by 0.9:1 proportioning, stir and form.
During abrasive disc, by the defective top of putting into the two-sided ground glass 2 of box body 1, then operate box body 1 its left and right is rocked back and forth, by the limit that collapses of 4 pairs of silicon chip edges of two-sided ground glass 2 and mortar, carry out grinding process and become qualified silicon chip.
During dismounting, only need unload the cushion block 3 in lower box body 1, can, by two-sided ground glass 2 from the interior dismounting of box body 1, clean.
The above-mentioned abrasive disc device of processing for silicon chip possesses detachably, can repeatedly clean, combined and instant, the large batch of silicon chip edge phenomenon that solved, improve processing silicon chip qualification rate, shortened the time that solves edge problem silicon chip, reduced the ratio of defective in production process, easy to use, safe and reliable.
Above embodiment has just set forth basic principle of the present utility model and characteristic; the utility model is not limited by above-mentioned example; do not departing under the prerequisite of the utility model spirit and scope; the utility model also has various variations and change, and these variations and change all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (5)
1. an abrasive disc device of processing for silicon chip, is characterized in that, it comprises the plastic box body of an end opening, is fixed with the abrasive disc for silicon chip is polished in described plastic box body, and in the top of described abrasive disc, is contained with mortar in described plastic box body.
2. the abrasive disc device of processing for silicon chip according to claim 1, is characterized in that, described plastic box body adopts foamed plastics to make.
3. the abrasive disc device of processing for silicon chip according to claim 1, is characterized in that, the length of described abrasive disc is less than the interior length of described plastic box body, and it is embedded on the inwall of described plastic box body by cushion block.
4. according to the abrasive disc device of processing for silicon chip described in claim 1 or 3, it is characterized in that, described abrasive disc adopts two-sided ground glass.
5. the abrasive disc device of processing for silicon chip according to claim 1 and 2, is characterized in that, described plastic box body length is 582mm, is highly 117mm, and the degree of depth is 70mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420152814.2U CN203817912U (en) | 2014-03-31 | 2014-03-31 | Wafer grinding device for silicon wafertreatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420152814.2U CN203817912U (en) | 2014-03-31 | 2014-03-31 | Wafer grinding device for silicon wafertreatment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203817912U true CN203817912U (en) | 2014-09-10 |
Family
ID=51473455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420152814.2U Expired - Fee Related CN203817912U (en) | 2014-03-31 | 2014-03-31 | Wafer grinding device for silicon wafertreatment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203817912U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103878660A (en) * | 2014-03-31 | 2014-06-25 | 高佳太阳能股份有限公司 | Silicon wafer grinding device used for silicon wafer treatment |
-
2014
- 2014-03-31 CN CN201420152814.2U patent/CN203817912U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103878660A (en) * | 2014-03-31 | 2014-06-25 | 高佳太阳能股份有限公司 | Silicon wafer grinding device used for silicon wafer treatment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140910 Termination date: 20210331 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |