CN103866375B - 一种掺杂区熔硅单晶的制备方法 - Google Patents
一种掺杂区熔硅单晶的制备方法 Download PDFInfo
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- CN103866375B CN103866375B CN201210530394.2A CN201210530394A CN103866375B CN 103866375 B CN103866375 B CN 103866375B CN 201210530394 A CN201210530394 A CN 201210530394A CN 103866375 B CN103866375 B CN 103866375B
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CN103866375A CN103866375A (zh) | 2014-06-18 |
CN103866375B true CN103866375B (zh) | 2016-02-24 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1455028A (zh) * | 2002-12-30 | 2003-11-12 | 天津市环欧半导体材料技术有限公司 | 气相掺杂区熔硅单晶的生产方法 |
CN1763266A (zh) * | 2005-09-29 | 2006-04-26 | 天津市环欧半导体材料技术有限公司 | 区熔气相掺杂太阳能电池硅单晶的制备方法 |
CN1865528A (zh) * | 2006-04-21 | 2006-11-22 | 天津市环欧半导体材料技术有限公司 | 大直径区熔硅单晶生产方法 |
CN101225543A (zh) * | 2007-10-09 | 2008-07-23 | 兰州大成自动化工程有限公司 | 单晶硅薄膜及其组件的制备方法 |
CN101525764A (zh) * | 2009-04-16 | 2009-09-09 | 峨嵋半导体材料研究所 | 一种真空区熔高阻硅单晶的制备方法 |
JP4367213B2 (ja) * | 2004-04-21 | 2009-11-18 | 信越半導体株式会社 | シリコン単結晶の製造方法 |
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JPH09286688A (ja) * | 1996-04-22 | 1997-11-04 | Komatsu Electron Metals Co Ltd | シリコン単結晶へのガスドープ方法 |
DE10216609B4 (de) * | 2002-04-15 | 2005-04-07 | Siltronic Ag | Verfahren zur Herstellung der Halbleiterscheibe |
JP4957600B2 (ja) * | 2008-03-18 | 2012-06-20 | 信越半導体株式会社 | Fz法による半導体結晶製造方法および半導体結晶製造装置 |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1455028A (zh) * | 2002-12-30 | 2003-11-12 | 天津市环欧半导体材料技术有限公司 | 气相掺杂区熔硅单晶的生产方法 |
JP4367213B2 (ja) * | 2004-04-21 | 2009-11-18 | 信越半導体株式会社 | シリコン単結晶の製造方法 |
CN1763266A (zh) * | 2005-09-29 | 2006-04-26 | 天津市环欧半导体材料技术有限公司 | 区熔气相掺杂太阳能电池硅单晶的制备方法 |
CN1865528A (zh) * | 2006-04-21 | 2006-11-22 | 天津市环欧半导体材料技术有限公司 | 大直径区熔硅单晶生产方法 |
CN101225543A (zh) * | 2007-10-09 | 2008-07-23 | 兰州大成自动化工程有限公司 | 单晶硅薄膜及其组件的制备方法 |
CN101525764A (zh) * | 2009-04-16 | 2009-09-09 | 峨嵋半导体材料研究所 | 一种真空区熔高阻硅单晶的制备方法 |
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Address after: 101300 south side of Shuanghe Road, Linhe Industrial Development Zone, Shunyi District, Beijing Patentee after: Youyan semiconductor silicon materials Co.,Ltd. Address before: 101300 south side of Shuanghe Road, Linhe Industrial Development Zone, Shunyi District, Beijing Patentee before: GRINM SEMICONDUCTOR MATERIALS Co.,Ltd. |