CN103858225B - 用于建立钎焊连接的方法 - Google Patents

用于建立钎焊连接的方法 Download PDF

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CN103858225B
CN103858225B CN201280047506.7A CN201280047506A CN103858225B CN 103858225 B CN103858225 B CN 103858225B CN 201280047506 A CN201280047506 A CN 201280047506A CN 103858225 B CN103858225 B CN 103858225B
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D·米歇尔斯
S·格林
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Robert Bosch GmbH
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Abstract

本发明涉及一种用于在至少一个基础件(2)和至少一个第一构件(3)之间建立钎焊连接的方法，所述方法包括以下步骤：提供所述基础件(2)；利用SACO喷射介质局部地喷射所述基础件(2)的表面，使得存在被SACO喷射的区域(20)和不被喷射的定位区域(40)，其中所述SACO喷射介质的喷射物(50)具有硅酸盐覆层(52)；以及将至少第一构件(3)钎焊在所述不被喷射的定位区域(40)上；其中，所述被SACO喷射的区域(20)用作钎焊终止部。

Description

用于建立钎焊连接的方法
技术领域
本发明涉及一种用于在基础件和构件之间建立钎焊连接的方法以及一种电子部件和一种模制模块。
背景技术
从现有技术中已经已知不同的设计方案的用于建立钎焊连接的方法。在此，例如在制造用于在机动车领域中的控制器的功率模块时使电气的或电子的构件、特别是功率半导体直接钎焊到金属的基础件、例如冲制格栅或散热器上，并且紧接着完全地或部分地利用热固性的塑料包封。在此，在多种情况中塑料在基础件上的附着性不足以承受由于构件的不同的热膨胀系数引起的机械应力。此外，在钎焊过程中存在构件被模糊(Verschwimmen)的风险。如果构件在例如被钎焊到基础件的边缘上的过程中被模糊，这可能导致不良的散热性／导热性或不均匀的热扩散。在多数情况中这种模糊导致构件报废，因为不再给出该构件在基础件上精确的定位。
发明内容
与此相对地，具有权利要求1所述特征的根据本发明的方法具有的优点是，通过表面处理实现壳体材料在基础件上明显的附着改进并且同时其上进行了表面处理的区域对于焊料来说不再可润湿。根据本发明，这通过以下方式实现，即，在所提供的基础件上通过利用SACO喷射介质仅仅局部地喷射基础件的表面来进行SACO喷射过程(例如Delo公司的喷砂涂覆)，使得存在SACO喷射区域和不被喷射的定位区域。紧接着，将至少第一构件钎焊在基础件的不被SACO喷射的区域上，其中，所述被SACO喷射的区域用作钎焊终止部。由此，可防止构件被模糊并且同时有效抑制了焊料流到被SACO喷射的区域中以及由此引起的不均匀的热扩散。基础件和至少一个如此固定在基础件的不被SACO喷射的区域上的构件优选地形成电子部件。通过在基础件的被喷射的区域上保留的SACO喷射物的硅酸盐残留物，实现了壳体材料、特别是热固性塑料在被喷射的区域上明显改进的附着性能。此外，实现了在基础件中更好地接收通过构件的不同的热膨胀系数引起的机械应力。
从属权利要求给出了本发明的优选的改进方案。
优选地，基础件具有多个侧面，并且基础件的仅仅一个侧面具有被SACO喷射的区域和不被喷射的定位区域。此外优选地，基础件具有多个侧面并且基础件的多个侧面具有被SACO喷射的区域。因此，可在唯一的在时间和成本方面高效的方法步骤中提供优选由金属材料制成的基础件的一个或多个侧面，其不仅具有与塑料相比改进的附着性能也具有防止焊料润湿的表面性能。由此，该方法可广泛地用于不同结构形式的基础件。
此外优选地，在SACO喷射之前借助于障板来遮蔽不被喷射的定位区域。由此，可以简单的且运行可靠的方式提供被遮蔽的基础件，其使随后的以高的时间节拍进行喷射的方法步骤成为可能。此外，可以最少的时间和材料消耗将障板施加到基础件上。
根据本发明的一个优选的设计方案，在基础件处设置至少两个定位区域以固定第一和第二构件。由此，以最小的总成本且在没有明显的时间消耗的情况下，实现了，制造用于可能的多倍装备部件的基础件并且以这种方式优选地提供电子部件。
优选地，在将构件钎焊到定位区域上之后进行模制壳体的模制。在此，该模制壳体包围基础件的至少一部分，由此在已安装的状态中(例如安装在车辆的控制器中)保护基础件不受环境影响。由此，确保了高的运行安全性以及耐久性。此外，基础件的表面的一些部分能够被包围的模制壳体留空出来，从而确保在运行中有效地导出在构件中产生的热。此外，有效地防止由此引起的在模制件和基础件之间的边界面上的脱层或脱离。
此外，本发明涉及一种电子部件，其包括至少一个第一构件和一个基础件，其中，该基础件具有至少一个通过SACO喷射介质喷射的区域和至少一个不被喷射的定位区域，该SACO喷射介质的喷射物具有硅酸盐覆层。在此，所述构件优选地通过钎焊布置在所述不被喷射的定位区域上，其中，硅酸盐颗粒附着在被SACO喷射的区域上。
根据本发明的另一优选的设计方案，所述被SACO喷射的区域没有焊料。该被SACO喷射的区域为可被焊料润湿的构件的定位面提供可靠的局部限制。由此，可靠地防止了在钎焊过程中使构件模糊以及焊料从定位面(焊料终止部)中流出或者形成围绕构件的焊料圈。
优选地，所述基础件构造成铜冲制格栅或铜散热器。由此，例如为功率半导体元件形式的基础件可以简单的方式直接被钎焊到铜冲制格栅或铜散热器上且在不被模糊的情况下被精确地定位。
此外优选地，该基础件具有多个侧面并且基础件的仅仅一个侧面具有所述被SACO喷射的区域。由此，在制造时可以简单的方式例如通过铝粗焊线焊接(Aluminium-Dickdrahtbondung)实现构件以及其触点的单侧钎焊，铜芯片的补焊，或者它们的组合。
从被喷射的区域的表面性能中得到明显改进的壳体材料、例如模制壳体在电子部件的基础件处的附着性能。在此，该模制壳体包围基础件的至少一部分，由此形成模制模块。以这种方式可靠地密封并且保护该模制模块以防侵入的环境影响，否则该环境影响物可引起模制模块的功能故障或失效。优选地，设置热固性的塑料材料用于构造模制壳体。使用热固性的塑料材料使整个模制模块的耐热的且运行可靠的包封成为可能。
附图说明
下面参照附图详细描述本发明的优选实施例。在附图中：
图1示出了根据本发明的模制模块的放大的示意性截面图，
图2示出了在喷射过程之前根据本发明第一优选实施例的基础件的放大的示意性俯视图，
图3示出了在喷射过程之后的图2基础件的放大的示意性俯视图，
图4示出了在喷射颗粒撞击之前SACO喷射过程的放大的示意图，
图5示出了在喷射颗粒撞击时SACO喷射过程的放大的示意图，以及
图6示出了在喷射颗粒撞击之后SACO喷射过程的放大的示意图，
图7示出了在喷射过程之前根据本发明第二实施例的模制模块的基础件的放大的示意性俯视图，以及
图8示出了在喷射过程之后图7基础件的放大的示意性俯视图。
具体实施方式
下面参照图1至6详细描述根据本发明第一优选实施例的根据本发明的模制模块1和基础件2以及用于建立钎焊连接的方法。
如可从图1中的根据本发明的模制模块1的简化示意性截面图中看出的那样，模制模块1包括模制壳体10以及金属的基础件2，该基础件2布置在模制壳体10的内部中。在此，基础件2构造成铜散热器。如还可从图1中看出的那样，模制壳体10包围基础件2的一个侧面21以及其邻接的侧面22、23，而基础件2的与所述侧面21相对的侧面24未被模制壳体10包围。
在该第一实施例中，基础件2的侧面21具有两个基本上对称地布置的定位区域40、41，构件3、确切地说在此不可见的第二构件借助于焊料30固定在所述定位区域40、41上，并且所述侧面21具有被SACO喷射的区域20，该区域20包围定位区域40、41，如在图2中示出的那样。此外，在构件3处的联接线31(或另一在此不可见的在第二构件处的联接线)借助于所述焊料30固定并且从模制壳体10中引导出来。基础件2备选地也可构造成铜冲制格栅。
在制造时例如借助于障板来遮蔽所述定位面40、41，以保护其作为钎焊面的铜表面，而保留的、未被遮蔽的面(其代表稍后的被SACO喷射区域20)经受SACO喷砂以改进附着。在此，使用带有喷射物50的特殊的喷射介质，其中每个颗粒51(如在图4中示出的那样)设有硅酸盐覆层52并且沿着箭头A的方向被喷射到基础件2的侧面21上。
如在图5中示出的那样，在此颗粒51在撞击时部分地侵入基础件2中。当颗粒51如在图6中示出的那样再次从基础件2中沿着箭头B的方向弹回时，硅酸盐覆层52的一部分保留在由喷射过程产生的凹入部53中。以这种方式，产生在图3中示出的被SACO喷射的区域20。该被SACO喷射的区域20一方面具有提高的表面粗糙度，其明显改进了塑料的附着，并且喷射物50的每个颗粒51的硅酸盐覆层52的留下的残渣另一方面在更大的程度上有利于、确切地说改进了塑料的附着性能并且同时使利用焊料润湿变得不可能。由此，通过根据本发明的方法同时实现了两个功能，即，改进塑料优选地在金属表面上的附着的功能，以及在金属表面上提供钎焊终止部的功能。这尤其地对于制造用作在机动车领域中的控制器中的功率模决来说是有利的。
下面参照图7和8详细描述根据本发明第二优选实施例的模制模块1的基础件。在此，利用与在第一实施例中相同的附图标记表示相同的部件或功能相同的构件。
与以上描述的第一实施例相反地，该第二实施例仅仅具有唯一的定位面40，其如在图7中示出的那样设置在基础件2A的侧面21上，并且如在图8中示出的那样在喷射过程之后完全被SACO喷射的区域20A包围。
原则上，可设想分别不设置模制壳体的根据图3和8的实施方案。在这些情况中，存在这样的电子部件，即，在其中通过设置被SACO喷射的区域20确保了被包围的钎焊触点区域的钎焊终止部。

Claims (11)

1.一种用于在至少一个基础件(2)和至少一个第一构件(3)之间建立钎焊连接的方法，所述方法包括以下步骤：
-提供所述基础件(2)，
-利用SACO喷射介质局部地喷射所述基础件(2)的表面，使得存在被SACO喷射的区域(20)和不被喷射的定位区域(40)，所述SACO喷射介质的喷射物(50)具有硅酸盐覆层(52)，以及
-将所述至少第一构件(3)钎焊在所述不被喷射的定位区域(40)上，
-其中，所述被SACO喷射的区域(20)用作钎焊终止部。
2.按照权利要求1所述的方法，其特征在于，所述基础件(2)具有多个侧面(21、22、23、24、25)并且所述基础件(2)的仅仅一个侧面(21)具有所述被SACO喷射的区域(20)和不被喷射的定位区域(40)。
3.按照权利要求1所述的方法，其特征在于，所述基础件(2)具有多个侧面(21、22、23、24、25)并且所述基础件(2)的多个侧面(21、22、23、24、25)具有所述被SACO喷射的区域(20)。
4.按照上述权利要求中任一项所述的方法，其特征在于，在所述SACO喷射之前借助于障板来遮蔽所述不被喷射的定位区域(40)。
5.按照上述权利要求1至3中任一项所述的方法，其特征在于，在所述基础件(2)处设置至少两个定位区域(40、41)以固定第一构件和第二构件。
6.按照上述权利要求1至3中任一项所述的方法，其特征在于，在将所述构件(3)钎焊到所述定位区域(40)上之后模制所述模制壳体(10)。
7.一种电子部件，其包括：
-至少一个第一构件(3)，以及
-基础件(2)，
-其中，所述基础件(2)具有至少一个通过SACO喷射介质喷射的区域(20)和至少一个不被喷射的定位区域(40)，所述SACO喷射介质的喷射物具有硅酸盐覆层，
-其中，所述构件(3)钎焊在所述不被喷射的定位区域(40)上，
-其中，硅酸盐微粒附着在所述被SACO喷射的区域(20)上，并且其中，所述被SACO喷射的区域(20)对于所述焊料来说不能被润湿。
8.按照权利要求7所述的电子部件，其特征在于，所述基础件(2)构造成铜冲制格栅或铜散热器。
9.按照权利要求7或8中任一项所述的电子部件，其特征在于，所述基础件(2)具有多个侧面(21、22、23、24、25)并且所述基础件(2)的仅仅一个侧面(21)具有所述被SACO喷射的区域(20)。
10.一种模制模块，其特征在于，所述模制模块包括按照权利要求7至9中任一项所述的电子部件和模制壳体，其中，所述模制壳体(10)在所述被SACO喷射的区域(20)处附着在所述基础元件(2)处。
11.按照权利要求10所述的模制模块，其特征在于，所述模制壳体(10)为热固性塑料。
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