CN103855278A - 一种led封装结构及照明设备 - Google Patents
一种led封装结构及照明设备 Download PDFInfo
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- CN103855278A CN103855278A CN201410038354.5A CN201410038354A CN103855278A CN 103855278 A CN103855278 A CN 103855278A CN 201410038354 A CN201410038354 A CN 201410038354A CN 103855278 A CN103855278 A CN 103855278A
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- Prior art keywords
- wafer
- led
- adhesives
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- fluorescent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410038354.5A CN103855278B (zh) | 2014-01-26 | 2014-01-26 | 一种led封装结构及照明设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410038354.5A CN103855278B (zh) | 2014-01-26 | 2014-01-26 | 一种led封装结构及照明设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103855278A true CN103855278A (zh) | 2014-06-11 |
CN103855278B CN103855278B (zh) | 2017-01-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201410038354.5A Expired - Fee Related CN103855278B (zh) | 2014-01-26 | 2014-01-26 | 一种led封装结构及照明设备 |
Country Status (1)
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CN (1) | CN103855278B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104979447A (zh) * | 2015-07-16 | 2015-10-14 | 华天科技(昆山)电子有限公司 | 倒装led封装结构及制作方法 |
CN105322073A (zh) * | 2014-08-11 | 2016-02-10 | 大连精拓光电有限公司 | 新型无打线led灯丝制作技术 |
WO2016037466A1 (zh) * | 2014-09-09 | 2016-03-17 | 厦门市三安光电科技有限公司 | 发光二极管器件及其制作方法 |
WO2021110019A1 (zh) * | 2019-12-02 | 2021-06-10 | 亿光电子工业股份有限公司 | Led发光装置及其制造方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020185965A1 (en) * | 2001-06-11 | 2002-12-12 | Lumileds Lighting, U.S., Llc | Phosphor-converted light emitting device |
CN102148321A (zh) * | 2011-01-24 | 2011-08-10 | 佛山电器照明股份有限公司 | Led白光荧光帽及其制造方法 |
CN102148319A (zh) * | 2011-01-24 | 2011-08-10 | 佛山电器照明股份有限公司 | 一种大功率白光led光源封装结构 |
CN102270730A (zh) * | 2011-07-27 | 2011-12-07 | 晶科电子(广州)有限公司 | 一种无金线的led器件 |
CN102447016A (zh) * | 2010-10-09 | 2012-05-09 | 佛山市奇明光电有限公司 | 发光二极管结构及其制作方法 |
CN102751424A (zh) * | 2011-04-21 | 2012-10-24 | 三星Led株式会社 | 发光器件模块及其制造方法 |
CN103474542A (zh) * | 2012-06-05 | 2013-12-25 | 华新丽华股份有限公司 | 发光二极管及其制造方法 |
CN203746899U (zh) * | 2014-01-26 | 2014-07-30 | 上海瑞丰光电子有限公司 | 一种led封装结构及照明设备 |
-
2014
- 2014-01-26 CN CN201410038354.5A patent/CN103855278B/zh not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020185965A1 (en) * | 2001-06-11 | 2002-12-12 | Lumileds Lighting, U.S., Llc | Phosphor-converted light emitting device |
CN102447016A (zh) * | 2010-10-09 | 2012-05-09 | 佛山市奇明光电有限公司 | 发光二极管结构及其制作方法 |
CN102148321A (zh) * | 2011-01-24 | 2011-08-10 | 佛山电器照明股份有限公司 | Led白光荧光帽及其制造方法 |
CN102148319A (zh) * | 2011-01-24 | 2011-08-10 | 佛山电器照明股份有限公司 | 一种大功率白光led光源封装结构 |
CN102751424A (zh) * | 2011-04-21 | 2012-10-24 | 三星Led株式会社 | 发光器件模块及其制造方法 |
CN102270730A (zh) * | 2011-07-27 | 2011-12-07 | 晶科电子(广州)有限公司 | 一种无金线的led器件 |
CN103474542A (zh) * | 2012-06-05 | 2013-12-25 | 华新丽华股份有限公司 | 发光二极管及其制造方法 |
CN203746899U (zh) * | 2014-01-26 | 2014-07-30 | 上海瑞丰光电子有限公司 | 一种led封装结构及照明设备 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105322073A (zh) * | 2014-08-11 | 2016-02-10 | 大连精拓光电有限公司 | 新型无打线led灯丝制作技术 |
CN105322073B (zh) * | 2014-08-11 | 2018-08-07 | 深圳市新光台电子科技股份有限公司 | 新型无打线led灯丝制作技术 |
WO2016037466A1 (zh) * | 2014-09-09 | 2016-03-17 | 厦门市三安光电科技有限公司 | 发光二极管器件及其制作方法 |
CN104979447A (zh) * | 2015-07-16 | 2015-10-14 | 华天科技(昆山)电子有限公司 | 倒装led封装结构及制作方法 |
CN104979447B (zh) * | 2015-07-16 | 2018-10-19 | 华天科技(昆山)电子有限公司 | 倒装led封装结构及制作方法 |
WO2021110019A1 (zh) * | 2019-12-02 | 2021-06-10 | 亿光电子工业股份有限公司 | Led发光装置及其制造方法 |
Also Published As
Publication number | Publication date |
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CN103855278B (zh) | 2017-01-04 |
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TR01 | Transfer of patent right |
Effective date of registration: 20210115 Address after: 518000, 6th floor, building 1, Tianliao community, Gongming office, Guangming New District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Refond Optoelectronics Co.,Ltd. Address before: 201306 room 8650, building 1, 1758, Luchaogang Road, Luchaogang Town, Pudong New Area, Shanghai Patentee before: SHANGHAI RUIFENG OPTOELECTRONICS Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170104 Termination date: 20220126 |