CN103855276B - A kind of LED filament and illuminator - Google Patents
A kind of LED filament and illuminator Download PDFInfo
- Publication number
- CN103855276B CN103855276B CN201410002092.7A CN201410002092A CN103855276B CN 103855276 B CN103855276 B CN 103855276B CN 201410002092 A CN201410002092 A CN 201410002092A CN 103855276 B CN103855276 B CN 103855276B
- Authority
- CN
- China
- Prior art keywords
- transparency carrier
- groove
- led wafer
- fluorescent glue
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000969 carrier Substances 0.000 claims abstract description 43
- 239000003292 glue Substances 0.000 claims abstract description 29
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000011222 crystalline ceramic Substances 0.000 description 1
- 229910002106 crystalline ceramic Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Abstract
The present invention is applicable to lighting technical field, provide a kind of LED filament and illuminator, described LED filament includes transparency carrier, the LED wafer being fixedly arranged on described one of them surface of transparency carrier and in order to cover the fluorescent glue of described LED wafer, described transparency carrier sets to fill the groove of fluorescent glue, and described LED wafer both sides sets at least one groove respectively；Described groove is arranged along transparency carrier length direction, and its degree of depth exceedes the 1/5 of described transparency carrier thickness.The coloured light that the most described LED wafer sends excites fluorescent glue to produce the light of required color in transparency carrier enters groove, penetrates from described transparency carrier side afterwards, thus avoids the problem that transparency carrier filament product coloured light is revealed.Thus, this LED filament can be widely used for various illuminator, and illuminating effect is splendid.
Description
Technical field
The invention belongs to lighting technical field, particularly relate to a kind of LED filament and illuminator.
Background technology
Due to the 360 ° of luminescences of LED filament product needed, general substrate is chosen as transparency carrier, and material is
Bright pottery or glass etc., the coloured light that chip sends, by penetrating from sidewall inside substrate, affects visual effect.
Summary of the invention
The purpose of the embodiment of the present invention is to provide a kind of LED filament, it is intended to solve existing LED filament easy
Problem in leakage coloured light.
The embodiment of the present invention is achieved in that a kind of LED filament, including transparency carrier, be fixedly arranged on described
The LED wafer on one of them surface of transparency carrier and in order to cover the fluorescent glue of described LED wafer, described
Transparency carrier sets to fill the groove of fluorescent glue, and described LED wafer both sides sets at least one groove respectively；
Described groove is arranged along transparency carrier length direction, and its degree of depth exceedes the 1/5 of described transparency carrier thickness.
The another object of the embodiment of the present invention is to provide a kind of illuminator, and described illuminator uses above-mentioned
LED filament.
Embodiment of the present invention LED wafer both sides on the transparent substrate sets at least one respectively in order to fill fluorescence
The groove of glue, its degree of depth exceedes the 1/5 of described transparency carrier thickness, the color that the most described LED wafer sends
Light excites fluorescent glue to produce the light of required color, afterwards from described transparency carrier in transparency carrier enters groove
Side is penetrated, thus avoids the problem that transparency carrier filament product coloured light is revealed.Thus, this LED filament
Can be widely used for various illuminator, illuminating effect is splendid.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED filament one of which embodiment that the present invention provides；
Fig. 2 is the structural representation of the LED filament another kind embodiment that the present invention provides；
Fig. 3 is the structural representation of the LED filament another embodiment that the present invention provides；
Fig. 4 is the top view of LED filament shown in Fig. 3.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing and reality
Execute example, the present invention is further elaborated.Only should be appreciated that specific embodiment described herein
Only in order to explain the present invention, it is not intended to limit the present invention.
Embodiment of the present invention LED wafer both sides on the transparent substrate sets at least one respectively in order to fill fluorescence
The groove of glue, its degree of depth exceedes the 1/5 of described transparency carrier thickness, the color that the most described LED wafer sends
Light excites fluorescent glue to produce the light of required color, afterwards from described transparency carrier in transparency carrier enters groove
Side is penetrated, thus avoids the problem that transparency carrier filament product coloured light is revealed.
Below in conjunction with specific embodiment, the realization of the present invention is described in detail.
As shown in figures 1-4, the LED filament that the embodiment of the present invention provides includes transparency carrier 1, is fixedly arranged on institute
State the LED wafer 2 on one of them surface of transparency carrier 1 and in order to cover the fluorescence of described LED wafer 2
Glue 31, described transparency carrier 1 sets to fill the groove 4 of fluorescent glue 32, described LED wafer 2 both sides
Set at least one groove 4 respectively；Described groove 4 is arranged along transparency carrier 1 length direction, and its depth S surpasses
Cross the 1/5 of described transparency carrier 1 thickness.The coloured light that the most described LED wafer 2 sends is through transparency carrier 1
Excite fluorescent glue 32 to produce the light of required color in entering groove 4, penetrate from described transparency carrier 1 side afterwards
Go out, thus avoid the problem that transparency carrier filament product coloured light is revealed.
Generally, described transparency carrier 1 is made of clear material, such as crystalline ceramics, glass etc., transparency > 10%;
Substrate surface makes metallic circuit, and wafer is installed in substrate surface, is interconnected with external electrical by metallic circuit.
Described fluorescent glue is the thermosets being mixed with fluorescent material, such as silica gel, epoxy resin etc..Wherein, described
The shape of cross section of groove 4 can be other shapes such as square, oval, and it can pass through machining, or
It it is etching or one-body molded during substrate manufacture.
As one of them embodiment of the present invention, when each groove 4 is arranged with LED wafer 2 homonymy, it is filled in
The fluorescent glue 32 of each groove 4 is one-body molded, as shown in Figure 1 with the fluorescent glue 31 covering LED wafer 2.
So enhance described fluorescent glue 32 and adhere to the firmness of transparency carrier 1.
As another embodiment of the present invention, if each groove 4 and LED wafer 2 heteropleural are arranged, it is filled in
The fluorescent glue 32 of each groove 4 is one-body molded, as shown in Figure 2.Similarly, described fluorescent glue is so enhanced
32 firmness adhering to transparency carrier 1.
As further embodiment of the present invention, described transparency carrier 1 sets 2N groove 4, and N is for being more than or equal to
The natural number of 2；The most N number of groove 4 is arranged with LED wafer 2 homonymy, is filled in the fluorescence of each groove 4
Glue is one-body molded with the fluorescent glue covering LED wafer 2；Remaining N number of groove 4 and LED wafer 2 heteropleural
Arranging, the fluorescent glue being filled in each groove 4 is one-body molded.As shown in Figure 3,4, described transparency carrier 1
If 4 grooves, wherein 2 grooves are arranged with LED wafer 2 homonymy, be filled in the fluorescent glue of each groove with
The fluorescent glue covering LED wafer is one-body molded；Another 2 grooves are arranged with LED wafer 2 heteropleural, fill
One-body molded in the fluorescent glue of each groove.Wherein, heteropleural is arranged and distance D between adjacent groove is less than
The thickness T of described transparency carrier, so reduces the probability that coloured light leaks from transparency carrier, solves filament
Product coloured light leakage problem.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all at this
Any amendment, equivalent and the improvement etc. made within bright spirit and principle, should be included in the present invention
Protection domain within.
Claims (5)
1. a LED filament, including transparency carrier, is fixedly arranged on described one of them surface of transparency carrier
LED wafer and in order to cover the fluorescent glue of described LED wafer, it is characterised in that described transparency carrier sets
In order to fill the groove of fluorescent glue, described LED wafer both sides sets at least one groove respectively；Described groove
For 2N, N is the natural number more than or equal to 2；The most N number of groove is arranged with LED wafer homonymy, its
Remaining N number of groove is arranged with LED wafer heteropleural, and described groove is arranged along transparency carrier length direction, and it is deep
Degree exceedes the 1/5 of described transparency carrier thickness.
2. LED filament as claimed in claim 1, it is characterised in that be filled in and LED wafer homonymy
Each groove fluorescent glue with cover LED wafer fluorescent glue one-body molded.
3. LED filament as claimed in claim 1, it is characterised in that be filled in and LED wafer heteropleural
The fluorescent glue of each groove one-body molded.
4. LED filament as claimed in claim 1, it is characterised in that heteropleural is arranged and adjacent groove
Between distance less than the thickness of described transparency carrier.
5. an illuminator, it is characterised in that described illuminator uses as arbitrary in Claims 1 to 4
LED filament described in Xiang.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410002092.7A CN103855276B (en) | 2014-01-02 | A kind of LED filament and illuminator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410002092.7A CN103855276B (en) | 2014-01-02 | A kind of LED filament and illuminator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103855276A CN103855276A (en) | 2014-06-11 |
| CN103855276B true CN103855276B (en) | 2016-11-30 |
Family
ID=
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201265758Y (en) * | 2008-07-01 | 2009-07-01 | 研晶光电股份有限公司 | Improved LED structure |
| CN103187514A (en) * | 2012-09-17 | 2013-07-03 | 中国科学院福建物质结构研究所 | LED (light-emitting diode) package structure |
| CN203351659U (en) * | 2013-07-31 | 2013-12-18 | 广州硅能照明有限公司 | Adjustable color temperature COB light source module |
| CN203733834U (en) * | 2014-01-02 | 2014-07-23 | 深圳市瑞丰光电子股份有限公司 | LED filament and lighting device |
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201265758Y (en) * | 2008-07-01 | 2009-07-01 | 研晶光电股份有限公司 | Improved LED structure |
| CN103187514A (en) * | 2012-09-17 | 2013-07-03 | 中国科学院福建物质结构研究所 | LED (light-emitting diode) package structure |
| CN203351659U (en) * | 2013-07-31 | 2013-12-18 | 广州硅能照明有限公司 | Adjustable color temperature COB light source module |
| CN203733834U (en) * | 2014-01-02 | 2014-07-23 | 深圳市瑞丰光电子股份有限公司 | LED filament and lighting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI604239B (en) | Color conversion substrate, method of fabricating the same, and display device including the same | |
| JP2015079805A (en) | Light-emitting device | |
| TW201717334A (en) | Package structure and method of manufacture | |
| EP2466658A3 (en) | LED including a phosphor layer, LED package and methods of manufacturing the same | |
| CN103872224A (en) | Novel LED (Light Emitting Diode) illuminating element | |
| JP2014072213A (en) | Light-emitting device and process of manufacturing the same | |
| CN103474559A (en) | Fluorescent plate and preparation method thereof | |
| CN102664229B (en) | Light emitting diode light source structure | |
| JP2013187245A (en) | Semiconductor light-emitting device | |
| CN103855276B (en) | A kind of LED filament and illuminator | |
| CN103851388B (en) | A kind of LED filament substrate and illuminator | |
| WO2017086535A1 (en) | Method for manufacturing three-dimensional phosphor layer | |
| RU2019119799A (en) | COATING SYSTEM AND PRODUCTS PRODUCED IN IT | |
| CN201561293U (en) | LED decoration lighting and light-emitting structure | |
| CN203733834U (en) | LED filament and lighting device | |
| CN103855276A (en) | LED lamp filament and illumination device | |
| CN103591480B (en) | Light emitting diode illuminating apparatus | |
| EP2369223A3 (en) | Light-emitting device and illumination device | |
| CN104300067A (en) | A flexible LED package | |
| CN203466190U (en) | COB light source based on light conversion body | |
| CN103855143A (en) | LED lamp filament and light-emitting device | |
| CN103075667A (en) | Full-angle light emitting diode (LED) light source body and production process for same | |
| CN203733793U (en) | LED filament and light-emitting device | |
| TW201525348A (en) | LED light strip | |
| TWI576929B (en) | Package structure and method of manufacture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 Termination date: 20180102 |