CN203733834U - LED filament and lighting device - Google Patents
LED filament and lighting device Download PDFInfo
- Publication number
- CN203733834U CN203733834U CN201420004735.7U CN201420004735U CN203733834U CN 203733834 U CN203733834 U CN 203733834U CN 201420004735 U CN201420004735 U CN 201420004735U CN 203733834 U CN203733834 U CN 203733834U
- Authority
- CN
- China
- Prior art keywords
- groove
- led
- fluorescent glue
- led wafer
- transparency carrier
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model is applied to the field of lighting technology, and provides an LED filament and a lighting device. The LED filament comprises a transparent substrate, an LED wafer fixedly disposed on one surface of the transparent substrate, and fluorescent glue used for covering the LED wafer; the transparent substrate is provided with grooves used for being filled with the fluorescent glue; two sides of the LED wafer are respectively provided with at least one groove; and each groove is disposed along the length direction of the transparent substrate, and the depth of each groove exceeds 1/5 of the thickness of the transparent substrate. Colored light emitted from the LED wafer enters into the grooves through the transparent substrate and excites the fluorescent glue to generate light with required colors, then the light is ejected from side surfaces of the transparent substrate, and therefore the problem of colored light leakage of a filament product with a transparent substrate is prevented. Therefore, the LED filament can be widely applied to various lighting devices with a perfect lighting effect.
Description
Technical field
The utility model belongs to lighting technical field, relates in particular to a kind of LED filament and lighting device.
Background technology
Because 360 ° of LED filament product needed are luminous, general substrate is chosen as transparency carrier, and material is transparent ceramic or glass etc., and the coloured light that chip sends penetrates from sidewall by substrate inside, affects visual effect.
Utility model content
The object of the utility model embodiment is to provide a kind of LED filament, is intended to solve the problem that existing LED filament is easy to leak coloured light.
The utility model embodiment realizes like this, a kind of LED filament, comprise transparency carrier, be fixedly arranged on one of them surperficial LED wafer of described transparency carrier and in order to cover the fluorescent glue of described LED wafer, described transparency carrier establishes to fill the groove of fluorescent glue, and at least one groove is established respectively in described LED wafer both sides; Described groove arranges along transparency carrier length direction, and its degree of depth surpasses 1/5 of described transparency carrier thickness.
Another object of the utility model embodiment is to provide a kind of lighting device, and described lighting device adopts above-mentioned LED filament.
The utility model embodiment establishes respectively at least one in order to fill the groove of fluorescent glue in LED wafer both sides on transparency carrier, its degree of depth surpasses 1/5 of described transparency carrier thickness, the coloured light that described like this LED wafer sends fluorescence excitation glue in transparency carrier enters groove produces the light of required color, from described transparency carrier side, penetrate afterwards, thus the problem of having avoided transparency carrier filament product coloured light to reveal.Thereby this LED filament can be widely used in various lighting devices, illuminating effect is splendid.
Accompanying drawing explanation
Fig. 1 is the wherein structural representation of a kind of embodiment of the LED filament that provides of the utility model;
Fig. 2 is the structural representation of the another kind of embodiment of the LED filament that provides of the utility model;
Fig. 3 is the structural representation of another embodiment of LED filament of providing of the utility model;
Fig. 4 is the vertical view of the filament of LED shown in Fig. 3.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
The utility model embodiment establishes respectively at least one in order to fill the groove of fluorescent glue in LED wafer both sides on transparency carrier, its degree of depth surpasses 1/5 of described transparency carrier thickness, the coloured light that described like this LED wafer sends fluorescence excitation glue in transparency carrier enters groove produces the light of required color, from described transparency carrier side, penetrate afterwards, thus the problem of having avoided transparency carrier filament product coloured light to reveal.
Below in conjunction with specific embodiment, realization of the present utility model is described in detail.
As shown in Fig. 1～4, the LED filament that the utility model embodiment provides comprises transparency carrier 1, be fixedly arranged on described transparency carrier 1 one of them surperficial LED wafer 2 and in order to cover the fluorescent glue 31 of described LED wafer 2, described transparency carrier 1 establishes to fill the groove 4 of fluorescent glue 32, and at least one groove 4 is established respectively in described LED wafer 2 both sides; Described groove 4 is along transparency carrier 1 length direction setting, and its depth S surpasses 1/5 of described transparency carrier 1 thickness.The coloured light that described like this LED wafer 2 sends enters through transparency carrier 1 light that the interior fluorescence excitation glue 32 of groove 4 produces required color, from described transparency carrier 1 side, penetrates afterwards, thus the problem of having avoided transparency carrier filament product coloured light to reveal.
Conventionally, described transparency carrier 1 is made by transparent material, as transparent ceramic, and glass etc., transparency >10%; Substrate surface is made metallic circuit, and wafer is installed in substrate surface, interconnected by metallic circuit and external electrical.Described fluorescent glue is the thermosets that is mixed with fluorescent material, as silica gel, and epoxy resin etc.Wherein, the shape of cross section of described groove 4 can be other shapes such as square, oval, and it can pass through machining, or one-body molded when etching or substrate manufacture.
As one of them embodiment of the utility model, when each groove 4 arranges with LED wafer 2 homonymies, the fluorescent glue 32 that is filled in each groove 4 is one-body molded with the fluorescent glue 31 that covers LED wafer 2, as shown in Figure 1.So strengthened the firmness that described fluorescent glue 32 adheres to transparency carrier 1.
As another embodiment of the utility model, if when each groove 4 arranges with LED wafer 2 heteropleurals, the fluorescent glue 32 that is filled in each groove 4 is one-body molded, as shown in Figure 2.Similarly, so strengthened the firmness that described fluorescent glue 32 adheres to transparency carrier 1.
As another embodiment of the utility model, described transparency carrier 1 is established 2N groove 4, and N is more than or equal to 2 natural number; Wherein N groove 4 and the 2 homonymy settings of LED wafer, the fluorescent glue that is filled in each groove 4 is one-body molded with the fluorescent glue that covers LED wafer 2; All the other N groove 4 and the 2 heteropleural settings of LED wafer, the fluorescent glue that is filled in each groove 4 is one-body molded.As shown in Figure 3,4, described transparency carrier 1 is established 4 grooves, wherein 2 grooves and the 2 homonymy settings of LED wafer, and the fluorescent glue that is filled in each groove is one-body molded with the fluorescent glue that covers LED wafer; Another 2 grooves and the 2 heteropleural settings of LED wafer, the fluorescent glue that is filled in each groove is one-body molded.Wherein, the distance D between heteropleural setting and adjacent groove is less than the thickness T of described transparency carrier, has so reduced the probability that coloured light leaks from transparency carrier, solves filament product coloured light leakage problem.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (6)
1. a LED filament, comprise transparency carrier, be fixedly arranged on one of them surperficial LED wafer of described transparency carrier and in order to cover the fluorescent glue of described LED wafer, it is characterized in that, described transparency carrier establishes to fill the groove of fluorescent glue, and at least one groove is established respectively in described LED wafer both sides; Described groove arranges along transparency carrier length direction, and its degree of depth surpasses 1/5 of described transparency carrier thickness.
2. LED filament as claimed in claim 1, is characterized in that, when each groove and LED wafer homonymy arrange, the fluorescent glue that is filled in each groove is one-body molded with the fluorescent glue that covers LED wafer.
3. LED filament as claimed in claim 1, is characterized in that, when each groove and LED wafer heteropleural arrange, the fluorescent glue that is filled in each groove is one-body molded.
4. LED filament as claimed in claim 1, is characterized in that, described transparency carrier is established 2N groove, and N is more than or equal to 2 natural number; Wherein N groove and LED wafer homonymy arrange, and the fluorescent glue that is filled in each groove is one-body molded with the fluorescent glue that covers LED wafer; All the other N groove and LED wafer heteropleural arrange, and the fluorescent glue that is filled in each groove is one-body molded.
5. LED filament as claimed in claim 4, is characterized in that, the distance between heteropleural setting and adjacent groove is less than the thickness of described transparency carrier.
6. a lighting device, is characterized in that, described lighting device adopts the LED filament as described in any one in claim 1～5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420004735.7U CN203733834U (en) | 2014-01-02 | 2014-01-02 | LED filament and lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420004735.7U CN203733834U (en) | 2014-01-02 | 2014-01-02 | LED filament and lighting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203733834U true CN203733834U (en) | 2014-07-23 |
Family
ID=51203882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420004735.7U Expired - Fee Related CN203733834U (en) | 2014-01-02 | 2014-01-02 | LED filament and lighting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203733834U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103855276A (en) * | 2014-01-02 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | LED lamp filament and illumination device |
| CN103855276B (en) * | 2014-01-02 | 2016-11-30 | 深圳市瑞丰光电子股份有限公司 | A kind of LED filament and illuminator |
-
2014
- 2014-01-02 CN CN201420004735.7U patent/CN203733834U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103855276A (en) * | 2014-01-02 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | LED lamp filament and illumination device |
| CN103855276B (en) * | 2014-01-02 | 2016-11-30 | 深圳市瑞丰光电子股份有限公司 | A kind of LED filament and illuminator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140723 Termination date: 20180102 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |