CN103846786A - Polishing pad - Google Patents
Polishing pad Download PDFInfo
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- CN103846786A CN103846786A CN201310425342.3A CN201310425342A CN103846786A CN 103846786 A CN103846786 A CN 103846786A CN 201310425342 A CN201310425342 A CN 201310425342A CN 103846786 A CN103846786 A CN 103846786A
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- Prior art keywords
- polysiloxane
- grinding
- grinding pad
- surface roughness
- adsorption layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a polishing pad which is formed in such a manner that an absorbing material containing a base material and an absorbing layer is joined to a polishing layer. The absorbing layer comprises a composition formed by crosslinking of polysiloxane and the like with straight-chain polysiloxane of vinyl only arranged at two tail ends. The average value Sa of surface roughness of the absorbing layer is within the range from 0.02 microns to 0.06 microns. Preferably, the uniform surface roughness of the absorbing layer is provided. Additionally, the difference between the surface roughness (Sc) at the center portion of the absorbing layer and Sa and the difference between the surface roughness (So) at the end portion of the absorbing layer and Sa are both below 0.02 microns. Furthermore, the base material of the absorbing material is preferably within the range from 210 MPa to 290 MPa in breaking strength and within the range from 80% to 130% in breaking depth. The polishing pad provided with the absorbing layer has following advantages: a polishing surface with higher precision is formed; and the polishing pad adapts to a large-area polishing surface.
Description
Technical field
The present invention relates to a kind of grinding pad, its use is polished in the grinding steps of member at the semiconductor chip used such as semiconductor device, electronic unit etc.More specifically, also relate to a kind of grinding pad, it can promote operating efficiency in the attrition process that is polished member, can improve the flatness of abradant surface simultaneously.
Background technology
Semiconductor chip, glass substrate for display, for hard disk in the manufacturing process of the semiconductor devices such as substrate, electronic unit, comprise the grinding steps for its surperficial planarization, mirror-polishing.In grinding steps, generally make to be polished member and be retained on a platform that grinds device, and grinding pad is fixed on to another platform, supply with slurry on one side, one side makes to be polished member and grinding pad relatively slides and carries out with the state of pressurization.
At this, to regard to the fixing means of platform, be to stick together fixing by sticking together the adhesive agents such as band with regard to grinding pad in the past.But this fixing means is rather consuming time on the fixed operation of grinding pad or exchanging operation, become the main cause of the operating efficiency that significantly reduces grinding steps.That is to say, grinding pad is sticked together while being fixed on platform, in order to ensure the flatness of grinding pad, must note on one side making not producing air layer between platform and grinding pad, attach at leisure on one side.Then, platform and sticking together while forming air layer between band, must will stick together that band is temporarily peeled off and air layer is eliminated after attach once again, cause leeway.
In addition, in the exchanging operation of grinding pad, old grinding pad need to be peeled off from platform, but at this moment be had adhesive agent and remain in the situation of platform.Now, before fixing new grinding pad, the step that the adhesive agent that remains in platform need to be used solvent etc. to remove and clean, thus make exchanging operation consuming time.
With respect to the grinding pad of this kind dependence adhesive agent in the past, the inventor etc. have developed a kind of grinding pad (patent documentation 1) of the fix/exchanging operation that can easily carry out grinding pad.This grinding pad as shown in Figure 2, is the adsorption material that the back side (one side of platform side) at grinding layer is provided with specific formation.This adsorption material, as its literal meaning, is fixed on grinding pad on platform by its suction-operated, different from the mode of adhesive agent in the past used (rely on stickiness and fix), while peeling off, can not remain residue from platform.And attaching again after can easily peeling off, therefore can successfully carry out peeling off/fixing of grinding pad, and can carry out efficiently exchanging operation.
[prior art document]
[patent documentation]
No. 3166396 description of [patent documentation 1] Japanese new patent registration
Due to the densification of semiconductor device, high very thinization, therefore strict gradually for the requirement of the high flat degree of abrasive article.Conventionally, for the requirement of grinding precision, think because be polished material abradant surface environment and improve, that especially improves because of the characteristic of grinding agent (slurry) is in the majority.
But, also should consider that the state of grinding pad, on the impact of grinding precision, especially considers in recent years, the ever-larger diameters of chip, display board, the development of large area, and only rely on the improvement of grinding agent and be difficult to abundant adaptation.At this, the present invention discloses a kind of grinding pad that possesses described adsorption layer, and it can help the high precision int of abradant surface, and can adapt to the large area of abradant surface.
Summary of the invention
(problem that invention wish solves)
The inventor etc. are for described object, and the formation of the grinding pad that possesses adsorption material of inventing according to the inventor etc., adjusts the characteristic of each formation and investigate its effect to nonferromagnetic substance.Especially be conceived to form the impact on nonferromagnetic substance of the adsorption layer of adsorption material and each characteristic of base material and investigate and draw the present invention.
That is to say, the present invention relates to a kind of grinding pad, it is by containing the adsorption material of base material and adsorption layer, engage and form with grinding layer, described adsorption layer comprises by being selected from the crosslinked constituent forming of at least one following polysiloxane: comprise the polysiloxane only at two ends with the straight chain shape polysiloxane of vinyl, be included in the polysiloxane that two ends and side chain have the straight chain shape polysiloxane of vinyl, comprise the polysiloxane only endways with the branched polysiloxane of vinyl, and be included in end and side chain and have the polysiloxane of the branched polysiloxane of vinyl, the mean value Sa of the surface roughness of described adsorption layer is 0.02 μ m to 0.06 μ m.
Below, describe the present invention in detail.As described, the invention relates to the surface roughness with the absorption aspect of contact with platform by restriction, and can carry out the grinding pad of suitable grinding operation.According to inventor's etc. the grinding pad that possesses adsorption material, in the time being fixed on platform, there is shearing force (horizontal constant intensity) height due to adsorption layer effect, and the low characteristic of peeling force (longitudinal constant intensity)., can bring into play and make the exchanging operation of grinding pad easy for the shearing force of platform and the relation of peeling force by this kind, suppress the effect of the grinding pad skew in grinding operation simultaneously.In addition, although low to the peeling force of platform, it only refers to meaning comparatively speaking, be not reach can make grinding pad in grinding operation come off or adsorption layer and platform between produce the faint power of the degree in space.
But, according to inventor's etc. investigation, the interface of adsorption layer and platform as described in state time, when the surface roughness of adsorption layer may be on grinding operation, the inner evenness of abrasive power causes small impact.Though little on the impact of this inner evenness, when abradant surface is required to the very thin flatness of superelevation or when the area that is polished face increases, can cause the impact that cannot ignore.
The grinding pad that possesses adsorption material of the present invention limits the surface roughness of adsorption layer because of described reason.About this surface roughness, need to be below 0.06 μ m.If exceed 0.06 μ m, may exert an influence to the inner evenness of abrasive power.On the other hand, about its lower limit, should not restricted limit, but the minimum of a value that can manufacture is 0.02 μ m.And, be arithmetic average roughness (Ra) in this surface roughness.
In addition, the surface roughness of adsorption layer means the mean value in absorption aspect, is the mean value for the surface roughness measurement value of multiple parts such as central part, end (peripheral part) of adsorption layer.Preferably adopt the mean value for the surface roughness at 3, central part, the both ends of adsorption layer.Then,, in order to bring into play nonferromagnetic substance preferably, preferably the surface roughness of adsorption layer has uniformity.In particular to the surface roughness (Sc) of central part of adsorption layer and the surface roughness (So) of the end of adsorption layer, preferably poor the and So of Sc and Sa and the difference of Sa are all below 0.02 μ m.And about the surface roughness of the end of adsorption layer, preferably the two ends of grinding pad diameter two directions possess described relation.
About the material of adsorption layer, substantially identical with the described grinding pad in the past according to inventor etc.That is to say, stacked following constituent and forming, this constituent by be selected from only comprise two ends have the straight chain shape polysiloxane of vinyl polysiloxane, be included in two ends and side chain have vinyl straight chain shape polysiloxane polysiloxane, the polysiloxane that comprises the branched polysiloxane only endways with vinyl and be included in end and side chain has crosslinked the forming of at least one polysiloxane in the polysiloxane of branched polysiloxane of vinyl.
With regard to the concrete example of described polysiloxane, the example of straight chain shape polysiloxane can be enumerated the compound of [Chemical formula 1].In addition, the example of branched polysiloxane can be enumerated the compound of [Chemical formula 2].
[Chemical formula 1]
(in formula, R represents following organic group, and n represents integer)
[Chemical formula 2]
(in formula, R represents following organic group, and m, n represent integer)
In [Chemical formula 1], [Chemical formula 2], with regard to the concrete example of substituting group (R), can enumerate following univalent hydrocarbyl group: the alkyl such as methyl, ethyl, propyl group, the group that the aromatic radical such as phenyl, tolyl or the part or all of hydrogen atom being connected with the carbon atom of these groups obtain through the replacement such as halogen atom, cyano group, wherein, except the identical or different unsaturated group of aliphatic series that is unsubstituted or is substituted.Preferably at least 50 % by mole is methyl.Substituting group can be identical or different.In addition, this polysiloxane can be independent or two or more mixtures.
In addition, the number average molecular weight of the polysiloxane of formation adsorption layer is to have suitable suction-operated at 30000 to 100000 o'clock.But in the adjustment of surface roughness, the number average molecular weight of the polysiloxane using and the calcination temperature of fabrication stage can impact.In order easily to obtain suitable surface roughness, the number average molecular weight of polysiloxane preferably 30000 to 60000.
Then,, in the present invention, about the physical property of base material that forms adsorption material together with adsorption layer, preferably set certain limitation.Base material refers to guarantee the supporting member of the treatability that contains organic thin adsorption layer.Therefore, the use of original base material also reckons without the nonferromagnetic substance of grinding pad, but according to the inventor etc., by make it have suitable application fracture strength and elongation at break for base material, can bring into play nonferromagnetic substance preferably.At this, the physical property of the base material that should set is fracture strength and elongation at break, and preferably fracture strength is that 210MPa to 290MPa, elongation at break are 80% to 130%.More preferably fracture strength is that 210MPa to 240MPa, elongation at break are 110% to 130%.And, the value of measuring when this hot strength is dry.
Base material uses the flaky resin material with described fracture strength, elongation at break.Particularly, be the resins such as polyester, polyethylene, polystyrene, polypropylene, nylon, polyurethane, the sub-ethene of poly-dichloro, polyvinyl chloride.Preferably resin material is polyester, PET (PET), PEN (PEN), and that special good is PET.Base material can be individual layer and also can be the multi-ply construction of various kinds of resin.
Adsorption material is made up of adsorption layer and base material, and the thickness of adsorption layer is preferably 20 μ m to 30 μ m.In addition, the thickness of base material is preferably 50 μ m to 200 μ m.Base material is preferably adjacent to and engages with adsorption layer.
The making of adsorption material is the coating fluid that contains polysiloxane composition of wanting to become adsorption layer to be coated on base material and calcination makes polysiloxane crosslinked and form adsorption layer.Coating fluid comprises described straight chain shape, branched polyorganosiloxane compounds and crosslinking agent.Crosslinking agent is preferably known crosslinking agent, for example, can enumerate organic hydrogen polysiloxanes.Organic hydrogen polysiloxanes is in a molecule, at least to have three hydrogen atoms that are connected with silicon atom, in practicality, preferably contains in the molecule of 50 % by weight of total amount and has two ≡ SiH keys, and all the other have at least three ≡ SiH keys in molecule.
Coating fluid can contain cross-linking reaction platinum catalyst used.The known catalyst of the suitable use of platinum catalyst, for example, can enumerate that tetrachloro closes platinic acid, chlordene closes the chloroplatinic acids such as platinic acid, alcoholic compound, aldehyde compound or chloroplatinic acid and the complex salt of various alkene etc. of chloroplatinic acid.In addition, coating fluid can be arbitrary form of no-solvent type, solvent-borne type, emulsion-type.While using solvent-borne type coating fluid, preferably dry and except desolventizing after coating.Calcination after coating fluid coating, preferably in 120 DEG C to 180 DEG C heating 60 seconds to 150 seconds.
Grinding pad of the present invention is engaged in adsorption material by grinding layer and forms.The abrasive cloth that grinding layer uses general grinding pad to use.Nonwoven, the foam molding etc. that for example can use nylon, polyurethane, PET etc. to form.In addition, the shape of its surface (abradant surface) is not limited to smooth, can form aptly ditch keeping by grinding agent etc.The thickness that forms the abrasive cloth of grinding layer uses 0.5mm to 3mm.
The joint method of grinding layer and base material can be known method, for example, as long as use solid, adhesive agent etc. that both are engaged.
(effect of invention)
Grinding pad of the present invention, by the application of adsorption layer, can promote the exchange of grinding pad, the workability of fixed operation, and can seek the high precision int of abradant surface.
Brief description of the drawings
Fig. 1 is the schematic diagram of the grinding device that uses of embodiment;
Fig. 2 is the pie graph that explanation possesses the grinding pad of adsorption material.
Detailed description of the invention
Be below explanation suitable embodiment of the present invention.In embodiment, different each adsorption material is bonded on to grinding layer and makes grinding pad, assess its abrasive characteristic.
(making of adsorption material)
In the base material that contains various resin materials (PET, PEN, PVC) (thickness 50 μ m, size
the coating fluid that 810mm) coating contains the polysiloxane composition being made up of polysiloxane.Coating fluid is only to comprise at two ends and have the no-solvent type polysiloxane liquid that contains 0.6 weight portion crosslinking agent, 2 weight portion platinum catalysts in the polysiloxane (molecular weight 30000) of straight chain shape polysiloxane of vinyl in 100 weight portions.After this coating fluid is coated to base material, polysiloxane be cross-linked in 100 seconds and form adsorption layer in 150 DEG C to 160 DEG C calcination.The thickness of the adsorption layer after crosslinked is all 25 μ m.
(making of grinding pad)
The abrasive cloth of grinding layer is general-using type chamois leather abrasive cloth (model 7355-000F), is that staple length (nap length) is the circular abrasive cloth that 450 μ m, thickness are 1.37mm.Grinding layer and adsorption material are followed and the integrated grinding pad that becomes.Grinding layer and adsorption material be then to use acrylic acid series solid and engage.
For the various grinding pads of manufacturing, measure the surface roughness of adsorption layer.The mensuration of surface roughness is according to JIS B0601-1994, uses roughness tester, measures with actuating speed 0.1mm/ second, sampling (cutoff) value 0.08mm, measured length 1.6mm × 5.Then, after surface roughness measurement, use each grinding pad to carry out the grinding of silicon, assessment abrasive characteristic.This assessment thes contents are as follows and states.
(grinding scar assessment)
Grinding pad is attached to the platform of the grinding device shown in Fig. 1, actual grind as the silicon that is polished member (
8 inches).In grinding steps, slurry (Glanzox (Fujimart Co., Ltd. (Fujimi Incorporated) system) is diluted to 30 times with pure water) is splashed in (flow 150ml/ minute) grinding layer.Other grinding condition is as following.
. grinding pressure: 0.163kgf/cm
2.
. the rotary speed of grinding pad: 45rpm.
. be polished the rotary speed of member: 47rpm.
. the shake speed of head: 250mm/ minute.
. milling time: 3 minutes.
After grinding, the face that is polished of chip is cleaned with pure water, after dustless state is dry, observed abradant surface, calculate size and the quantity of scar, assess to subtract point-score from 100 points of full marks.Now, large scar subtracts point larger.About assessment result, using 95 points above 100 points following as " ◎ ", do not reach above 95 points as "○" using 90 points, do not reach above 90 points as " △ " using 85 points, further will not reach 85 points as "×".
(inner evenness assessment)
Grind the determining film thickness of the oxide-film on rear silicon surface, the uniformity of assessment abradant surface.The determining film thickness of oxide-film uses reflective film thickness measuring instrument (great Zhong Electronics Co., Ltd system).Inner evenness uses on silicon piles up the sample that has 1 μ m heat oxide film, grinds 1 minute with grinding condition same as described above, and the determining film thickness value before and after 25 ad-hoc locations from chip grind is tried to achieve grinding rate maximum (R
max) and grinding rate minimum of a value (R
min), calculate inner evenness according to following mathematical expression.About assessment result, using below 5% as " ◎ ", will exceed below 5% and 8% as "○", using below 10% as " △ ", will exceed 10% as "×".
[mathematical expression 1]
Inner evenness (%)=(R
max-R
min)/(R
max+ R
min) × 100
Above assessment result is shown in table 1.In addition, also carry out above physical property measurement and abrasive characteristic assessment for the grinding pad with adsorption material in the past as a comparative example.
[table 1]
Can confirm from table 1, for scar assessment all can be accepted with inner evenness both sides, as its necessary condition, must limit the mean value of the surface roughness of adsorption layer.Though this is that inner evenness is poor because the assessment of the scar of comparative example is good.Then, in order to make inner evenness precision higher, need ask the uniformity of the surface roughness of guaranteeing adsorption layer, preferably central part (Sc) is less with the difference of end (So).And, be suitable if make for fracture strength, the elongation at break of the base material of adsorption layer, demonstrate better abrasive characteristic.
(industrial utilizability)
As above explanation, grinding pad of the present invention possesses the convenience obtaining because of the setting of adsorption material on the one hand, and can form the good high-quality abradant surface of flatness.According to the present invention, for chip, the display board of ever-larger diameters, large areaization development, also can form high accuracy abradant surface.
Claims (5)
1. a grinding pad, it,, by by the adsorption material that contains base material and adsorption layer, engage and form with grinding layer, is characterized in that,
Described adsorption layer comprises by being selected from the crosslinked constituent forming of at least one following polysiloxane: only comprise two ends have the straight chain shape polysiloxane of vinyl polysiloxane, be included in two ends and side chain have vinyl straight chain shape polysiloxane polysiloxane, the polysiloxane that comprises the branched polysiloxane only endways with vinyl and be included in end and side chain has the polysiloxane of the branched polysiloxane of vinyl
The mean value Sa of the surface roughness of described adsorption layer is 0.02 μ m to 0.06 μ m.
2. grinding pad according to claim 1, it is characterized in that, the surface roughness (Sc) of the central part of described adsorption layer is all below 0.02 μ m with the surface roughness (So) of end and the difference of Sa of the poor and described adsorption layer of Sa.
3. grinding pad according to claim 1 and 2, is characterized in that, the thickness of described adsorption layer is 20 μ m to 30 μ m.
4. grinding pad according to claim 1 and 2, is characterized in that, it is that 210MPa to 290MPa, elongation at break are 80% to 130% resin that the base material of described adsorption material comprises fracture strength.
5. grinding pad according to claim 1 and 2, is characterized in that, the thickness of described base material is 50 μ m to 200 μ m.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-264968 | 2012-12-04 | ||
| JP2012264968A JP5765858B2 (en) | 2012-12-04 | 2012-12-04 | Polishing pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103846786A true CN103846786A (en) | 2014-06-11 |
| CN103846786B CN103846786B (en) | 2017-04-05 |
Family
ID=50855155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310425342.3A Active CN103846786B (en) | 2012-12-04 | 2013-09-17 | Grinding pad |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5765858B2 (en) |
| KR (1) | KR101604170B1 (en) |
| CN (1) | CN103846786B (en) |
| TW (1) | TWI515083B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111819033A (en) * | 2018-05-08 | 2020-10-23 | 丸石产业株式会社 | Polishing pad and polishing method using same |
| CN113382824A (en) * | 2019-03-20 | 2021-09-10 | 丸石产业株式会社 | Polishing apparatus platen, polishing apparatus, and polishing method |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105500186A (en) * | 2016-01-21 | 2016-04-20 | 苏州新美光纳米科技有限公司 | Polishing pad for wafer polishing and self-absorption method thereof |
| JP6917058B2 (en) * | 2017-06-06 | 2021-08-11 | 丸石産業株式会社 | Polishing method using a polishing pad provided with an adsorption layer |
| CN110869166B (en) * | 2017-07-11 | 2023-01-20 | 3M创新有限公司 | Abrasive article including conformable coating and polishing system formed therefrom |
| JP7026942B2 (en) * | 2018-04-26 | 2022-03-01 | 丸石産業株式会社 | Underlay for polishing pad and polishing method using the underlay |
| US20230100526A1 (en) * | 2020-02-07 | 2023-03-30 | Fujicopian Co.,Ltd. | Silicone adsorption film |
| JP7424729B2 (en) * | 2020-02-21 | 2024-01-30 | フジコピアン株式会社 | silicone adsorption film |
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| JP2008162240A (en) * | 2007-01-05 | 2008-07-17 | Fujicopian Co Ltd | Adhesion sheet |
| CN101850535A (en) * | 2009-01-06 | 2010-10-06 | 保谷株式会社 | Lens pad, lens pad manufacturing method, lens manufacturing method, and adhesive member |
| JP2010234458A (en) * | 2009-03-30 | 2010-10-21 | Fujibo Holdings Inc | Polishing pad |
| JP3166396U (en) * | 2010-12-20 | 2011-03-03 | 丸石産業株式会社 | Polishing pad |
| JP2011183496A (en) * | 2010-03-08 | 2011-09-22 | Meitec Corp | Protective cover for painting robot |
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| JP4414697B2 (en) * | 2003-08-05 | 2010-02-10 | 東洋インキ製造株式会社 | Polishing pad laminate and double-sided adhesive sheet |
| JP2011000671A (en) * | 2009-06-18 | 2011-01-06 | Okamoto Machine Tool Works Ltd | Polishing surface plate for substrate |
| JP5291647B2 (en) * | 2010-03-08 | 2013-09-18 | 株式会社岡本工作機械製作所 | Easy to replace and replace laminated polishing pad |
-
2012
- 2012-12-04 JP JP2012264968A patent/JP5765858B2/en active Active
-
2013
- 2013-08-21 KR KR1020130098861A patent/KR101604170B1/en active IP Right Grant
- 2013-09-17 CN CN201310425342.3A patent/CN103846786B/en active Active
- 2013-09-25 TW TW102134473A patent/TWI515083B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008162240A (en) * | 2007-01-05 | 2008-07-17 | Fujicopian Co Ltd | Adhesion sheet |
| CN101850535A (en) * | 2009-01-06 | 2010-10-06 | 保谷株式会社 | Lens pad, lens pad manufacturing method, lens manufacturing method, and adhesive member |
| JP2010234458A (en) * | 2009-03-30 | 2010-10-21 | Fujibo Holdings Inc | Polishing pad |
| JP2011183496A (en) * | 2010-03-08 | 2011-09-22 | Meitec Corp | Protective cover for painting robot |
| JP3166396U (en) * | 2010-12-20 | 2011-03-03 | 丸石産業株式会社 | Polishing pad |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111819033A (en) * | 2018-05-08 | 2020-10-23 | 丸石产业株式会社 | Polishing pad and polishing method using same |
| CN111819033B (en) * | 2018-05-08 | 2022-05-13 | 丸石产业株式会社 | Polishing pad and polishing method using same |
| CN113382824A (en) * | 2019-03-20 | 2021-09-10 | 丸石产业株式会社 | Polishing apparatus platen, polishing apparatus, and polishing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5765858B2 (en) | 2015-08-19 |
| KR20140071874A (en) | 2014-06-12 |
| CN103846786B (en) | 2017-04-05 |
| TW201422372A (en) | 2014-06-16 |
| TWI515083B (en) | 2016-01-01 |
| JP2014108498A (en) | 2014-06-12 |
| KR101604170B1 (en) | 2016-03-16 |
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