JP3166396U - Polishing pad - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a polishing pad which is easier to replace than the conventional one and can be reused even after being peeled off from a surface plate once before the end of its life. SOLUTION: A polishing pad 1 is provided on a sheet-shaped base material 2, a polishing cloth provided on one surface of the base material 2, and a vinyl group provided on the other surface of the base material 2, and vinyl groups are provided only at both ends. Silicone composed of linear polyorganosiloxane having, silicone composed of linear polyorganosiloxane having vinyl groups at both ends and side chains, silicone composed of branched polyorganosiloxane having vinyl groups only at the ends, and ends and It is provided with an adsorption layer 4 formed by cross-linking at least one type of silicone selected from silicones made of on-branch polyorganosiloxane having a vinyl group on the side chain. [Selection diagram] Fig. 2

Description

  The present invention relates to a polishing pad used for flattening the surface of a member to be polished such as a wafer.

  For example, when flattening or mirroring a member to be polished such as wafer, flat panel display substrate glass, LSI and flat panel display mask substrate, hard disk substrate, etc., the polishing pad is pressed against the surface to be polished of the member to be polished While the slurry (abrasive) is supplied between the two, the two are relatively moved (for example, rotated) to polish the surface to be polished of the member to be polished. In a polishing apparatus used for such a polishing process, conventionally, the polishing pad is fixed to the surface plate using an adhesive tape. That is, in the conventional polishing apparatus, the surface plate and the polishing pad are fixed by the adhesive material provided on the surface of the adhesive tape. As a conventional adhesive tape used when fixing a polishing pad to such a surface plate, the double-sided tape of patent document 1 is proposed, for example.

JP 2007-203400 A (summary, FIG. 1)

  Conventionally, since the polishing pad is fixed to the surface plate of the polishing apparatus using an adhesive tape (that is, an adhesive material), there is a problem that it takes time to replace the polishing pad.

  For example, when attaching a polishing pad to a surface plate, in order to ensure the flatness of the polishing pad, the polishing pad is placed on the surface plate so that there is no air layer between the surface plate and the polishing pad (more specifically, adhesive tape). It is necessary to paste. Here, when the polishing pad is attached to the surface plate using the adhesive tape, once the air layer is formed between the two, the state where the surface plate and the adhesive tape are attached by the adhesive material around the air layer Therefore, it is not easy to push the air layer out of the polishing sheet. For this reason, in the process of attaching the polishing pad to the surface plate using the adhesive tape, if an air layer is formed between the surface plate and the adhesive tape during the attaching operation, the adhesive tape near the air layer is removed. It is necessary to exfoliate and extrude air from this air layer and gradually apply the polishing pad to the surface plate. Therefore, in the conventional method of attaching the polishing pad to the surface plate using the adhesive tape, it takes time to apply the polishing pad to the surface plate.

  Further, when the polishing pad is replaced, it is necessary to peel off the old polishing pad from the surface plate. At this time, in the conventional method of attaching the polishing pad to the surface plate using the adhesive tape, the adhesive material remains on the surface plate after the old polishing pad is peeled off. For this reason, before attaching a new polishing pad to a surface plate, the cleaning process which removes the adhesive material remaining on the surface plate using a solvent etc. is needed. Therefore, in the conventional method of attaching the polishing pad to the surface plate using the adhesive tape, the cleaning process before attaching the polishing pad to the surface plate also takes time.

  Further, in the conventional method of attaching a polishing pad to a surface plate using an adhesive tape, once the polishing pad is peeled off from the surface plate, the polishing pad cannot be attached to the surface plate again. For this reason, in the conventional method of sticking the polishing pad to the surface plate using the adhesive tape, there is also a problem that the polishing pad before the life cannot be reused if the polishing pad before the life is peeled off from the surface plate. .

  The present invention has been made to solve the above-described problems, and is easier to replace than conventional, and can be reused once it has been removed from the surface plate and before the end of its service life. The purpose is to obtain a pad.

  A polishing pad according to the present invention includes a sheet-like base material, a polishing cloth provided on one surface of the base material, and a linear shape provided on the other surface of the base material and having vinyl groups only at both ends. Silicone made of polyorganosiloxane, silicone made of linear polyorganosiloxane having vinyl groups at both ends and side chains, silicone made of branched polyorganosiloxane having vinyl groups only at the ends, and vinyl at terminals and side chains And an adsorption layer formed by crosslinking at least one silicone selected from silicones composed of branched polyorganosiloxane having a group.

  For example, Japanese Patent Application Laid-Open No. 2004-26950 discloses a silicone made of a linear polyorganosiloxane having vinyl groups only at both ends, and a silicone made of a linear polyorganosiloxane having vinyl groups at both ends and side chains. An adhesive layer formed by crosslinking at least one silicone selected from the group consisting of: Further, for example, in JP-A-2008-162240, a silicone composed of a branched polyorganosiloxane having a vinyl group only at the terminal and a silicone composed of a branched polyorganosiloxane having a vinyl group at the terminal and side chains are selected. An adhesion layer formed by crosslinking at least one silicone is disclosed. These adhesion layers have an effect that when the adhesion member provided with the adhesion layer is peeled from the adherend member, the adhesion member can be peeled without leaving an adhesive material on the adherend member.

  A polishing pad according to the present invention is provided with the adhesion layer as an adsorption layer. As a result, the polishing pad according to the present invention can be adhered to the surface plate by vacuum-adsorbing the adsorption layer. For this reason, in the process of attaching the polishing pad to the surface plate, even if an air layer is formed between the surface plate and the adsorption layer during the attaching operation, without removing the adsorption layer near the air layer, Air can be pushed out of this air layer. Therefore, the polishing pad can be easily attached to the surface plate in a short time. Further, in the process of peeling off the old polishing pad from the surface plate, no adhesive material remains on the surface plate, so that a cleaning step before attaching a new polishing pad to the surface plate becomes unnecessary.

  In addition, the polishing pad according to the present invention can be adhered to the surface plate by vacuum-adsorbing the adsorption layer. Therefore, even if the polishing pad before the life is peeled off from the surface plate, the polishing pad before the life is reattached to the surface plate. It becomes possible to paste.

  Therefore, according to the present invention, it is possible to obtain a polishing pad that is easier to replace than in the past and that can be reused once it has been removed from the surface plate and before its lifetime.

1 is a front view showing an example of a polishing apparatus in which a polishing pad according to an embodiment of the present invention is used. It is a front view which shows another example of the grinding | polishing apparatus with which the polishing pad which concerns on embodiment of this invention is used. It is a longitudinal section showing a polishing pad concerning an embodiment of the invention. It is explanatory drawing for demonstrating the peeling force measuring method of the adsorption layer which concerns on embodiment of this invention. It is explanatory drawing for demonstrating an example of the affixing strength test method of the polishing pad which concerns on embodiment of this invention. It is a characteristic view which shows the test result of the sticking strength test shown in FIG. It is a characteristic view which shows the test result of another adhesion strength test method of the polishing pad which concerns on embodiment of this invention.

Embodiment.
The polishing pad 1 according to the present embodiment is used when polishing the surface of a member to be polished such as a wafer, for example, and a conventionally used polishing apparatus (that is, a conventional polishing pad is used). Polishing apparatus).

FIG. 1 is a front view showing an example of a polishing apparatus in which a polishing pad according to an embodiment of the present invention is used.
A polishing apparatus 10 shown in FIG. 1 is an apparatus that polishes one surface of a member to be polished 20 such as a wafer, and includes a surface plate 11 and a head 12. The surface plate 11 has, for example, a substantially disk shape, and is driven to rotate about the rotation shaft 11a. The polishing pad 1 according to the present embodiment is attached to the upper surface (attachment surface) of the surface plate 11. A detailed configuration of the polishing pad 1 and a method for attaching the polishing pad 1 to the surface plate 11 will be described later.

  The head 12 has a substantially disk shape, for example, and is driven to rotate about the rotation shaft 12a. The head 12 swings so as to reciprocate between the center side (rotating shaft 11a side) and the outer peripheral side of the surface plate 11. In the polishing apparatus 10 shown in FIG. 1, the diameter of the head 12 is approximately the same as the radius of the surface plate 11. A member to be polished 20 such as a wafer is attached to the lower surface (attachment surface) of the head 12.

  Each of the lower surface (attachment surface) of the head 12 and the upper surface (attachment surface) of the surface plate 11 is formed with a predetermined flatness. Further, the lower surface (bonding surface) of the head 12 and the upper surface (bonding surface) of the surface plate 11 are arranged with a predetermined parallelism. For this reason, the member 20 to be polished attached to the lower surface (attachment surface) of the head 12 is pressed against the polishing pad 1 attached to the upper surface (attachment surface) of the surface plate 11 with a predetermined pressure (polishing pressure). The surface to be polished (the lower surface in FIG. 1) of the member to be polished 20 can be processed to a predetermined flatness by rotating and swinging the head 12 and rotating the surface plate 11.

  Note that the polishing apparatus 10 shown in FIG. 1 is merely an example. For example, as shown in FIG. 2, the polishing pad 1 according to the present embodiment may be used for a polishing apparatus capable of simultaneously polishing both surfaces of a member 20 such as a wafer.

  A polishing apparatus 100 shown in FIG. 2 includes a lower surface plate 110 and an upper surface plate 120 for simultaneously polishing both surfaces of the member 20 to be polished. The lower surface plate 110 has, for example, a substantially disk shape, and is driven to rotate about the rotation shaft 111. In addition, an insertion shaft 112 for positioning with the upper surface plate 120 at the time of polishing is provided at a substantially central portion of the upper surface of the lower surface plate 110. For this reason, the polishing pad 1 having a substantially donut shape in plan view is attached to the upper surface (attachment surface) of the lower surface plate 110. Note that gear teeth are formed on a side surface portion of the insertion shaft 112 at a position facing an outer peripheral surface of a carrier 130 described later. The upper surface plate 120 has, for example, a substantially disk shape, and is driven to rotate about the rotation shaft 121. Further, an insertion hole 122 into which the insertion shaft 112 of the lower surface plate 110 is inserted is formed at a substantially central portion of the lower surface of the upper surface plate 120. When the upper surface plate 120 and the lower surface plate 110 before polishing are set, the insertion shaft 112 is inserted into the insertion hole 122 so that the lower surface plate 110 and the upper surface plate 120 are positioned. The polishing pad 1 having a substantially donut shape in plan view is also attached to the lower surface (attachment surface) of the upper surface plate 120.

  The member 20 to be polished is disposed on the upper surface of the polishing pad 1 held by the carrier 130 and attached to the lower surface plate 110. FIG. 2 shows a carrier 130 that can hold a plurality of members 20 to be polished. The carrier 130 has gear teeth formed on the outer peripheral surface thereof, and these teeth mesh with the teeth formed on the insertion shaft 112 of the lower surface plate 110. When the lower surface plate 110 rotates, the insertion shaft 112 functions as a sun gear, and the carrier 130 functions as a planetary gear. For this reason, when the lower surface plate 110 rotates, the carrier 130 rotates and revolves around the insertion shaft 112.

  When polishing the member 20 to be polished, the lower surface plate 110 is driven to rotate. As a result, the carrier 130 rotates and revolves around the insertion shaft 112. In this state, the upper surface plate 120 is lowered, pressed against the upper surface of the member 20 to be polished with a predetermined pressure (polishing pressure), and rotated to simultaneously polish both surfaces of the member 20 to be polished. The slurry is supplied from, for example, a supply port provided on the upper surface plate.

<Detailed configuration of polishing pad 1>
FIG. 3 is a longitudinal sectional view showing a polishing pad according to an embodiment of the present invention.
The polishing pad 1 according to the present embodiment is configured by laminating a polishing pad 3, a substrate 2, and an adsorption layer 4. The sheet-like substrate 2 is made of, for example, polyethylene terephthalate (PET). In addition, the material of the base material 2 is not limited to polyethylene terephthalate. For example, you may form the base material 2 using the sheet | seat of 1 layer or a multilayer structure which consists of polyethylene, a polystyrene, a polypropylene, nylon, urethane, a polyvinylidene chloride, a polyvinyl chloride, etc.

  A polishing cloth 3 is provided on one surface of the substrate 2 (upper surface in FIG. 3). The polishing cloth 3 is not particularly limited, and a known polishing cloth can be used. For example, a nonwoven fabric formed of nylon, polyurethane, polyethylene terephthalate, or the like may be used as the polishing cloth 3. Moreover, the joining method of the polishing cloth 3 and the base material 2 may be a known method, and for example, both may be joined using an adhesive or the like. In addition, although the surface (surface on the opposite side to the bonding surface of the base material 2) of the polishing cloth 3 according to the present embodiment has a flat shape, a groove for holding an abrasive is appropriately formed on the surface. Of course.

  An adsorption layer 4 is provided on the other surface of the substrate 2 (the surface opposite to the bonding surface of the polishing pad 3 and the lower surface in FIG. 3). This adsorbing layer 4 is formed on the other surface of the substrate 2 from a silicone composed of a linear polyorganosiloxane having vinyl groups only at both ends, and from a linear polyorganosiloxane having vinyl groups at both ends and side chains. And at least one silicone selected from a silicone comprising a branched polyorganosiloxane having a vinyl group only at the terminal, and a silicone comprising a branched polyorganosiloxane having a vinyl group at the terminal and side chain. The composition is formed by laminating.

  The linear polyorganosiloxane having vinyl groups only at both ends, which is one form of the silicone, is a compound represented by the following general formula (Formula 1).

(Wherein R represents the following organic group, and n represents an integer)

(Wherein R represents the following organic group, m and n represent an integer)
The organic group (R) bonded to the silicon atom other than the vinyl group may be different or the same, but specific examples include alkyl groups such as methyl, ethyl and propyl groups, and aryl groups such as phenyl and tolyl groups. Or a monovalent hydrocarbon group other than the same or different unsubstituted or substituted aliphatic unsaturated group in which part or all of the hydrogen atoms bonded to the carbon atoms of these groups are substituted with halogen atoms, cyano groups, or the like. Preferable examples include those having at least 50 mol% of a methyl group. These diorganopolysiloxanes may be used alone or as a mixture of two or more thereof.

  A silicone comprising a linear polyorganosiloxane having vinyl groups at both ends and side chains is a compound in which a part of R in the above general formula (Formula 1) is a vinyl group. Silicone composed of a branched polyorganosiloxane having a vinyl group only at the terminal is a compound represented by the above general formula (Formula 2). The silicone comprising a branched polyorganosiloxane having vinyl groups at the terminals and side chains is a compound in which a part of R in the above general formula (Formula 2) is a vinyl group.

  Here, a known crosslinking agent may be used for the crosslinking reaction. Examples of the crosslinking agent include organohydrogenpolysiloxane. Organohydrogenpolysiloxane has at least three hydrogen atoms bonded to silicon atoms in one molecule, but from a practical viewpoint, one having two ≡SiH bonds in the molecule is 50% by weight of the total amount. It is preferable that the remainder contains at least three ≡SiH bonds in the molecule.

  The platinum-based catalyst used for the crosslinking reaction may be a known one, including chloroplatinic acid such as chloroplatinic acid and chloroplatinic acid, alcohol compounds of chloroplatinic acid, aldehyde compounds or chloroplatinic acid and various olefins. And chain salts. The cross-linked silicone has flexibility such as a silicone gel, and this flexibility makes it easy to adhere to the adherend.

  Although the shape of the commercial item of silicone includes a solventless type, a solvent type, and an emulsion type, any type can be used. Above all, the solventless type is very advantageous in terms of safety, hygiene, and air pollution because it does not use a solvent. In addition, since the coating thickness of the adhesion layer is about several millimeters in some cases, solvent-type silicone and emulsion-type silicone take a great deal of energy to dry the solvent during coating, which is uneconomical. Therefore, it is preferable to use a solventless silicone as the silicone used in this embodiment.

  The adsorbing layer 4 as described above is obtained by vacuum adsorbing the adsorbing layer 4 to the affixing surface of the surface plate 11 of the polishing apparatus 10 as shown in JP-A Nos. 2002-183158 and 2007-203400. The following effects are obtained. That is, the force (peeling force) when peeling the adsorbing layer 4 from the affixing surface is almost zero even though the force (shearing force) for shifting the adsorbing layer 4 parallel to the affixing surface is high. It becomes. That is, the adsorption layer 4 has physical properties different from those of the weak adhesive sheet having a high shearing force and a slight peeling force.

For example, adsorption layer 4 and SUS plate polished product (measured based on JIS-B0601-1994, surface roughness Ra: long direction 0.13 μm, short direction 0.18 μm, surface roughness Ry: long direction 1.0 μm The shear force with the short length direction of 1.6 μm is 1.0 N / cm ² or more.

  Further, for example, when the peeling force of the adsorption layer 4 is measured by the following measurement method, the peeling force of the bonded layer of the adsorption layer 4 and a PET film having a thickness of 6 μm is less than 10 mN / 12.7 mm.

<Method of measuring peel force>
The sheet sample 31 provided with the adsorption layer 4 on both surfaces of the substrate 2 is cut into 12.7 mm × 50 mm. A PET film 33 having a thickness of 6 μm is cut to 12.7 mm × 130 mm and is aligned with the adhesion surface of the adsorption layer 4. The PET film 33 and the sheet sample 31 are pressure-bonded by reciprocating once from the top of the sheet sample 31 at a speed of about 300 mm using a manual pressure bonding apparatus described in JIS Z 0237. After leaving for 40 minutes after pressure bonding, the play portion of the PET film 33 is folded back 180 degrees, and the sheet sample 31 is attached to the measurement table 32 as shown in FIG. Then, the PET film 33 is peeled off at a speed of 300 mm per minute. Read the average peel force between the side lengths of 50 mm. Record the average of the values measured twice for each sample.

  In the middle of peeling the PET film 33, there is a phenomenon that the PET film 33 itself is peeled and charged, and the PET film 33 in the portion folded back 180 degrees and the PET film 33 in the portion in close contact with the adsorption layer 4 are attracted. Arise. When this phenomenon occurs, the peel force value increases and accurate measurement cannot be performed. Then, it peeled off, performing a static elimination process toward the PET film 33 peeled off using the portable static eliminator (Ishiyama Seisakusho Co., Ltd.).

  The adhesive peel strength test method specified in JIS K 6854 is a method in which a double-sided adhesive sheet is attached to an adherend SUS, and the double-sided adhesive sheet is peeled off and measured. However, since the peeling force of the sheet sample 31 according to the present embodiment (that is, the peeling force of the polishing pad 1) is a minimum value, the play portion of the sheet sample 31 that is closely attached to the SUS plate by the JIS method is 180. When trying to fold back, the entire sheet sample 31 peeled off instantaneously due to the strength of the waist of the base material 2 and could not be measured. Therefore, instead of taking the method of peeling the sheet sample 31 as in the above method, for convenience, a method was adopted in which a PET film 33 having a thin film thickness of 6 μm was adhered to the sheet sample 31 and peeled.

<Replacement work>
The replacement operation of the polishing pad 1 configured as described above is performed as follows.

  When the polishing pad 1 is attached to the upper surface (attachment surface) of the surface plate 11, the surface plate 11 is polished so that an air layer is not formed between the surface plate 11 and the polishing pad 1 (more specifically, the adsorption layer 4). It is necessary to paste the pad 1. If an air layer is formed between them, the flatness of the polishing surface (upper surface in FIG. 1) of the polishing pad 1 cannot be secured, and the member 20 to be polished cannot be polished with a desired flatness. .

  Here, in a conventional polishing pad that is attached to the surface of the surface plate using an adhesive tape, once an air layer is formed between the two, the periphery of the air layer is adhered to the surface plate by an adhesive material. Since the tape is stuck, it is not easy to push the air layer out of the polishing sheet. For this reason, if an air layer is formed between the surface plate and the adhesive tape during the pasting operation, the adhesive tape in the vicinity of the air layer is peeled off to extrude air from the air layer, and the polishing pad is gradually applied to the surface plate. Must be pasted. Therefore, with the conventional polishing pad that is attached to the surface of the surface plate using an adhesive tape, the process of attaching the polishing pad to the surface plate takes time.

  On the other hand, in the case of the polishing pad 1 according to the present embodiment, the polishing pad 1 is attached to the surface plate 11 by vacuum-adsorbing the adsorption layer 4 to the surface plate 11. Specifically, since the adsorbing layer 4 configured as described above has good wettability, when the adsorbing layer 4 is pressed against the surface plate 11, the adsorbing layer 4 is adsorbed so as to be attracted to the surface plate 11. . Thereby, the space between the adsorption layer 4 and the surface plate 11 is in a vacuum state, and the polishing pad 1 can be attached to the surface plate 11.

  At this time, even if an air layer is formed between the surface plate 11 and the adsorbing layer 4 during the pasting operation, the air layer is not in a state of being stuck by the adhesive material. The air can be pushed out from the air layer without removing the adsorption layer 4. Moreover, the polishing pad 1 which concerns on this Embodiment can extrude air from this air layer, without peeling off the adsorption layer 4 of the air layer vicinity, as mentioned above. For this reason, even when a small air layer is formed between the surface plate 11 and the polishing pad 1 after being attached, the air in the air layer is polished by the polishing pressure in the initial step of the polishing step (for example, rough polishing step). It is pushed out of the pad 1. Therefore, in the case of the polishing pad 1 according to the present embodiment, the polishing pad 1 can be easily attached to the surface plate 11 in a short time.

  When the polishing pad 1 reaches the end of its life, the polishing pad 1 that has reached the end of its life is peeled off from the surface plate 11 and a new polishing pad 1 is attached to the surface plate 11.

  Here, in a conventional polishing pad that is attached to an attachment surface of a surface plate using an adhesive tape, the adhesive material remains on the surface plate after the old polishing pad is peeled off. For this reason, before attaching a new polishing pad to a surface plate, the cleaning process which removes the adhesive material remaining on the surface plate using a solvent etc. is needed. Therefore, with a conventional polishing pad that is attached to the surface of the surface plate using an adhesive tape, the cleaning process before the polishing pad is attached to the surface plate also takes time.

  On the other hand, in the case of the polishing pad 1 according to the present embodiment, the polishing pad 1 is attached to the surface plate 11 by vacuum-adsorbing the adsorption layer 4 to the surface plate 11. For this reason, in the process of peeling the old polishing pad 1 from the surface plate 11, no adhesive remains on the surface plate 11. Therefore, a cleaning process before attaching a new polishing pad 1 to the surface plate 11 becomes unnecessary.

  In addition, since the polishing pad 1 according to the present embodiment is attached by vacuum-adsorbing the adsorption layer 4 to the surface plate 11, the once removed polishing pad 1 can be attached again. For this reason, the polishing pad 1 peeled off before the end of its life, such as during an evaluation test of the polishing pad 1, can be used again.

  As described above, the polishing pad 1 according to the present embodiment can be easily replaced in a short time. For example, a polishing pad used in a polishing apparatus for polishing a member to be polished such as a wafer has a diameter of about 1 to 2 m when it is large. In the case of such a large polishing pad, with a conventional polishing pad that is attached using an adhesive tape, the polishing pad can be replaced (the operation of attaching the polishing pad so that an air layer is not formed between the surface plate and the polishing pad). It took about 3-4 hours to clean the adhesive remaining on the panel. On the other hand, the polishing pad 1 according to the present embodiment can be easily attached to the surface plate 11 and does not require a cleaning operation before the polishing pad 1 is attached. The replacement work can be completed in a short time of about several minutes (for example, 5 minutes). Further, even a long polishing pad used in a polishing apparatus for polishing a member to be polished such as a wafer will reach the end of its life in several days. That is, it is necessary to replace the polishing pad at least once every few days. Therefore, it can be seen that the polishing pad 1 according to the present embodiment is a very useful polishing pad as compared with the conventional polishing pad.

<Performance evaluation test>
Then, it shows about the result of the performance evaluation test of the polishing pad 1 which concerns on this Embodiment.

  FIG. 5 is an explanatory diagram for explaining an example of the polishing pad adhesion strength test method according to the embodiment of the present invention. FIG. 6 is a characteristic diagram showing the test results of the adhesion strength test shown in FIG. In addition, in FIG. 6, the adhesion strength test result of the conventional polishing pad (more specifically, the polishing pad bonded using an acrylic adhesive tape) is also shown.

  In the affixing strength test shown in FIG. 5, for example, a steel affixing plate 35 is installed so that its affixing surface is vertical. The surface roughness of the attachment surface of the attachment plate 35 is 0.2 μm to 0.7 μm as measured based on JIS-B0601-1994, and the general surface of the polishing pad attachment surface of the surface plate of the polishing apparatus is used. It is equivalent to a typical surface roughness. Then, each of the polishing pad 1 according to the present embodiment and a conventional polishing pad (more specifically, a polishing pad attached using an acrylic adhesive tape) is attached to the attachment surface of the attachment plate 35, A weight M having a predetermined load was added to these polishing pads, and the polishing pad was left for a predetermined time to compare the bonding strengths of the two.

More specifically, two types of loads (14.4 N / cm ² and 18.7 N / cm ² ) were applied to the polishing pad 1 according to the present embodiment and the conventional polishing pad. That is, two types of shearing forces (14.4 N / cm ² and 18.7 N / cm ² ) were applied to the polishing pad 1 according to the present embodiment and the conventional polishing pad. Then, the polishing pad 1 according to the present embodiment to which each load (shearing force) was applied and the conventional polishing pad were left for 72 hours or 110 hours. Thereafter, it was observed whether the polishing pad 1 according to the present embodiment and the conventional polishing pad were peeled, floated, or misaligned. The two types of loads assume a general shearing force applied to the polishing pad during precision polishing or rough polishing. The standing time is assumed to be the life of the polishing pad (in other words, the time from sticking to peeling).

As shown in FIG. 6, when a load of 14.4 N / cm ² is applied and left for 72 hours, a change is observed in the pasting state in both the polishing pad 1 according to the present embodiment and the conventional polishing pad. None (no peeling, floating, misalignment, etc.). Similarly, in the case where the load was applied for 18.7 N / cm ² and left for 110 hours, similarly, in both the polishing pad 1 according to the present embodiment and the conventional polishing pad, no change was observed in the attached state. (Peeling, floating, misalignment, etc. did not occur).

FIG. 7 is a characteristic diagram showing the test results of another method for testing the adhesion of a polishing pad according to an embodiment of the present invention.
The test results shown in FIG. 7 are obtained by attaching the polishing pad 1 according to the present embodiment to the surface plate 11 of the polishing apparatus 10 shown in FIG. 1 and actually polishing the silicon wafer as the member 20 to be polished. The polishing rate of the wafer (that is, the flatness of the silicon wafer) is measured. The polishing conditions are
Polishing cloth 3: M-214 (manufactured by Maruishi Sangyo Co., Ltd.).
-Slurry: Glanzox (manufactured by Fujimi Incorporated) diluted 30 times with pure water.
Polishing pressure: 0.163 kgf / cm ² .
The rotational speed of the surface plate 11 (polishing pad 1): 40 rpm.
The rotational speed of the head 12 (the member to be polished 20): 41 rpm.
OSCL speed (swing speed of the head 12): 200 mm / min.
-Number of silicon wafers processed: 200.
A silicon wafer having a diameter of 300 mm was used.

  FIG. 7 shows the polishing rate for each position in the silicon wafer processed on the first, 50th, 100th, and 200th wafers. In other words, this polishing rate indicates the flatness of the surface to be polished of the silicon wafer. In addition, since the first processed silicon wafer is still processed with the polishing pad 1 in a new state, the flatness of the first processed silicon wafer is ensured to be a desired flatness. It will be a thing. From FIG. 7, it can be seen that the flatness of the silicon wafer processed to the 200th wafer is processed to the same flatness as the silicon wafer processed to the 1st wafer. From this, it can be seen that the polishing pad 1 according to the present embodiment does not peel off from the surface plate, floats, or shifts, and can be processed to a desired flatness over a long period of time.

  As described above, as shown in FIGS. 5 to 7, the polishing pad 1 according to the present embodiment can easily replace the polishing pad 1 in a short time, and can adhere to the surface to which the surface plate is attached. It can be seen that the member 20 to be polished can be stably polished as in the case of a conventional polishing pad attached using a tape.

  DESCRIPTION OF SYMBOLS 1 Polishing pad, 2 base material, 3 polishing cloth, 4 adsorption layer, 10 polishing apparatus, 11 surface plate, 11a rotating shaft, 12 head, 12a rotating shaft, 20 to-be-polished member, 31 sheet sample, 32 measuring stand, 33 PET Film (6 μm), 35 Adhering plate, 100 Polishing device, 110 Lower surface plate, 111 Rotating shaft, 112 Inserting shaft, 120 Upper surface plate, 121 Rotating shaft, 122 Inserting hole, 130 Carrier.

Claims (2)

A sheet-like substrate;
An abrasive cloth provided on one surface of the substrate;
Silicone made of linear polyorganosiloxane having vinyl groups only at both ends provided on the other surface of the base material, silicone made of linear polyorganosiloxane having vinyl groups at both ends and side chains, terminal An adsorption layer obtained by crosslinking at least one silicone selected from a silicone composed of a branched polyorganosiloxane having a vinyl group only and a silicone composed of a branched polyorganosiloxane having a vinyl group at its terminal and side chain;
A polishing pad comprising: The polishing pad according to claim 1, wherein the adsorption layer satisfies the following requirements.
A: The shearing force between the adsorption layer and the polished SUS plate is 1.0 N / cm ² or more (the polished SUS plate is measured according to JIS-B0601-1994, the surface roughness Ra: the longitudinal direction) 0.13 μm, short direction 0.18 μm, surface roughness Ry: long direction 1.0 μm, short direction 1.6 μm).
B: The peel force of the adhesive sheet and the PET film having a thickness of 6 μm bonded to each other is less than 10 mN / 12.7 mm (the peel force measurement method is a method based on the description in the present specification). ).

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