JP2006022168A - Pressure-sensitive adhesive support - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive support wherein the pressure-sensitive adhesive layer scarcely forms chips when objects to be supported are attached to or detached from the surface of the layer. <P>SOLUTION: The pressure-sensitive adhesive support is one which is composed of a substrate 12 and a pressure-sensitive adhesive layer laminated thereon and supports the objects 16 by pressure-sensitive adhesiveness on the surface of the layer 14, wherein the layer 14 comprises a cured product of a pressure-sensitive adhesive composition comprising an unvulcanized silicone rubber, a crosslinking component, a tackifying component, a platinum compound, and silica, and the silica has a specific surface area of at least 50 m<SP>2</SP>/g. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an adhesive support having an adhesive layer for supporting a support such as an electronic component with adhesive force, and more particularly to an adhesive support using a silicone-based adhesive as the adhesive layer.

  Conventionally, when an end face of an electronic component such as a chip capacitor is subjected to a treatment such as coating, it is necessary to expose a portion to be processed to support a large number of electronic components, and many supports have been proposed.

As such a support, the following Patent Document 1 discloses a predetermined vinyl group-containing organopolysiloxane, organohydrodiene polysiloxane, (CH ₂ ═CH) R ¹ ₂ SiO _0.5 unit, R ¹ ₃ SiO _0. There is described a support in which a flexible member layer obtained by curing a composition containing ₅ units and an organopolysiloxane containing SiO ₂ units and a platinum compound is formed, and a number of holes are provided in the flexible member. Here, a part of many electronic components is inserted into many holes formed in the flexible member layer, and the electronic component is supported by the elasticity of the flexible member layer.

  Patent Document 2 below describes a support in which an adhesive layer is provided on the surface of the support. In this support, the end face of the electronic component is supported by adhering to the adhesive surface. Here, unlike the support of Patent Document 1, it is not necessary to insert a part of many electronic components into a large number of fine holes, so it is not necessary to accurately form a large number of fine holes. Manufacture is easy, and the electronic components can be easily attached and detached during use.

Further, Patent Document 3 below describes that a large number of electronic components supported by adhesion on the surface of the adhesive layer are peeled off and removed by a detaching blade that moves relative to the surface of the adhesive layer in parallel. Has been. Here, since the electronic component is supported on the surface of the adhesive surface, it is easy to detach a large number of electronic components.
Japanese Patent Publication No. 3-76778 JP-A-4-291712 JP 2000-77772 A

  However, in a conventional support having an adhesive layer, when attaching and detaching a large number of electronic components supported on the surface of the adhesive layer, the surface of the adhesive layer is a member such as a blade used for attaching or detaching the electronic component itself or the electronic component. As a result, it is easy to generate shavings and residue from the adhesive component of the adhesive layer. There has been a problem that it adheres as a foreign substance and easily causes a product defect.

  Therefore, an object of the present invention is to provide an adhesive support that is less likely to be scraped off or left behind from the adhesive layer when the support is attached to or detached from the surface of the adhesive layer.

The invention according to claim 1, which solves the above-mentioned problem, is the pressure-sensitive adhesive layer in which the pressure-sensitive adhesive layer is provided on a substrate so as to support the support by the adhesive force of the surface of the pressure-sensitive adhesive layer. Is a cured product of a pressure-sensitive adhesive composition containing (a) silicone raw rubber, (b) a crosslinking component, (c) a pressure-sensitive adhesive component, (d) a platinum compound, and (e) silica. It has a specific surface area of 50 m ² / g or more.

  The invention according to claim 2 is characterized in that, in addition to the configuration according to claim 1, the supported body is an electronic component.

  The invention according to claim 3 is characterized in that, in addition to the structure according to claim 1 or 2, the pressure-sensitive adhesive surface comprising at least a part of the surface of the pressure-sensitive adhesive layer in contact with the supported body is a flat surface.

  According to a fourth aspect of the present invention, in addition to the structure according to any one of the first to third aspects, the body substrate is a hard member made of metal, resin, or ceramics. .

The invention according to claim 5 is characterized in that, in addition to the structure according to any one of claims 1 to 4, the specific surface area of the silica is 100 m ² / g or more and 400 m ² / g or less. .

According to the invention of any one of claims 1 to 5, since the adhesive layer is made of a cured product of a predetermined adhesive composition containing silica having a specific surface area of 50 m ² / g or more, the adhesive layer As a result, when the support is detached from the surface of the adhesive layer during use, the surface attaches or detaches the support or the support. Even if it is rubbed by a member for the purpose, it is not easily generated by scraping from the components constituting the adhesive layer due to the friction, in particular, from the component (c) that imparts the adhesiveness of the adhesive layer. Sex supports can be provided.

  In particular, according to the second aspect of the present invention, since the supported body supported by such an adhesive support is an electronic component, it is difficult for scraps or residue to adhere to the electronic component, resulting in product defects. It can be made difficult to do.

  Furthermore, according to the invention described in claims 3 to 5, since the pressure-sensitive adhesive surface comprising at least a part of the surface of the pressure-sensitive adhesive layer in contact with the substrate to be supported is a flat surface, When attaching and detaching, it is easy to move the supported body in a direction along the surface of the adhesive layer, or to apply a force in a direction along the surface of the adhesive layer to attach and detach the supported body. And even in such a use, since the effect of retaining the components constituting the adhesive layer in the adhesive layer is high, scraping or residue is hardly generated and it can be suitably used.

  Embodiments of the present invention will be described below.

  FIG.1 and FIG.2 shows the adhesive support body of this embodiment.

  In the figure, reference numeral 10 denotes an adhesive support formed in a flat plate shape, a plate-like base material 12 having strength against a load during use, and an adhesive layer 14 laminated on one surface of the base material 12. It is made up of.

  Such an adhesive support 10 is used to support a large number of electronic components 16 as supported bodies. For example, one end 16a of the electronic component 16 is supported on the surface of the adhesive layer 14 by an adhesive force. In this state, the other end portion 16b can be coated. Here, since the entire surface including the adhesive surface composed of the surface in contact with each electronic component 16 of the adhesive layer 14 is formed flat, each electronic component 16 is supported only by the adhesive force of the adhesive layer 14.

  Here, the flatness of the adhesive surface of the adhesive layer 14 is preferably 50 μm or less, and the surface roughness (Ra) is preferably 1 μm or less. This is because it is easy to ensure a contact area of the adhesive surface with the electronic component 16.

  Examples of the electronic component 16 include a finished product or an unfinished product such as a capacitor, a resistor, an inductor, an FPC, or a wafer.

  In order to support the electronic component 16 on the adhesive support 10 in this use, for example, a positioning member (not shown) that can place the electronic component 16 at a predetermined position on the surface of the adhesive layer 14 is brought into contact with or not in contact with the adhesive layer 14. The electronic component 16 can be placed in a predetermined position on the surface of the pressure-sensitive adhesive layer 14 while being used in contact with the pressure-sensitive adhesive layer 14, pressed against the pressure-sensitive adhesive layer 14, and then supported by releasing the pressing force.

  On the other hand, in order to detach a large number of electronic components 16 supported by the adhesive layer 14, for example, with the tip of the detaching blade 18 in pressure contact with the surface of the adhesive layer 14, the detaching blade 18 is moved. By relatively moving in the direction A along the surface of the adhesive layer 14, a large number of electronic components 16 can be peeled off at the tip and detached.

  In the adhesive support 10 used in this way, when the electronic component 16 is supported on the adhesive layer 14 and when the electronic component 16 is detached from the adhesive layer 14, the surface of the adhesive layer 14 is rubbed by the electronic component 16. It is done. Therefore, in this invention, in order to ensure the intensity | strength which can endure such use, ensuring sufficient adhesiveness, what consists of the hardened | cured material of a specific adhesive composition is used as the adhesion layer 14. FIG.

  That is, in this invention, the pressure-sensitive adhesive layer 14 is composed of a component (a) composed of silicone raw rubber, a component (b) composed of a crosslinking component, a component (c) composed of a pressure-sensitive adhesive component, and a component (d) composed of a platinum compound. And a cured product of the pressure-sensitive adhesive composition containing the component (e) made of silica.

  First, in the present invention, as the component (a) made of silicone raw rubber, for example, a polyorganosiloxane having an alkenyl group that can be cross-linked by an addition reaction can be used, and those represented by the following formula (1) are particularly preferable. Can be used.

(Chemical formula 1)
R ¹ _(3-a) X _a SiO— (R ¹ XSiO) _m — (R ¹ ₂ SiO) _n —SiR ¹ _(3-b) X _b (1)

  (In the formula (1), R1 is a monovalent hydrocarbon group having no aliphatic unsaturated bond, which may be the same or different, X is an alkenyl-containing organic group, A is an integer of 0 to 3, b is an integer of 0 to 3, m is an integer of 0 or more, n is an integer of 100 or more, a, b, And m are not 0 at the same time.)

Here, R ₁ is preferably one having 1 to 10 carbon atoms, an alkyl group such as a methyl group, an ethyl group, a propyl group or a butyl group, a cycloalkyl group such as a cyclohexyl group, an aryl such as a phenyl group or a tolyl group. Examples thereof include groups such as a methyl group and a phenyl group.

  Moreover, as an alkenyl group containing organic group of X, a C2-C10 thing is preferable, a vinyl group, an allyl group, a hexenyl group, an octenyl group, an acryloylpropyl group, an acryloylmethyl group, a methacryloylpropyl group, a cyclohexenylethyl group. And vinyloxypropyl group.

  The component (a) may have oily or clay-like properties, and preferably has a viscosity of 50 mPa · s or more at 25 ° C., particularly preferably 100 mPa · s or more.

  Moreover, although this (a) component may be used individually by 1 type, you may use it in mixture of 2 or more types.

  Next, the crosslinking component (b) in the present invention is a component capable of undergoing a crosslinking reaction with the component (a). For example, at least 2 H atoms bonded to Si atoms in one molecule, preferably 3 or more. SiH bond-containing polyorganosiloxane (hereinafter sometimes referred to as organohydrogenpolysiloxane) can be used.

  As this polyorganosiloxane, linear, branched, or cyclic compounds can be appropriately selected and used, and examples thereof include those represented by the following formula (2) or (3).

(Chemical formula 2)
_{^{H c R 1 3-c SiO-}} (HR 1 SiO) x - (R 1 2 SiO) y -SiR 1 3-d H d ··· (2)

(In the above formulas (2) and (3), R ¹ is the same hydrocarbon group as described above and may be the same or different. C and d are integers of 0 to 3, x, y, and s are integers of 0 or more, r is an integer of 1 or more, c, d, and x are not simultaneously 0, and x + y ≧ 0, and r + s ≧ 3, preferably Is 8 ≧ r + s ≧ 3.)

  This organohydrogenpolysiloxane has oily properties, and preferably has a viscosity of 1 to 5000 mPa · s at 25 ° C.

  This component (b) may also be used alone or in combination of two or more.

  The blending ratio of the component (b) can be selected as appropriate, but when the component (a) contains an alkenyl group and the component (b) contains a SiH bond, the component (a) in the component (a) It is preferable that the molar ratio of the SiH bond in the component (b) to the alkenyl group is 0.5 to 20, and it is particularly preferable that the SiH bond is in the range of 1 to 15. If this molar ratio is less than 0.5, the crosslinking density after curing described later will be low, and it may be difficult to maintain the shape of the adhesive layer 14. On the other hand, when the molar ratio exceeds 20, the adhesive strength of the resulting adhesive layer 14 may be reduced.

Next, the component (c), which is an adhesive component in the present invention, is a component that is blended in order to improve the adhesive strength, and for example, polyorganosiloxane can be used, and in particular, R ² ₃ SiO _0.5 It is preferable to use a unit and a unit containing SiO ₂ unit and / or R ² ₃ SiO _2/3 unit (where R ² is a monovalent hydrocarbon group having no aliphatic unsaturated bond). it can.

Here, R ² is preferably one having 1 to 10 carbon atoms, alkyl group such as methyl group, ethyl group, propyl group or butyl group, cycloalkyl group such as cyclohexyl group, aryl such as phenyl group or tolyl group. Examples thereof include groups such as a methyl group and a phenyl group.

  In general, the component (c) preferably has a structure that does not cause or hardly causes a crosslinking reaction together with the components (a) and (b) in order to ensure a higher degree of adhesiveness.

When polyorganosiloxane is used as the component (c), the molar ratio of (R ² ₃ SiO _0.5 unit and / or R ² ₃ SiO _2/3 unit) / SiO ₂ unit is 0.6 to 1. .7 is preferable. If this molar ratio is less than 0.6, the tackiness may become too high, or it may become difficult to be compatible with the component (a), and may not be separated to express the tackiness. On the other hand, if the molar ratio exceeds 1.7, the adhesive strength may decrease.

  In addition, this polyorganosiloxane may contain OH group couple | bonded with Si atom, and it is preferable that OH group content shall be 0-4.0 mol% in that case.

  In the case of using a substance containing an OH group bonded to an Si atom, when the polyorganosiloxane represented by the following formula (4) is contained as the component (a), the component (a) and the component (b) are one. A partial condensation reaction product may be formed.

(Chemical formula 4)
_{^{(OH) R 1 YSiO- (R}} 1 XSiO) p - (R 1 2 SiO) q -SiR 1 2 (OH) ··· (4)

(In Formula (4), R ¹ is a monovalent hydrocarbon group having no aliphatic unsaturated bond, and may be the same or different, and Y is R ¹ or an alkenyl group-containing organic group. In addition, p is an integer of 1 or more, and q is an integer of 100 or more.)

  In order to form such a condensation reaction product of the component (a) and the component (c), a mixture of the component (a) and the component (c) dissolved in a solvent such as toluene is added in the presence of an alkaline catalyst. The reaction may be performed at room temperature or under reflux.

  In addition, such (c) component may be used individually by 1 type, or may be used in mixture of 2 or more types.

  And it is preferable to use such (c) component in the range of 20 / 80-80 / 20 as a weight ratio of (a) component / (c) component, and it is set as 30 / 70-70 / 30 especially. Is preferred. If the amount of the component (c) is less than this range, the tackiness tends to be insufficient. On the other hand, if the amount is large, the adhesive layer 14 becomes hard and elastic, and the adhesive layer 14 is difficult to deform. It tends to be difficult to adhere the supported object.

  Next, the component (d) of the present invention is a platinum compound that mainly serves as a catalyst for promoting the crosslinking reaction between the component (a) and the component (b), and is usually used as a hydrosilation catalyst. It is.

  As the component (d), chloroplatinic acid, an alcohol solution of chloroplatinic acid, a reaction product of chloroplatinic acid and alcohol, a reaction product of chloroplatinic acid and an olefin compound, chloroplatinic acid and a vinyl group-containing siloxane And reactants.

  The blending ratio of the component (d) is preferably 1 to 5,000 ppm as a platinum content, particularly 5 to 2,000 ppm, with respect to the total amount of the components (a) and (b). Is preferred. This is because if the blending ratio is less than 1 ppm, the curability is lowered, the crosslinking density is lowered, and the holding power may be lowered. On the other hand, if it exceeds 5,000 ppm, the usable time of the treatment bath may be shortened. .

  Next, the component (e) of the present invention is silica added together with each of the above components and reinforces the mechanical strength of the pressure-sensitive adhesive layer 14, and also provides the components constituting the pressure-sensitive adhesive layer 14, in particular, tackiness. (C) It is a component which keeps a component in the adhesion layer 14 and makes it hard to detach | desorb.

Silica has conventionally been added to improve the mechanical strength of silicone resins and rubbers. However, when a support such as the electronic component 16 is used for the adhesive support 10 that supports the support by the adhesive force of the adhesive layer 14, it is generally difficult to add silica because the adhesive force tends to decrease. Further, even if the mechanical strength such as the tensile strength of the adhesive layer 14 is improved by adding silica, the adhesive layer 14 is configured when the adhesive layer 14 is rubbed by a support or another member. In particular, components that impart tackiness are easily detached, and fine shavings and residue are likely to be generated. Such shavings and residue cannot be prevented simply by increasing the amount of silica in the pressure-sensitive adhesive layer 14. In this invention, the specific surface area measured by the BET method is 50 m ² / g or more. By using silica, such a point is solved, and at the same time, the physical properties from the viewpoint of preventing detachment of the component imparted with the fuel are improved while ensuring the adhesive strength.

In particular, the silica preferably has a specific surface area of 100 m ² / g or more and 400 m ² / g or less. This is because, if the specific surface area is 100 m ² / g or more, the effect of suppressing scraping can be obtained more remarkably. A product having a specific surface area exceeding 400 m ² / g is not practical because it requires labor for production and is expensive.

  Such silica of component (e) may be silica synthesized by a dry method such as fumed silica or calcined silica, or may be silica synthesized by a wet method such as precipitated silica or silica gel, What is necessary is just to be able to obtain the specific surface area. Here, fumed silica and precipitated silica are preferable because it is easy to obtain a specific surface area.

  In addition, this silica may be used individually by 1 type, or may be used in combination of 2 or more types.

  Moreover, you may use what processed the surface of the silica with surface treating agents, such as organopolysiloxane, organopolysilazane, chlorosilane, alkoxysilane, as needed.

  The mixing ratio of such silica is preferably 1 to 30 parts by mass with respect to 100 parts by mass of the total amount of the component (a) and the component (c). More preferably, it is 5-20 mass parts. If the blending ratio is small, the strength of the pressure-sensitive adhesive layer 14 is lowered, and it is difficult to obtain a sufficient effect. Further, a residue is easily generated during use. On the other hand, if the blending ratio is large, the adhesive strength is decreased. Because there are things.

  Furthermore, in this invention, it is possible to add arbitrary components as appropriate in addition to the components (a) to (e).

  For example, a reaction control agent for suppressing a crosslinking reaction when mixing the above components can be added. Examples of the reaction control agent include 3-methyl-1-butyn-3-ol, 3-methyl-1-pentyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, and 1-ethynyl. Cyclohexanol, 3-methyl-3-trimethylsiloxy-1-butyne, 3-methyl-3-trimethylsiloxy-1-pentyne, 3,5-dimethyl-3-trimethylsiloxy-1-hexyne, 1-ethynyl-1- Trimethylsiloxycyclohexane, bis (2,2-dimethyl-3-butynoxy) dimethylsilane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1,1,3 Examples include 3-tetramethyl-1,3-divinyldisiloxane.

  When this reaction control agent is added, the blending ratio can be in the range of 0 to 5.0 parts by mass with respect to 100 parts by mass of the total amount of the component (a) and the component (c). It is preferable to set it as 05-2.0 mass parts. It is because it will become difficult to harden | cure at the time of hardening of an adhesive composition when the mixture ratio of this reaction control agent exceeds 5.0 mass parts.

  In addition to the reaction control agent, in the present invention, it is possible to add optional components as appropriate. For example, non-reactive polyorganosiloxanes such as polydimethylsiloxane and polydimethyldiphenylsiloxane, As solvents for reducing the viscosity, aromatic solvents such as toluene and xylene, aliphatic solvents such as hexane, octane and isoparaffin, ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone, ethyl acetate, isobutyl acetate and the like An ester solvent, an ether solvent such as diisopropyl ether or 1,4-dioxane, or a mixed solvent thereof, a dye, or a pigment can be used.

  The pressure-sensitive adhesive composition of the present invention is a mixture obtained by mixing the respective components as described above, and each component is blended in a predetermined amount and preferably uniformly dispersed.

  And in order to manufacture the above adhesive support bodies 10 using the adhesive composition as mentioned above, the said silicone type adhesive composition is applied to the base material 12, and on predetermined conditions. It can manufacture by making it harden | cure and obtaining the adhesion layer 14. FIG.

  Here, the base material 12 is formed of a material capable of holding the adhesive layer 14, for example, a metal plate such as stainless steel or aluminum, a metal foil such as aluminum foil or copper foil, polyester, polytetrafluoroethylene, Polyimide, polyphenylene sulfide, polyamide, polycarbonate, polystyrene, polypropylene, polyethylene, polyvinyl chloride and other resin films and plates, Japanese paper, synthetic paper, polyethylene laminated paper and other paper, cloth, glass fiber, glass plate and other ceramics, glass Examples thereof include composite materials such as an epoxy resin plate, and composite base materials formed by laminating a plurality of these materials. Here, those made of a hard member made of metal, resin, or ceramic are particularly suitable.

  These base materials 12 can be used after being subjected to primer treatment, corona treatment, etching treatment, plasma treatment or the like in order to improve the adhesion between the base material 12 and the adhesive layer 14.

  And in order to apply and cure the silicone-based pressure-sensitive adhesive composition as described above on these base materials 12, the pressure-sensitive adhesive composition is laminated on one surface of the base material 12 and pressed with a mold or the like. It can be performed by a method such as molding or by inserting the base material 12 into a mold and injecting the adhesive composition into the mold and molding.

  In such a coating method, the thickness of the adhesive layer 14 after curing can be set to about 0.2 mm to 10 mm. In this case, the curing conditions can be 3 to 40 minutes at 80 to 130 ° C., but can be adjusted as appropriate.

  Further, it is possible to use a coating method for further reducing the thickness, such as a comma coater, a lip coater, a roll coater, a die coater, a knife coater, a blade coater, a rod coater, a kiss coater, a gravure coater, etc. Coating can be performed using a known coating method such as coating by dip coating, dip coating, or cast coating.

  In such a coating method, the thickness of the adhesive layer 14 after curing can be set to 1 to 200 μm. In this case, the curing conditions can be set at 80 to 130 ° C. for 30 seconds to 3 minutes, but can be appropriately adjusted.

  Furthermore, an adhesive tape in which the adhesive composition is cured may be manufactured without applying the adhesive composition to the substrate 12 formed in advance as described above, and the release is performed with a release coating. After coating and curing on a film, release paper or the like, it may be produced by a transfer method in which the substrate 12 is bonded to obtain an adhesive tape.

  In the pressure-sensitive adhesive layer 14 obtained by curing as described above, it is desirable that there is no low-molecular siloxane component or an uncrosslinked component of the component (a). It is desirable that the polymer is 1000 ppm or less, more preferably 300 ppm or less.

According to the pressure-sensitive adhesive support 10 manufactured as described above, the pressure-sensitive adhesive layer 14 is made of a cured product of a predetermined pressure-sensitive adhesive composition containing silica having a specific surface area of 50 m ² / g or more. 14 can be sufficiently improved, and as a result, when a support such as the electronic component 16 is attached to or detached from the surface of the adhesive layer 14 during use, the surface of the adhesive layer 14 Even if the surface of the adhesive layer 14 is rubbed by pressing a blade 18 for attaching or detaching the electronic component 16 or the support or applying a force in a direction along the surface of the adhesive layer 14, the friction is caused by the friction. The shavings composed of the components constituting the layer 14, in particular, the shavings or residue consisting of the component (c) that imparts tackiness hardly occur.

  Moreover, since the surface of the adhesive layer 14 is formed in a flat surface without a hole for inserting the electronic component 16, and the electronic component 16 is supported on the surface of the adhesive layer 14, the adhesive layer 14 can be used in use. When attaching / detaching the electronic component 16, the electronic component 16 or the blade 18 is moved in the direction A along the surface of the adhesive layer 14, or a force in a direction along the surface of the adhesive layer 14 is applied to attach / detach the electronic component 16. Is easy. Even in such a use, since the effect of holding the components constituting the adhesive layer 14 in the adhesive layer 14 is high as described above, it is difficult to generate scraped scraps or residue from the components constituting the adhesive layer 14. It is preferable that the product failure of the electronic component 16 hardly occurs.

  In the above-described embodiment, the example in which the electronic component 16 is supported has been described. However, the supported body is not limited in any way, and may be another electronic component such as a silicon wafer. It is possible to support a supported body in accordance with the force and the strength of the adhesive support 10.

  Moreover, although the adhesive layer 14 was formed in the plate-shaped base material 12 in the above, the shape of the base material 12 is not specifically limited, For example, a roll shape, a curved surface shape, and also various irregular shapes etc. Accordingly, any shape that can hold the adhesive layer 14 can be adopted as appropriate. Further, the material of the base material 12 can be appropriately selected as long as it can stably hold the adhesive layer 14. Furthermore, it is also possible to use an adhesive support made of only the adhesive layer 12 without using the substrate 12 or as a separate member.

  Furthermore, in the above description, an example in which the entire surface of the adhesive layer 14 forms a planar adhesive surface has been described. However, the surface is not particularly limited to a planar shape, and a portion that adheres a support such as the electronic component 16 or the like. It may be formed into a convex shape or a concave shape. Moreover, the adhesive support body 10 in which a part of the surface of the adhesive layer 14 becomes a non-adhesive surface may be used as long as the support body such as the electronic component 16 can be adhered.

Examples of the present invention will be described below.
Example 1

100 parts by weight of an alkenyl group-containing polyorganosiloxane containing 5 mol% of methyl vinyl siloxane units and 95 mol% of dimethyl vinyl siloxane units as component (a), and H (CH ₃ ) ₂ SiO— as component (b) 5.7 parts by mass of SiH bond-containing polyorganosiloxane composed of ((CH ₃ ) ₂ SiO) ₁₈ -Si (CH ₃ ) ₂ H, and as component (c), (CH ₃ ) SiO _0.5 unit / SiO ₂ A 2-ethylhexanol solution of chloroplatinic acid having a unit of 50 parts by mass of polyorganosiloxane having a molar ratio of (CH ₃ ) SiO _0.5 unit / SiO ₂ unit of 0.85 and a platinum content of 2%. 0.28 parts by mass, 10 parts by mass of fumed silica having a specific surface area measured by the BET method of 130 m ² / g, as a reaction control agent, 0.05 part by mass of clohexanol was uniformly mixed to prepare an adhesive composition.

Thereafter, it was uniformly applied to a plate-like base material 12 made of stainless steel at a thickness of 1.5 mm and cured at 120 ° C. for 15 minutes to produce an adhesive support 10 as shown in FIG.
Example 2

An adhesive composition was prepared in the same manner as in Example 1 except that silica having a specific surface area of 250 m ² / g was used, and an adhesive support 10 was produced.
Comparative Example 1

The pressure-sensitive adhesive composition was the same as in Example 1 except that 10 parts by mass of crystallite (trade name, manufactured by Tatsumori Co., Ltd.) having an average particle size of 4 to 6 μm and a specific surface area of 1.7 m ² / g was used as silica. The adhesive support 10 was produced.
Comparative Example 2

  A pressure-sensitive adhesive composition was prepared in the same manner as in Comparative Example 1 except that the amount of crystallite was 20 parts by mass, and a pressure-sensitive adhesive support 10 was produced.

  Using the adhesive supports 10 of Examples 1 and 2 and Comparative Examples 1 and 2 obtained as described above, a Taber abrasion test based on JIS K 6264 was performed under the same conditions, and the amount of abrasion was determined. It was measured. In the test, H22 was used as a polishing wheel, and the load applied to the test piece was 9.8 N.

  The obtained results are shown in Table 1.

  As is apparent from Table 1, it was confirmed that in Examples 1 and 2, it was less likely to cause scraping than Comparative Examples 1 and 2.

It is a perspective view which shows the adhesive support body of embodiment of this invention. It is a fragmentary sectional view which shows the use condition of the adhesive support body of the embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Adhesive support body 12 Base material 14 Adhesive layer 16 Electronic component (supported body)
18 Detachment blade

Claims (5)

In the adhesive support provided with the adhesive layer on the substrate so as to support the support by the adhesive force of the surface of the adhesive layer,
The adhesive layer is a cured product of an adhesive composition containing (a) silicone raw rubber, (b) a crosslinking component, (c) an adhesive component, (d) a platinum compound, and (e) silica,
The adhesive support according to claim 1, wherein the silica has a specific surface area of 50 m ² / g or more. The adhesive support according to claim 1, wherein the support is an electronic component. The pressure-sensitive adhesive support according to claim 1 or 2, wherein the pressure-sensitive adhesive surface comprising at least a part of the surface of the pressure-sensitive adhesive layer in contact with the support is a flat surface. The pressure-sensitive adhesive support according to any one of claims 1 to 3, wherein the base material is a hard member made of metal, resin, or ceramics. 5. The adhesive support according to claim 1, wherein the silica has a specific surface area of 100 m ² / g or more and 400 m ² / g or less.

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