JP4636619B2 - Holding jig, a set of holding jigs, and an adherend holding device - Google Patents

Description

  The present invention relates to a holding jig, a set of holding jigs, and an adherend holding device, and more specifically, for example, a large number of small component members can be transferred to other holding jigs as desired. In addition, the present invention relates to a holding jig, a set of holding jigs, and an adherend holding apparatus that can manufacture small parts with high quality accuracy.

  2. Description of the Related Art Conventionally, for example, when manufacturing a small component such as a chip capacitor, a holding jig capable of sticking and holding a member for a small component capable of manufacturing the small component on its surface has been used. For example, a chip capacitor will be described as an example of a small component. Since a chip capacitor is formed by forming electrodes at both ends in the axial direction of a prismatic body or a cylindrical body, etc., it is used for manufacturing a chip capacitor. In the jig, after one electrode is formed on the lower end surface of the small component member formed of a prismatic body or a cylindrical body that is adhesively held on the surface, the object to be adhered is detached from the holding jig, Next, it is necessary to hold the end face formed with the electrodes in close contact with the surface of the holding jig again.

  As an invention that meets this need, for example, there is an electronic component chip holder described in Patent Document 1. The electronic component chip holder described in Patent Document 1 is “in an electronic component chip holder for holding an electronic component chip having first and second end faces facing each other, wherein the electronic component chip holder is The first member includes a first adhesive surface for holding the electronic component chip, and the second member includes the second member of the electronic component chip. It has a second adhesive surface that adheres to an end face and holds the electronic component chip and gives an adhesive force stronger than the adhesive force given by the first adhesive surface ”(Patent Document 1) (See claim 1). In Patent Document 1, it is necessary to set the adhesive force of the second adhesive surface in one electronic component chip holder to be larger than the adhesive force of the first adhesive surface in the other electronic component chip holder. (See columns [0026] and [0028] in Patent Document 1).

  However, for example, a large number of objects to be adhered held on the first adhesive surface are transferred to the second adhesive surface to be adhered and retained on the second adhesive surface, and further adhered to the first adhesive surface. In order to transfer all of a large number of objects to be adhered to the second adhesive surface, it is not sufficient to simply make the adhesive force of the first adhesive surface different from the adhesive force of the second adhesive surface. If all of the large number of objects to be adhered held on the first adhesive surface cannot be transferred to the second adhesive surface, a predetermined number of objects to be adhered are retained on the second adhesive surface. Productivity is reduced because it is not. In addition, if all of a large number of objects to be adhered and held on the first adhesive surface cannot be transferred to the second adhesive surface, the first adhesive surface is not transferred to the second adhesive surface. Therefore, it is necessary to remove the object to be adhered while it remains adhered to the first adhesive surface, and the productivity is also significantly reduced.

  Further, even if a large number of objects to be adhered and held on the first adhesive surface can be transferred to the second adhesive surface, an electrode is formed on the object to be adhered and held on the second adhesive surface. In this step, the amount of conductive paste applied to the adherend becomes uneven, and as a result, the quality accuracy of small parts manufactured from the adherend transferred to the second adhesive surface may be reduced. is there.

Japanese Patent No. 2682250

  An object of the present invention is to transfer a large number of objects to be adhered, for example, small component members to other holding jigs as desired, and to manufacture small components with high quality accuracy. Providing a holding jig that can be transferred, and a large number of objects to be adhered, for example, small component members, which are adhesively held on one holding jig, can be transferred to the other holding jig as desired, and quality accuracy It is to provide a set of holding jigs that can manufacture small parts having a high height, and to provide an adherend holding device provided with the set of holding jigs.

As means for solving the problems,
A first aspect of the present invention is a holding jig that is provided with an adhesive elastic member on the surface of a jig body, and can hold an object to be adhered to the elastic member. The holding jig has the maximum thickness. It is a holding jig characterized in that the difference from the minimum thickness is 4% or less with respect to the axial length of the adherend,
According to a second aspect of the present invention, there is provided a first holding jig in which a first elastic member having adhesiveness is provided on the surface of the first jig body, and a second elastic member having adhesiveness as the second jig. A second holding jig provided on the surface of the main body, wherein at least one of the first holding jig and the second holding jig is the holding jig according to claim 1, and The second elastic member is a set of holding jigs having an adhesive force larger than the adhesive force of the first elastic member,
A third aspect of the present invention is an adherend holding device provided with the set of holding jigs according to the second aspect.

  Since the difference between the maximum thickness and the minimum thickness of the holding jig according to the present invention is 4% or less with respect to the length in the axial direction of the adherend, the holding jig can be used at any position of the elastic member. The distance from the lower surface to the free end of the adherend is constant, and the adherend is held by the elastic member with an even adhesive force. As a result, when a large number of objects to be adhered are transferred to another holding jig, the large number of objects to be adhered and held by the holding jig according to the present invention are equally pressed against the other holding jig. Therefore, a large number of objects to be adhered can be uniformly adhered and held by the elastic members in other holding jigs and transferred. Further, for example, when a desired small part is manufactured from a small part member as an adherend, a large number of small part members that are adhesively held by the holding jig according to the present invention and / or other holding parts A large number of small component members transferred to the jig can be processed uniformly.

  Therefore, according to the present invention, a holding jig capable of transferring a large number of objects to be adhered and held to other holding jigs as desired and manufacturing a small article with high quality accuracy, A set of holding jigs that can transfer a large number of objects that are adhesively held in one holding jig to the other holding jig as desired, and can manufacture small parts with high quality accuracy. And the to-be-adhered article holding | maintenance apparatus provided with this one set of holding jig can be provided.

  A holding jig according to an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, the holding jig 1 includes a jig body 2 and an elastic member 3 formed on the surface of the jig body 2, and the elastic member 3 is formed on the surface of the elastic member 3. The object to be adhered can be held with the adhesive strength of.

  The object to be adhered in this invention is a member for small parts that can manufacture small parts that need to be adhesively held by the holding jig according to the present invention, such as a member for small instruments, a member for small machine elements, and a small electronic device. Examples include parts members. In addition, since the manufacture of small parts includes a process of transporting small parts, the adherend includes small parts themselves, for example, small instruments, small machine elements, and small electronic parts. Therefore, in the present invention, it is not necessary to clearly distinguish the small component from the small component member. Among these adherends, examples of the adherend suitable for the holding jig according to the present invention to stick and hold include small electronic components and / or members for small electronic components. Examples of the small electronic component and the small electronic component member include a capacitor chip (also referred to as a chip capacitor), an inductor chip, a resistor chip, an FPC, a finished product such as a wafer, an unfinished product, and the like. For example, a prism or cylinder, a prism or cylinder having ridges at one end, a prism or cylinder having ridges at both ends, and the like can be used. For example, as a member for a small electronic component capable of manufacturing a chip capacitor as a small electronic component, a rectangular column having a side length of about 0.3 mm and an axial direction length of about 0.6 mm can be given.

  The holding jig according to the present invention is suitable, for example, for holding an adhesive for such a small electronic component and / or a member for a small electronic component. In particular, the holding jig according to the present invention is more suitable for holding an adhesive for a small electronic component member that needs to be coated with a conductive paste in at least two places. When a conductive paste is applied to at least two parts of a small electronic component member, after immersing a part of the small electronic component member adhesively held by the holding jig in the conductive paste, the small electronic component member When the member is adhesively held again with another holding jig, the conventional holding jig sometimes cannot hold the small electronic component member with the other holding jig as desired. In this holding jig, the small electronic component member is held in the holding jig that has been first adhered and held, and the small electronic component member is held in the other manner as desired without leaving most of the small electronic component members remaining. The adhesive paste can be held on the jig, the conductive paste can be applied with high productivity, and the conductive paste can be uniformly attached to the surface of the small electronic component member.

  The jig body 2 in the holding jig 1 holds or supports an elastic member 3 to be described later. The jig body 2 can take various forms based on various design changes as long as the elastic member 3 can be held or supported. For example, the jig main body 2 in the holding jig 1 is formed in a disk-shaped body having a square shape as shown in FIG. As an example of the dimension in the jig | tool main body 2, the dimension of 120 mm x 120 mm x 0.5 mm (thickness) can be mentioned, for example.

  The jig body 2 only needs to have a thickness capable of holding or supporting the elastic member 3, but the surface accuracy of the holding jig 1 described later can be easily adjusted to a predetermined range described later. The jig body 2 preferably has a smooth surface, and the jig body 2 preferably has a uniform thickness. For example, the jig body 2 may have a difference between the maximum thickness and the minimum thickness of 4% or less with respect to the axial length of the adherend.

  The jig body 2 is preferably subjected to primer treatment, corona treatment, etching treatment and / or plasma treatment on the surface on which the elastic member 3 is formed in order to improve adhesion to the elastic member 3.

  The elastic member 3 is designed so that a large number of objects to be adhered can be held by adhesion. For example, as shown in FIG. 1, the elastic member 3 is a disk-shaped body that forms a square on the surface of the jig product body 2. Molded. As an example of the dimension in the elastic member 3, the dimension of 110 mm x 110 mm x 1.5 mm (thickness) can be mentioned, for example.

The elastic member 3 has an adhesive force capable of sticking and holding an adherend. Specifically, the elastic member 3 may typically that has the adhesive force of 1 to 50 g / mm ^2, it is preferable that a adhesive strength of 7~50g / mm ^2.

  Here, the adhesive force of the elastic member 3 is obtained as follows. The following adhesive strength measurement method was devised by the applicant and is therefore referred to as the Shin-Etsu Polymer Method.

First, a suction fixing device (for example, trade name: electromagnetic chuck, KET-1530B, manufactured by Kanetech Co., Ltd.) or a vacuum suction chuck plate for fixing the elastic member 3 horizontally, and a cylinder with a diameter of 10 mm at the tip of the measurement unit A load measuring device including a digital force gauge (trade name: ZP-50N, manufactured by Imada Co., Ltd.) to which a contact made of stainless steel (SUS304) is attached is prepared. Next, the elastic member 3 is fixed on the suction fixing device or vacuum suction chuck plate in the load measuring device, and the measurement environment is set to 21 ± 1 ° C. and the humidity 50 ± 5%. Next, the contact attached to the load measuring device is lowered until it contacts the part to be measured of the elastic member 3 at a speed of 20 mm / min, and then the contact is measured at a predetermined load on the part to be measured. Press vertically for 3 seconds against the part. Here, the predetermined load is set to 25 g / mm ² . Next, the contact is pulled away from the site to be measured at a speed of 180 mm / min, and the pulling load measured by the digital force gauge at this time is read. This operation is performed at a plurality of measurement sites, and the obtained plurality of separation loads are arithmetically averaged, and the obtained average value is used as the adhesive force of the elastic member 3. In addition, although this measuring method may be performed manually, for example, it may be performed automatically using a device such as a test stand (for example, trade name: VERTICAL MODEL MOTORIZED STAND series, manufactured by Imada Co., Ltd.). .

  The elastic member 3 only needs to have a desired thickness, but the elastic member 3 has a smooth surface in that the surface accuracy of the holding jig 1 described later can be easily adjusted to a predetermined range described later. Further, it is preferable that the elastic member 3 has a uniform thickness. For example, in the elastic member 3, the difference between the maximum thickness and the minimum thickness is preferably 4% or less, more preferably 3% or less, and more preferably 2% or less with respect to the axial length of the adherend. Is particularly preferred.

  In general, the elastic member 3 has a surface hardness (JIS K6253 [Durometer E]) for adhering and holding an object to be adhered, preferably about 5 to 60, and more preferably 15 to 45. When the surface of the elastic member 3 that adheres and holds the adherend is within the above hardness range, the adherend is slightly attached to the elastic member 3 when the adherend placed on the surface of the elastic member 3 is pressed. In other words, the adherend is held on the surface of the elastic member 3 in a state of being slightly indented into the elastic member 3. If it does so, the to-be-adhered thing standing on the elastic member 3 will be hold | maintained by the elastic member 3 in the bottom part which was slightly sunk into the elastic member 3. FIG. Therefore, the object to be adhered on the elastic member 3 is firmly fixed on the surface of the elastic member 3 by the adhesive force of the elastic member 3 and the peripheral side surface in the vicinity of the bottom of the object to be adhered surrounded by the elastic member 3. Will be retained.

Holding jig 1 made in this way, the axial direction of the maximum thickness (t _max) and minimum thickness (t _min) the difference between the target stickies in the total thickness of the jig main body 2 and the elastic member 3 It is 4% or less with respect to the length (L). The difference between the maximum thickness (t _max ) and the minimum thickness (t _min ) in the total thickness of the jig body 2 and the elastic member 3 with respect to the axial length (L) of the adherend is shown as a percentage. If the measured value ([(t _max −t _min ) / L] × 100 (%), hereinafter referred to as surface accuracy of the holding jig 1) is 4% or less, the holding jig 1, The smoothness on the surface of the elastic member 3 is increased, and at any position of the elastic member 3, the distance from the lower surface of the holding jig 1 to the free end of the object to be adhered is constant and with an even adhesive force. The object to be adhered can be adhered and held. As a result, when a large number of objects to be adhesively held are transferred to another holding jig, the other holding jigs can be evenly pressed against the many objects to be adhesively held by the holding jig 1. From the above, it is possible to uniformly hold a large number of objects to be adhered to other holding jigs as desired without causing most of the large number of objects to be adhered to the holding jig that first adheres and holds the objects to be adhered. be able to. As a result, it is excellent in productivity when a large number of objects to be adhered are transferred to another holding jig. Further, when a desired small part is manufactured from an object to be adhered, a large number of objects to be adhered which are adhesively held by the holding jig 1 and / or a large number of objects to be adhered which are transferred to other holding jigs. A thing can be processed uniformly.

  The surface accuracy of the holding jig 1 is such that a large number of adherends can be transferred to other holding jigs as desired, and small parts with high quality accuracy can be manufactured from the adherends. Further, it is preferably 3% or less, more preferably 2% or less, with respect to the axial length of the adherend. The lower limit of the surface accuracy is ultimately 0%, but considering productivity and the like, for example, it may be about 1%, and more preferably about 0.2%.

  Here, the length (L) in the axial direction of the adherend is the height of the adherend when the adherend is held by the elastic member 3 in a desired state among the dimensions of the adherend. . Specifically, for example, as shown in FIG. 5 and the like, for example, as an object to be adhered, for example, a small electronic component having a quadrangular prism body having a side length of about 0.3 mm and an axial direction length of about 0.6 mm When the member 6 is adhesively held on the holding jig 1 in a standing state on the bottom surface of the quadrangular prism body, the axial length of the adherend is the axial length of the small electronic component member 6; That is, it is about 0.6 mm.

The surface accuracy of the holding jig 1 is obtained as follows. First, a suction fixing device (for example, trade name: electromagnetic chuck, KET-1530B, manufactured by Kanetech Co., Ltd.) or a vacuum suction chuck plate for fixing the holding jig 1 horizontally, and a laser measuring instrument, for example, a laser displacement meter (Product name: LK-G35, manufactured by Keyence Corporation) is prepared. Next, the holding jig 1 is fixed on the suction fixing device or the vacuum suction chuck plate (also referred to as a test stand) in this measuring device, and the measurement environment is set to 21 ± 1 ° C. and the humidity 50 ± 5%. Next, the laser measuring device is lowered above the measurement site until reaching the reference distance from the surface of the test table, and the laser is irradiated from the laser measuring device toward the elastic member 3 of the holding jig 1. The reflected light reflected from the surface is detected, and the total thickness of the jig body 2 and the elastic member 3, that is, the thickness of the holding jig 1 is measured by a measurement principle applying triangulation. This operation is performed at a plurality of locations of the holding jig 1, for example, a plurality of locations near the center and the edge of the elastic member 3, and a difference between the measured maximum thickness and minimum thickness is obtained, and this value is determined. The value expressed as a percentage divided by the length (L) in the axial direction of the object to be adhered to the tool 1 is defined as the surface accuracy of the holding jig 1. Alternatively, using a dial gauge (trade name: Digimatic Indicator ID-C112C, manufactured by Mitutoyo Corporation) instead of this method, the contact point of the dial gauge on the surface of the elastic member 3 is 0.4 g / mm ^2. The thickness of the holding jig 1 is measured, the difference between the measured maximum thickness and the minimum thickness is obtained, and this value is divided by the axial length (L) of the adherend in percentage. The indicated value can be the surface accuracy of the holding jig 1.

  The jig body 2 may be formed of a material capable of holding or supporting the elastic member 3, for example, a metal plate such as stainless steel and aluminum, a metal foil such as aluminum foil and copper foil, polyester, polytetra Resin films or resin plates such as fluoroethylene, polyimide, polyphenylene sulfide, polyamide, polycarbonate, polystyrene, polypropylene, polyethylene and polyvinyl chloride, paper such as Japanese paper, synthetic paper and polyethylene laminated paper, and cloth, glass fiber and glass plate And a composite material such as a glass epoxy resin plate. Furthermore, the jig body 2 may be a laminate formed by laminating a plurality of sheet-like materials. The jig body 2 is preferably formed of a hard material made of metal, resin or ceramics.

  The elastic member 3 only needs to be formed of an adhesive material capable of imparting the adhesive force to the elastic member, or a cured product of this adhesive material. Such as rubber, fluorine-containing resin or fluorine-containing composition containing fluorine-based rubber, silicone resin or silicone rubber, silicone composition containing silicone resin or silicone rubber, urethane-based elastomer, natural rubber, styrene-butadiene copolymer elastomer, etc. Various elastomers etc. are mentioned. Among these, addition reaction curable adhesive silicone compositions and peroxide curable adhesive silicone compositions containing silicone rubber and / or silicone rubber are preferred.

  Examples of the addition reaction curable adhesive silicone composition include a raw silicone rubber (a), a crosslinking component (b), an adhesion improver (c), a catalyst (d), and a silica-based filler (e). Can be mentioned.

Examples of the silicone raw rubber (a) include a (R ₂ SiO _2/2 ) unit (R represents a hydrocarbon group), and a polydimethylsiloxane long chain polymer which may have a substituent. For example, a polyorganosiloxane that can be cross-linked by an addition reaction can be used, and more specifically, an alkenyl group-containing polyorganosiloxane can be used, and in particular, it is represented by the following formula (1). An alkenyl group-containing polyorganosiloxane can be preferably used.

_{^{R 1 (3-a) X}} a SiO- (R 1 XSiO) m - (R 1 2 SiO) n -SiR 1 (3-b) X b (1) equation However, in (1), ^{R 1} is A monovalent hydrocarbon group having no aliphatic unsaturated bond, which may be the same or different, and X is an alkenyl-containing organic group, which may be the same or different. Good. A is an integer of 0 to 3, b is an integer of 0 to 3, m is an integer of 0 or more, n is an integer of 100 or more, and a, b, and m are not 0 at the same time.

In the formula (1), R ¹ is preferably the hydrocarbon group having 1 to 10 carbon atoms, for example, a linear or branched alkyl group such as a methyl group, an ethyl group, a propyl group, or a butyl group, a cyclohexyl group, or the like. Aryl groups such as a cycloalkyl group, a phenyl group, and a tolyl group, and the like, and a methyl group and a phenyl group are particularly preferable. Moreover, as an alkenyl group containing organic group shown by X, a C2-C10 alkenyl group containing organic group is preferable, for example, carbon double bond containing hydrocarbons, such as a vinyl group, an allyl group, a hexenyl group, and an octenyl group Group, acryloylpropyl group, acryloylmethyl group, methacryloylpropyl group, (meth) acryloylalkyl group such as methacryloylmethyl group, cyclohexenylmethyl group, cyclohexenylethyl group, cyclohexenylpropyl group and other cycloalkenylalkyl groups, vinyloxypropyl Groups and the like.

  The silicone raw rubber (a) may have oily or clay-like properties, and its viscosity is preferably 50 mPa · s or more at 25 ° C., particularly preferably 100 mPa · s or more.

  A silicone raw rubber (a) may be used individually by 1 type, and may mix and use 2 or more types.

  The cross-linking component (b) is a component capable of undergoing a cross-linking reaction with the silicone raw rubber (a). For example, the SiH bond having at least 2 or more, preferably 3 or more H atoms bonded to Si atoms in one molecule. Containing polyorganosiloxane (hereinafter sometimes referred to as organohydrogenpolysiloxane) can be used.

  The organohydrogenpolysiloxane can be used by appropriately selecting from linear, branched, and cyclic organohydrogenpolysiloxanes. For example, the following formula (2) or (3) A preferred example is an organohydrogenpolysiloxane represented by the formula:

^{_{HcR 1 (3-c) SiO-}} (HR 1 SiO) x - (R 1 2 SiO) y -SiR 1 (3-d) H d (2) formula

In the formulas (2) and (3), R ¹ is the same monovalent hydrocarbon group as described above and may be the same or different. C and d are integers of 0 to 3, x, y and s are integers of 0 or more, r is an integer of 1 or more, c, d and x are not 0 simultaneously, and x + y ≧ 0 It is. Further, r + s ≧ 3, preferably 8 ≧ r + s ≧ 3.

  Among these organohydrogenpolysiloxanes, organohydrogenpolysiloxane having oily properties and a viscosity of 1 to 5000 mPa · s at 25 ° C. is preferable.

  A crosslinking component (b) may be used individually by 1 type, and may mix and use 2 or more types.

  The blending ratio of the crosslinking component (b) can be appropriately selected. When the silicone raw rubber (a) contains an alkenyl group and the crosslinking component (b) contains a SiH bond, the silicone raw rubber The molar ratio of the SiH bond in the crosslinking component (b) to the alkenyl group in (a) is preferably from 0.5 to 20, and particularly preferably from 1 to 15. If this molar ratio is less than 0.5, the crosslinking density after curing described later will be low, and it may be difficult to maintain the shape of the elastic member. On the other hand, when the molar ratio exceeds 20, the adhesive force of the obtained elastic member may be reduced.

The adhesive strength improver (c) is a component blended to improve the adhesive strength. For example, polyorganosiloxane can be used, and in particular, R ² ₃ SiO _1/2 units and SiO ₂ units ( However, R ² is a monovalent hydrocarbon group that does not have an aliphatic unsaturated bond. Here, as R ^2, preferably a substituted group having 1 to 10 carbon atoms, a methyl group, an ethyl group, a propyl group, a linear or branched alkyl group such as butyl group, cycloalkyl groups such as cyclohexyl group, a phenyl group, An aryl group such as a tolyl group can be exemplified, and a methyl group and a phenyl group are particularly preferable.

  In general, the adhesive strength improver (c) has a structure in which a crosslinking reaction does not occur or hardly occurs together with the silicone raw rubber (a) and the crosslinking component (b) in order to ensure a higher degree of adhesion. preferable.

When polyorganosiloxane is used as the adhesive strength improver (c), those having a molar ratio of R ² ₃ SiO _1/2 units / SiO ₂ units of 0.6 to 1.7 are preferable. When this molar ratio is less than 0.6, the adhesiveness of the elastic member becomes too high, or it becomes difficult to be compatible with the silicone raw rubber (a), and the silicone raw rubber (a) and the adhesive strength improver (c) are separated. As a result, the adhesiveness may not be exhibited. On the other hand, when the molar ratio exceeds 1.7, the adhesive force of the elastic member may be reduced.

  In addition, this polyorganosiloxane may contain OH group couple | bonded with Si atom, and it is preferable that OH group content is 0-4.0 mol% in that case.

  In the case of using one containing an OH group bonded to an Si atom, when the polyorganosiloxane represented by the following formula (4) is contained as the silicone raw rubber (a), the silicone raw rubber (a) and an adhesion improver (C) may partially form a condensation reaction product.

(OH) R ¹ YSiO— (R ¹ XSiO) _p — (R ¹ ₂ SiO) _q —SiR ¹ ₂ (OH) (4) where R ¹ has an aliphatic unsaturated bond. The monovalent hydrocarbon group may be the same or different and Y is R ¹ or an alkenyl group-containing organic group. X is an alkenyl-containing organic group. P is an integer of 1 or more, and q is an integer of 100 or more. The monovalent hydrocarbon group and alkenyl group-containing organic group are the same as described above.

  In order to form a condensation reaction product of the silicone raw rubber (a) and the adhesion improver (c), a mixture of the silicone raw rubber (a) and the adhesion improver (c) dissolved in a solvent such as toluene, The reaction may be performed at room temperature to reflux in the presence of an alkaline catalyst.

  The adhesive strength improver (c) may be used singly or in combination of two or more.

  The adhesion improver (c) is preferably used in a mass ratio of silicone raw rubber (a) / adhesion improver (c) in the range of 20/80 to 80/20, and particularly 30/70 to 70/30. Is preferable. If the adhesive strength improver (c) is less than this range, the adhesiveness tends to be insufficient, whereas if it is large, the elastic member becomes hard and elastic force is strong, and the elastic member is difficult to deform. It may be difficult to hold small electronic components with adhesive.

  The catalyst (d) is a catalyst that mainly promotes a crosslinking reaction between the silicone raw rubber (a) and the crosslinking component (b), and may be any catalyst that is usually used as a hydrosilation catalyst. For example, a platinum compound etc. are mentioned. Platinum compounds include chloroplatinic acid, alcohol solution of chloroplatinic acid, reaction product of chloroplatinic acid and alcohol, reaction product of chloroplatinic acid and olefin compound, reaction product of chloroplatinic acid and vinyl group-containing siloxane, etc. Is mentioned.

  The blending ratio of the catalyst (d) is preferably 1 to 5,000 ppm as a platinum component, particularly 5 to 2,000 ppm, with respect to the total mass of the silicone raw rubber (a) and the crosslinking component (b). It is preferable to do. If the blending ratio is less than 1 ppm, the curability may be lowered and the crosslink density may be lowered to reduce the adhesive strength of the elastic member. On the other hand, if it exceeds 5,000 ppm, the usable time of the treatment bath may be shortened. .

  The silica-based filler (e) is added together with the components described above, and reinforces the mechanical strength of the elastic member, and also includes a component constituting the elastic member, particularly an adhesive strength improver (c) that imparts tackiness. It is a component that is dispersed in the adhesive layer and contributes to secure adhesion of small electronic components.

Examples of the silica-based filler (e) include silica, quartz powder, diatomaceous earth, and the like, and silica is preferable. Suitable silica, the specific surface area measured by BET method is ^{50 m} 2 / g or more, preferably mention may be made of silica 100 to 400 m ² / g. When silica having such a specific surface area is contained in the addition reaction curable pressure-sensitive adhesive silicone composition, the mechanical strength such as the tensile strength of the elastic member can be improved and the component imparting the tackiness is removed. It becomes difficult to separate, and it becomes difficult to produce fine shavings and residue. In addition, when the specific surface area exceeds 400 m ² / g, the flow characteristics of the addition reaction curable pressure-sensitive adhesive silicone composition may be reduced, and it may take time to manufacture the elastic member and increase the cost.

  Examples of the silica-based filler (e) include silica synthesized by a dry method such as fumed silica and calcined silica, silica synthesized by a wet method such as precipitated silica and silica gel. Among these, fumed silica and precipitated silica are preferable in that it is easy to obtain silica having the specific surface area.

  A silica type filler (e) may be used individually by 1 type, or 2 or more types may be mixed and used for it. Moreover, you may use what processed the surface of the silica type filler (e) with surface treating agents, such as organopolysiloxane, organopolysilazane, chlorosilane, alkoxysilane, as needed.

  The blending ratio of the silica-based filler (e) is preferably 1 to 30 parts by mass with respect to 100 parts by mass in total of the silicone raw rubber (a) and the adhesion improver (c), More preferably, it is 20 parts by mass. When the blending ratio is less than 1 part by mass, the strength of the elastic member is lowered, and it is difficult to obtain a sufficient effect, and fine shavings and residue may be easily generated during use. On the other hand, when the blending ratio exceeds 30 parts by mass, the adhesive force of the elastic member may be reduced.

  Furthermore, in this invention, it is possible to add arbitrary components from the silicone raw rubber (a) to the silica-based filler (e) as appropriate.

  For example, a reaction control agent for suppressing a crosslinking reaction when mixing the components can be added. Examples of the reaction control agent include 3-methyl-1-butyn-3-ol, 3-methyl-1-pentyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, and 1-ethynyl. Cyclohexanol, 3-methyl-3-trimethylsiloxy-1-butyne, 3-methyl-3-trimethylsiloxy-1-pentyne, 3,5-dimethyl-3-trimethylsiloxy-1-hexyne, 1-ethynyl-1- Trimethylsiloxycyclohexane, bis (2,2-dimethyl-3-butynoxy) dimethylsilane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1,1,3 Examples include 3-tetramethyl-1,3-divinyldisiloxane.

  When adding this reaction control agent, the mixture ratio shall be 0-5.0 mass parts with respect to a total of 100 mass parts of the said silicone raw rubber (a) and the said adhesive force improving agent (c). Especially, it is preferable to set it as 0.05-2.0 mass parts. When the blending ratio of the reaction control agent exceeds 5.0 parts by mass, it may be difficult to cure at the time of curing the adhesive composition.

  In addition to this reaction control agent, it is possible to add optional components as appropriate, for example, non-reactive polyorganosiloxanes such as polydimethylsiloxane and polydimethyldiphenylsiloxane, and viscosity during coating. As solvents for lowering the temperature, aromatic solvents such as toluene and xylene, aliphatic solvents such as hexane, octane and isoparaffin, ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone, and ester solvents such as ethyl acetate and isobutyl acetate , Ether solvents such as diisopropyl ether and 1,4-dioxane, or mixed solvents, dyes, pigments and the like thereof can be used.

  As a composition containing the said silicone raw rubber (a), a crosslinking component (b), an adhesive improvement agent (c), a catalyst (d), and a silica type filler (e), you may manufacture suitably and are a commercial item. May be used. Examples of commercially available products include “X-40 series” such as trade names “KE1214” and “X-40-3098” manufactured by Shin-Etsu Chemical Co., Ltd., which is a composition not containing the silica filler (e). And "X-34 series" compositions such as "X-34-632A / B" are available.

  The peroxide curable adhesive silicone composition contains a silicone raw rubber (a), an adhesive strength improver (c), a silica filler (e), and an organic peroxide (f). Can be mentioned.

As the rubber silicone raw rubber (a), a long-chain polymer of polysiloxane which contains a (R ₂ SiO _2/2 ) unit (R represents a hydrocarbon group) and may have a substituent, etc. For example, polydimethylsiloxane, a substituted product thereof, and the like can be given. The properties, viscosity, etc. of the silicone raw rubber (a) are basically the same as those of the silicone raw rubber (a) contained in the addition reaction curable pressure-sensitive adhesive composition. A silicone raw rubber (a) may be used individually by 1 type, and may mix and use 2 or more types.

  The adhesive strength improver (c) and the silica-based filler (e) contained in the peroxide curable adhesive silicone composition are each an adhesive strength improver contained in the addition reaction curable adhesive composition. Basically the same as (c) and the silica-based filler (e).

  The organic peroxide (f) contained in the peroxide curable adhesive silicone composition is mainly composed of silicone raw rubbers (a), or silicone raw rubber (a) and an adhesion improver (c). It is a curing agent to be crosslinked, and examples thereof include diacyl peroxides such as benzoyl peroxide and dialkyl peroxides such as di-t-butyl peroxide. As the organic peroxide (f), diacyl peroxides are preferable, and benzoyl peroxide is particularly preferable.

  The blending ratio of the organic peroxide (f) is preferably 0.2 to 5.0 parts by mass with respect to the total mass of the silicone raw rubber (a) and the adhesive strength improver (c), and is particularly preferably 0.00. It is suitable to set it as 5-2.5 mass parts. If the blending ratio is less than 0.2 parts by mass, the curability is lowered and the crosslink density is lowered, and the adhesive strength of the adhesive layer may be reduced. On the other hand, if it exceeds 5.0 parts by mass, the adhesive composition In some cases, the rubber elastic member formed by the method has a disadvantage that the hardness of the rubber elastic member is increased and the adhesive force is reduced.

  In addition to the silicone raw rubber (a), the adhesive strength improver (c), the silica-based filler (e) and the organic peroxide (f), the peroxide curable pressure-sensitive adhesive silicone composition It is possible to add optional components. As an arbitrary component, the component illustrated by the said addition reaction curable adhesive composition is mentioned.

  As such a peroxide curable adhesive silicone composition, it may manufacture suitably and a commercial item may be used. As a commercial item, the brand name "KR-101-10", "KR-120", "KR-130" by Shin-Etsu Chemical Co., Ltd. which is a composition which does not contain the said organic peroxide (f), for example. And “KR-140” are available.

  The holding jig 1 may be manufactured by forming the elastic member 3 with the adhesive material on the surface of the jig body 2. For example, the holding jig 1 may be manufactured by applying the adhesive material to the surface of the jig body 2. The tool body 2 and the elastic member 3 may be integrally molded, and the adhesive material is molded to produce a sheet-shaped molded body. The sheet-shaped molded body is formed on the surface of the jig body 2. It may be manufactured by being pasted on. In order to easily realize the surface accuracy of the holding jig 1 within the above range, for example, a method of uniforming the thickness of the jig body 2 by polishing, grinding or cutting the jig body 2, the adhesive property A method of injecting material from the vicinity of the center of the mold over time and integrally molding the jig body 2 and the elastic member 3, and the cavity gradually protrudes from each edge toward the substantially center. A mold that is crowned so as to form a crown shape, and the amount of protrusion at the substantially central portion thereof is adjusted to a height of about 0.5% to about 5% with respect to the thickness of the elastic member to be formed. , A method of integrally molding the jig body 2 and the elastic member 3, a method of forming the adhesive material on the entire surface of the jig body 2, molding and then cutting the edge, A sheet-like molded body is prepared from an adhesive material, and the desired surface accuracy is obtained from this sheet-shaped molded body. Cut out minute method pasted to the jig main body 2, or, a method in which a combination of these methods. For example, when the elastic member 3 is formed of the addition reaction curable adhesive silicone composition, it is usually cured by heating at 80 to 130 ° C. for 3 to 40 minutes. Moreover, when the elastic member 3 is formed with the said peroxide curable adhesive silicone composition, it is normally hardened | cured by heating at 100-150 degreeC for 5 to 20 minutes. The addition reaction curable adhesive silicone composition and the peroxide curable adhesive silicone composition cured in this manner are further subjected to secondary heating at 170 to 220 ° C. for 2 to 10 hours. Also good.

  A set of holding jigs according to an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 2, the set of holding jigs 5 includes a first elastic member 3A provided on the surface of the first jig body 2A with a first elastic member 3A capable of adhering and holding an adherend. A tool 1A and a second holding jig 1B formed by providing a second elastic member 3B capable of sticking and holding an adherend on the surface of the second jig body 2B are provided. The first holding jig 1A and the second holding jig 1B are basically configured in the same manner as the holding jig 1, and are respectively provided on the surface of the jig main body 2A or 2B and the jig main body 2A or 2B. It has the formed elastic member 3A or 3B, and the object to be adhered can be held on the surface of the elastic member 3A or 3B by the adhesive force of the elastic member 3A or 3B.

The first elastic member 3A and the second elastic member 3B preferably have an adhesive force capable of sticking and holding the adherend, usually 1 to 50 g / mm ^2. It should have an adhesive strength of ˜50 g / mm ² .

Then, the second elastic member 3B in the second holding jig 1B has an adhesive force larger than the adhesive force of the first elastic member 3A. Since the first elastic member 3A and the second elastic member 3B have such an adhesive force relationship, the first elastic member 3A in the first holding jig 1A is changed to the second one in the second holding jig 1B. The adherend can be transferred to the second elastic member 3B. The adhesive force between the first elastic member 3A and the second elastic member 3B can be smoothly transferred from the first elastic member 3A to the second elastic member 3B without dropping off the adherend. is preferably the difference is 15~43g / mm ^2, more preferably from 18~35g / mm ^2, particularly preferably from 20 to 30 g / mm ^2.

  In the set of holding jigs 5, one of the first holding jig 1 </ b> A and the second holding jig 1 </ b> B is the holding jig 1, in other words, the jig main body and the elasticity of the holding jig. The difference between the maximum thickness and the minimum thickness in the total thickness with the member is adjusted to 4% or less with respect to the axial length of the adherend. When one of the first holding jig 1A and the second holding jig 1B has the surface accuracy of the holding jig in the above range, as described above, a large number of objects to be adhered are held on the other side. It can be transferred to the jig as desired, and a small component with high quality accuracy can be manufactured from the small component member. The first holding jig is capable of transferring a large number of objects to be adhered to the other holding jig as desired and manufacturing a small component with higher quality accuracy from the small component member. It is preferable that both the tool 1A and the second holding jig 1B serve as the holding jig 1.

  An adherend holding apparatus according to an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 3, the adherend holding apparatus 10 includes a set of holding jigs including a first holding jig 1 </ b> A and a second holding jig 1 </ b> B. This is an apparatus capable of transferring an object to be adhered from the first holding jig 1A to the second holding jig 1B. The set of holding jigs included in the adherend holding apparatus 10 is configured in the same manner as the set of holding jigs 5.

  As shown in FIG. 3, the adherend holding apparatus 10 is configured such that the first holding jig 1A and the second holding jig 1B have a relative relationship between the first elastic member 3A and the second elastic member 3B. It can be arranged to face. Thereby, the to-be-adhered object adhered and held by the first holding jig 1A can be transferred to a state in which the object is adhered and held by the second holding jig 1B. Such an arrangement of the first elastic member 3A and the second elastic member 3B may be realized by a displacement means having a mechanical configuration, or may be realized manually.

  As shown in FIG. 3, the first holding jig 1 </ b> A has a front end of the support arm 13 in which the surface side of the jig main body 2 </ b> A where the elastic member 3 </ b> A is not formed extends downward from the holding jig displacement means 12. The support member 14 is fixed to the support member 14 and is supported by the holding jig displacement means 12.

  The holding jig displacing means 12 is attached to the rail 11, is configured to be movable in the horizontal direction along the rail 11, and is configured to be capable of moving the support arm 13 in the vertical direction. Therefore, the first holding jig 1A supported by the holding jig displacing means 12 can be freely moved in the horizontal direction and the vertical direction by the holding jig displacing means 12. That is, the first holding jig 1A having the first elastic member 3A for hanging and holding the adherend is, for example, above the conductive paste bath or at an appropriate position other than the position above the conductive paste bath, For example, it can be transferred to a position above the second holding jig 1B, and the first holding jig 1A is lowered toward the second holding jig 1B, and the second holding jig After holding the adherend to the elastic member 3B of the jig 1B, the first holding jig 1A can be raised from the second holding jig 1B.

  Further, the holding jig displacing means 12 is configured to be capable of rotating around the axis with the rail 11 as a central axis. When the holding jig displacing means 12 is capable of rotational movement in this way, the state of the first holding jig 1A is the state in which the object to be adhered is suspended by the elastic member 3A, and the object to be adhered is the first. The elastic member 3 </ b> A can be changed to a state of being held upright as desired.

  Further, as shown in FIG. 3, the second holding jig 1B has a surface side of the second jig main body 2B where the second elastic member 3B is not formed facing upward from the holding jig displacement means 16. It is fixed to a support member 18 provided at the tip of the extending support arm 17 and supported by the holding jig displacement means 16.

  The holding jig displacing means 16 is attached to a rail 15 that is substantially orthogonal to the rail 11 and is configured to be movable in the horizontal direction along the rail 15 and is configured to be capable of moving the support arm 17 in the vertical direction. ing. Therefore, the second holding jig 1B supported by the holding jig displacing means 16 can be freely moved in the horizontal direction and the vertical direction by the holding jig displacing means 16. That is, the second holding jig 1B can be transferred to an appropriate position, for example, a position below the first holding jig 1A, and the second holding jig 1B can be moved to the first holding jig. The second holding jig 1B is moved to the first holding jig 1A, and the second holding jig 1B is moved to the second holding jig 1B after holding the adhesive object held by the first elastic member 3A of the first holding jig 1A. 1 holding jig 1A can be lowered.

  Further, the holding jig displacing means 16 is configured to be capable of rotating around the axis with the rail 15 as the central axis. When the holding jig displacing means 16 is capable of rotational movement in this way, the second holding jig 1B is in a state in which the object to be adhered is held upright by the elastic member 3B and the object to be adhered is in the second state. The elastic member 3B can be changed to a state of being suspended and held as desired.

  The movement mechanism in the holding jig displacing means 12 and the holding jig displacing means 16 is not particularly limited. For example, a driving means for generating a driving force, for example, a motor, and the output of the motor 11 or 15, In addition, a movement mechanism including transmission means for transmitting to the support arm 13 or 17, for example, a gear, a wire, or the like may be used. This motion mechanism may be controlled by a normal personal computer or manually.

  As shown in FIG. 3, the adherend holding device 10 includes a first holding jig 1 </ b> A and a second holding jig 1 </ b> B in the vicinity of the position where the rail 11 and the rail 15 intersect. The elastic member 3A and the second elastic member 3B can be arranged so as to face each other. Thereby, the adherend to which the first holding jig 1A is adhesively held can be transferred to the second holding jig 1B.

  Next, a method for manufacturing a chip capacitor which is a small electronic component by forming an electrode on a chip capacitor body which is one of the members for small electronic components using the adherend holding apparatus 10 according to the present invention will be described. In addition, the operation of the adherend holding apparatus 10 will be described. As shown in FIG. 4, the chip capacitor body 6 has a quadrangular prism body, and the chip capacitor has electrodes formed on both ends of the chip capacitor body 6.

  Using the adherend holding device 10 which is an example of the present invention, the electrode 7 is formed on the capacitor body 6 as follows.

  First, the holding jig displacing means 12 shown in FIG. 3 is rotated around the axis with the rail 11 as the central axis, and the first elastic member 3A is turned up as shown in FIG. The standing arrangement plate 20 is stacked on the holding jig 1A. The standing arrangement plate 20 is formed with a plurality of arrangement holes 22 which are through holes 22 formed by forming an annular tapered surface 21 in the upper opening. A large number of chip capacitor bodies 6 are distributed in a messy state on the upper surface of the upright arrangement plate 20. When vibration is applied to the standing arrangement plate 20, the chip capacitor body 6 is received in the arrangement hole 22 so as to be guided by the tapered surface 21. Since the thickness of the upright arrangement plate 20 is designed to be smaller than the axial length of the chip capacitor body 6, the lower end surface of the chip capacitor body 6 received in the arrangement hole 22 is the first elastic member 3A. The upper end surface of the upright arrangement plate 20 protrudes from the upper end surface.

  Next, as shown in FIG. 4, the protruding heads of all the chip capacitor bodies 6 are pressed with a flat press plate 23. Then, the lower end surface of the chip capacitor body 6 accommodated in the arrangement hole 22 is slightly indented into the first elastic member 3A, and the lower end portion of the chip capacitor body 6 is the first due to the adhesive force of the first elastic member 3A. It adheres to the elastic member 3A. At this time, since the first holding jig 1A has the surface accuracy within the above range, as shown in FIG. 4, the large number of chip capacitor bodies 6 in the first elastic member 3A are protruded from them. The position of the head is substantially in the same plane. Thereafter, the standing arrangement plate 20 is removed. Next, the holding jig displacing means 12 (not shown) is rotated around the axis with the rail 11 as the central axis, and the first holding jig 1A is rotated to turn the first holding jig 1A as shown in FIG. When the elastic member 3A is directed downward, a large number of chip capacitor bodies 6 are suspended from the lower surface of the first elastic member 3A.

  Next, the holding jig displacing means 12 (not shown) is moved in the horizontal direction along the rail 11 (not shown), and a large number of chip capacitor bodies 6 are suspended and held by the first elastic member 3A. The first holding jig 1 </ b> A is horizontally moved above the conductive paste bath (not shown) in the state where it is left. Thereafter, the support arm 13 (not shown) is moved downward by the holding jig displacing means 12 to lower the first holding jig 1A toward the conductive paste bath. The first holding jig 1A is lowered and the lower end portion of the chip capacitor body 6 is immersed in the conductive paste bath. At this time, since the first holding jig 1A has a surface accuracy within the above-mentioned range, each of a large number of chip capacitor bodies 6 is immersed in a conductive paste bath at a certain portion at the lower end thereof. After immersion, the support jig 13 is moved upward by the holding jig displacing means 12 to raise the first holding jig 1A. As a result, as shown in FIG. 6, an electrode 7 having a substantially uniform size is formed at the lower end of each chip capacitor body 6 suspended and held by the first elastic member 3 </ b> A.

  Next, the holding jig displacing means 12 is moved in the horizontal direction along the rail 11, and a large number of electrodes 7 are coated on the lower end portion above the second elastic member 3 </ b> B in the second holding jig 1 </ b> B. The first holding jig 1A holding the chip capacitor body 6 suspended from the first elastic member 3A is moved horizontally. Next, as shown in FIG. 7, the support arm 13 is moved downward by the holding jig displacement means 12 (not shown) to move the first holding jig 1A toward the second holding jig 1B. Is lowered. The second holding jig 1B is arranged with the second elastic member 3B facing up.

  As shown in FIG. 7, the holding jig displacement means 12 (not shown) moves the support arm 13 (not shown) downward to lower the first holding jig 1 </ b> A. The lower end portion of the plurality of chip capacitor bodies 6 suspended from the first elastic member 3A of the first holding jig 1A and the electrode 7 formed on the second elastic member 3B of the second holding jig 1B Is adhered. At this time, the second elastic member 3B has an adhesive force larger than the adhesive force of the first elastic member 3A, and the first holding jig 1A and the second holding jig 1B each have a surface in the above range. Since it has accuracy, as shown in FIG. 7, the plurality of chip capacitor bodies 6 in the first elastic member 3A have their free ends, that is, their bottom surfaces substantially uniform, and the second elastic member 3B. Pressed. Next, when the support arm 13 (not shown) is moved upward by the holding jig displacing means 12 (not shown) to raise the first holding jig 1A, the chip capacitor main body 6 becomes the electrode. 7 is firmly adhered to the second elastic member 3B via 7, so that the chip capacitor body 6 is detached from the first elastic member 3A of the first holding jig 1A without remaining. In this way, a large number of chip capacitor bodies 6 can be transferred as desired without dropping from the first holding jig 1A to the second holding jig 1B.

  Next, the holding jig displacing means 16 (not shown) is rotated around the axis with the rail 15 (not shown) as the central axis, and the second holding jig 1B is moved as shown in FIG. The second holding jig 1B holding and sticking the chip capacitor body 6 upright on the second elastic member 3B via the electrode 7 is rotated and the chip capacitor body 6 is suspended and held To be.

  Next, the holding jig displacing means 16 (not shown) is moved in the horizontal direction along the rails 15 (not shown), and a large number of chip capacitor bodies 6 are suspended and held by the second elastic member 3B. The second holding jig 1B is moved horizontally above the conductive paste bath (not shown) with the state kept. Thereafter, the support arm 17 (not shown) is moved downward by the holding jig displacement means 16 (not shown) to lower the second holding jig 1B toward the conductive paste bath. The second holding jig 1B is lowered and the lower end portion of the chip capacitor body 6 is immersed in the conductive paste bath. At this time, since the second holding jig 1B has a surface accuracy within the above-mentioned range, each of the chip capacitor bodies 6 is immersed in a conductive paste bath at certain portions at the lower ends thereof. After the immersion, the support jig 17 (not shown) is moved upward by the holding jig displacing means 16 (not shown) to raise the second holding jig 1B. As a result, as shown in FIG. 8, an electrode 7 having a substantially equal size is formed at the lower end of each chip capacitor body 6 suspended and held by the second elastic member 3 </ b> B of the second holding jig 1 </ b> B. .

  The second elastic member 3B in the second holding jig 1B is adhered to a chip capacitor 8 in which electrodes 7 having substantially equal sizes are formed on both ends of the chip capacitor body 6 in a suspended state. Is retained. The chip capacitor 8 adhered and held by the second holding jig 1B is brought into contact with the second elastic member 3B by, for example, sliding a stripper (not shown) on the lower surface of the second elastic member 3B. The chip capacitor 8 that has been held suspended is detached and dropped.

  Thus, by using the holding jig 1 or the set of holding jigs 5 according to the present invention, the second chip capacitor main body 6 adhered and held by the first holding jig 1A can be removed without dropping. It can be transferred to the holding jig 1B as desired, and the chip capacitor 8 with high quality accuracy in which the electrodes 7 having the same size are formed at both ends can be easily manufactured.

  The holding jig 1, the set of holding jigs 5 and the adherend holding apparatus 10 according to the present invention are not limited to the above-described embodiments, but can be achieved within the scope of achieving the object of the present invention. Various modifications are possible.

  For example, in the holding jig 1, the jig main body 2 and the elastic member 3 are both formed in a rectangular shape, but the jig main body and the elastic member may have any shape suitable for manufacturing small parts, The shape is arbitrary depending on the shape of the adherend, the shape of the adherend holding device, the manufacturing process, the workability, and the like. For example, the holding jig includes a plate-like body such as a polygon such as a square, a rectangle, a pentagon, and a hexagon, a circle, an ellipse, an indeterminate shape, or a combination thereof. Moreover, one surface side in which the elastic member 3 in the jig body 2 is not formed may be a planar shape or a three-dimensional shape such as a semi-cylindrical body.

  The set of holding jigs 5 includes a first holding jig 1A and a second holding jig 1B. In addition to these holding jigs, a third holding jig or the like is provided. You may have.

  In the adherend holding device 10, the first holding jig 1A and the second holding jig 1B are provided, but three or more kinds of holding jigs may be provided.

  In the adherend holding device 10, the first elastic member 3A and the second elastic member 3B may be formed of the same adhesive material or different adhesive materials.

  Furthermore, in the to-be-adhered article holding device 10, the rails 11 and the rails 15 are disposed so as to intersect substantially at right angles, but the rails and the rails may be disposed substantially in parallel.

  Moreover, in the to-be-adhered article holding device 10, the holding jig displacement means 12 and 16 are configured to be rotatable around the axis with the rails 11 and 15 as the central axis. You may be comprised so that rotation movement is impossible. In this case, the first holding member in which the chip capacitor body is adhered and held on the first elastic member may be supported by the holding jig displacing means, and the chip capacitor is adhered and held on the second elastic member. The second holding jig may be removed from the holding jig displacing means, and the chip capacitor may be removed from the second elastic member.

Example 1
From a stainless steel plate (made of SUS304, thickness 0.5 mm, difference between maximum thickness and minimum thickness 0.05 mm), a square board having a side length of 120 mm was cut out. After degreasing one surface of this disc-like body with an organic solvent such as acetone, an appropriate amount of a silicone rubber adhesion primer (trade name “X-33-156-20”, manufactured by Shin-Etsu Chemical Co., Ltd.) is applied. A jig body was produced.

  Silicone rubber containing the silicone raw rubber (a), the crosslinking component (b), the adhesion improver (c) and the catalyst (d) (trade name “X-34-632 A / B”, manufactured by Shin-Etsu Chemical Co., Ltd. ) Addition reaction curable adhesive silicone composition containing 99% by mass and 1% by mass of a silica-based filler (trade name “Crystallite” manufactured by Tatsumori Co., Ltd.) as component (e), and an adhesive strength adjusting composition A liquid silicone rubber composition (trade name “KE-1950 / 30 A / B”, manufactured by Shin-Etsu Chemical Co., Ltd.) and an adhesive silicone composition (addition reaction curable adhesive silicone composition: liquid silicone rubber) The composition = 90: 10) was placed on the jig body so as to be a square having a side length of 110 mm and a thickness of 1.5 mm, and a pressure of 10 MPa was applied using an elastic member forming mold. Reduction, The holding jig A was manufactured by press molding at 120 ° C. for 10 minutes and then further curing at 200 ° C. for 4 hours. The elastic member forming mold is crowned so that the cavity has a crown shape that gradually protrudes from each edge toward the substantially central portion, and the protruding amount of the substantially central portion is formed. This was a mold for forming an elastic member having a cavity adjusted to a height of 1.6% with respect to the thickness of the elastic member.

(Example 2)
A holding jig B is manufactured in the same manner as in Example 1 except that the addition amount of the addition reaction curable adhesive silicone composition and the liquid silicone rubber composition in the adhesive silicone composition is changed to 50:50. did.
(Example 3)
Instead of the elastic member forming mold, crown processing is similarly performed, and the protruding amount of the substantially central portion is adjusted to a height of 1.1% with respect to the thickness of the formed elastic member. A holding jig C was manufactured in the same manner as in Example 1 except that an elastic member forming mold having a cavity was used.
Example 4
Instead of the elastic member forming mold, crown processing is similarly performed, and the protruding amount of the substantially central portion is adjusted to a height of 0.5% with respect to the thickness of the elastic member to be formed. A holding jig D was manufactured in the same manner as in Example 1 except that a mold for forming an elastic member having a cavity was used.
(Example 5)
A holding jig E was used in the same manner as in Example 1 except that a stainless steel plate (made of SUS430 2BC, thickness 0.5 mm, difference between maximum thickness and minimum thickness 0.02 mm) was used instead of the stainless steel plate. Manufactured.

(Comparative Example 1)
In place of the elastic member forming mold, a holding jig F is provided in the same manner as in Example 1 except that an elastic member forming mold having a smooth cavity, which is not crowned, is used. Manufactured.
(Comparative Example 2)
Instead of the elastic member forming mold, crown processing is similarly performed, and the protruding amount of the substantially central portion is adjusted to a height of 0.2% with respect to the thickness of the elastic member to be formed. A holding jig G was manufactured in the same manner as in Example 1 except that an elastic member forming mold having a cavity was used.

When the adhesive force of the elastic member in the manufactured holding jigs A to G was measured by the method described above, the adhesive strength of the holding jigs A and C to G was 40 g / mm ² , and the adhesive strength of the holding jig B was It was 15 g / mm ² .

  Table 1 shows the results of measuring the surface accuracy of the holding jigs A to G by the method using the laser measuring instrument described above. The surface accuracy is determined by measuring the thickness of the holding jig using nine sections obtained by dividing the elastic member in each holding jig into three parts vertically and horizontally, and measuring the maximum and minimum values of the measured thickness. And the value indicated by percentage was calculated by dividing by the axial length of the chip capacitor body. In addition, the surface accuracy was based on a chip capacitor body having a quadrangular columnar body with a side length of 0.3 mm and an axial length of 0.6 mm as an adherend. In the measurement method using the dial gauge, almost the same surface accuracy was obtained.

  Next, according to the combination of holding jigs shown in Table 2, a set of holding jigs was selected, and the adherend holding apparatus shown in FIG. 3 was assembled. As the adherend, a chip capacitor body having a quadrangular prism body with a diameter of 0.3 mm and an axial length of about 0.6 mm was used. The 4,000 chip capacitor bodies are erected and held at substantially equal intervals on the first elastic member in the first holding jig shown in Table 2, and then the chip capacitor body that is adhesively held is the first elastic member. The first holding jig was rotated so as to be suspended and held (that is, in the same state as the first holding jig 1A shown in FIG. 4). While maintaining this state, the chip capacitor body was immersed in a conductive paste bath containing nickel and an organic solvent so that the height of the formed electrode was 150 μm. This conductive paste was dried under predetermined conditions to form an electrode. Next, the first holding jig is lowered toward the second holding jig shown in Table 2, and the chip capacitor body adhered and held by the first holding jig is moved to the second holding jig. The chip capacitor body was pressed into the second elastic member so that the chip capacitor body sinks 100 μm into the second elastic member. After 3 seconds passed, the first holding jig was lifted upward at a speed of 3 mm / sec and pulled away from the second holding jig. The number of chip-conden main bodies that were not transferred to the second holding jig while being adhered and held by the first elastic member in the separated first holding jig, and dropped from the first elastic member The number of chip condenser bodies that were not adhesively held by the second elastic member was confirmed. This operation is performed 10 times, and the arithmetic average value thereof is obtained, and the ratio of the total number of chip capacitor bodies that have not been transferred and the number of chip capacitor bodies that have been dropped to the total number of chip capacitor bodies (referred to as the untransferable ratio). Asked. The results are shown in Table 2. Next, the chip capacitor body adhered and held by the second holding jig is immersed in the conductive paste bath so that the height of the electrode to be formed is 150 μm, and the conductive paste of the chip capacitor body is predetermined. It dried on conditions, and the electrode was formed.

  Arbitrary 100 chip capacitors manufactured in this way are selected, and the uniformity of the 200 electrodes formed on both ends of the chip capacitor is determined in the order of "◎", "○", "△". And it evaluated in four steps of "x". The results are shown in Table 2.

FIG. 1 is a schematic perspective view showing a holding jig according to an embodiment of the present invention. FIG. 2 is a schematic perspective view showing a set of holding jigs according to an embodiment of the present invention. FIG. 3 is a schematic explanatory view showing an adherend holding apparatus which is an embodiment of the present invention. FIG. 4 is a schematic cross-sectional explanatory diagram for explaining a procedure for sticking the chip capacitor body to the first elastic member in the standing state in the adherend holding apparatus according to the embodiment of the present invention. FIG. 5 is a schematic explanatory view showing a state in which the chip capacitor body is suspended and held by the first holding jig in the adherend holding apparatus which is an embodiment of the present invention. FIG. 6 is a schematic explanatory view showing a state in which a chip capacitor body in which an electrode is formed is suspended and held on a first holding jig in an adherend holding apparatus which is an embodiment of the present invention. FIG. 7 is a schematic explanatory view showing a state where the chip capacitor body suspended from the first holding jig in the adherend holding apparatus according to the embodiment of the present invention is pressed against the second holding jig. is there. FIG. 8 is a schematic explanatory view showing a state in which a chip capacitor formed by coating electrodes on both ends of the second holding jig in the adherend holding apparatus according to one embodiment of the present invention is suspended and held. .

Explanation of symbols

1, 1A, 1B Holding jig 2, 2A, 2B Jig main body 3, 3A, 3B Elastic member 5 One set of holding jig 6 Chip capacitor main body 7 Electrode 8 Chip capacitor 10 Adhered object holding device 11, 15 Rail 12 , 16 Holding jig displacement means 13, 17 Support arm 14, 18 Support member 20 Standing arrangement plate 21 Tapered surface 22 Through hole 23 Press plate

Claims (3)

  An elastic member having adhesiveness is provided on the surface of the jig body, and is a holding jig that can adhere and hold an object to be adhered to the elastic member. The holding jig has a difference between the maximum thickness and the minimum thickness. Is 4% or less with respect to the axial length of the adherend. A first holding jig having an adhesive first elastic member provided on the surface of the first jig body and an adhesive second elastic member provided on the surface of the second jig body. A second holding jig,
At least one of the first holding jig and the second holding jig is the holding jig according to claim 1, and
The set of holding jigs, wherein the second elastic member has an adhesive force larger than that of the first elastic member.   An adherend holding device comprising the set of holding jigs according to claim 2.

Images