JP2003282351A - Manufacturing method for extremely small-sized laminated chip electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an extremely small-sized laminated chip electronic component, by which mass production of the extremely small-sized laminated chip electronic component is made possible. <P>SOLUTION: When edge electrodes 120 are formed on edge parts of a baked chip component 110 which is manufactured in a process comprising a step for printing inner electrodes on an unbaked dielectric layer 101, there are provided a step for laminating and compressing dielectric layers, a step for cutting the compressed body into chips and a step for baking the chips, a process for forming the edge electrodes 120 comprises a step for attaching one ends of a group of chip components to the adhesive coating face of a first adhesive tape and applying a conductive paste to the other ends, a step for drying the paste to form one-side electrodes, a step for transferring the group of the chip components from the first adhesive tape to the adhesive coating face of a second adhesive tape after the one-side electrodes are formed, a step for applying the conductive paste to one ends having no paste thereon of the group of the chip components which are transferred to the second adhesive tape, and a step for drying the paste to form both-side electrodes. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated chip electronic component of a composite component such as a chip capacitor, a chip inductor, a chip resistor or the like or a filter constituted by a combination thereof, and more particularly, a product having an extremely small external size. The present invention relates to a manufacturing method of.

[0002]

2. Description of the Related Art A conventional method of manufacturing a laminated chip electronic component will be briefly described below.

First, a dielectric material is applied to a PET film as a base to form a dielectric layer (green sheet) having a predetermined thickness.

The PET film is supplied in a state of being wound in a roll shape, coated with a dielectric material, then wound in a roll shape again and supplied to the next step.

Next, an internal conductor pattern to be an internal electrode is formed on the dielectric layer. Using an internal electrode paste which is a paste of a conductive material, a large number (several hundred) of internal conductor patterns are collectively printed and dried by a printing method such as a screen printing machine or a gravure printing machine. In the case of a single-function product, it is wound again into a roll and proceed to the next step, but for composite parts with an internal structure that combines several internal conductor patterns, cut into strip cards at this stage.
To separate.

The dielectric sheets printed with the internal conductor patterns are peeled from the PET film one by one, and a prescribed number of layers are laminated so that necessary characteristics can be obtained. For a single-function product, you only need to stack the same inner conductor pattern, so
The roll-shaped sheets are sequentially peeled off and laminated. Since the composite component is configured by combining several types of internal conductor patterns, sheets that are previously separated into a card shape and separately supplied for each pattern are stacked in the order and the number of sheets determined so as to have a desired configuration.

Next, by applying pressure with a hydraulic press, the stacked sheets are pressure-bonded to be integrated.

Next, in the cutting step, the final product shape is cut and separated into chips, and then each of the parts cut into chips is fired. End electrodes (external terminal electrodes) for the purpose of connecting internal conductors and connecting to the outside are formed on the chip-shaped component after firing. The conductive material paste (end electrode paste) is spread evenly to form a paste film, and the chip-shaped parts inserted and held in a silicon rubber plate with many holes are dipped into the paste film, Process the pieces in a batch. The electrode dimensional accuracy of chip-shaped parts is controlled by the paste film thickness and the part holding accuracy. However, when the plate made of silicone rubber, which is an elastic material, is used, the dimensional accuracy cannot be increased.

After coating and drying the conductor paste to be the end electrodes, the conductor paste is baked to form the end electrodes (base layer).
Is further formed, and the required metal plating is further applied thereon to complete the formation of the end electrodes.

As a method of manufacturing a laminated electronic component of this kind, Japanese Patent Laid-Open Nos. 2000-216038 and 2001 are known.
The production method disclosed in Japanese Patent No. 172076 is known.

[0011]

When manufacturing a chip-like laminated chip-like electronic component of an extremely small size, which is smaller than the current product, due to the extremely small standard size of the product, it is difficult to achieve accuracy in some steps in the conventional method. It is not possible to mass-produce it because of lack of capacity and marked decrease in productivity. For reference, the 1005 type and 0603 are shown in FIG.
Indicates the product dimensional accuracy standard of the type. The tolerance of the length dimension L, the width dimension W, the thickness dimension t, and the length dimension B of the electrode portion is 100 μm for the 1005 type chip-shaped component, but the length dimension L, the width dimension W, and the thickness dimension for the 0603 type component. The tolerance of t and the length B of the electrode part are each 30 μm
Becomes severe.

Therefore, as the product shape becomes smaller, the internal conductor pattern becomes finer in the printing process, and it is necessary to realize high-precision fine printing. In the end electrode coating process, the external electrode dimensions and tolerances become stricter. However, it is necessary to improve the coating accuracy, and it is difficult to form high-precision end electrodes with the conventional coating method using an elastic carrier plate. Handling during in-process work in the end electrode coating process and end electrode plating process In the end electrode plating process, it is difficult to develop media according to the product size (when using a medium that is a conductor medium, the media itself becomes even smaller, and the manufacturing of extremely small media according to the chip component size Dimension maintenance is required), the problem that the media is plated during plating,
In addition, it is troublesome to separate the product after plating from the media (need to maintain the dimensional accuracy of the mesh holes of the pot for separating and discharging the media).

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems and provide a method of manufacturing an extremely small-sized laminated chip-shaped electronic component that enables mass production of an extremely small-sized laminated chip-shaped electronic component.

Other objects and novel features of the present invention will be clarified in the embodiments described later.

[0015]

In order to achieve the above object, the invention of claim 1 of the present application is such that an internal electrode is printed on a green sheet, and the green sheet after the internal electrode is printed is laminated and pressed to obtain a chip-shaped component. A method for manufacturing a microminiature stacked chip-type electronic component, in which an end electrode is formed at the end of the chip-shaped component that has been cut and fired, and the end electrode is formed by One end of a group of chip-shaped parts is attached in an aligned state on the adhesive coated surface of the adhesive tape of, the other end is pressed against a flat bed for application, a conductor paste is applied, and one side electrode is formed by drying. A group of chip-shaped components transferred to the second adhesive tape by transferring the group of chip-shaped components after formation of the one-sided electrode from the first adhesive tape to the adhesive-coated surface of the second adhesive tape. The conductor The conductive paste is applied against one end of strike is not applied to the coating plane beds, is characterized by comprising the step of forming both side electrodes and dried.

According to a second aspect of the present invention, there is provided a method for manufacturing an extremely small-sized multilayer chip-shaped electronic component according to the first aspect, wherein the step of plating the end electrodes is accommodated in a barrel without using a medium. Immersing a group of chip-shaped components that have been subjected to plating solution, energize between the cathode on the barrel side and the anode outside the barrel, while rotating the barrel of the end electrodes of the chip-shaped component with respect to the cathode The method is characterized by including a step of forming a chain of mutual contact and conduction and electroplating the end electrodes of the chip-shaped component.

According to a third aspect of the present invention, there is provided a method for manufacturing an extremely small-sized laminated chip electronic component according to the first or second aspect, wherein the step of printing the internal electrodes on the green sheet has a coefficient of thermal expansion of 7 .98-9.10 × 10 ⁻⁶ / ° C.,
A lower pedestal of a stone platen having a chemical composition of 45% or more by weight of SiO ₂ which is a plutonic rock, an upper pedestal fixed to the upper surface of the lower pedestal, a printing table supported by the lower pedestal, and printing A screen printing machine including a screen and a printing unit including a squeegee that moves on the screen and supported by the upper mount is used, and an internal electrode is placed at a predetermined position on the green sheet positioned on the printing table. It is characterized by including a step of printing a paste.

The method for manufacturing an extremely small-sized multilayer chip-shaped electronic component according to the invention of claim 4 is characterized in that in claim 1, 2 or 3, the size of the chip-shaped component is 1005 size or less. There is.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a method of manufacturing a laminated chip-shaped electronic component having an extremely small size according to the present invention will be described below with reference to the drawings.

An embodiment of the present invention will be described with reference to FIGS. 1 to 14. FIG. 1 is an embodiment of a method for manufacturing a laminated chip-shaped electronic component of an extremely small size according to the present invention, showing a schematic process thereof, and FIGS. 2 to 5 show green sheets (unfired) in the present embodiment. (Ceramic Dielectric Sheet) Shows a screen printing machine using a stone surface plate as a base to perform the printing process of the internal electrodes with high accuracy, and FIGS. 6 to 12 show the end electrode formation for a very small chip-shaped component efficiently. FIG. 13 and FIG. 14 show an end electrode forming apparatus and an end electrode forming process that can be performed with high dimensional accuracy, and FIGS. 13 and 14 show an electroplating process in which a metal plating process is performed on the end electrodes by a barrel plating method without using a medium. Indicates.

Explaining in accordance with the manufacturing process diagram of FIG. 1, first, a dielectric material is applied to a PET film 100 as a base film by a coater and dried in a drying oven to obtain a dielectric layer (green sheet) having a predetermined thickness. 101 is formed.

Next, a paste (internal electrode paste) of a conductive material is printed and applied on the dielectric layer 2 by the screen printing machine shown in FIGS. 2 to 5 to form an internal conductor pattern 102 to be an internal electrode. Form. Here, a large number (for example, several hundreds) of internal conductor patterns are collectively printed by the screen printing method, and then dried in a drying furnace.

After that, when the PET film 100 provided with the dielectric layer is in a roll shape (long product), FIGS.
The card is cut into a card shape by a card cutting machine so as to be compatible with the printing process by the screen printing machine shown in FIG.

As described above, the screen printing machine shown in FIGS. 2 to 5 has a stone surface plate as a base so that the printing process of the internal electrodes on the green sheet can be executed with high accuracy. The configuration will be described in detail.

In FIGS. 2 to 5, reference numeral 1 denotes a casing that surrounds the entire apparatus, and the casing 1 is installed on the floor F by legs 2. A printer main body 3 and a loader / unloader robot 4 are installed in the housing 1. An air filter unit (HEPA filter unit) is installed on the upper surface of the housing 1, and clean air is introduced into the inside of the housing. That is, the housing 1 has substantially the same function as a clean room.

A changer (clean transfer load port) 6 having a gate opening (opening / closing opening communicating with the inside of the housing) is installed on the outside of the left side surface of the housing 1, and a work transfer hermetically sealed pod 10 is mounted thereon. By opening it and opening the gate,
A space inside the closed pod 10 and the inside of the housing 1 are communicated with each other. The loader / unloader robot 4 is supported by a multi-tiered rack inside the sealed pod 10 in a communication state with its gate opening open (here, a green sheet (a PET film provided with a dielectric layer is used. Card)) is supplied to the printer main body 3 (printing unit 40 described later) or the work after printing is returned to the sealed pod 10. The gate port is closed and the inside of the housing 1 is kept in a clean air atmosphere except when it is necessary to communicate the internal space of the closed pod 10 with the inside of the housing 1.

The printing machine main body 3 has a lower mount 31 and an upper mount 32. The lower mount 31 is made of a stone surface plate integrally formed by cutting a stone (black granite), and is made of cast iron, or An upper pedestal 32 of a square steel pipe welded structure, which is subjected to post-welding annealing treatment to remove residual stress and working stress, is combined.

The stone material for the lower pedestal 31 is a stone surface plate made of stone material having a thermal expansion coefficient of 10 ⁻⁵ / ° C. or less. Specifically, it is an igneous rock commonly called black granite and has a thermal expansion coefficient of 7 .98 to 9.10 × 10 ⁻⁶ / ° C., chemical composition is SiO
Use 45% or more plutonic rock at ₂ % by weight. Above all, S
It is preferable to employ granite having an iO ₂ wt% in the range of 65 to 77%. The upper mount 32 mounting surface and the bearing mounting surface for moving the printing table are directly formed on the lower mount 31. The support bracket 34 of the image processing camera 33 is directly attached and fixed to the upper mount 32.

It should be noted that it is not preferable to use a stone material having a coefficient of thermal expansion larger than 10 ⁻⁵ / ° C. as the lower pedestal since it loses its superiority to carbon steel and the like. As a particularly preferable material for the stone material, SiO ₂ weight% is 65 to 77.
The reason why the granite is in the range of% is that the composition is relatively limited and there is little variation as a stone material.

A printing unit 40 having a print head 42 and the like is assembled inside and on the upper mount 32, and the printing unit 40 is covered with an airtight cover 43 that covers the upper side of the upper mount 32. The side of the printing unit 40 is surrounded by the upper frame 32.

The printing table 41 is a base that moves laterally (left and right in FIG. 2) in a plane parallel to the upper surface of the lower pedestal 31 by a slide rail 50 installed on the lower pedestal 31 as shown in FIG. A correction table 52 having a table 51 and movable in X, Y, and θ directions is mounted on the table 51, and a printing table main body 54 is fixed on a moving plate 53 of the correction table 52.

The printing table 41 is movable between the image processing position and the printing position, and the movement of the entire printing table 41, that is, the movement of the base table 51 is executed by a servo motor and a ball screw. That is, the ball screw that is rotationally driven by the servo motor is axially supported in parallel with the upper surface of the lower mount, and the ball screw nut screwed to the ball screw and the base table 51 are connected by a joint having a certain clearance. At the moving end corresponding to the image processing position for image processing by the image processing camera 33 and the moving end corresponding to the printing position, a clamp cam (mechanical clamp) driven by an air cylinder is used to move the base table 51.
Is attracted and fixed. The stop position is a mechanical stop system that is regulated by positioning bolts. By setting the amount of pulling of the clamp cam smaller than the amount of clearance of the joint portion, the base table 51 can be reliably stopped and held without overloading the servo motor during clamping.

The correction table 52 mounted on the base table 51 has only one moving plate 53, and is supported by bearings that are movable in all X, Y, and θ directions.
The moving plate 53 has a total of 3 axes including 1 axis in the X direction and 2 axes in the Y direction.
An axis servo motor is attached so that movements in all X, Y, and θ directions are controlled.

As shown in FIGS. 4 and 5, the printing table body 54 is provided with a printing stage 55 on which a green sheet (a PET film provided with a dielectric layer is cut into a card) is mounted as shown in FIGS. Are integrated. The upper surface of the printing stage 55 becomes the work mounting surface.

As shown in FIG. 4, the plate frame 61 of the printing screen 60 is supported by a plate making receiving portion 62 provided on the upper frame 32. Here, in order to adjust the parallelism of the screen 60 and the printing table main body 54, a plurality of non-contact laser displacement meters 20 (minimum three, four in this example) are attached to the printing table 41 side, and these non-contact laser displacements are attached. The meter allows the distance from the bottom of the screen to the screen surface to be measured directly. And each displacement meter 2
The adjustment mechanism provided in the plate-making receiving portion 62 changes the plate frame support height of each plate-making receiving portion 62 so that the indicated values of 0 become equal, and the parallel adjustment of the screen is performed.

As shown in FIGS. 4 and 5, the print head 42
Is in a plane parallel to the upper surface of the lower mount 31 and the upper mount 3
2, a print head main body 70 slidably attached in a direction perpendicular to the paper surface of FIG. 2, and a squeegee holder 71 that is vertically movable (movable in a vertical direction to the upper surface of the lower mount 31). , Squeegee 72 held by this
It has and. The squeegee holder 71 is guided up and down with respect to the print head main body 70 by a guide shaft 73 and driven up and down by an air cylinder 74. A center position in the width direction of the mounting portion 72a of the squeegee 72 is a pin 75 serving as a fulcrum shaft at the center position in the width direction of the squeegee holder 71.
It is pivotally supported by. At one end of the squeegee holder 71, a push rod 77 for adjustment driven by a linear actuator 76 using a servo motor is provided.
Is attached so as to push down one end of the squeegee mounting portion 72a, and the backup spring 78 is provided between the opposite end of the squeegee holder 71 and the squeegee mounting portion 72a.
(Compression spring) is installed. These are mechanisms for enabling parallel adjustment of the squeegee in the left-right direction.

Further, as shown in the front view of the squeegee in FIG. 5A and the side view of the squeegee in FIG.
2 At the left and right ends, the printing stage 55 of the printing table 41
Two sets of parallel light linear sensors 80 are installed on the printing table 41 so that the distance from the upper surface to the edge of the squeegee 72 can be measured. Each parallel light linear sensor 80 is a combination of a light emitting side sensor 80a and a light receiving side sensor 80b. As a result, the amount of gap between the printing table surface (the upper surface of the printing stage 55) and the edge of the squeegee tip can be measured without contact, so that the measurement can be performed without being affected by other parameters such as printing pressure and squeegee hardness.

Accordingly, the linear actuator 76 drives the adjusting push rod 77 while the parallel light linear sensor 80 measures the gap amount between the upper surface of the printing stage 55 at the left and right ends of the squeegee 72 and the edge of the tip of the squeegee. Squeegee parallel adjustment is possible. That is, the push rod 77 is moved according to the measured gap data, feedback control is performed until the gap amounts at both ends of the squeegee 72 become equal, and after the parallel to the stage surface, the lock bolt 79 is used to fix the squeegee mounting portion 72a. The squeegee holder 71 is fixed.

As described above, the casing 1 is provided so as to surround the printer main body 3, and clean air is introduced into the casing 1 through the air filter unit. The airtight cover 43 is provided on the upper side of the printing unit 40 of FIG.
Covered with. Further, the plate-making receiving portion 62 is provided with a screen lower shutter.

As a result, the upper portion of the screen 60 is made airtight by the airtight cover 43, and the side of the screen is provided with the upper mount 32.
The lower part of the screen 60 is opened by a screen lower shutter only during the printing operation and is normally closed so that the surrounding atmosphere does not enter through the print pattern holes of the screen 60, and the printing part 40 is covered. It is made airtight so that the environment inside it can be kept in a certain state.

An image processing monitor 81 for displaying an image picked up by the operation panel 80 and the image processing camera 33 is provided on the outer front surface of the housing 1.

The operation of this screen printer will be described. A changer (clean transfer load port) 6 installed on the outside of the left side surface of the housing 1 is provided with a sealed pod 10 for transferring a work containing a green sheet before printing. Place it,
Open the gate opening of the changer 6, and close the pod 1
The internal space of 0 and the inside of the housing 1 are communicated with each other, and the loader / unloader robot 4 communicates the green sheets supported by the multi-tiered shelves inside the sealed pod 10 in a communicating state with an open gate port. 3 (printing unit 40 described later) is transferred onto the print table 41 (that is, on the print stage 55).
At this time, the print table 41 is at the image processing position, and the necessary image processing is executed after the green sheet is transferred.

The correction amounts in the X, Y, and θ directions are calculated by the image processing, and the correction table 52 incorporated in the print table 41 side corrects the position of the print table main body 54 in the X, Y, and θ directions. After that, the printing table 41 is moved to the printing position below the screen 60, where the squeegee 7
2 by lowering and moving the screen 60 while pressing it against the positioned green sheet.
The printing paste (internal electrode paste) supplied above is printed at a predetermined position on the green sheet through the printing pattern holes of the screen.

After the green sheet printing process, the printing table 41 returns to the image processing position, and the printed green sheet on the printing table 41 is held by the loader / unloader robot 4 and the hermetically sealed pod 10 is kept open with the gate port open. Transfer printed green sheets to the internal multi-tiered shelves.

In the screen printing machine of FIGS. 2 to 5, a lower base 31 of a stone surface plate integrally formed by cutting a stone material (black granite) and cast iron, or annealing after welding to perform residual stress and processing. Upper pedestal 3 of square steel pipe welded structure with stress removed
The gantry structure is a combination of two, and there is little change in ambient temperature or aging, and the surface of the printing table 41 (printing stage 5
5), the surface of the screen 60, and the locus surface of the tip of the squeegee 72, the parallelism of three planes can be maintained, and high-precision screen printing is possible. For example, as a stone material for the lower mount 31, the thermal expansion coefficient is 7.98 to 9.10 × 10 ^−6.
/ ° C., the chemical composition of 45% or more of plutonic in weight percent of SiO _2, if particularly SiO ₂ weight percent adopt granite in the range of 65-77%, a large effect. Table 1 below shows a comparative example in the case of the present embodiment using granite as a lower mount and a comparative example using carbon steel (however, measurement results at room temperature).

[0046]

[Table 1] In Table 1, the linear guide constitutes a bearing for moving the printing table which supports the printing table 41. It can be seen from Table 1 that the linear guide mounting surface accuracy and the printing table straightness are remarkably excellent in the case of the present embodiment.

As a result, the internal electrode printing accuracy on the green sheet was about ± 15 μm, but it was ± 5 μm.
Improved to below 1005 size (length 1.0mm, width 0.
5mm, thickness 0.5mm), of course, it can be used for chip type parts, 0603 type (length 0.6mm, width 0.3mm, thickness 0.3mm) and 0402 type (formal standard undecided) However, it is estimated that the length will be 0.4 mm, the width will be 0.2 mm, and the thickness will be 0.2 mm).

In a screen printing machine, a roll-to-roll (roll-to-roll) method is used without cutting into a card shape.
It is also possible to supply and print a long green sheet by the l) method.

In the process diagram of FIG. 1, the green sheet on which the internal conductor pattern to be the internal electrode is screen-printed is dried in a drying oven (if the green sheet is screen-printed in a long size, it is further dried. After cutting into a card shape), the PET film 100 as a base film on which the green sheet is formed is peeled off sheet by sheet with a film peeling device, and then the green sheet having only the dielectric portion has the required characteristics. Laminate the specified number of sheets with a laminating machine so as to obtain it. Since a composite part is configured by combining several types of internal conductor patterns, green sheets that are separated in advance into a card shape and are separately supplied for each pattern are laminated in the order and the number of sheets that are determined so as to have a desired configuration. . Then, by applying pressure with a pressing device (hydraulic press), the stacked sheets are pressed and integrated. In the case of a large capacity chip capacitor or the like, the number of laminated layers is 500 or more.

The green sheets are laminated, and the laminated body after pressurization is cut and separated into individual chip-shaped parts which are the final product shape by a chip cutting machine which executes a cutting process. Then, the chip-shaped component is fired in a firing furnace.

As shown in FIG. 1, end electrodes for forming end electrodes (external terminal electrodes) for the purpose of connecting internal electrodes to each other or connecting to the outside at both ends of the chip-shaped component 110 after the firing treatment. The paste 120 is applied, and the end electrode forming apparatus shown in FIGS. 6 to 12 is used to improve the accuracy of forming the end electrodes.

FIG. 6 is a front view of the entire structure of the end electrode forming apparatus, FIG. 7 is a process flow chart, and 170 is a first tape running mechanism and 180 is a second tape running mechanism.

The first tape running mechanism 170 has a first adhesive tape 17 whose one surface is coated with a heat-foaming adhesive.
1 has a feeding roll 172, a winding roll 173, a driving roll 174, and a separator winding roll 175 for winding a separator between tape layers. 176 and 177 are guide rolls. The driving roll 174 vacuum-adsorbs the surface of the first adhesive tape 171 which does not have an adhesive, and drives the driving roll 174 by a fixed amount, and the intermittent rotation of the driving roll 174 causes the first adhesive tape 171 to be intermittent at regular intervals. Will be sent.

The second tape running mechanism 180 has a second adhesive tape 18 coated on one side with a heat-foaming adhesive.
1 has a feeding roll 182, a winding roll 183, a driving roll 184, and a separator winding roll 185 for winding the separator between the tape layers. 186, 187, 188
Is a guide roll. The drive roll 184 vacuum-adheres the adhesive-free surface of the second adhesive tape 181 to drive it, and the intermittent rotation of the drive roll 184 causes the second adhesive tape 181 to be intermittently fed at predetermined intervals. It

An electronic component supply unit for adhering one end of a group of chip-shaped components in an aligned state on the adhesive-coated surface of the first adhesive tape 171 along the running path of the first adhesive tape 171. 190, a first paste application unit 200 for applying the conductor paste by pressing the other end of the group of chip-shaped components transferred by the traveling of the first adhesive tape 171 to the application flat bed, and a group of chips A first drying unit 210 for drying the conductor paste applied to the other end of the strip-shaped component is sequentially arranged.

Further, the first and second adhesive tapes 171,
A group of chip-shaped components that have passed through the first drying unit 210 are transferred from the first adhesive tape 171 to the second adhesive tape 181 along a portion where the 181 travels in parallel to form a group of chip-shaped components. A transfer section 220 is provided to hold the conductor paste at the end on the side where the conductor paste is applied.

The second adhesive tape 1 is transferred to the transfer section 220.
The leveling unit 2 for aligning the lower end positions of the group of chip-shaped components along the traveling path of the second adhesive tape 181 for the processing on the group of chip-shaped components transferred to 81.
30 and a second paste application for applying the conductor paste by pressing one end of the group of chip-like parts transferred by the running of the second adhesive tape 181 to the application flat bed The section 240, the second drying section 250 for drying the conductor paste applied to one end of the group of chip-shaped components, and the discharging section 26 for peeling the group of chip-shaped components from the second adhesive tape 181.
0 is sequentially arranged.

As shown in FIG. 6, each of these mechanisms is attached to a frame 271 which is erected on a stand 270.

The first and second adhesive tapes 171 and 1
81 is a PET film base material coated on one side with an adhesive. For example, the product name “Riva Alpha” manufactured by Nitto Denko Corporation can be used.
71 is a 150 ° C. foam, and a single-sided adhesive coated product having an adhesive strength = (adhesive adhesive strength / tape width) of 3.7 N / 20 mm can be used, and the second adhesive tape 181 is a 170 ° C. foam,
Adhesive strength of 3.7 N / 20 mm can be used with a single-sided adhesive coated product. The tape width of each of the tapes 171 and 181 is, for example, 20 mm. This tape width makes the device smaller, simpler,
Select to ensure machine accuracy. Regardless of the precision of forming the end electrodes of the chip-shaped component, when mass production is required, the tape width can be increased to greatly improve the processing capacity. Also, the tape length is 50 m per reel, and one lot of chip-shaped parts 100
It is possible to process tens of thousands. The PET film substrate had a thickness of 100 μm, and the adhesive layer had a thickness of 45 μm. However,
The thickness of the adhesive layer is preferably about 10% of the longitudinal dimension of the chip-shaped component 110.

The first and second adhesive tapes 171 and 1
The adhesive force of 81 may be the same, but the adhesive force of the first adhesive tape 171 is weak (for example, 2.4 N / adhesive force).
It is even more preferable that it can be reliably transferred by the transfer section 220 as 20 mm).

It is not possible to use a PET film substrate coated with an adhesive on both sides, since this leads to destabilization of the attitude of the chip-shaped component.

The first drive roll 174 for driving the first adhesive tape 171 has a hollow roll structure and has a large number of vacuum suction holes formed on the outer peripheral surface, and the inside is evacuated by a vacuum exhaust system. By doing so, the first adhesive tape 1
The surface of 71 which is not coated with the pressure-sensitive adhesive can be suction-dried and driven. The first drive roll 174 is adapted to receive the rotational drive force of the servo motor.

The same applies to the second drive roll 184 that drives the second adhesive tape 181 to run.

A mechanism for keeping the tension of the first adhesive tape 171 constant is added to the side of the feeding roll 172, which is desired for the first adhesive tape 171 fed from this roll 172. It is designed to generate a constant tension.

The tension of the second adhesive tape 181 is also maintained constant.

8 and 9 show the electronic component supply section 190, which has a through hole 194 as an alignment hole for the chip-shaped component 110.
Of the alignment block (guide plate) 193 for aligning the chip-shaped components 110 in an upright state, and a reference block having a flat surface that abuts the lower surface of the alignment block to align the lower end positions of the chip-shaped components 110 (bed). ) And 195. The reference block 195 is intended to level the coated surface of the chip-shaped component, and its flatness is preferably within 2 μm. The upper end opening of the through hole 194 is chamfered and spreads in a tapered shape.

The adhesive coating surface 171a on the lower surface of the first adhesive tape 171 faces and faces the electronic component supply section 190, and the alignment block 19
The first adhesive tape 171 is attached to the upper end portion (0.1 mm protrusion to the upper surface of the alignment block) of the group of chip-shaped components positioned in the through-hole 194 of the No. 3 and positioned and faced by the reference block 195 by the top plate 196. By pressing, one end of the chip-shaped component 110 is attached to the adhesive tape 17
The pasting step of pasting to No. 1 is executed. At this time, the press-fitting amount of the adhesive tape 171 into the adhesive layer is about 25 μm in order to obtain a stable holding posture of the chip-shaped component. The amount of embedding in the adhesive is preferably about 5% of the longitudinal dimension of the chip-shaped component 110 and about 50% of the thickness of the adhesive layer.

The density of a group of chip-shaped parts is, for example, about 638 / (18 × 21 mm), and the density is set to generate a resistance to disturbance. Further, the distance between chip-shaped components is set to an array pitch of 0.8 mm to secure a distance that does not affect the electrode formation of adjacent chip-shaped components.

10 and 11 show the first paste applying section 200, and FIG. 10 shows the conductor paste layer formed on the flat coating bed 201 provided in the paste applying section 200. Here, the coating flat bed 201 is movable in a direction that faces the first adhesive tape 171 in parallel and is orthogonal to the traveling direction of the adhesive tape 171. On the other hand, the scraping blade 202 for scraping the conductor paste is configured to perform only the vertical movement.

Here, in order to precisely form the conductor paste layer, the area of the flat coating bed 201 is 30 mm × 10.
It is preferable to make it as small as 0 mm and make the flatness within 5 μm. Furthermore, it is preferable that the running parallelism of the movement of the coating flat bed 201 is within 5 μm. This can improve the accuracy of electrode formation.

After the conductive paste is entirely applied to the coating flat bed 201, the scraping blade 202 is lowered to the same height as the upper surface of the coating flat bed 201 and moved in the direction of arrow P by a certain amount. Thereby, the flat bed 201 for application
An area 201a having no conductor paste is formed thereon.
Next, by moving the coating flat bed 201 by 0.15 mm higher than the upper surface of the coating flat bed 201 and moving the coating flat bed 201 by a predetermined amount in the direction of arrow P, a dip conductor paste layer 203 having a thickness of 0.15 mm is obtained. Form. Further, by moving the coating flat bed 201 by a certain amount in the direction of arrow P while making it higher than the upper surface of the coating flat bed 201 by about 30 μm,
A conductive paste layer 204 for a blot having a thickness of 30 μm is formed.

In this way, the conductor paste layer 203 for dipping and the conductor paste layer 204 for blotting are formed in advance. Then, as shown in FIG. 11, the first adhesive tape 1
The lower end of the group of chip-shaped components 110 attached to 71
By lowering the first adhesive tape 171 with the top plate 205, an end electrode that is dipped in the dip conductor paste layer 203 is formed on one side of the chip-shaped component 110 (first operation). After the first adhesive tape 171 is returned to the raised position, the blot conductive paste layer 204 is removed by moving the coating flat bed 201.
The first adhesive tape 171 is lowered so as to face the bottom of the chip-shaped component 110, and the lower end portion of the chip-shaped component 110 is attached to the blotting conductor paste layer 2
04, and the excessively attached conductor paste of the conductor paste adhered to the chip-shaped component 110 is blotted back to the flat coating bed 201 (second operation). The blotting conductor paste layer 204 is provided in order that the conductor pastes are applied to the chip-shaped component 110 so that the conductor pastes easily adhere to the coating flat bed 201 side when the conductor pastes contact each other. In principle, the blotting conductor pastes are provided. The layer 204 may have a thickness of zero, that is, an uncoated surface.

Each time the dipping and blotting operations of the group of chip-shaped parts 110 are completed once, the scraping blade 202 is lowered and the coating flat bed 201 is moved to scrape the used conductor paste. I have to. As a result, it is possible to drastically reduce the drop of the chip-shaped component and the defective electrode formation due to the inclusion of foreign matter.

Although the first paste applying section 200 has been described, the second paste applying section 240 has the same structure.

The tape guide 295 of FIG. 6 is provided at least on the tape receiving side and the sending side of the first and second paste applying sections 200 and 240, and is the adhesive of the first and second adhesive tapes 171 and 181. The surface not coated with is vacuum-adsorbed to prevent tape meandering and tape loosening.

The first drying section 210 and the second drying section 250 are provided with halogen lamps for generating far infrared rays,
It has a function of irradiating concentrated far infrared rays on the conductor paste application portion (lower end portion) of the chip-shaped component attached to the adhesive tape to efficiently dry it.

FIG. 12 shows the structure of the transfer section 220, and FIG.
Reference block 2 as the top plate on the frame 271 of
22 is fixedly supported. The reference block 222 has a tape holding mechanism by vacuum suction for holding the second adhesive tape 181. Further, a hot plate 229 (separation temperature raising heater 229a as a lower flat support plate facing in parallel to the plane of the reference block 222 is provided.
(Built-in) is provided so as to be movable up and down with respect to the frame 271.

Then, the first adhesive tape 171 and the second adhesive tape 171 are formed by the reference block 222 and the hot plate 229.
The adhesive coating surfaces 181a of the second adhesive tape 181 are adhered to the group of chip-shaped components 110 at normal temperature, and the first adhesive tape 171 is heated by the hot plate 229. This is foamed to lose the adhesive force of the first adhesive tape 171 (becomes 0.15 N / 20 mm or less). For example, for the first adhesive tape 171 (foaming at 150 ° C.), 170 ° C. 10
The first adhesive tape 171 by the second hot plate heating
Foam the adhesive. In addition, in order to increase the volume of the adhesive at the time of foaming, the reference block 222 is increased by this increase.
And widen the space between the hot plates 229 (about 0.1 mm).

After that, by lowering the hot plate 229, the first adhesive tape 171 and the second adhesive tape 1
The group of chip-shaped components 110 held between 81 are attached and held on the second adhesive tape 181 and are transferred together with the second adhesive tape 181 by the rotation of the drive roll 184.

Next, the overall operation of the end electrode forming apparatus shown in FIGS. 6 to 12 will be described.

The first adhesive tape 171 is fed out in a fixed amount by the drive roll 174 with the adhesive coated surface facing downward, and enters the through hole 94 of the electronic component supply section 190 of FIGS. The top plate 196 is attached to the upper end portion of the group of chip-shaped components 110 that are positioned and chamfered as described above.
It is pressed by. As a result, a sticking step of sticking one end of the positioned and surfacing chip-shaped component 110 to the adhesive coating surface 171a of the adhesive tape 171 is executed.

The group of chip-shaped parts 110 held by the first adhesive tape 171 is transferred to the first paste application section 200 after the attaching step is completed. Here, the lower end portion of the chip-shaped component 110 is first dipped in the dip conductor paste layer 203 on the coating flat bed 201 shown in FIGS. 10 and 11, and then the coating flat bed 201 is moved to form the blotting conductor paste layer 204. The excess conductor paste is brought into contact with the conductor paste to return it, and an appropriate amount of conductor paste is applied to form the electrode 120 on one side as in the process flow of FIG. 7 (application process).

The group of chip-shaped components that have completed the coating process is moved by the first adhesive tape 171 and the first drying section 21 is moved.
0, here, the temperature of the conductor paste and the chip-shaped component that will be the end electrodes is heated to 110 ° C. to 120 ° C.,
The temperature of the tape 171 is kept from room temperature to about 60 ° C. For this reason, far-infrared lamps (halogen lamps) are used for light heating, and by irradiating light to the conductor paste application portion from diagonally below the chip-shaped component, only the chip-shaped component and the conductor paste are predetermined. It has a structure where it is heated to the temperature and the others are not heated.

The group of chip-shaped parts that have undergone the drying process in the first drying section 210 pass through the driving roll 174 and are inverted so that the adhesive coated surface faces upward.
2 is transferred to the transfer section 220. The adhesive coating surface 171a of the lower first adhesive tape 171 faces upward, and the adhesive coating surface 1 of the upper second adhesive tape 181.
Both tapes are on the standard block 2 so that 81a faces downward.
22 and the hot plate 229 are sandwiched in parallel,
170 ° C against the adhesive tape 171 (foaming at 150 ° C)
1st adhesive tape 1 by hot plate heating for 10 seconds 1
71 is foamed to lose its adhesive strength. In order to increase the volume of the pressure-sensitive adhesive at the time of foaming, it is necessary to retract the hot plate 229 by this increased amount at the time of foaming (the escape amount when foam is peeled off is reduced by about 0.1 mm). Thereafter, the chip-shaped component 110 adheres to the second adhesive tape 181 and moves along with this traveling.

The group of chip-shaped components transferred to the second adhesive tape 181 is transferred to the leveling section 230 of FIG. Although not shown, the mechanism of the leveling unit 230 corrects the attitude defect of the chip-shaped component and presses the lower ends of the group of chip-shaped components against the reference plane to perform leveling so that the heights of the lower ends are aligned.

The group of chip-shaped parts held by the second adhesive tape 181 is transferred to the second paste application part 240 after the surface is leveled at the leveling part 230, and the conductor paste of the chip-shaped parts is not applied. Similar to the first paste application unit 200, an appropriate amount of the conductor paste is applied to the end portion to provide the end electrode 120.

The group of chip-shaped components that have completed the coating process are moved by the second adhesive tape 181 and the second drying unit 25 is operated.
Transferred to 0. Here, the same drying process as that of the first drying unit 210 is performed.

The group of chip-shaped components which have been dried by the second drying section 250 are transferred to the discharging section 160. In the discharge section 160, the second adhesive tape 181 (170 ° C.
For foaming), hot plate heating at 190 ° C. for 10 seconds is performed. As a result, the second adhesive tape 181 foams and loses its adhesive strength, and the chip-shaped component falls under its own weight into the discharge box and is stored therein.

According to the end electrode forming apparatus described with reference to FIGS. 6 to 12, a group of chip-shaped components is transferred by the first adhesive tape 171 and the conductor paste is applied to one end of the chip-shaped components. After the electrodes are formed, the electrodes are transferred to the second adhesive tape 181, and the conductor paste is applied to the other end of the chip-shaped component to form the end electrodes. Can be automated and mass productivity can be improved. In addition, the precision of forming the end electrodes is ± 30
What was about μm can be improved to ± 15 μm or less.

With respect to the chip-shaped component having the conductor paste serving as the end electrode provided on both ends, the conductor paste is baked to form the end electrode (base layer), and further, required metal plating (for example, The lower layer is Ni-plated and the upper layer is Sn-plated) in an electroplating facility using a medialess barrel.

FIGS. 12A and 12B show an example of a medialess barrel plating process. As the barrel 300, insulating lids are provided on both sides of a tubular body 301 (eg, a polygonal tube such as an octagonal tube). , A plurality of plate-shaped conductive members 30 having a gap through which a plating solution is passed so as to divide one circumference of the cylindrical body 301 into a plurality of parts
2 (for example, stainless steel mesh) is used to form the surface of the cylindrical body, and each plate-shaped conductive member 302 is insulated and held by insulating columns 303.

Then, the barrel 300 is rotatably supported with the cylinder center of the cylinder body 301 as a rotation center axis in a substantially horizontal direction,
The plate-shaped conductive member 302 is set to conduct to the negative side of the plating power source at a predetermined rotation position, but is insulated from the plating power source at other rotation positions. In FIG. 13B, about half of the barrel 300 is immersed in the plating solution,
An anode 310 connected to the positive side of the plating power source is arranged below 00.

A chip-shaped component 110 with end electrodes is housed in the barrel 300 without using a medium, and the barrel 300 is rotated by immersing it in a plating solution and rotating the barrel-shaped component to form a plate shape at a rotation position. The conductive member 302 is electrically connected to the plating power source to plate the end electrode of the chip-shaped component, and the plate-shaped conductive member 302 at the rotation position where the chip-shaped components are not assembled is insulated from the plating power source to obtain the plate-shaped conductive member. No unnecessary plating current flows.

It will be described with reference to FIG. 14 that barrel plating can be performed without using a medium. FIG. 14A shows 1608.
In the case of a chip-shaped component having a size or more, the ratio of the end electrode area is smaller than the total surface area, and the mutual contact and conduction chain by the end electrodes are less likely to occur between the chip-shaped components. On the other hand, 1005 to 0603,040 as shown in FIG.
When the size is made extremely small to 2, the surface area ratio of the end electrode portion gradually increases, and the ratio of mutual contact by the end electrodes and conduction chain to the barrel side cathode between the chip-shaped components increases. Therefore, a barrel plating method in which the medium is not housed in the barrel is possible.

By adopting the medialess barrel plating process of FIG. 13, there is no need for a process of separating the media and the chip-shaped component after plating, and the development and plating of the media according to the product size generated by the use of the media. It is possible to solve the problems that the media is sometimes plated and the workability of separating the plated product from the media is lowered.

The chip-shaped component after the end electrode plating treatment is shipped as a product after appearance inspection, characteristic inspection, taping or other packaging treatment.

According to this embodiment, the following effects can be obtained.

(1) The internal electrode paste can be printed on the green sheet with high accuracy by the screen printer shown in FIGS. 2 to 5. That is, in the screen printing machine shown in FIGS. 2 to 5, the lower pedestal 31 of the stone surface plate integrally formed by cutting the stone material (black granite etc.) and the cast iron or the post-welding annealing treatment to perform residual stress The pedestal structure is a combination of the upper pedestal 32 of the square-shaped steel pipe welded structure, in which the processing stress is removed.
The parallelism of the three planes of the first surface (the upper surface of the printing stage 55), the surface of the screen 60, and the locus surface of the tip of the squeegee 72 can be maintained, and high-precision screen printing is possible. For example, as a stone material for the lower mount 31, the thermal expansion coefficient is 7.
^{98~9.10 × 10 -6 / ℃, 45} % or more plutonic chemical composition in weight percent of SiO _2, if particularly SiO ₂ weight percent adopt granite in the range of 65-77%, a large effect .

As a result, the internal electrode printing accuracy on the green sheet was about ± 15 μm, but it was ± 5 μm.
It is improved to the following, and of course, it can be applied to 1005 size chip parts, 0603 type and 0402 type.
It can also be used for chip type parts.

(2) In the screen printing machine, the printing machine main body 3 is arranged in the housing 1 kept in a clean atmosphere to which clean air is supplied, so that the inside of the housing serves as a green sheet as a work. It is possible to prevent foreign matter such as particles when the sheet moves from being attached to the green sheet and impairing print quality. Further, by supplying the green sheet from the outside to the inside of the housing by using the closed pod 10 having the multi-tiered shelves, pieces of cutting dust or sheets mixed in in the previous process (cutting), and further, It is possible to prevent foreign matters such as particles from adhering to the green sheet when the process is moved, and thus prevent the printed pattern from being scratched or chipped.

Due to the miniaturization of electronic parts, the finer printing patterns (thinner lines) and the thinner printing film thickness are advancing. However, by maintaining a clean atmosphere inside the housing 1, it is possible to obtain fine print patterns (thin lines) and thin print layers with high quality. Screen printing can be realized.

(3) Airtight cover 4 on top of the screen 60
3, the lower part is closed by a shutter except when printing is performed, so that the atmosphere around the printing paste supplied onto the screen 60 can be distinguished from the surrounding environment. As a result, the surrounding atmosphere can be prevented from penetrating above the screen and through the printed pattern holes, and the viscosity of the paste changes due to the volatilization of the volatile solvent components and the oxygen in the atmosphere oxidizes and chemically reacts. It is possible to prevent the composition from changing.

(4) The end electrode formation on both ends of the chip-shaped component can be performed with high accuracy and efficiency by the end electrode forming apparatus shown in FIGS. 6 to 12. That is, in the end electrode forming apparatus, the first adhesive tape 171 is used to transfer a group of chip-shaped components, apply the conductor paste to one end of the chip-shaped component to form the end electrodes, and then to form the second electrode. It is possible to transfer the adhesive tape 181 and apply the conductor paste to the other end of the chip-shaped component to form the end-electrodes, and it is possible to automate both end-electrode formation processes of the chip-shaped component, improving mass productivity. Can be achieved.

(5) The first adhesive tape 171 and the second adhesive tape 181 have a structure in which the chip-shaped component is transferred to the conductor paste application and drying process while being adhered to the downward adhesive-coated surface of the first adhesive tape 171. Even if it is peeled off from the tape, it will fall, so defective chips will not be mixed in the subsequent process. Further, since the end part electrode of the chip-shaped component is always formed on the lower side, it is suitable for the gravity direction and the electrode forming accuracy can be maintained.

(6) The chip-shaped component is fixed to the first and second adhesive tapes so as to hang. When transferring from the first adhesive tape 171 to the second adhesive tape 181, the first adhesive tape 171 is inverted and the chip-shaped component is positioned on the first adhesive tape 171.
Since the chip-shaped component that fails to be delivered falls onto the first adhesive tape 171, it is possible to prevent defective products from being mixed. Further, it is difficult to receive a disturbance such as gravity during the formation of the electrodes and the transportation.

(7) According to the end electrode forming apparatus used in the present embodiment, the chip level leveling accuracy is within 5 μm, and the lengthwise dimension (B dimension in FIG. 16) of each end electrode of the chip-like component varies by 15 μm. Can be achieved within.

(8) The electroplating of the end electrodes is performed by the medialess barrel plating process of FIG. 13, and the problems associated with the use of media can be solved. That is, it is possible to solve the problems of developing a medium according to the product size, the problem that the medium is plated at the time of plating, and the workability deterioration of the separating work of the product and the medium after plating.

(9) Due to the above, 0 which was impossible in the past
Mass production of 603,0402 size microchip parts is realized. Further, it can be used for production of 1005 size ultra-small chip-shaped parts currently manufactured. Moreover, these ultra-small chip-shaped parts can be produced with high precision and high yield within the product standard size. Further, the manufacturing apparatus itself can be simplified and inexpensive compared to the conventional apparatus. That is,
When forming the end electrodes, there is no need for expensive aligning plates, carrier plates and large-scale transporting devices like the conventional ones, and no media is used for electroplating the end electrodes. This is because the discharging device is unnecessary.

FIGS. 15A and 15B show another example of the medialess barrel plating process for electroplating the end electrodes. As the barrel 320, a cylindrical body 321 made of an insulating resin such as a nylon mesh having a through hole or a gap for passing a plating solution.
Insulating lids are provided on both sides of (for example, a polygonal cylinder such as an octagonal cylinder), and a loop-shaped cathode 323 that hangs from a central axis 322 that horizontally penetrates the cylinder center of the cylinder 321 is used. Here, the cylindrical body 321 rotates around the center axis 322, but the center axis 322 does not rotate, and the loop cathode 3
Reference numeral 23 denotes a length that is always downward and does not contact the cylindrical body 321, and the lower side of the loop is formed in a band shape and arranged parallel to the anode 310 arranged below the barrel 320.

The cylindrical core of the cylindrical body 321 is rotatably supported about the central axis of rotation in the horizontal direction, and the loop cathode 323 is provided.
Is connected to the negative side of the plating power supply, and the anode 310 is connected to the positive side of the plating power supply. In this case, FIG. 15 (B)
As described above, the entire barrel 320 is immersed in the plating solution.

The chip-shaped component 110 with end electrodes is housed in the barrel 320 without using a medium and immersed in the plating solution to rotate the cylindrical body 321. Utilizing the feature that the surface area ratio of the external end electrodes is large, the end electrodes of many small chip-shaped components in the barrel are brought into contact with each other as shown in FIG. 14 (B) to form a conduction chain to the cathode 323. . At that time, the electroplating is performed while the conduction chain with the strip-shaped cathode 323 is made uniform by rotating the cylindrical body 321 and stirring the chip-shaped components.

The cylindrical body 321 is not limited to being made of resin, and may be a cylindrical body in which a metal mesh having a large number of through holes is coated with resin. Also, a loop cathode 323
Is more preferably arranged within a rotation angle of 30 to 45 ° with respect to the barrel rotation direction from the vertically lower surface from the barrel rotation axis as shown in FIG. 15 (B). Further, it is preferable that the chip-shaped component is accommodated within a range not exceeding 30% of the barrel internal volume. Further, the loop-shaped cathode 323 may be a twisted wire of copper, stainless steel or titanium, or may be composed of one piece of copper, stainless steel or titanium.

Although the embodiments of the present invention have been described above, it is obvious to those skilled in the art that the present invention is not limited to these and various modifications and changes can be made within the scope of the claims. Ah

[0114]

As described above, according to the method of manufacturing a very small size multilayer chip-shaped electronic component according to the present invention,
The following effects can be achieved.

(1) 0603,04 which was impossible in the past
It is possible to mass-produce 02-size microchip-like parts, and it can also be used for production of 1005 size microchip-like parts currently manufactured.

(2) Since it has become possible to print fine internal electrode patterns with high precision, and also it is possible to apply and form fine end electrodes with high precision, these extremely small chip-shaped parts can be manufactured to product standard dimensions. It can be produced with high accuracy and high yield.

(3) According to the manufacturing method of the present invention, the manufacturing equipment is simpler and less expensive than the conventional method. In other words, when forming the end electrodes, it is not necessary to use expensive alignment plates, carrier plates and large-scale transfer devices for them as in the past, and no media is used for plating the end electrodes. This is because the discharging device is unnecessary.

[Brief description of drawings]

FIG. 1 is a process drawing showing an embodiment of a method for manufacturing a microchip-type electronic chip component according to the present invention.

FIG. 2 is a front view showing a part of the screen printing machine used in the embodiment of the present invention as seen through.

FIG. 3 is a right side view of the same with a part thereof seen through.

FIG. 4 is a front sectional view showing a configuration of a printing unit in the screen printing machine.

FIG. 5 is an explanatory diagram showing a configuration for squeegee parallel measurement in the screen printing machine.

FIG. 6 is a front view of an end electrode forming device used in the embodiment of the present invention.

FIG. 7 is a process flow diagram of the end electrode forming apparatus.

FIG. 8 is a side sectional view of an electronic component supply unit in the end electrode forming device.

FIG. 9 is a plan view of the same.

FIG. 10 is a schematic perspective view showing a main configuration of a paste applying section in the end electrode forming apparatus.

FIG. 11 is a side sectional view of a paste applying section in the end electrode forming apparatus.

FIG. 12 is a side sectional view showing a transfer portion in the end electrode forming apparatus.

FIG. 13 is a medialess barrel plating process of the end electrodes in the embodiment of the present invention, (A) is a perspective view, and (B) is a side sectional view.

FIG. 14 is an explanatory diagram showing that electroplating can be performed in the medialess barrel plating process.

FIG. 15 is another example of the medialess barrel plating process of the end electrodes in the embodiment of the present invention,
Is a perspective view and (B) is a side sectional view.

FIG. 16 is an explanatory diagram showing a product dimensional accuracy standard of an extremely small chip-shaped component.

[Explanation of symbols]

1 case Two legs 3 Printing machine body 4 Loader / Unloader robot 10 sealed pods 20 Non-contact laser displacement meter 31 Lower mount 32 Upper mount 33 image processing camera 40 Printing Department 41 Printing table 42 print head 43 Airtight cover 51 base table 52 Correction table 55 Printing Stage 60 screen 70 Print head body 71 Squeegee holder 72 Squeegee 74 Air cylinder 75 pin 77 Push rod 78 backup spring 79 Rock bolt 80 Parallel light linear sensor 100 PET film 101 Dielectric layer (green sheet) 110 Chip parts 120 end electrode 170, 180 Tape running mechanism 171,181 adhesive tape 174,184 Drive roll 190 Electronic component supply unit 193 Alignment block 194 through hole 195 reference block 200,240 Paste application section 201 Flatbed for coating 202 scraping blade 203 Conductor paste layer for dip 204 Conductor paste layer for blotting 210,250 Drying section 220 Transfer Section 222 Reference block 229 hot plate 230 Leveling part 260 discharge part 270 stand 271 frames 295 Tape Guide 300,320 barrels 310 Anode 323 cathode

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takashi Sakurai             1-13-1, Nihonbashi, Chuo-ku, Tokyo Tea             DC Inc. (72) Inventor Satoshi Kurimoto             1-13-1, Nihonbashi, Chuo-ku, Tokyo Tea             DC Inc. (72) Inventor Hiroki Sato             1-13-1, Nihonbashi, Chuo-ku, Tokyo Tea             DC Inc. F-term (reference) 5E062 FF10                 5E082 AA01 AB03 BB01 BC14 EE04                       EE23 EE35 FF05 FG04 FG26                       FG46 MM23 MM24 PP03 PP06

Claims (4)

[Claims] 1. An internal electrode is printed on a green sheet, the green sheet on which the internal electrode is printed is laminated and pressed, cut into chip-like parts, and baked, and end electrodes are formed at the ends of the baked chip-like parts. A method of manufacturing an extremely small-sized multilayer chip-shaped electronic component to be formed, wherein the step of forming the end electrodes includes aligning one end of a group of chip-shaped components on an adhesive-coated surface of a first adhesive tape. , The other end is pressed against the flat coating bed to apply the conductor paste, and the conductor paste is dried to form the one-sided electrode. The adhesive tape of the second adhesive tape is transferred to the adhesive-coated surface, and one end of the group of chip-shaped components transferred to the second adhesive tape, which has not been coated with the conductor paste, is pressed against the flat bed for coating and guided. Paste was applied and dried to a manufacturing method of a multilayer electronic chip components tiny size, characterized in that it comprises a step of forming a bilateral electrode. 2. The step of plating the end electrodes is performed by immersing a group of chip-shaped parts housed in a barrel without using a medium in a plating solution to form a cathode on the barrel side and an anode outside the barrel. And a step of electroplating the end electrodes of the chip-shaped component by forming a chain of mutual contact and conduction between the end electrodes of the chip-shaped component with respect to the cathode while rotating the barrel while rotating the barrel. Item 2. A method for manufacturing an extremely small-sized multilayer chip-shaped electronic component according to Item 1. 3. The thermal expansion coefficient of the step of printing the internal electrodes on the green sheet is 7.98 to 9.10 × 10 ^−6.
/ ° C., lower composition of a stone surface plate which is a plutonic rock whose chemical composition is 45% or more by weight% of SiO ₂ , a upper composition fixed to the upper surface of the lower composition, and a printing table supported by the lower composition. A predetermined position on the green sheet positioned on the printing table, using a screen printing machine including a printing screen and a printing unit including a squeegee moving on the screen and supported by the upper mount. The method for manufacturing a very small-sized multilayer chip-shaped electronic component according to claim 1 or 2, further comprising a step of printing an internal electrode paste. 4. The method for manufacturing a laminated chip-shaped electronic component of extremely small size according to claim 1, wherein the size of the chip-shaped component is 1005 size or less.