JP2014120586A - Holding jig, holding jig set and stuck material holding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a holding jig capable of adhesion holding a stuck material, and easily removing the stuck material adhesion held, while maintaining the stickiness for the stuck material in the use of each time, and to provide a holding jig set and a stuck material holding device.SOLUTION: A holding jig includes a jig body, an adhesive elastic member formed on the surface of the jig body, and a thermally foamable adhesive member formed on the surface of the adhesive elastic member on the reverse side of the jig body surface.

Description

  The present invention relates to a holding jig, a set of holding jigs, and an object to be adhered holding device, and more specifically, in a normal state, a large number of objects to be adhered can be stably adhered and held in a uniform standing state. The holding object can be used repeatedly so that the object can be easily detached from the holding jig and the object can be adhered again even after the object is removed. And a large number of objects to be adhered and held on one holding jig can be transferred to the other holding jig as desired, and without using a scraping member such as a scraper. A pair of holding jigs and adherends that can be easily separated and can be used as a regenerated holding jig that can adhere the adherends by a simple operation after removing the adherends. Holding On location.

  Conventionally, for example, when manufacturing a small component such as a chip capacitor, a holding jig capable of sticking and holding a small component member or the like capable of manufacturing the small component on the surface thereof has been used. For example, the holding jig described in Patent Document 1 includes: “a jig main body, an intermediate elastic member formed on the surface of the jig main body, and a surface on which the jig main body of the intermediate elastic member is formed; Is an adhesive elastic member formed on the surface on the opposite side, and the intermediate elastic member has a smaller hardness than the adhesive elastic member ”(Patent Document 1) (See claim 1).

  The holding jig described in Patent Document 1 states that “even if the shape of the adherend is a thin rectangular parallelepiped, it is possible to stably stick and hold a large number of adherends in a uniform standing state”. Although it has the outstanding advantage, when this holding jig is used repeatedly, there exists a problem that the adhesive force of the said adhesive elastic member falls with progress of time.

  On the other hand, the invention disclosed in Patent Document 2 is “a method for forming an external electrode of a chip-shaped electronic component”, and the second attaching step in this external electrode forming method is “the plurality of chip-like components attached to the first adhesive material”. The element is attached to a second adhesive material having a heat resistant temperature lower than that of the first adhesive material and stronger adhesive force than the first adhesive material, with the first external electrode side as an adhesive surface. The step of peeling the plurality of chip-like elements from the first adhesive material by pulling the plurality of chip-like elements from the first adhesive material with a material ”(Claims of Patent Document 2, Claim 1) reference). And it is disclosed by patent document 2 that a thermal foaming adhesive is included as said 2nd adhesive material (refer the claim of patent document 2, claim 2).

  The “sheet 17 as the second adhesive material” disclosed in Patent Document 2 is a sheet having a substantially rectangular planar shape in which the foamable peeling adhesive 16 is applied to the surface of the PET film 18. It is being fixed to the holder which does not carry out. "(Refer paragraph number 0019 of patent document 2).

  When this foamable peelable adhesive material is foamed by heating, its adhesive strength is lost, so the sheet 17 cannot be used repeatedly. Therefore, the PET film 18 having the foamable peeling adhesive once used is peeled off from the holder fixed with an adhesive or the like, and the holder from which the used foaming peeling adhesive is removed is newly added with an adhesive or the like. The PET film 18 to which the unused foaming release adhesive is applied must be fixed.

JP 2009-105312 A Japanese Patent No. 4462218

  An object of the present invention is to adhere and hold an adherend to be adhered, to easily remove the adherend to be adhered, and to maintain adhesiveness to the adherend in each use. It is providing the holding jig which can carry out, The 2nd holding | maintenance is carried out from the 1st holding jig by sticking the to-be-adhered object to the 2nd holding jig from the 1st holding jig which carries out the adhesion holding. The operation of transferring the adherend to the jig and then separating the adherend from the second holding jig with a simple operation results in a decrease in the adhesiveness to the adherend in the second holding jig. It is to provide a set of holding jigs that can be repeatedly performed, and to provide an adherend holding apparatus having the set of holding jigs.

As means for solving the problems,
(1) Jig main body, adhesive elastic member formed on the surface of the jig main body, and thermal foaming property formed on the surface of the adhesive elastic member opposite to the surface of the jig main body. A holding jig comprising an adhesive member.
(2) Thermal foaming formed on a surface opposite to the surface of the base film that is bonded to the adhesive elastic member and the surface of the base film that is bonded to the adhesive elastic member. It is a holding jig as described in said (1) which has an adhesive layer,
(3) The holding jig according to (1), the holding jig or the jig main body according to (1), and an adhesive elastic member formed on a surface of the jig main body. A set of holding jigs equipped with tools,
The heat-foamable adhesive layer in the holding jig described in (1) of the set of holding jigs has a larger adhesive force than the adhesive elastic member in the other holding jig. A set of holding jigs,
(4) A to-be-adhered object holding device provided with the set of holding jigs according to (3),
It is.

  Since the holding jig according to the present invention includes the thermally foamable adhesive member on the surface of the adhesive elastic member, the object to be adhered can be adhered at room temperature. When the holding jig is positioned so that the heat-foamable adhesive member is located on the lower surface, the object to be adhered is held and adhered to the heat-foamable adhesive member while hanging the object to be adhered to the heat-foamable adhesive member at room temperature. be able to. When the heat-foamable pressure-sensitive adhesive member that holds the pressure-sensitive adhesive object in a suspended state is heated in this way, foaming occurs in the heat-foamable pressure-sensitive adhesive member, and the surface of the heat-foamable pressure-sensitive adhesive member is adhered to the surface. Changes to an uneven surface. When the surface of the foamable adhesive member changes to an uneven surface, the area where the adherend is in contact with the surface of the thermally foamable adhesive member decreases. The state in which the adherend is stuck to the thermally foamable adhesive member depends on the adhesive force in the contact area where the adherend is in contact with the thermally foamable adhesive member. A decrease in contact area results in a decrease in adhesion. As a result, the adherend to be suspended is dropped from the holding jig by its own weight. Therefore, according to the holding jig according to the present invention, the holding jig is held to the holding jig by the operation of scraping the adherend with a scraping member such as a scraper or the operation of vibrating the holding jig. It is not necessary to remove the adherend from the holding jig. The fact that the adherend can be detached from the holding jig simply by heating without using a scraping member such as a scraper or a vibration device realizes simplification of the device configuration and cost reduction. be able to.

  Since the heat-foamable pressure-sensitive adhesive member in the present invention loses the pressure-sensitive adhesive property for sticking the member to be bonded after heating, the once-used holding jig cannot stick the object to be bonded. That is, the used holding jig cannot be reused as it is.

  Therefore, in the present invention, the heat-foamable pressure-sensitive adhesive member is peeled off from the used holding jig, and the unused heat-foamable pressure-sensitive adhesive member is attached to the surface of the pressure-sensitive adhesive elastic member exposed by peeling. The holding jig formed by sticking an unused heat-foamable pressure-sensitive adhesive member can be used effectively for the next pressure-sensitive adhesive object. And in order to isolate | separate a to-be-adhered material from the heat-foamable adhesive member which adhered the to-be-adhered material, above-described heating operation is performed.

  In the set of holding jigs according to the present invention, the second holding jig includes an adhesive elastic member and a thermally foamable adhesive member, and in the first holding jig, the thermally foamable adhesive member. The adhesive elastic member is provided without having. The adhesiveness of the thermally foamable adhesive member in the second holding jig has a larger adhesive force than the adhesive elastic member in the first holding jig.

  Therefore, the thermally foamable adhesive member in the second holding jig is brought into contact with the adherend to be adhered to the adhesive elastic member of the first holding jig, and the adherend is adhered to the thermally foamable adhesive member. When the first holding jig and the second holding jig are moved away from each other, or when one of the holding jigs is moved, the heat foaming adhesive member in the second holding jig is moved. The adherend adheres, and the adherend moves from the first holding jig to the second holding jig.

  When the heat-foamable pressure-sensitive adhesive member in the second holding jig for sticking and holding the adherend is heated, the heat-foamable pressure-sensitive adhesive member foams and the surface of the heat-foamable pressure-sensitive adhesive member becomes an uneven surface. When the surface of the heat-foamable pressure-sensitive adhesive member becomes an uneven surface, the contact area between the heat-foamable pressure-sensitive adhesive member and the adherend is reduced. Since the adhesiveness of the adherend due to the heat-foamable pressure-sensitive adhesive member decreases due to the reduction of the contact area, the adherend can be easily removed from the heat-foamable pressure-sensitive adhesive member. In particular, when the adherend is in a state of being suspended from the heat-foamable adhesive member, simply heating the heat-foamable adhesive member causes the object to be adhered and held in the suspended state to fall from the heat-foamable adhesive member. And leave.

  The heat-foamable pressure-sensitive adhesive member from which the adherend is separated cannot be used again as a pressure-sensitive adhesive member. Therefore, the heat-foamable pressure-sensitive adhesive member foamed by heating is peeled off from the pressure-sensitive adhesive elastic member, and a heat-foamable pressure-sensitive adhesive member is newly attached to the exposed surface of the pressure-sensitive adhesive elastic member. As a result, a new second holding jig is obtained. This new second holding jig is used again for the transfer of the adherend in combination with the first holding jig.

  As described in detail above, according to the present invention, the adherend can be adhered and held, and the adherend to be adhered can be easily removed, and the adhesiveness to the adherend is improved. A holding jig that can be maintained in each use can be provided, and the first holding is performed by adhering the adherend to the second holding jig from the first holding jig that holds the object to be adhered. The operation of transferring the object to be adhered from the jig to the second holding jig and then separating the object to be adhered from the second holding jig by a simple heating operation is as simple as replacing the heat-foamable adhesive member. A set of holding jigs that can be repeatedly performed can be provided.

FIG. 1 is a perspective view showing an example of a holding jig according to the present invention. FIG. 2 is a schematic perspective view showing a set of holding jigs as an example of the set of holding jigs according to the present invention. FIG. 3 is a schematic explanatory view showing an adherend holding device which is an embodiment of the adherend holding device according to the present invention. FIG. 4 is a schematic cross-sectional view for explaining a procedure for adhering the adherend to the first adhesive elastic member in the standing state in the adherend holding apparatus which is an embodiment of the adherend holding apparatus according to the present invention. It is explanatory drawing. FIG. 5 is a schematic explanatory view showing a state in which the adherend member is suspended and held by the first holding jig in the adherend holding apparatus which is an embodiment of the adherend holding apparatus according to the present invention. FIG. 6 is a schematic view showing a state in which a member to be adhered on which an electrode is formed is suspended and held on a first holding jig in the object-to-be-adhered holding device which is an embodiment of the object-to-be-adhered device according to the present invention. It is explanatory drawing. FIG. 7 shows a pressure-sensitive adhesive member suspended from a first holding jig in the pressure-sensitive adhesive object holding apparatus according to an embodiment of the present invention, and pressed against the second holding jig. It is a schematic explanatory drawing which shows a state. FIG. 8 shows a second example of an object to be adhered holding apparatus according to the present invention, in which the object to be adhered is formed by hanging electrodes on both ends of the second holding jig. It is a schematic explanatory drawing which shows a state.

  A holding jig as an embodiment of the holding jig according to the present invention will be described with reference to the drawings. As shown in FIG. 1, the holding jig 1 includes a jig main body 2, an adhesive elastic member 3 formed on at least a part of the surface of the jig main body 2, and a jig of the adhesive elastic member 3. It has a heat-foamable adhesive member 4 formed on the surface opposite to the main body 2 side, and the object to be adhered can be held by the adhesive force of the heat-foamable adhesive member 4. This holding jig corresponds to the second holding jig of the set of holding jigs.

  The adherend in this invention is a member for a small part that can produce a small part by being adhesively held by the holding jig according to the present invention, such as a member for a small instrument, a member for a small machine element, and a small member. Examples include electronic component members. In addition, since the manufacture of small parts includes a process of transporting small parts, the adherend includes small parts themselves, for example, small instruments, small machine elements, and small electronic parts. Therefore, in the present invention, it is not necessary to clearly distinguish the small component from the small component member. Among these adherends, examples of the adherend suitable for the holding jig according to the present invention to stick and hold include small electronic components and / or members for small electronic components. As the small electronic component and the small electronic component member, for example, a finished product or an unfinished product such as a capacitor chip (also referred to as a chip capacitor), an inductor chip, a resistor chip, and / or the like. For example, a prism or cylinder, a prism or cylinder having ridges at one end, a prism or cylinder having ridges at both ends, and the like.

  The holding jig according to the present invention is suitable, for example, as an adhesive holding device for such a small electronic component and / or a member for a small electronic component. In particular, the holding jig according to the present invention is more suitable for holding an adhesive for a small electronic component member that needs to be coated with a conductive paste in at least two places.

  Focusing on the adherend, examples of the shape of the chip capacitor include a prismatic body (for example, vertical x horizontal x height (mm) is 0.5 x 0.5 x 1.0 (mm)).

  The jig body 2 in the holding jig 1 holds or supports the adhesive elastic member 3 and the thermally foamable adhesive member 4. The jig body 2 can be in various forms based on various design changes as long as the adhesive elastic member 3 and the heat-foamable adhesive member 4 can be held or supported. For example, the jig main body 2 in the holding jig 1 is formed in a disk-shaped body having a square shape as shown in FIG.

  The jig body 2 only needs to have a thickness capable of holding or supporting the adhesive elastic member 3 and the heat-foamable adhesive member 4, but the thickness of the holding jig 1 is easily adjusted within a predetermined range. In view of this, the jig body 2 preferably has a smooth surface, and the jig body 2 preferably has a uniform thickness.

  The jig body 2 is subjected to primer treatment, corona treatment, etching treatment and / or plasma treatment on the surface on which the adhesive elastic member 3 is formed in order to improve the adhesion to the adhesive elastic member 3. preferable.

  The adhesive elastic member 3 is formed on at least a part of the surface of the jig body 2. The adhesive elastic member 3 is designed so that the heat-foamable adhesive member 4 can be held by adhesion. For example, as shown in FIG. It is molded into.

The adhesive elastic member 3B has an adhesive force capable of sticking and holding an adherend. Specifically, the pressure-sensitive elastic member 3B may typically that has the adhesive force of 1 to 50 g / mm ^2, more good has the adhesive force of 7~50g / mm ^2.

  Here, the adhesive force of the adhesive elastic member 3B is obtained as follows. The following adhesive strength measurement method was devised by the applicant and is therefore referred to as the Shin-Etsu Polymer Method.

First, a suction fixing device (for example, trade name: electromagnetic chuck, KET-1530B, manufactured by Kanetech Co., Ltd.) or a vacuum suction chuck plate for horizontally fixing the adhesive elastic member 3B, and a cylinder with a diameter of 10 mm at the tip of the measurement unit A load measuring device equipped with a digital force gauge (trade name: ZP-50N, manufactured by Imada Co., Ltd.) to which a contact made of stainless steel (SUS304) is attached is prepared. Next, the adhesive elastic member 3B is fixed on the suction fixing device or the vacuum suction chuck plate in the load measuring device, and the measurement environment is set to 21 ± 1 ° C. and the humidity 50 ± 5%. Next, the contact attached to the load measuring device is lowered until it comes into contact with the measurement site of the adhesive elastic member 3B at a speed of 20 mm / min, and then this contact is applied to the measurement site with a predetermined load. Press vertically for 3 seconds against the measuring part. Here, the predetermined load is set to 25 g / mm ² . Next, the contact is pulled away from the site to be measured at a speed of 180 mm / min, and the pulling load measured by the digital force gauge at this time is read. This operation is performed at a plurality of locations of the measurement site, and the plurality of separation loads obtained are arithmetically averaged, and the obtained average value is used as the adhesive force of the adhesive elastic member 3B. In addition, although this measuring method may be performed manually, for example, it may be performed automatically using a device such as a test stand (for example, trade name: VERTICAL MODEL MOTORIZED STAND series, manufactured by Imada Co., Ltd.). .

  The adhesive elastic member 3B only needs to have a desired thickness, but the thickness of the holding jig 1 can be easily adjusted to a predetermined range, and the sheet-like heat-foamable adhesive member 4 can be made uniform. The adhesive elastic member 3B preferably has a smooth surface, and the adhesive elastic member 3B preferably has a uniform thickness in that it can be adhesively held.

  The jig body 2 may be formed of a material capable of holding or supporting an adhesive elastic member. For example, a metal plate such as stainless steel and aluminum, a metal foil such as an aluminum foil and a copper foil, polyester, polytetra Resin films or resin plates such as fluoroethylene, polyimide, polyphenylene sulfide, polyamide, polycarbonate, polystyrene, polypropylene, polyethylene and polyvinyl chloride, paper such as Japanese paper, synthetic paper and polyethylene laminated paper, and cloth, glass fiber and glass plate And a composite material such as a glass epoxy resin plate. Furthermore, the jig body 2 may be a laminate formed by laminating a plurality of sheet-like materials. The jig body 2 is preferably formed of a hard material made of metal, resin or ceramics.

  The adhesive elastic member 3B only needs to be formed of an adhesive material that can impart the adhesive force to the adhesive elastic member 3B, or a cured product of this adhesive material. Resin or fluorine rubber, fluorine resin containing fluorine resin or fluorine rubber, silicone resin or silicone rubber, silicone composition containing silicone resin or silicone rubber, urethane elastomer, natural rubber, styrene-butadiene copolymer Examples include various elastomers such as a polymerized elastomer. Among these, addition reaction curable adhesive silicone compositions and peroxide curable adhesive silicone compositions containing silicone rubber and / or silicone rubber are preferred.

  Examples of the addition reaction curable adhesive silicone composition include a raw silicone rubber (a), a crosslinking component (b), an adhesion improver (c), a catalyst (d), and a silica-based filler (e). Can be mentioned.

Examples of the silicone raw rubber (a) include a (R ₂ SiO _2/2 ) unit (R represents a hydrocarbon group), and a polydimethylsiloxane long chain polymer which may have a substituent. For example, a polyorganosiloxane that can be cross-linked by an addition reaction can be used, and more specifically, an alkenyl group-containing polyorganosiloxane can be used, and in particular, it is represented by the following formula (1). An alkenyl group-containing polyorganosiloxane can be preferably used.

_{^{R 1 (3-a) X}} a SiO- (R 1 XSiO) m - (R 1 2 SiO) n -SiR 1 (3-b) X b (1) equation However, in (1), ^{R 1} is A monovalent hydrocarbon group having no aliphatic unsaturated bond, which may be the same or different, and X is an alkenyl-containing organic group, which may be the same or different. Good. A is an integer of 0 to 3, b is an integer of 0 to 3, m is an integer of 0 or more, n is an integer of 100 or more, and a, b, and m are not 0 at the same time.

In the formula (1), R ¹ is preferably the hydrocarbon group having 1 to 10 carbon atoms, for example, a linear or branched alkyl group such as a methyl group, an ethyl group, a propyl group, or a butyl group, a cyclohexyl group, or the like. Aryl groups such as a cycloalkyl group, phenyl group, and tolyl group, and the like, and a methyl group and a phenyl group are particularly preferable. Moreover, as an alkenyl group containing organic group shown by X, a C2-C10 alkenyl group containing organic group is preferable, for example, carbon double bond containing hydrocarbons, such as a vinyl group, an allyl group, a hexenyl group, and an octenyl group Group, acryloylpropyl group, acryloylmethyl group, methacryloylpropyl group, methacryloylmethyl group and other (meth) acryloylalkyl groups, cyclohexenylmethyl group, cyclohexenylethyl group, cyclohexenylpropyl group and other cycloalkenylalkyl groups, vinyloxypropyl Groups and the like.

  The silicone raw rubber (a) may have oily or clay-like properties, and its viscosity is preferably 50 mPa · s or more at 25 ° C., particularly preferably 100 mPa · s or more.

  A silicone raw rubber (a) may be used individually by 1 type, and may mix and use 2 or more types.

  The cross-linking component (b) is a component capable of undergoing a cross-linking reaction with the silicone raw rubber (a). For example, the SiH bond having at least 2 or more, preferably 3 or more H atoms bonded to Si atoms in one molecule. Containing polyorganosiloxane (hereinafter sometimes referred to as organohydrogenpolysiloxane) can be used.

  The organohydrogenpolysiloxane can be used by appropriately selecting from linear, branched, and cyclic organohydrogenpolysiloxanes. For example, the following formula (2) or (3) A preferred example is an organohydrogenpolysiloxane represented by the formula:

^{_{HcR 1 (3-c) SiO-}} (HR 1 SiO) x - (R 1 2 SiO) y -SiR 1 (3-d) H d (2) formula

In the formulas (2) and (3), R ¹ is the same monovalent hydrocarbon group as described above and may be the same or different. C and d are integers of 0 to 3, x, y and s are integers of 0 or more, r is an integer of 1 or more, c, d and x are not 0 simultaneously, and x + y ≧ 0 It is. Further, r + s ≧ 3, preferably 8 ≧ r + s ≧ 3.

  Among these organohydrogenpolysiloxanes, organohydrogenpolysiloxane having oily properties and a viscosity of 1 to 5000 mPa · s at 25 ° C. is preferable.

  A crosslinking component (b) may be used individually by 1 type, and may mix and use 2 or more types.

  The blending ratio of the crosslinking component (b) can be appropriately selected. When the silicone raw rubber (a) contains an alkenyl group and the crosslinking component (b) contains a SiH bond, the silicone raw rubber The molar ratio of the SiH bond in the crosslinking component (b) to the alkenyl group in (a) is preferably from 0.5 to 20, and particularly preferably from 1 to 15. When this molar ratio is less than 0.5, the crosslinking density after curing described later is low, and it may be difficult to maintain the shape of the adhesive elastic member 3B. On the other hand, when the molar ratio exceeds 20, the adhesive strength of the adhesive elastic member 3B may be reduced.

The adhesive strength improver (c) is a component blended to improve the adhesive strength. For example, polyorganosiloxane can be used, and in particular, R ² ₃ SiO _1/2 units and SiO ₂ units ( However, R ² is a monovalent hydrocarbon group that does not have an aliphatic unsaturated bond. Here, as R ^2, preferably a substituted group having 1 to 10 carbon atoms, a methyl group, an ethyl group, a propyl group, a linear or branched alkyl group such as butyl group, cycloalkyl groups such as cyclohexyl group, a phenyl group, An aryl group such as a tolyl group can be exemplified, and a methyl group and a phenyl group are particularly preferable.

  In general, the adhesive strength improver (c) has a structure in which a crosslinking reaction does not occur or hardly occurs together with the silicone raw rubber (a) and the crosslinking component (b) in order to ensure a higher degree of adhesion. preferable.

When polyorganosiloxane is used as the adhesive strength improver (c), those having a molar ratio of R ² ₃ SiO _1/2 units / SiO ₂ units of 0.6 to 1.7 are preferable. When the molar ratio is less than 0.6, the adhesive elastic member 3B has too high adhesiveness or is hardly compatible with the silicone raw rubber (a), and the silicone raw rubber (a) and the adhesive strength improver (c) May separate and no longer develop tackiness. On the other hand, if the molar ratio exceeds 1.7, the adhesive strength of the adhesive elastic member 3B may be reduced.

  In addition, this polyorganosiloxane may contain OH group couple | bonded with Si atom, and it is preferable that OH group content is 0-4.0 mol% in that case.

  In the case of using one containing an OH group bonded to an Si atom, when the polyorganosiloxane represented by the following formula (4) is contained as the silicone raw rubber (a), the silicone raw rubber (a) and an adhesion improver (C) may partially form a condensation reaction product.

(OH) R ¹ YSiO— (R ¹ XSiO) _p — (R ¹ ₂ SiO) _q —SiR ¹ ₂ (OH) (4) where R ¹ has an aliphatic unsaturated bond. The monovalent hydrocarbon group may be the same or different and Y is R ¹ or an alkenyl group-containing organic group. X is an alkenyl-containing organic group. P is an integer of 1 or more, and q is an integer of 100 or more. The monovalent hydrocarbon group and alkenyl group-containing organic group are the same as described above.

  In order to form a condensation reaction product of the silicone raw rubber (a) and the adhesion improver (c), a mixture of the silicone raw rubber (a) and the adhesion improver (c) dissolved in a solvent such as toluene, The reaction may be performed at room temperature to reflux in the presence of an alkaline catalyst.

  The adhesive strength improver (c) may be used singly or in combination of two or more.

  The adhesion improver (c) is preferably used in a mass ratio of silicone raw rubber (a) / adhesion improver (c) in the range of 20/80 to 80/20, and particularly 30/70 to 70/30. Is preferable. If the adhesive strength improver (c) is less than this range, the adhesiveness tends to be insufficient. On the other hand, if the adhesive strength improver (c) is large, the adhesive elastic member 3B becomes hard and elastic, and the adhesive elastic member 3B is difficult to deform. In any case, it may be difficult to hold the small electronic component with adhesive.

  The catalyst (d) is a catalyst that mainly promotes a crosslinking reaction between the silicone raw rubber (a) and the crosslinking component (b), and may be any catalyst that is usually used as a hydrosilation catalyst. For example, a platinum compound etc. are mentioned. Platinum compounds include chloroplatinic acid, alcohol solution of chloroplatinic acid, reaction product of chloroplatinic acid and alcohol, reaction product of chloroplatinic acid and olefin compound, reaction product of chloroplatinic acid and vinyl group-containing siloxane, etc. Is mentioned.

  The blending ratio of the catalyst (d) is preferably 1 to 5,000 ppm as a platinum component, particularly 5 to 2,000 ppm, with respect to the total mass of the silicone raw rubber (a) and the crosslinking component (b). It is preferable to do. When the blending ratio is less than 1 ppm, the curability is lowered and the crosslinking density is lowered, and the adhesive strength of the adhesive elastic member 3B may be reduced. On the other hand, when it exceeds 5,000 ppm, the usable time of the treatment bath is shortened. There is.

  The silica-based filler (e) is added together with the above components to reinforce the mechanical strength of the adhesive elastic member 3B and at the same time, the component constituting the adhesive elastic member 3B, in particular, an adhesive strength improver that provides adhesiveness. (C) is a component that disperses the adhesive layer in the adhesive layer and contributes to secure adhesion of small electronic components.

Examples of the silica-based filler (e) include silica, quartz powder, diatomaceous earth, and the like, preferably silica. Suitable silica, the specific surface area measured by BET method is ^{50 m} 2 / g or more, preferably mention may be made of silica 100 to 400 m ² / g. When the addition reaction curable pressure-sensitive adhesive silicone composition contains silica having such a specific surface area, the mechanical strength such as the tensile strength of the pressure-sensitive adhesive elastic member 3B can be improved and adhesiveness can be imparted. Becomes difficult to detach, and it becomes difficult to produce fine shavings and residue. In addition, when the specific surface area exceeds 400 m ² / g, the flow characteristics of the addition reaction curable pressure-sensitive adhesive silicone composition may be deteriorated, and it may take time to manufacture the pressure-sensitive adhesive elastic member 3B and increase the cost. .

  Examples of the silica-based filler (e) include silica synthesized by a dry method such as fumed silica and calcined silica, silica synthesized by a wet method such as precipitated silica and silica gel. Among these, fumed silica and precipitated silica are preferable in that it is easy to obtain silica having the specific surface area.

  A silica type filler (e) may be used individually by 1 type, or 2 or more types may be mixed and used for it. Moreover, you may use what processed the surface of the silica type filler (e) with surface treating agents, such as organopolysiloxane, organopolysilazane, chlorosilane, alkoxysilane, as needed.

  The blending ratio of the silica-based filler (e) is preferably 1 to 30 parts by mass with respect to 100 parts by mass in total of the silicone raw rubber (a) and the adhesion improver (c), More preferably, it is 20 parts by mass. When the blending ratio is less than 1 part by mass, the strength of the adhesive elastic member 3B is lowered, and it becomes difficult to obtain a sufficient effect, and fine shavings and residue may easily occur during use. . On the other hand, when the blending ratio exceeds 30 parts by mass, the adhesive strength of the adhesive elastic member 3B may be reduced.

  Furthermore, in this invention, it is possible to add arbitrary components from the silicone raw rubber (a) to the silica-based filler (e) as appropriate.

  For example, a reaction control agent for suppressing a crosslinking reaction when mixing the components can be added. Examples of the reaction control agent include 3-methyl-1-butyn-3-ol, 3-methyl-1-pentyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, and 1-ethynyl. Cyclohexanol, 3-methyl-3-trimethylsiloxy-1-butyne, 3-methyl-3-trimethylsiloxy-1-pentyne, 3,5-dimethyl-3-trimethylsiloxy-1-hexyne, 1-ethynyl-1- Trimethylsiloxycyclohexane, bis (2,2-dimethyl-3-butynoxy) dimethylsilane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1,1,3 Examples include 3-tetramethyl-1,3-divinyldisiloxane.

  When adding this reaction control agent, the mixture ratio shall be 0-5.0 mass parts with respect to a total of 100 mass parts of the said silicone raw rubber (a) and the said adhesive force improving agent (c). Especially, it is preferable to set it as 0.05-2.0 mass parts. When the blending ratio of the reaction control agent exceeds 5.0 parts by mass, it may be difficult to cure at the time of curing the adhesive composition.

  In addition to this reaction control agent, it is possible to add optional components as appropriate, for example, non-reactive polyorganosiloxanes such as polydimethylsiloxane and polydimethyldiphenylsiloxane, and non-adhesive silicone rubbers. As a solvent for lowering the viscosity during composition, coating, aromatic solvents such as toluene and xylene, aliphatic solvents such as hexane, octane and isoparaffin, ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone, acetic acid An ester solvent such as ethyl and isobutyl acetate, an ether solvent such as diisopropyl ether and 1,4-dioxane, a mixed solvent thereof, a dye, and a pigment can be used.

  As a composition containing the said silicone raw rubber (a), a crosslinking component (b), an adhesive improvement agent (c), a catalyst (d), and a silica type filler (e), you may manufacture suitably and are a commercial item. May be used. Examples of commercially available products include “X-40 series” such as trade names “KE1214” and “X-40-3098” manufactured by Shin-Etsu Chemical Co., Ltd., which is a composition not containing the silica filler (e). And "X-34 series" compositions such as "X-34-632A / B" are available.

  The peroxide curable adhesive silicone composition contains a silicone raw rubber (a), an adhesive strength improver (c), a silica filler (e), and an organic peroxide (f). Can be mentioned.

As the rubber silicone raw rubber (a), a long-chain polymer of polysiloxane which contains a (R ₂ SiO _2/2 ) unit (R represents a hydrocarbon group) and may have a substituent, etc. For example, polydimethylsiloxane, a substituted product thereof, and the like can be given. The properties, viscosity, etc. of the silicone raw rubber (a) are basically the same as those of the silicone raw rubber (a) contained in the addition reaction curable pressure-sensitive adhesive composition. A silicone raw rubber (a) may be used individually by 1 type, and may mix and use 2 or more types.

  The adhesive strength improver (c) and the silica-based filler (e) contained in the peroxide curable adhesive silicone composition are each an adhesive strength improver contained in the addition reaction curable adhesive composition. Basically the same as (c) and the silica-based filler (e).

  The organic peroxide (f) contained in the peroxide curable adhesive silicone composition is mainly composed of silicone raw rubbers (a), or silicone raw rubber (a) and an adhesion improver (c). It is a curing agent to be crosslinked, and examples thereof include diacyl peroxides such as benzoyl peroxide and dialkyl peroxides such as di-t-butyl peroxide. As the organic peroxide (f), diacyl peroxides are preferable, and benzoyl peroxide is particularly preferable.

  The blending ratio of the organic peroxide (f) is preferably 0.2 to 5.0 parts by mass with respect to the total mass of the silicone raw rubber (a) and the adhesive strength improver (c), and is particularly preferably 0.00. It is suitable to set it as 5-2.5 mass parts. If the blending ratio is less than 0.2 parts by mass, the curability is lowered and the crosslink density is lowered, and the adhesive strength of the adhesive layer may be reduced. On the other hand, if it exceeds 5.0 parts by mass, the adhesive composition In some cases, the adhesive elastic member 3 </ b> B formed by the method has a disadvantage that the hardness of the adhesive elastic member 3 </ b> B increases and the adhesive strength decreases.

  In addition to the silicone raw rubber (a), the adhesive strength improver (c), the silica-based filler (e) and the organic peroxide (f), the peroxide curable pressure-sensitive adhesive silicone composition It is possible to add optional components. As an arbitrary component, the component illustrated by the said addition reaction curable adhesive composition is mentioned.

  As such a peroxide curable adhesive silicone composition, it may manufacture suitably and a commercial item may be used. As a commercial item, the brand name "KR-101-10", "KR-120", "KR-130" by Shin-Etsu Chemical Co., Ltd. which is a composition which does not contain the said organic peroxide (f), for example. And “KR-140” are available.

  For example, when the adhesive elastic member 3B is formed of the addition reaction curable adhesive silicone composition, it is usually cured by heating at 80 to 130 ° C. for 3 to 40 minutes. Moreover, when the adhesive elastic member 3B is formed with the said peroxide curable adhesive silicone composition, it is normally hardened | cured by heating at 100-150 degreeC for 5 to 20 minutes. The addition reaction curable adhesive silicone composition and the peroxide curable adhesive silicone composition cured in this manner are further subjected to secondary heating at 170 to 220 ° C. for 2 to 10 hours. Also good.

  As shown in FIG. 1, the heat-foamable pressure-sensitive adhesive member 4 in the holding jig 1 includes a base film 4A and a heat-foamable pressure-sensitive adhesive layer 4B formed of a heat-foamable pressure-sensitive adhesive on the surface of the base film 4A. Have

  Examples of the base film 4A include polyester films such as polyethylene terephthalate films; olefin resin films such as polyethylene films and polypropylene films; polyvinyl chloride films; polyimide films; polyamide films such as nylon films; and plastics such as rayon films. A base film (synthetic resin film) is mentioned. In addition, a paper base material (a base material made of paper such as fine paper, Japanese paper, craft paper, glassine paper, synthetic paper, topcoat paper) may be used. Among these, a polyester film such as a polyethylene terephthalate film is preferably used.

  As the heat-foamable pressure-sensitive adhesive, a heat-foaming-agent-containing pressure-sensitive adhesive composition having an acrylic polymer mainly composed of an acrylic monomer as a base polymer is preferable. In particular, a thermal foaming agent-containing pressure-sensitive adhesive composition composed of a vinyl monomer mixture or a partial polymer thereof, a photopolymerization initiator or a thermal polymerization initiator, a thermal foaming agent, and a polyfunctional (meth) acrylate is preferable.

  The vinyl monomer is not particularly limited as long as it is a monomer having an unsaturated double bond and capable of radical polymerization (radical polymerizable monomer), but is preferably an acrylic monomer from the viewpoint of reactivity, and particularly an acrylic monomer. Among the monomers, alkyl (meth) acrylates having an alkyl group having 2 to 18 carbon atoms are preferable. That is, an acrylic monomer is preferable as the main component of the vinyl monomer mixture or partial polymer thereof used in the thermal foaming agent-containing pressure-sensitive adhesive composition, and in particular, an alkyl (meth) acrylate having an alkyl group having 2 to 18 carbon atoms. Is preferred.

  The photopolymerization initiator is not particularly limited, and for example, benzoin ether photopolymerization initiator, acetophenone photopolymerization initiator, α-ketol photopolymerization initiator, aromatic sulfonyl chloride photopolymerization initiator, photoactivity An oxime photopolymerization initiator, a benzoin photopolymerization initiator, a benzyl photopolymerization initiator, a benzophenone photopolymerization initiator, a ketal photopolymerization initiator, a thioxanthone photopolymerization initiator, or the like can be used.

  Examples of the thermal polymerization initiator include 2,2′-azobisisobutyronitrile, 2,2′-azobis-2-methylbutyronitrile, 2,2′-azobis (2 -Methylpropionic acid) dimethyl, 4,4'-azobis-4-cyanovaleric acid, azobisisovaleronitrile, 2,2'-azobis (2-amidinopropane) dihydrochloride, 2,2'-azobis [2- (5-Methyl-2-imidazolin-2-yl) propane] dihydrochloride, 2,2′-azobis (2-methylpropionamidine) disulfate, 2,2′-azobis (N, N′-dimethyleneisobutyl) Amidine) azo-based thermal polymerization initiators such as dihydrochloride; peroxide-based thermal polymerization initiators such as dibenzoyl peroxide and tert-butyl permaleate; Box-based thermal polymerization initiators, and the like. The amount of the thermal polymerization initiator used is not particularly limited as long as it can be conventionally used as a thermal polymerization initiator.

The thermal foaming agent is not particularly limited, and for example, a known thermal foaming agent can be appropriately selected and used. Among them, a microencapsulated foaming agent can be preferably used. Examples of such microencapsulated foaming agents include microspheres (“thermal expansion”) in which a material that expands easily by gasification by heating, such as isobutane, propane, or pentane, is encapsulated in an elastic shell. May be referred to as ”microspheres”)
Examples of the polyfunctional (meth) acrylate include trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetraacrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, 1,2-ethylene glycol di (meth) acrylate, 1,4-butylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,12-dodecanediol di (meth) acrylate, dipenta Erythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, polyethylene glycol di (meth) acrylate, hexanediol di (meth) acrylate , (Poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, tetramethylolmethane tri (meth) acrylate, allyl (meth) acrylate, vinyl (meta ) Acrylates, epoxy acrylates, polyester acrylates, urethane acrylates, reactive hyperbranched polymers having a plurality of (meth) acryloyl groups at the terminals [for example, trade names “CN2300”, “CN2301”, “CN2320” (manufactured by SARTOMER), etc.], etc. Is mentioned. In addition, polyfunctional (meth) acrylate can be used individually or in combination of 2 or more types.

  The heat-foamable pressure-sensitive adhesive in the present invention exhibits normal pressure-sensitive adhesive strength at room temperature, and when heated to a predetermined temperature or higher, the foaming agent foams to reduce the adhesive area and the surface of the heat-foamable pressure-sensitive adhesive layer is uneven. As a result, the adhesive strength is lost, and the adherend becomes separable from the thermally foamable adhesive layer. The adhesive force is larger than the adhesive force of the adhesive elastic member in the other holding jig, and the foaming temperature is adjusted to be lower than the heat resistant temperature of the thermally foamable adhesive member.

  As such a heat-foamable pressure-sensitive adhesive member 4, a product name “Riva Alpha” manufactured by Nitto Denko Corporation can be used.

  In the holding jig 1, the adhesive elastic member 3 is formed of the adhesive material on at least a part of the surface of the jig body 2, and the thermally foamable adhesive member 4 is further formed on at least a part of the surface of the adhesive elastic member 3. It can be formed and manufactured. For example, the holding jig 1 produces the sheet-like molded body by molding the rubber composition and the adhesive material, respectively, both sides of the sheet-shaped molded body formed of the rubber composition, and the adhesive One side of the sheet-like molded body formed of the material is polished, and an adhesive or a primer is applied to each polished surface by spraying, dipping, etc., and then bonded to the rubber composition. Even if the sheet-like molded body formed by bonding the formed sheet-like molded body and the sheet-like molded body formed of the adhesive material is attached to at least a part of the surface of the jig body 2, Good. Further, the holding jig 1 forms a sheet-like laminated molded body by laminating and vulcanizing the rubber composition and the adhesive material, and then polishing both surfaces of the sheet-like laminated molded body. Then, after applying an adhesive or primer to the surface formed by the rubber composition by spraying, dipping, or the like, the sheet-like laminated molded body is attached to at least a part of the surface of the jig body 2, May be manufactured. Furthermore, the holding jig 1 may be formed by integrally forming the jig body 2 and the adhesive elastic member 3B by transfer molding.

  The primer is not particularly limited, and examples thereof include a silane coupling primer. The adhesive is not particularly limited, and examples thereof include alkyd resins, phenol-modified / silicone-modified alkyd resin modified products, oil-free alkyd resins, acrylic resins, silicone resins, epoxy resins, fluororesins, phenol resins, polyamides. Resins, urethane resins and mixtures thereof may be mentioned. Among these, an adhesive having an amino group and / or a hydroxyl group is preferable. Moreover, an isocyanate compound, a melamine compound, an epoxy compound, a peroxide, a phenol compound, a hydrogensiloxane compound, etc. are used as a crosslinking agent for curing these resins.

  In order to make the thickness of the holding jig 1 uniform, for example, a method of making the jig body 2 uniform by polishing, grinding, cutting, or the like, the rubber composition, and the adhesive property. A method for producing a sheet-shaped molded body from the material, cutting out a portion having a uniform thickness from the sheet-shaped molded body, and affixing it to the jig body 2, a method for surface-treating the adhesive elastic member 3, and these methods The method etc. which combined these are mentioned.

A set of holding jigs as an example of the set of holding jigs according to the present invention will be described with reference to the drawings. As shown in FIG. 2, the set of holding jigs 5 includes a first holding jig 1a and a second holding jig 1A.
Similar to the second jig body 2A, the first holding jig 1a is formed on at least a part of the surface of the first jig body 2a. The second holding jig 1A is provided with a member 3 and adheres an object to be adhered, which is formed on at least a part of the surface of the second jig body 2A and the second jig body 2A. The pressure-sensitive adhesive elastic member 3 can be held, and a heat-foamable pressure-sensitive adhesive member 4 provided on the surface of the pressure-sensitive adhesive elastic member 3 on the side opposite to the second jig body 2A.

  The heat-foamable pressure-sensitive adhesive member 4 has a base film 4A and a heat-foamable pressure-sensitive adhesive layer 4B formed on the surface of the base film 4A.

  The first holding jig 1a and the second holding jig 1A are basically the same as the holding jig 1 except for the heat-foamable adhesive member 4, and the hardness of the adhesive elastic member 3 is heat. It is set larger than the foamable adhesive layer 4B.

The adhesive elastic member 3 and the heat-foamable adhesive layer 4B preferably have an adhesive force capable of adhering and holding an adherend, usually 1 to 50 g / mm ² , and 7 to 50 g. It is particularly good to have an adhesive strength of / mm ² .

The thermally foamable adhesive layer 4B in the second holding jig 1A has an adhesive force larger than the adhesive force of the adhesive elastic member 3 in the first holding jig 1a. When the heat-foamable adhesive layer 4B and the adhesive elastic member 3 have such an adhesive force relationship, the heat-foamable adhesive layer in the second holding jig 1A is changed from the adhesive elastic member 3 in the first holding jig 1a. The object to be adhered can be transferred to 4B. The adhesive force difference between the adhesive elastic member 3 and the heat-foamable adhesive layer 4B is 15 to 15 in that it can be smoothly transferred from the adhesive elastic member 3 to the heat-foamable adhesive layer 4B without dropping off. it is preferably from 43 g / mm ^2, more preferably from 18~35g / mm ^2, particularly preferably from 20 to 30 g / mm ^2.

  The set of holding jigs 5 is preferably used for holding an object to be adhered to the first holding jig 1a, and then transferring to the second holding jig 1A for adhesion holding. The member for a small electronic component and / or the small electronic component, which is a thin rectangular parallelepiped shape, is adhesively held on the first holding jig 1a, and then transferred to the second holding jig 1A to be adhesively held. It is preferably used.

  In the example shown in FIG. 2, the second holding jig 1 </ b> A uses the holding jig 1 according to the present invention. In the set of holding jigs 5, the first holding jig 1 a is It is a holding jig which does not have the heat-foamable adhesive layer 4 and is formed by directly forming an adhesive elastic member on the surface of the jig body.

  An adherend holding apparatus according to an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 3, the adherend holding apparatus 10 includes a pair of holding jigs including a first holding jig 1a and a second holding jig 1A, and holds the object to be bonded. This is an apparatus that can transfer an object to be adhered from the first holding jig 1a to the second holding jig 1A. The set of holding jigs included in the adherend holding apparatus 10 is configured in the same manner as the set of holding jigs 5, and both the first holding jig 1a and the second holding jig 1A are configured. Is an example of the holding jig 1. As this adherend, a small electronic component member and / or a small electronic component is preferably used.

  As shown in FIG. 3, the adherend holding device 10 includes a first holding jig 1a and a second holding jig 1A, and a first adhesive elastic member 3 and a thermally foamable adhesive member 4. It can be arranged so as to face each other. The second holding jig 1A can move horizontally and move up and down, the first holding jig 1a can move up and down toward the second holding jig 1A, and the second holding jig 1A can move up and down. It is possible to move horizontally from the position immediately below the holding jig 1A to the retracted position. Note that the vertical movement of the first holding jig 1a can be realized by mechanical means, or can be realized manually. Thereby, the to-be-adhered object stickingly hold | maintained at the 1st holding jig 1a can be transferred to the state hold | maintained at the 2nd holding jig 1A.

  As shown in FIG. 3, the first holding jig 1 a has a support arm 13 whose surface side opposite to the adhesive elastic member 3 in the jig body 2 a extends downward from the holding jig displacing means 12. It is fixed to a support member 14 provided at the tip and supported by the holding jig displacement means 12.

  The holding jig displacing means 12 is attached to the rail 11 and configured to be movable in the horizontal direction along the rail 11 and is configured to be able to move the support arm 13 up and down. Therefore, the first holding jig 1a supported by the holding jig displacing means 12 can be freely moved in the horizontal direction and the vertical direction by the holding jig displacing means 12. That is, the first holding jig 1a having the adhesive elastic member 3 for holding the object to be adhered is suspended by the holding jig displacing means 12, for example, above or from the conductive paste bath. While being able to move to an appropriate position other than above the bath, for example, to a position above the second holding jig 1A, the first holding jig 1a is directed toward the second holding jig 1A. After lowering and holding the adherend to the thermally foamable adhesive member 4 of the second holding jig 1A, the first holding jig 1a is lifted away from the second holding jig 1A. Can be moved.

  Further, the holding jig displacing means 12 is configured to be rotatable around the axis with the rail 11 as a central axis. When the holding jig displacing means 12 is capable of rotational movement in this way, the state of the first holding jig 1a is the state in which the object to be adhered is suspended by the adhesive elastic member 3, and the object to be adhered is adhesive elastic. Any of the states of standing and holding on the upper surface of the member 3 can be changed as desired.

  Further, as shown in FIG. 3, the second holding jig 1A has a surface side of the first jig main body 2A where the adhesive elastic member 3 is not formed extending upward from the holding jig displacement means 16. The support arm 17 is fixed to a support member 18 provided at the tip of the support arm 17 and supported by the holding jig displacement means 16.

  The holding jig displacing means 16 is below the rail 11 and is attached to a rail 15 that is orthogonal to or intersects with the rail 11 when viewed from above, and is configured to be movable in the horizontal direction along the rail 15. At the same time, the support arm 17 is vertically extendable and movable. Therefore, the second holding jig 1A supported by the holding jig displacing means 16 can be freely moved in the horizontal direction and the vertical direction by the holding jig displacing means 16. That is, the second holding jig 1A can be moved to an appropriate position, for example, a position immediately below the first holding jig 1a, and the second holding jig 1A can be moved to the first holding jig. The second holding jig is moved up toward the tool 1a, and the second object holding jig is held by the adhesive elastic member 3 in the first holding jig 1a. 1A can be lowered so as to move away from the first holding jig 1a.

  Further, the holding jig displacing means 16 is configured to be rotatable around the axis with the rail 15 as the central axis. When the holding jig displacing means 16 is rotatable in this way, the second holding jig 1A is in an upright state in which the object to be adhered is held upright by the thermally foamable adhesive member 4, and The object can be changed as desired to the inverted state in which the object is suspended and held by the first thermally foamable adhesive member 4.

  The movement mechanism in the holding jig displacing means 12 and the holding jig displacing means 16 is not particularly limited. For example, a driving means for generating a driving force, for example, a motor, and the output of the motor is connected to the rail 11 or 15. In addition, there may be mentioned a motion mechanism provided with power transmission means for transmitting to the support arm 13 or 17, for example, a gear, a wire, or the like. This motion mechanism may be controlled by a normal personal computer or manually.

  As shown in FIG. 3, the adherend holding apparatus 10 includes a first holding jig 1a and a second holding jig in the vicinity of a position where the rail 11 and the rail 15 are orthogonal to each other when viewed from above or intersect. The tool 1A can be arranged so that the adhesive elastic member 3 and the thermally foamable adhesive member 4 face each other. Thereby, the adherend to which the first holding jig 1a is adhered and held can be transferred to the second holding jig 1A.

  Next, a method for manufacturing a small electronic component by forming an electrode on a small electronic component member using the adherend holding device 10 according to the present invention will be described. The operation will be described.

  An electrode is formed on a member for a small electronic component as follows using a to-be-adhered object holding device as an example of the present invention.

  First, the holding jig displacing means 12 shown in FIG. 3 is rotated around the axis with the rail 11 as the central axis, and the first holding with the adhesive elastic member 3 facing upward as shown in FIG. The standing arrangement plate 20 is stacked on the jig 1a. The standing arrangement plate 20 is formed by forming a tapered surface 21 whose diameter is enlarged toward the surface at the upper opening, and a plurality of arrangement holes 22 which are through holes capable of accommodating the small electronic component member 6 are formed. ing. A large number of small electronic component members 6 are distributed in a messy state on the upper surface of the upright arrangement plate 20. When vibration is applied to the standing arrangement plate 20, the small electronic component member 6 is accommodated in the arrangement hole 22 so as to be guided by the tapered surface 21.

  Next, as shown in FIG. 4, the projecting heads of all the small electronic component members 6 are pressed with a flat press plate 23. Then, the lower end surface of the small electronic component member 6 accommodated in the arrangement hole 22 is slightly sunk into the adhesive elastic member 3 and the lower end portion of the small electronic component member 6 is adhesive elastic due to the adhesive force of the adhesive elastic member 3. Adhere to the member 3. At this time, many small electronic component members 6 in the adhesive elastic member 3 have the positions of their protruding end faces substantially in the same plane. Thereafter, the standing arrangement plate 20 is removed. Next, the holding jig displacing means 12 (see FIG. 3) is rotated about the axis around the rail 11, and the first holding jig 1a is rotated as shown in FIG. When the member 3 is directed downward, a large number of small electronic component members 6 are suspended from the lower surface of the adhesive elastic member 3.

Next, the holding jig displacing means 12 (see FIG. 3) is moved horizontally along the rail 11 (see FIG. 3), and a large number of small electronic component members 6 are suspended and held by the adhesive elastic member 3. The first holding jig 1a is horizontally moved above the conductive paste bath (not shown). Thereafter, the support arm 13 (see FIG. 3) is extended downward by the holding jig displacing means 12, and the first holding jig 1a is lowered toward the conductive paste bath. The first holding jig 1a is lowered and the lower end portion of the small electronic component member 6 is immersed in the conductive paste bath. At this time,
Since the lower end portion of the small electronic component member 6 that is adhered and held on the surface of the adhesive elastic member 3, that is, the end surface opposite to the adhesive end surface is located on the same plane, a large number of small electronic component members Each of the 6 is immersed in a conductive paste bath at a certain portion at the lower end thereof. After the immersion, the support arm 13 is raised upward by the holding jig displacing means 12, and the first holding jig 1a is raised. Then, as shown in FIG. 6, an electrode 7 having a substantially uniform thickness is formed at the lower end of each small electronic component member 6 suspended and held by the adhesive elastic member 3.

  Next, the holding jig displacing means 12 is moved in the horizontal direction along the rail 11, and a number of electrodes 7 are applied to the lower end portion of the second holding jig 1 </ b> A above the thermally foamable adhesive member 4. The first holding jig 1a holding the small electronic component member 6 suspended from the adhesive elastic member 3 is moved horizontally. When the first holding jig 1a arrives at a position where the adhesive elastic member 3 is directed above the heat-foamable adhesive member 4, the plane on which the small electronic component member 6 of the adhesive elastic member 3 is adhesively held becomes the lower surface. And the 1st holding member 1a is located so that the heat foaming adhesive member 4 of 1 A of holding members located below may be faced. Next, as shown in FIG. 7, the support arm 13 is extended or lowered downward by the holding jig displacing means 12 (see FIG. 3) to move toward the second holding jig 1A. The tool 1a is lowered. The second holding jig 1A is arranged with the heat-foamable adhesive member 4 facing upward.

  As shown in FIG. 7, the holding arm displacing means 12 (see FIG. 3) moves the support arm 13 downward to lower the first holding jig 1a, and the second holding jig 1A The heat-foamable adhesive member 4 is adhered to the lower end portions of the large number of small electronic component members 6 suspended and supported by the adhesive elastic member 3 in the first holding jig 1a, on which the electrodes 7 are formed. At this time, the heat-foamable pressure-sensitive adhesive layer in the heat-foamable pressure-sensitive adhesive member 4 has a pressure-sensitive adhesive force larger than the pressure-sensitive adhesive force of the pressure-sensitive adhesive elastic member 3, and is sticky-held on the surface of the pressure-sensitive elastic member 3 in the first holding jig 1a. Since the end surface opposite to the adhesive end surface of the small electronic component member 6 is positioned on the same plane, as shown in FIG. 7, a large number of adhesive elastic members 3 are adhesively held. Each of the small electronic component members 6 has its free end, that is, the bottom surface pressed almost uniformly against the heat-foamable adhesive member 4. At this time, by pressing the small electronic component member 6 against the heat-foamable adhesive member 4, the strain generated in the thickness direction of the adhesive elastic member 3 and the surface direction perpendicular to the thickness direction is quickly recovered, and the adhesive Since the surface of the elastic member 3 can be kept smooth, the small electronic component member 6 is prevented from being overturned or tilted, and is stably held in the second holding jig 1A in a uniform standing state. can do. Next, when the support arm 13 (not shown) is moved upward by the holding jig displacing means 12 (not shown) to raise the first holding jig 1a, the small electronic component member 6 is moved. Is firmly adhered to the heat-foamable adhesive member 4 via the electrode 7, so that the small electronic component member 6 is detached from the adhesive elastic member 3 of the first holding jig 1a without remaining. In this way, a large number of small electronic component members 6 can be transferred as desired without dropping from the first holding jig 1a to the second holding jig 1A.

  Next, the holding jig displacing means 16 (not shown) is rotated about the axis with the rail 15 (not shown) as the central axis, and as shown in FIG. 8, the second holding jig 1A is moved. The second holding jig 1A that holds and holds the small electronic component member 6 in an upright state on the thermally foamable pressure sensitive adhesive member 4 via the electrode 7 is rotated to suspend the small electronic component member 6 from hanging. It is held.

  Next, the holding jig displacing means 16 (not shown) is moved in the horizontal direction along the rail 15 (not shown), and a large number of small electronic component members 6 are suspended from the thermally foamable adhesive member 4. The second holding jig 1A is moved horizontally above the conductive paste bath (not shown) while being held. After that, the holding jig displacing means 16 (not shown) moves the support arm 17 (not shown) downward to lower the second holding jig 1A toward the conductive paste bath. . The second holding jig 1A is lowered and the lower end portion of the small electronic component member 6 is immersed in the conductive paste bath. At this time, since the 2nd holding jig 1A has the surface precision of the said range, as for each member 6 for many small electronic components, the fixed part in those lower end parts is immersed in a conductive paste bath. The After the immersion, the support jig 17 (not shown) is moved upward by the holding jig displacement means 16 (not shown) to raise the second holding jig 1A. Then, as shown in FIG. 8, an electrode 7 having a substantially uniform thickness is formed at the lower end of each small electronic component member 6 suspended and held by the thermally foamable adhesive member 4 in the second holding jig 1B. Is done.

  The heat-foamable adhesive member 4 in the second holding jig 1A is formed with electrodes 7 of substantially equal size at both ends of each small electronic component member 6 and is adhesively held in a suspended state. .

  Next, the heat-foamable adhesive member 4 of the second holding jig 1A is heated by a heater (not shown). Then, the foaming agent in the heat-foamable pressure-sensitive adhesive layer 4B in the heat-foamable pressure-sensitive adhesive member 4 is foamed, and the bubbles generated by the foaming make the surface of the heat-foamable pressure-sensitive adhesive layer 4B uneven. When the surface of the heat-foamable pressure-sensitive adhesive layer 4B becomes uneven, the contact area between the small-sized electronic component member 6 and the heat-foamable pressure-sensitive adhesive layer 4B that are adhered and held on the heat-foamable pressure-sensitive adhesive layer 4B decreases. Due to the reduction in the contact area, the weight of the small electronic component member 6 overcomes the adhesive force, and the small electronic component member 6 falls from the thermally foamable adhesive member 4.

  After the heat foamable adhesive member 4 in the second holding jig 1A is heated, the heat foamable adhesive layer 4B in the heat foamable adhesive member 4 does not have sufficient adhesive force.

  Therefore, when the second holding jig 1A is reused, the heated heat-foamable pressure-sensitive adhesive member 4 is peeled off from the pressure-sensitive adhesive elastic member 3B, and a new heat-foamable pressure-sensitive adhesive member is formed on the surface of the pressure-sensitive adhesive elastic member 3 exposed. 4 is used, and a second holding jig 1A having a newly attached heat-foamable adhesive member 4 is used.

  As described above, by using the holding jig 1 or the set of holding jigs 5 according to the present invention, the plurality of small electronic component members 6 adhered and held on the first holding jig 1a can be removed without dropping. 2 can be transferred to the holding jig 1A as desired, and the small-sized electronic component member 6 with high quality accuracy in which the electrodes 7 having uniform thickness are formed at both ends can be easily manufactured. it can.

  The holding jig 1, the set of holding jigs 5 and the adherend holding apparatus 10 according to the present invention are not limited to the above-described embodiments, but can be achieved within the scope of achieving the object of the present invention. Various modifications are possible.

  For example, in the holding jig 1, the jig main body 2 and the adhesive elastic member 3 are both formed in a rectangular shape. In the present invention, the jig main body and the adhesive elastic member are suitable for manufacturing small parts. The shape may be any shape, and may be any shape depending on the shape of the adherend, the shape of the adherend holding device, the manufacturing process, workability, and the like. For example, the holding jig includes a plate-like body such as a polygon such as a square, a rectangle, a pentagon, and a hexagon, a circle, an ellipse, an indeterminate shape, or a combination thereof. Further, one surface side of the jig body 2 where the adhesive elastic member 3 is not formed may be a planar shape or a three-dimensional shape such as a semi-cylindrical body. Examples of the object to be adhered and held by the holding jig 1 include small parts having various shapes such as a prismatic body and a cylindrical body having a square bottom surface, members for small parts, and the like. Further, the holding jig according to the present invention can be used when it is necessary to stick and hold the adherend in the transporting process or the like in addition to the manufacturing process of the adherend.

  The set of holding jigs 5 includes a first holding jig 1a and a second holding jig 1A. In addition to these holding jigs, a third holding jig or the like is provided. You may have.

  The adherend holding device 10 includes the first holding jig 1a and the second holding jig 1A, but may include three or more types of holding jigs. The third holding jig may be a conventional holding jig formed by a jig main body and an adhesive elastic member, or may be the holding jig 1. 1 is preferred. Examples of the objects to be adhered and retained in the object-to-be-adhered holding apparatus 10 include small parts having various shapes such as a prismatic body and a cylindrical body having a square bottom surface, and members for small parts.

  Furthermore, in the to-be-adhered article holding device 10, the rail 11 and the rail 15 are disposed so as to intersect at a substantially right angle, but the rail and the rail may be disposed substantially in parallel.

  Further, in the adherend holding apparatus 10, the holding jig displacing means 12 and 16 are configured to be rotatable around the axis with the rails 11 and 15 as the central axes. You may be comprised so that rotation movement is impossible. In this case, it is only necessary to support the first holding jig in which the adherend is adhered to the first adhesive elastic member by the holding jig displacing means, and the adherend is attached to the second adhesive elastic member. What is necessary is just to remove the to-be-adhered object from a 2nd adhesion elastic member by removing the 2nd holding jig which carried out adhesion | attachment from a holding jig displacement means.

Example 1
From a stainless steel plate (SUS304, thickness 0.5 mm), a square plate-like body having a side length of 120 mm was cut out. After degreasing one surface of this disc-like body with an organic solvent such as acetone, an appropriate amount of a silicone rubber adhesion primer (trade name “X-33-156-20”, manufactured by Shin-Etsu Chemical Co., Ltd.) is applied. A jig body A was produced.

  Silicone rubber containing the silicone raw rubber (a), the crosslinking component (b), the adhesion improver (c) and the catalyst (d) (trade name “X-34-632 A / B”, manufactured by Shin-Etsu Chemical Co., Ltd. ) Addition reaction curable adhesive silicone composition containing 99% by mass and 1% by mass of a silica-based filler (trade name “Crystallite” manufactured by Tatsumori Co., Ltd.) as component (e), and an adhesive strength adjusting composition A liquid silicone rubber composition (trade name “KE-1950 / 30 A / B”, manufactured by Shin-Etsu Chemical Co., Ltd.) and an adhesive silicone composition (addition reaction curable adhesive silicone composition: liquid silicone rubber) The composition = 50: 50) was press-molded at 120 ° C. under a pressure of 10 MPa, and further cured at 200 ° C. for 4 hours. The length of one side was 110 mm and the thickness was 1.5 m. Adhesive elastic member A was manufactured so that it might become a square of m.

  Subsequently, both surfaces of the produced adhesive elastic member A were each polished with a surface grinder.

  Next, the adhesive elastic member A was bonded to the surface of the jig body A on which the silicone rubber adhesion primer (trade name “X-33-156-20”, manufactured by Shin-Etsu Chemical Co., Ltd.) was applied. Next, by attaching “Riva Alpha” (product number: No. 3159 HS) manufactured by Nitto Denko Corporation to the surface of the adhesive elastic member A, the holding jig A which is the second holding jig Manufactured.

  Using this holding jig A, the adherend holding apparatus shown in FIG. 3 was assembled. As the adherend, a small electronic component member 6 having a size of 0.5 × 0.5 × 1.0 (mm) was used. In addition, a standing arrangement plate 20 having a thickness of 0.4 mm in which 4,000 arrangement holes 22 were formed was prepared. Each arrangement hole 22 of the standing arrangement plate 20 is 0.9 mm long × 2 mm wide, and has a tapered surface 21 whose diameter is expanded toward the surface at the upper opening.

  The standing arrangement plate 20 was overlapped on the first adhesive elastic member 3 in the first holding jig 1a, and a large number of small electronic component members 6 were distributed on the upper surface of the standing arrangement plate 20 in a messy state. In this state, the standing arrangement plate 20 was vibrated to drop the small electronic component member 6 into the arrangement hole 22. At this time, the small electronic component member 6 is positioned on the first adhesive elastic member with the side surface before the electrode 7 is formed as the adherend surface, and the surface opposite to the adherend surface stands. It was in the state which protruded from the upper end surface of the installation board 20. Next, as shown in FIG. 4, the protruding head of all the small electronic component members 6 is pressed with the flat press plate 23 for 3 seconds so that the small electronic component member 6 sinks 100 μm into the adhesive elastic member 3. did. Thereafter, the press plate 23 and the standing arrangement plate 20 are separated from the small electronic component member 6 and the adhesive elastic member 3, and 4,000 small electronic component members 6 stand on the adhesive elastic member 3 at substantially equal intervals. Held.

  Next, the first holding jig 1a was rotated so that the small electronic component member 6 adhered and held by the first adhesive elastic member 3 was suspended (that is, the first holding shown in FIG. 5). It is the same state as the jig 1A.) Next, the first holding jig 1a is lowered toward the second holding jig 1A, and the small electronic component member 6 adhered and held by the first holding jig 1a is moved to the second holding jig 1A. Was pressed so that the small electronic component member 6 would sink 100 μm into the second adhesive elastic member 3b. After 3 seconds passed, the first holding jig 1a was lifted upward at a speed of 3 mm / sec and pulled away from the second holding jig 1A.

  Next, the thermally foamable adhesive member in the second holding jig 1A was heated to 160 ° C. with a dryer. Then, all the small electronic component members 6 held by the second holding jig 1A were separated from the dropped second holding jig 1A.

DESCRIPTION OF SYMBOLS 1 Holding jig 1a 1st holding jig 1A 2nd holding jig 2 Jig main body 2a 1st jig main body 2A 2nd jig main body 3 Adhesive elastic member 4 Thermal foaming adhesive member 4A Base film 4B Thermal foaming adhesive layer 5 A set of holding jigs 6 Small electronic component members 7 Electrodes 8 Small electronic components 10 Sticky object holding device 11 Rail 12 Holding jig displacement means 13 Support arm 14 Supporting member 15 Rail 16 Holding jig Displacement means 17 Support arm 18 Support member 20 Standing arrangement plate 21 Tapered surface 22 Arrangement hole 23 Press plate

Claims (4)

  A jig main body, an adhesive elastic member formed on the surface of the jig main body, and a thermally foamable adhesive member formed on the surface of the adhesive elastic member opposite to the surface of the jig main body. A holding jig characterized by comprising:   The heat-foamable pressure-sensitive adhesive layer is formed on the surface opposite to the surface of the base film that is bonded to the pressure-sensitive adhesive member and the surface of the base film that is bonded to the pressure-sensitive adhesive member. The holding jig according to claim 1, comprising: A holding jig according to claim 1, and a holding jig having the holding jig according to claim 1, or a jig body and an adhesive elastic member formed on a surface of the jig body. A set of holding jigs,
The heat-foamable adhesive layer in the holding jig according to claim 1 of the set of holding jigs has a larger adhesive force than the adhesive elastic member in the other holding jig. A set of holding jigs.   An adherend holding device comprising the set of holding jigs according to claim 3.

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