JP2007103757A - Holding jig and small electronic component retainer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a holding jig that can adjust adhesive force by controlling the temperature in rubber elastic materials; and a small electronic component retainer that eliminates the need for multiple kinds of holding materials and monitors the temperature of a single holding material to retain or release a small electronic component, by adjusting the adhesive force of rubber elastic material of the holding material. <P>SOLUTION: The presented holding jig and small electronic component retainer are characterized by the presence of a rubber elastic material whose adhesion property lies in a region indicated by the formula Y=aX+b which represents the relationship between adhesive force and temperature. In this formula, (a) is a value from -1 to -0.7; (b) is a value from 40 to 65; Y is an adhesive force (unit: g/mm<SP>2</SP>); X is a temperature (unit: °C) from 10°C to 35°C. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a holding jig and a small electronic component holding device, and more specifically, by using a holding jig that exhibits different adhesive force by changing the temperature of the rubber elastic member, and the holding jig, The present invention relates to a small electronic component holding device that can easily hold a small electronic component such as a chip capacitor without using a plurality of types of rubber elastic members having different adhesive forces.

  As a holding jig for holding a small electronic component such as a chip capacitor, there is a “holding jig for a small electronic component” disclosed in Patent Document 1.

  The holding jig described in Patent Document 1 is characterized in that “at least the surface portion is formed of a rubber elastic material having adhesiveness, and the adhesive force can hold a small component on the elastic material surface. (Refer to claim 1 of patent document 1).

  In this holding jig, since soft silicone rubber has adhesive force, small electronic components such as a chip capacitor are tightly held using this property.

  By the way, when a small electronic component such as a chip capacitor has a prismatic shape or a cylindrical shape having a long axis, when forming electrodes at both ends in the long axis direction, the rubber elastic material It is not sufficient to hold small electronic components in close contact with the surface. That is, after an electrode is formed on the lower end surface of a small electronic component that is adhesively held on the surface of the rubber elastic material, the small electronic component is detached from the rubber elastic material, and then the end surface formed with the electrode is again attached to the rubber elastic material. It is necessary to keep it in close contact with the surface.

  As an invention that meets this need, there is an electronic component chip holder described in Patent Document 2.

  The electronic component chip holder disclosed in Patent Document 2 is “in an electronic component chip holder for holding an electronic component chip having first and second end faces facing each other, wherein the electronic component chip holder is The first member includes a first adhesive surface for holding the electronic component chip, and the second member includes the second member of the electronic component chip. It is characterized by comprising a second adhesive surface that adheres to an end face and holds the electronic component chip and gives an adhesive force stronger than the adhesive force given by the first adhesive surface ”(Patent Document 2) (See claim 1).

  As described above, the electronic component chip holder disclosed in Patent Document 2 includes a first member having a first adhesive surface for holding the electronic component chip by adhesion, and the first adhesive surface is used as the electronic component chip. Two types of members are necessary, that is, a second member having a second adhesive surface having an adhesive strength greater than the applied adhesive strength.

  Moreover, even if the adhesive force on the first adhesive surface and the second adhesive surface for holding the electronic component chip by adhesion is an appropriate adhesive force when holding the predetermined electronic component chip, the electronic component chip In the case where the type is changed to hold another type of electronic component chip, the adhesive strength is not always appropriate. That is, in order to make the adhesive force on the first adhesive surface and the second adhesive surface appropriate for each electronic component chip, a rubber elastic member having an appropriate adhesive force must be selected and replaced for each electronic component chip. I must.

Japanese Examined Patent Publication No. 7-93247 Japanese Patent No. 2682250

  An object of the present invention is to provide a holding jig capable of adjusting an adhesive force by adjusting a temperature in a rubber elastic member, and a first member having a first adhesive surface having a different adhesive force, and a first member Without requiring a plurality of types of holding members, such as the second member having two adhesive surfaces, the temperature of the holding member can be controlled by controlling the temperature of the rubber elastic member of the holding member. It is an object of the present invention to provide a small electronic component holding device that can be adjusted to hold a small electronic component and to release the small electronic component.

As means for solving the above problems,
Claim 1 is a holding jig characterized by having a rubber elastic member having an adhesive property in which the relationship between adhesive force and temperature satisfies the following formula:
Y = aX + b
However, in said formula, a is -1--0.7, b is 40-65, Y is adhesive force (unit: g / mm < ² >), X is the temperature (unit: 10 degreeC or more and 35 degrees C or less). ° C).
A second aspect of the present invention is a small electronic component holding device comprising the holding jig according to the first aspect and a temperature adjusting means for adjusting a surface temperature of the rubber elastic member.
3. The small electronic component according to claim 2, wherein the temperature adjusting means comprises heating means for heating the surface of the rubber elastic member and cooling means for cooling the surface of the rubber elastic member. Holding device,
According to a fourth aspect of the present invention, the temperature adjusting unit measures the surface temperature of the rubber elastic member, and the control unit controls the heating unit and the cooling unit according to the temperature measured by the temperature measuring unit. The small electronic component holding device according to claim 3, comprising:

  In this invention, when the surface temperature of the rubber elastic member is raised by the temperature adjusting means, the adhesive force of the rubber elastic member is lowered, and when the surface temperature of the rubber elastic member is lowered by the temperature adjusting means, the rubber elastic member Increases adhesive strength. By utilizing such adhesion characteristics of the rubber elastic member according to the present invention, in the small electronic component holding device according to the present invention, the small electronic component is adhered and held on the surface of the rubber elastic member, and the surface of the rubber elastic member The small electronic component that is adhesively held on the surface can be detached from the surface of the rubber elastic member. Therefore, according to the present invention, at least one type of rubber elastic member is used without using two or more types of rubber elastic members having different adhesive forces, and the temperature of the rubber elastic member is controlled so that a small electronic component can be obtained. It is possible to provide a holding jig capable of holding and releasing an adhesive and a small electronic component holding device using the holding jig.

  FIG. 1 is an explanatory view showing a small electronic component holding apparatus according to an embodiment of the present invention.

  As shown in FIG. 1, the small electronic component holding device 1 is a device that can hold a small electronic component by adhesion. Examples of small electronic components include finished products or semi-finished products such as chip capacitors, chip resistors, inductors, FPCs, and wafers.

  The small electronic component holding device 1 includes a holding jig 2 and a temperature adjusting means 3. The holding jig 2 includes a jig main body 4 and an adhesive holding portion 5 attached to the jig main body 4.

  The adhesive holding part 5 is designed so that a large number of small electronic components can be held by adhesion, and examples thereof include a disk-like body formed of a rubber elastic member in a square shape. As an example of the size of the square-shaped pressure-sensitive adhesive holding portion 5 having a disk shape, 110 mm × 110 mm × 1.8 mm can be mentioned.

As shown in FIG. 2, the rubber elastic member used for the adhesive holding unit 5 has a characteristic of having an adhesive force satisfying the following formula, as shown in FIG.
Y = aX + b
(In the above formula, a is −1 to −0.7, b is 40 to 65, Y is adhesive strength (unit: g / mm ² ), and X is a temperature (unit: 10 ° C. to 35 ° C.). : ° C.)
The adhesive strength satisfying the above formula at 10 ° C. or higher and 35 ° C. or higher, as shown in FIG. 2, is below the region indicated by Y = −0.7X + 65 and above the region indicated by Y = −X + 40 It is. If it is outside this area, the small electronic component cannot be adhered and held, or the small electronic component adhered and held on the rubber elastic member is quickly separated and detached because the force to retain the small electronic component is too large. Can not be made.

  Here, the adhesive strength is determined as follows. The following adhesive strength measurement method was devised by the applicant and is therefore referred to as the Shin-Etsu Polymer Method.

  First, a suction fixing device (for example, trade name: electromagnetic chuck, KET-1530B, manufactured by Kanetech Co., Ltd., vacuum suction chuck plate, etc.) for fixing a rubber elastic member horizontally, and a cylinder with a diameter of 10 mm at the tip of the measurement unit. A load measuring device provided with a digital force gauge (trade name: ZP-50N, manufactured by Imada Co., Ltd.) with a contact made of stainless steel (SUS304) made is prepared.

A rubber elastic member is fixed on the test stand, and the measurement environment is set to 20 ° C. and humidity 50%. Next, the contact attached to the load measuring device is lowered until it comes into contact with the measured part of the rubber elastic member at a speed of 20 mm / min, and then the contact is measured at a predetermined load on the measured part. Press vertically for 3 seconds against the part. Here, the predetermined load is set to 25 g / mm ² . Next, the contact is pulled away from the site to be measured at a speed of 180 mm / min, and the pulling load measured by the digital force gauge at this time is read. This operation is performed at a plurality of locations of the measurement site, the plurality of separation loads obtained are arithmetically averaged, and the average value obtained is taken as the adhesive strength of the measurement site.

  This measurement method may be performed manually, for example, using a test stand (for example, trade name: VERTICAl MODEL MOTORIZED STAND series, manufactured by Imada Co., Ltd.) or the like. .

  The rubber elastic member having the adhesive force in the region represented by the above formula can be appropriately selected from various known rubber elastic members. For example, an adhesive silicone rubber having heat resistance in the temperature range is used. Can be adopted.

  As said adhesive silicone rubber, (a) component consisting of silicone raw rubber, (b) component consisting of crosslinking component, (c) component consisting of adhesive component, (d) component consisting of platinum compound, and silica The cured | curing material of the adhesive composition containing the (e) component which becomes becomes.

As the component (a) composed of the silicone raw rubber, for example, a polyorganosiloxane having an alkenyl group that can be crosslinked by an addition reaction can be used, and in particular, a polyorganosiloxane represented by the following formula (1) is preferably used. be able to.
R ¹ _(3-a) X _a SiO— (R ¹ XSiO) _m — (R ¹ ₂ SiO) _n —SiR ¹ _(3-b) X _b (1) Formula (where R ^{1 is} Are monovalent hydrocarbon groups having no aliphatic unsaturated bond, which may be the same or different, and X is an alkenyl-containing organic group, which may be the same or different. A is an integer of 0 to 3, b is an integer of 0 to 3, m is an integer of 0 or more, n is an integer of 100 or more, and a, b, and m are not 0 at the same time. .)
Here, as R ^1, preferably the hydrocarbon group having 1 to 10 carbon atoms, a methyl group, an ethyl group, a propyl group, an alkyl group such as butyl group, cycloalkyl groups such as cyclohexyl group, a phenyl group, a tolyl group And aryl groups such as methyl group and phenyl group are particularly preferable.

  Moreover, as an alkenyl group containing organic group shown by X, a C2-C10 alkenyl group containing organic group is preferable, and a vinyl group, an allyl group, a hexenyl group, an octenyl group, an acryloylpropyl group, an acryloylmethyl group, a methacryloylpropyl group. Group, cyclohexenylethyl group, vinyloxypropyl group and the like.

  The component (a) may have oily or clay-like properties, and its viscosity is preferably 50 mPa · s or more at 25 ° C., particularly preferably 100 mPa · s or more.

  Moreover, although this (a) component may be used individually by 1 type, you may use it in mixture of 2 or more types.

  The cross-linking component (b) is a component capable of undergoing a cross-linking reaction with the component (a). For example, the SiH bond-containing polysilane having at least 2 or more, preferably 3 or more H atoms bonded to Si atoms in one molecule. Organosiloxane (hereinafter sometimes referred to as organohydrogenpolysiloxane) can be used.

As this polyorganosiloxane, it can be used by appropriately selecting from linear, branched, and cyclic polyorganosiloxanes. For example, polyorganosiloxane represented by the following formula (2) or (3) Organosiloxane can be mentioned as a suitable example.
^{_{HcR 1 (3-c) SiO-}} (HR 1 SiO) x - (R 1 2 SiO) y -SiR 1 (3-d) H d (2) formula

(In the above formulas (2) and (3), R ¹ is the same hydrocarbon group as described above, and may be the same or different. C and d are integers of 0 to 3. , X, y, and s are integers of 0 or more, r is an integer of 1 or more, c, d, and x are not simultaneously 0, and x + y ≧ 0, and r + s ≧ 3, Preferably, 8 ≧ r + s ≧ 3.)
Among these organohydrogenpolysiloxanes, organohydrogenpolysiloxane having oily properties and a viscosity of 1 to 5000 mPa · s at 25 ° C. is preferable.

  The component (b) can be used alone or in combination of two or more.

  The blending ratio of the component (b) can be selected as appropriate. When the component (a) contains an alkenyl group and the component (b) contains a SiH bond, the component (a) The molar ratio of the SiH bond in the component (b) to the alkenyl group is preferably 0.5 to 20, particularly preferably 1 to 15. When this molar ratio is less than 0.5, the crosslinking density after curing described later is low, and it may be difficult to maintain the shape of the adhesive holding part. On the other hand, when the molar ratio exceeds 20, the adhesive strength of the obtained adhesive holding part may be reduced.

Next, the component (c), which is an adhesive component in the present invention, is a component that is blended in order to improve adhesive strength, and for example, polyorganosiloxane can be used, and in particular, R ² ₃ SiO1 / 2 unit. And those containing SiO ₂ units and / or R ² ₃ SiO 2/3 units (where R ² is a monovalent hydrocarbon group having no aliphatic unsaturated bond) can be suitably used.

Here, R ² is preferably one having 1 to 10 carbon atoms, alkyl group such as methyl group, ethyl group, propyl group or butyl group, cycloalkyl group such as cyclohexyl group, aryl such as phenyl group or tolyl group. Examples thereof include groups such as a methyl group and a phenyl group.

  In general, the component (c) preferably has a structure that does not cause or hardly causes a crosslinking reaction together with the components (a) and (b) in order to ensure a higher degree of adhesiveness.

When polyorganosiloxane is used as such a component (c), the molar ratio of (R ² ₃ SiO1 / 2 unit and / or R ² ₃ SiO2 / 3 unit) / SiO2 unit is 0.6 to 1.7. Is preferred. If this molar ratio is less than 0.6, the adhesiveness of the adhesive holding part becomes too high, or it becomes difficult to be compatible with the component (a), and the adhesiveness may not be exhibited by separation. On the other hand, if the molar ratio exceeds 1.7, the adhesive strength may decrease.

  In addition, this polyorganosiloxane may contain OH group couple | bonded with Si atom, and it is preferable that OH group content shall be 0-4.0 mol% in that case.

In the case of using an OH group bonded to an Si atom, when the polyorganosiloxane represented by the following formula (4) is contained as the component (a), the component (a) and the component (b) are one. A partial condensation reaction product may be formed.
_{^{(OH) R 1 YSiO- (R}} 1 XSiO) p - (R 1 2 SiO) q -SiR 1 2 (OH) (4) Equation (provided that (4) where, ^{R 1} is an aliphatic unsaturated bond These are monovalent hydrocarbon groups which may not be present, and may be the same or different, Y is R ¹ or an alkenyl group-containing organic group, p is an integer of 1 or more, and q is 100 (It is an integer above.)
In order to form such a condensation reaction product of the component (a) and the component (c), a mixture of the component (a) and the component (c) dissolved in a solvent such as toluene is added in the presence of an alkaline catalyst. The reaction may be performed at room temperature or under reflux.

  In addition, such (c) component may be used individually by 1 type, or may be used in mixture of 2 or more types.

  And it is preferable to use such (c) component in the range of 20 / 80-80 / 20 as a weight ratio of (a) component / (c) component, and it is set as 30 / 70-70 / 30 especially. Is preferred. If the amount of the component (c) is less than this range, the adhesiveness tends to be insufficient. On the other hand, if the amount is large, the adhesive holding part becomes hard and elastic, and the adhesive holding part is difficult to deform. It tends to be difficult to adhere the supported object.

  Next, the component (d) in this invention is a platinum compound that mainly serves as a catalyst for promoting the crosslinking reaction between the component (a) and the component (b), and is usually used as a catalyst for hydrosilation. It is.

  As the component (d), chloroplatinic acid, an alcohol solution of chloroplatinic acid, a reaction product of chloroplatinic acid and alcohol, a reaction product of chloroplatinic acid and an olefin compound, chloroplatinic acid and a vinyl group-containing siloxane And reactants.

  The blending ratio of component (d) is preferably 1 to 5,000 ppm, particularly 5 to 2,000 ppm in terms of platinum with respect to the total amount of component (a) and component (b). Is preferred. This is because if the blending ratio is less than 1 ppm, the curability is lowered and the crosslinking density is lowered and the holding power may be lowered. On the other hand, if it exceeds 5,000 ppm, the usable time of the treatment bath may be shortened. .

  Next, the component (e) in the present invention is silica added together with each of the above components, and reinforces the mechanical strength of the adhesive holding portion and imparts the component constituting the adhesive holding portion, particularly adhesiveness. (C) It is a component which makes a sticking holding part contain a component and makes it hard to detach | desorb.

In particular, the silica preferably has a specific surface area of 100 m ² / g or more and 400 m ² / g or less. This is because, if the specific surface area is 100 m ² / g or more, the effect of suppressing scraping can be obtained more remarkably. A product having a specific surface area exceeding 400 m ² / g is not practical because it requires labor for production and is expensive.

  Such silica of component (e) may be silica synthesized by a dry method such as fumed silica or calcined silica, or may be silica synthesized by a wet method such as precipitated silica or silica gel, What is necessary is just to be able to obtain the specific surface area. Here, fumed silica and precipitated silica are preferable because it is easy to obtain a specific surface area.

  In addition, this silica may be used individually by 1 type, or may be used in combination of 2 or more types.

  Moreover, you may use what processed the surface of the silica with surface treating agents, such as organopolysiloxane, organopolysilazane, chlorosilane, alkoxysilane, as needed.

  It is preferable that the blending ratio of such silica is 1 to 30 parts by mass with respect to 100 parts by mass of the total amount of the component (a) and the component (c). More preferably, it is 5-20 mass parts. If the blending ratio is small, the strength of the pressure-sensitive adhesive layer is lowered, and it is difficult to obtain a sufficient effect. Also, a residue is likely to be generated during use. On the other hand, if the blending ratio is large, the adhesive strength is decreased. Because there is.

  Furthermore, in this invention, it is possible to add arbitrary components as appropriate in addition to the components (a) to (e).

  For example, a reaction control agent for suppressing a crosslinking reaction when mixing the above components can be added. Examples of the reaction control agent include 3-methyl-1-butyn-3-ol, 3-methyl-1-pentyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, and 1-ethynyl. Cyclohexanol, 3-methyl-3-trimethylsiloxy-1-butyne, 3-methyl-3-trimethylsiloxy-1-pentyne, 3,5-dimethyl-3-trimethylsiloxy-1-hexyne, 1-ethynyl-1- Trimethylsiloxycyclohexane, bis (2,2-dimethyl-3-butynoxy) dimethylsilane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1,1,3 Examples include 3-tetramethyl-1,3-divinyldisiloxane.

  When this reaction control agent is added, the blending ratio can be in the range of 0 to 5.0 parts by mass with respect to 100 parts by mass of the total amount of the component (a) and the component (c). It is preferable to set it as 05-2.0 mass parts. It is because it will become difficult to harden | cure at the time of hardening of an adhesive composition when the mixture ratio of this reaction control agent exceeds 5.0 mass parts.

  In addition to the reaction control agent, in the present invention, it is possible to add optional components as appropriate. For example, non-reactive polyorganosiloxanes such as polydimethylsiloxane and polydimethyldiphenylsiloxane, As solvents for reducing the viscosity, aromatic solvents such as toluene and xylene, aliphatic solvents such as hexane, octane and isoparaffin, ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone, ethyl acetate, isobutyl acetate and the like An ester solvent, an ether solvent such as diisopropyl ether or 1,4-dioxane, or a mixed solvent thereof, a dye, or a pigment can be used.

  Examples of the jig body 4 include a jig that can be equipped with the adhesive holding portion 5 and can hold or hold a temperature adjusting means 3 described later.

  Examples of the jig body 4 include various forms based on various design changes as long as the adhesive holding portion 5 can be held.

  As the jig body 4, metal plates such as stainless steel and aluminum, metal foils such as aluminum foil and copper foil, polyester, polytetrafluoroethylene, polyimide, polyphenylene sulfide, polyamide, polycarbonate, polystyrene, polypropylene, polyethylene, And resin films such as polyvinyl chloride, resin plates, and papers such as Japanese paper, synthetic paper, and polyethylene laminated paper, and composite materials such as cloth, ceramics such as glass fibers and glass plates, and glass epoxy resin plates be able to. Further, as the jig body 4, a laminated body formed by laminating a plurality of sheet-like materials can be exemplified. The jig body 4 is preferably formed of a hard member made of metal, resin, or ceramic.

  The jig body 4 is subjected to primer treatment, corona treatment, etching treatment, plasma treatment, etc. on the surface on which the rubber elastic member, which is the adhesive holding portion 5, is formed, in order to improve the adhesion to the rubber elastic member. It is preferable to keep it.

  The jig main body 4 includes a jig main body displacing means that can move the jig main body 4 horizontally, move it up and down, and rotate the jig main body 4 around the horizontal central axis. (Not shown) is preferably provided.

  When this jig body displacing means is provided, (1) for example, the jig body 4 having the adhesive holding part 5 for holding the small electronic parts suspended is lowered toward the conductive paste bath, for example. The jig body 4 having the adhesive holding part 5 for hanging and holding the small electronic component having the lower end immersed in the conductive paste can be lifted from the conductive paste bath, and (2) the conductive paste is applied to the lower end The jig body 4 having the adhesive holding part 5 for hanging and holding the small electronic component can be transferred from a position above the conductive paste bath to an appropriate position other than above the conductive paste bath. (3) Further, by rotating the jig body 4 around the central axis of the jig body 4, the small electronic component formed by applying the conductive paste to the lower end portion is suspended from the adhesive holding portion 5. Lead to the top Paste it is possible to change to a state of upright retaining the adhesive holding section 5 of the small-sized electronic part formed by Nurigi a.

  As the mechanical configuration of the jig body displacing means, various configurations can be adopted as long as the vertical movement, horizontal movement, and rotation can be performed.

  The temperature adjusting means 3 may be any means that can change the temperature of the adhesive holding part 5, for example, the temperature of the part of the adhesive holding part 5 where the small electronic component is adhesively held within the temperature range defined by X. For example, the adhesive holding unit 5, particularly the heating unit 6 that heats a portion of the adhesive holding unit 5 that holds and holds the small electronic component, and the cooling unit 7 that cools the heated temperature to a desired temperature are formed. be able to.

  As the heating means 6, a hot air sending nozzle or a hot air sending fan structured to be able to send hot air to the adhesive holding part 5 and a hot air sending fan and a heated air flow, and an air flow toward the heater A hot-air delivery means that functions as a gas delivery device that feeds in, a heater that is heated by energization, disposed in the vicinity of the surface of the adhesive holder 5 that holds the small electronic parts suspended, the inside of the adhesive holder 5, or the adhesive holder 5 It is possible to employ a heater or the like mounted inside the jig body 4 that holds

  The cooling means 7 includes a cool air sending nozzle or a cool air sending fan constructed to be able to send cold air to the adhesive holding unit 5, a cooler for cooling the air stream sent to the cool air sending fan, and the cooler. Cooling air sending means comprising a gas sending device for sending an air flow, a cooling element using the piezoelectric effect, and an adhesive holding part, which is arranged in the vicinity of the surface of the adhesive holding part 5 where the small electronic components are suspended and held, and which is cooled by energization It is possible to employ the cooling element or the like mounted inside 5 or the jig body 4 that holds the adhesive holding portion 5.

  The temperature adjusting unit 3 includes a temperature measuring unit 8 that measures the temperature of the adhesive holding unit 5 so that the adhesive force in the adhesive holding unit 5 can be automatically controlled by controlling the heating unit 6 and the cooling unit 7. A control means 9 for inputting a temperature detection signal indicating the temperature of the adhesive holding unit 5 measured by the temperature measurement means 8 and outputting a control signal to the heating means 6 and / or the cooling means 7 based on the temperature detection signal. It is preferable to comprise.

  Examples of the temperature measuring means 8 include a thermocouple, a resistance temperature detector, and a thermistor. As the control means 9, a normal personal computer or the like can be employed.

  Next, a method for forming electrodes on a chip capacitor, which is one of the small electronic components, using the small electronic component holding device 1 according to the present invention will be described, and the operation of the small electronic component holding device 1 will be described.

  The chip capacitor is formed by, for example, a capacitor main body having a quadrangular prism body and electrodes formed at both ends thereof.

  Electrodes are formed on the capacitor body as follows using the small electronic component holding device 1 which is an example of the present invention.

  First, as shown in FIG. 3, the standing arrangement plate 10 is placed on the holding jig 2 with the adhesive holding portion 5 made of a rubber elastic member facing upward. The standing arrangement plate 10 is formed with a plurality of arrangement holes which are through-holes 11 in which an annular tapered surface 12 is formed in the upper opening. A plurality of, for example, chip capacitor main bodies 13 are distributed in a messy state on the upper surface of the upright arrangement plate 10. When vibration is applied to the standing arrangement plate 10, the chip capacitor main body 13 is fitted in the arrangement hole so as to be guided by the tapered surface 12. Since the thickness of the upright arrangement plate 10 is designed to be smaller than the length in the axial direction of the chip capacitor body 13, the lower end surface of the chip capacitor body 13 that fits in the arrangement hole comes into contact with the adhesive holding part 5. The upper end surface protrudes from the upper end surface of the upright arrangement plate 10.

  Next, as shown in FIG. 4, the protruding heads of all of the plurality of chip capacitor bodies 13 are pressed with a flat press plate 14. Then, the lower end surface of the chip capacitor main body 13 accommodated in the arrangement hole is slightly indented into the adhesive holding portion 5, and the lower end portion of the chip capacitor main body 13 adheres to the adhesive holding portion 5 due to the adhesive force of the adhesive holding portion 5. . After that, when the standing arrangement plate 10 is removed and the holding jig 2 is rotated so that the adhesive holding part 5 faces downward, a plurality of chip capacitor main bodies 13 are suspended and held on the lower surface of the adhesive holding part 5 become.

  Next, the holding jig 2 is moved in parallel above the conductive paste bath (not shown) while the plurality of chip capacitor main bodies 13 are suspended and held by the adhesive holding portion 5, and thereafter toward the conductive paste bath. The holding jig 2 is lowered. The holding jig 2 is lowered and the lower ends of the plurality of chip capacitor bodies 13 are immersed in the conductive paste bath. After immersion, the holding jig 2 is raised. Then, as shown in FIG. 5, an electrode 15 made of a conductive paste is formed at the lower end portion of each chip capacitor body 13 suspended and held by the adhesive holding portion 5.

  Next, as described above, a second holding jig 2 having the same structure as the holding jig 2 that holds the chip capacitor body 13 suspended from the adhesive holding portion 5 is prepared. The rubber elastic member in the second holding jig 2 is the same as the rubber elastic member in the first holding jig 2.

  The second holding jig 2 is arranged with the adhesive holding portion 5 facing upward, and a plurality of electrodes 15 are applied to the lower end portion of the second holding jig 2 and the electrode 15 is coated on the lower end portion. The first holding jig 2 for suspending and holding the chip capacitor body 13 on the adhesive holding part 5 is positioned, and the first holding jig 2 is lowered toward the second holding jig 2.

  As shown in FIG. 6, the first holding jig 2 is lowered and suspended by the adhesive holding part 5 of the second holding jig 2 and suspended by the adhesive holding part 5 of the first holding jig 2. The lower ends of the plurality of chip capacitor bodies 13 on which the electrodes 15 are formed are adhered.

  Subsequently, the rubber elastic member forming the adhesive holding portion 5 in the first holding jig 2 is heated by the heating means 6 in the first holding jig 2 and 1 by the cooling means 7 in the second holding jig 2. The rubber elastic member forming the adhesive holding part 5 in the second holding jig 2 is cooled. Then, the adhesive force of the rubber elastic member in the first holding jig 2 is relatively smaller than the adhesive force of the rubber elastic member in the second holding jig 2.

  Therefore, when the first holding jig 2 is raised, the chip capacitor body 13 is firmly adhered to the rubber elastic member via the electrode 15 by the adhesive force of the rubber elastic member in the second holding jig 2. The chip capacitor body 13 is detached from the rubber elastic member in the first holding jig 2.

  As shown in FIG. 7, the second one in which the chip capacitor main body 13 is adhesively held through the electrode 15 on the rubber elastic member which is the adhesive holding portion 5 in the second holding jig 2. The holding jig 2 is rotated so that the chip capacitor body 13 is suspended and held.

  The second holding jig 2 is moved in parallel above the conductive paste bath while the plurality of chip capacitor bodies 13 are suspended and held by the adhesive holding portion 5, and then the second holding jig 2 is moved toward the conductive paste bath. The holding jig 2 is lowered. The second holding jig 2 is lowered and the lower ends of the plurality of chip capacitor bodies 13 are immersed in the conductive paste bath. After the immersion, the second holding jig 2 is raised. Then, as shown in FIG. 8, an electrode 15 made of a conductive paste is formed on the lower end portion of each chip capacitor body 13 suspended and held by the adhesive holding portion 5 in the second holding jig 2.

  When the chip capacitor body 13 is adhesively held by the second holding jig 2, the adhesiveness of the rubber elastic member in the adhesive holding portion 5 is suspended from the lower surface of the adhesive holding portion 5 by the cooling means 7 and the heating means 6. You may adjust suitably so that the chip capacitor main body 13 which carries out adhesion holding | maintenance in the state may not fall.

  A chip capacitor 16 in which electrodes 15 are formed on both ends of the chip capacitor body 13 is adhesively held in the adhesive holding portion 5 of the second holding jig 2 in a suspended state. The rubber elastic member in the adhesive holding part 5 is heated by the heating means 6 in the second holding jig 2. If it does so, the adhesive force of a rubber elastic member will fall. Therefore, when a stripper (not shown) is brought into sliding contact with the lower surface of the rubber elastic member as the adhesive holding part 5, the chip capacitor 16 suspended and held by the adhesive holding part 5 is easily detached and dropped.

  As described above, at least two holding jigs 2 having the same configuration are used, and the temperature of the rubber elastic member in the adhesive holding portion 5 in each holding jig 2 is adjusted to be held by the holding jig 2. The small electronic component can be replaced with another holding jig 2, and the small electronic component held by the holding jig 2 can be easily detached from the adhesive holding portion 5.

Example 1
Two holding jigs having the same structure were prepared. This holding jig is formed by sticking an adhesive holding portion made of a rubber elastic member made of silicone rubber and formed in a flat plate shape having a thickness of 2 mm to a substrate which is a holding portion main body.

When the rubber elastic member was heated to 35 ° C. and its adhesive strength was measured according to the Shin-Etsu polymer method, the adhesive strength was 25 g / mm ² .

Next, the rubber elastic member heated to 35 ° C. was cooled to 10 ° C., and the adhesive strength of the rubber elastic member at that temperature was measured in the same manner as described above. The adhesive strength was 45 g / mm ² .

  A chip capacitor is held on the surface of a rubber elastic member in the holding jig by adhesion, and the first holding jig arranged with the rubber elastic member facing upward has the same structure as the first holding jig. The second holding jig is overlapped so that the rubber elastic member in the first holding jig and the rubber elastic member in the second holding jig are in contact with each other, and then the rubber in the first holding jig is used. While heating the elastic member and cooling the rubber elastic member in the second holding jig so that the temperature does not rise, the adhesive force of the rubber elastic member in the first holding jig is reduced in the second holding jig. When the adhesive force of the rubber elastic member is lowered and then the second holding jig is separated from the first holding jig, the first holding is held on the surface of the rubber elastic member in the second holding jig. Rubber elastic member in jig Chip capacitor which has been adhesive holding is migrated, was adhesive holding.

  Therefore, two types of rubber elastic members having different adhesive strength at normal temperature are prepared, and one type of rubber elastic member is provided without preparing two types of holding jigs each having two types of rubber elastic members. Two holding jigs having the same configuration are prepared, and the adhesive force of the rubber elastic member in these holding jigs is adjusted by changing the temperature of the rubber elastic member, thereby reducing the size of the holding jig held by one holding jig. The electronic component can be transferred to the other holding jig.

FIG. 1 is a schematic illustration showing a small electronic component holding apparatus according to an embodiment of the present invention. FIG. 2 is a graph showing the relationship between temperature and adhesive strength of the rubber elastic member according to the present invention. FIG. 3 is a schematic explanatory view for explaining a procedure for sticking a chip capacitor in an upright state to an adhesive holding portion in a small electronic component holding apparatus according to an embodiment of the present invention. FIG. 4 is a schematic explanatory view showing a state in which the chip capacitor is pressed with a press plate in order to adhere the chip capacitor to the adhesive holding portion in the small electronic component holding device according to one embodiment of the present invention. FIG. 5 is a schematic explanatory view showing a state in which a chip capacitor is suspended and held by a holding jig in a small electronic component holding apparatus according to an embodiment of the present invention. FIG. 6 shows a chip capacitor body suspended from a first holding jig according to an embodiment of the present invention, formed on the surface of the rubber elastic member of the adhesive holding portion of the second holding jig. It is a schematic explanatory drawing which shows the state currently made to adhere so that the made electrode may be made to contact. FIG. 7 is a schematic explanatory view showing a state in which the chip capacitor main body is suspended and held with the electrodes facing downward in the second holding jig according to one embodiment of the present invention. FIG. 8 is a schematic explanatory view showing a state in which a chip capacitor formed by coating electrodes on both ends of a second holding jig according to an embodiment of the present invention is suspended and held.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Small electronic component holding device 2 Holding jig 3 Temperature adjusting means 4 Jig body 5 Adhesive holding part 6 Heating means 7 Cooling means 8 Temperature measuring means 9 Control means 10 Standing arrangement plate 11 Through hole 12 Tapered surface 13 Chip capacitor body 14 Press plate 15 Electrode

Claims (4)

A holding jig having a rubber elastic member having an adhesive property in which a relationship between an adhesive force and a temperature satisfies the following formula.
Y = aX + b
However, in said formula, a is -1--0.7, b is 40-65, Y is adhesive force (unit: g / mm < ² >), X is the temperature (unit: 10 degreeC or more and 35 degrees C or less). ° C).   2. A small electronic component holding apparatus comprising: the holding jig according to claim 1; and temperature adjusting means for adjusting a surface temperature of the rubber elastic member.   The small electronic component holding apparatus according to claim 2, wherein the temperature adjusting means includes a heating means for heating the surface of the rubber elastic member and a cooling means for cooling the surface of the rubber elastic member. The temperature adjusting means includes temperature measuring means for measuring the surface temperature of the rubber elastic member, and control means for controlling the heating means and the cooling means in accordance with the temperature measured by the temperature measuring means. The small electronic component holding device according to claim 3.

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