CN103846786B - Grinding pad - Google Patents
Grinding pad Download PDFInfo
- Publication number
- CN103846786B CN103846786B CN201310425342.3A CN201310425342A CN103846786B CN 103846786 B CN103846786 B CN 103846786B CN 201310425342 A CN201310425342 A CN 201310425342A CN 103846786 B CN103846786 B CN 103846786B
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- Prior art keywords
- grinding
- adsorption layer
- polysiloxane
- grinding pad
- adsorption
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention discloses a kind of grinding pad, which is passed through the adsorption material containing base material and adsorption layer is engaged with grinding layer and forms, the adsorption layer includes that by meansigma methodss Sa comprising the constituent only in two ends with the crosslinking such as polysiloxane of straight-chain polysiloxane of vinyl, the surface roughness of the adsorption layer be 0.02 μm to 0.06 μm.Here, the even surface roughness of preferably described adsorption layer, it is preferred that the surface roughness (Sc) of the adsorption layer central part is all less than 0.02 μm with the difference of Sa with the difference of Sa and the surface roughness (So) of the absorbent tip.Additionally, it is 80% to 130% that the base material of the adsorption material is preferably fracture strength for 210MPa to 290MPa, elongation at break.The grinding pad for possessing adsorption layer disclosed by the invention, which can form the abradant surface of higher precision, and be suitable for the abradant surface of large area.
Description
Technical field
The present invention relates to a kind of grinding pad, which is using in semiconductor chip used by semiconductor device, electronic unit etc. etc.
It is ground in the grinding steps of component.More specifically, a kind of grinding pad is further related to, which is being ground the attrition process of component
In, working performance can be lifted, while the flatness of abradant surface can be improved.
Background technology
Semiconductor device, the manufacturing process of electronic unit such as semiconductor chip, display glass substrate, hard disk substrate
In, the grinding steps comprising the planarization for its surface, mirror-polishing.In grinding steps, typically make to be ground component and be retained on
One platform of grinding elements, and grinding pad is fixed on into another platform, slurry is supplied, while making to be ground component
Relatively slided with the state pressurizeed with grinding pad and carried out.
Here, with regard to grinding pad for the fixing meanss of platform, be to stick together fixation by sticking together the adhesive agents such as band in the past.
However, the fixing meanss are rather taken in the fixed operation of grinding pad or exchanging operation, become and grinding steps are greatly reduced
The main cause of working performance.That is, grinding pad is sticked together when being fixed on platform, in order to ensure the flatness of grinding pad,
Must while note make between platform and grinding pad, not producing air layer, attach at leisure.Then, platform with stick together with it
Between when forming air layer, it is necessary to band will be sticked together and temporarily peeled off and attached after air layer is eliminated once again, cause leeway.
In addition, in the exchanging operation of grinding pad, needing old grinding pad is peeled off from platform, but it being residual at this moment to have adhesive agent
Stay in the situation of platform.Now, before the new grinding pad of fixation, need to use solvent etc. to remove the adhesive agent for remaining in platform
And the step of clean, so that exchanging operation is time-consuming.
One kind is developed relative to the grinding pad of this kind of conventional dependence adhesive agent, the present inventor etc. to be easily ground
The grinding pad (patent documentation 1) of the fixation/exchanging operation of pad.The grinding pad is as shown in Fig. 2 be the back side (platform in grinding layer
The one side of side) it is provided with the adsorption material of specific composition.The adsorption material such as its literal meaning, by its adsorption by grinding pad
It is fixed on platform, it is different from the mode of adhesive agent in the past used (fixing by stickiness), when peeling off from platform, will not be residual
Leave residue.And, attaching again after easily being peeled off, therefore the stripping/fixation of pad can be successfully ground,
And can efficiently swap operation.
[prior art document]
[patent documentation]
No. 3166396 description of [patent documentation 1] Japanese Utility Pat. Registration
Due to densification, high very thinization of semiconductor device, thus for abrasive article high flat degree requirement gradually
Strictly.Typically for the requirement of grinding precision, it is believed that be because the environment of the abradant surface of ground material and improve, especially
What is improved because of the characteristic of grinding agent (slurry) is in the majority.
It is however, be also considered as the impact of the state to grinding precision of grinding pad, particularly in view of in recent years, chip, aobvious
Show ever-larger diameterses, the development of large area of plate, and only rely on the improvement of grinding agent and be difficult to fully adaptation.Here, of the invention
A kind of grinding pad for possessing the adsorption layer is disclosed, and which can help the high precision int of abradant surface, and be suitable for the big face of abradant surface
Productization.
The content of the invention
（The problem solved by invention）
The present inventor etc. for said purpose, the structure of the grinding pad for possessing adsorption material invented according to the present inventor etc.
Into the characteristic of each composition of adjustment simultaneously investigates its effect to grinding performance.Especially it is conceived to the adsorption layer and base for constituting adsorption material
Each characteristic of material is drawn the present invention to grinding the impact of performance and investigating.
That is, the present invention relates to a kind of grinding pad, which passes through the adsorption material containing base material and adsorption layer and grinding
Layer engagement is formed, and the adsorption layer is included by the constituent selected from following at least one polysiloxane crosslinking：
Polysiloxane comprising the straight-chain polysiloxane only in two ends with vinyl, it is included in two ends and side chain
The polysiloxane of the straight-chain polysiloxane with vinyl, comprising there is the branched poly- of vinyl in end only
The polysiloxane of organosiloxane and it is included in end and side chain has the branched polysiloxane of vinyl
Polysiloxane, meansigma methodss Sa of the surface roughness of the adsorption layer are 0.02 μm to 0.06 μm.
Hereinafter, describe the present invention in detail.As described, the present invention is with regard to by limiting the absorption aspect with contact with platform
Surface roughness, and the grinding pad of suitable grinding operation can be carried out.According to the grinding for possessing adsorption material of the present inventor etc.
Pad, it is when platform is fixed on, high with the shearing force (horizontal fixing intensity) caused by adsorption layer effect, and peeling force (longitudinal direction
Fixing intensity) low characteristic.By this kind of for the shearing force and the relation of peeling force of platform, the friendship for making grinding pad can be played
Change operation easily, while the effect of the grinding pad skew in suppressing grinding operation.Additionally, although low to the peeling force of platform,
Which simply means to meaning comparatively, be not reach grinding pad in grinding operation can be made to come off, or adsorption layer and platform between produce
The faint power of the degree in raw space.
But, according to the seam of the investigation of the present inventor etc., adsorption layer and platform in state as mentioned, adsorption layer
Surface roughness may cause small impact to the inner evenness of abrasive power during grinding operation.To the inner evenness
Though affecting little, when the very thin flatness of superelevation is required to abradant surface or can cause when the area of surface to be polished increases cannot
The impact of ignorance.
The grinding pad for possessing adsorption material of the present invention limits the surface roughness of adsorption layer because of the reason.With regard to the table
Surface roughness, needs for less than 0.06 μm.If more than 0.06 μm, impact may be produced on the inner evenness of abrasive power.Separately
On the one hand, with regard to its lower limit, should not restricted limit, but the minima that can be manufactured be 0.02 μm.And, rough surface in this
Degree is arithmetic average roughness (Ra).
In addition, the surface roughness of adsorption layer means the meansigma methodss in absorption aspect, it is central part, end for adsorption layer
The meansigma methodss of the surface roughness measurement value of some such as portion's (peripheral part).Preferably using the center for adsorption layer
Portion, the meansigma methodss of the surface roughness at 3 points of both ends.Then, in order to play grinding performance preferably, it is preferred that absorption
The surface roughness of layer has uniformity.Surface roughness (Sc) and adsorption layer in particular to the central part of adsorption layer
The surface roughness (So) of end, it is preferred that the difference and So of Sc and Sa is all less than 0.02 μm with the difference of Sa.And, with regard to
The surface roughness of the end of adsorption layer, it is preferred that the two ends in two direction of grinding pad diameter possess the relation.
It is with regard to the material of adsorption layer, substantially identical with the conventional grinding pad according to the present inventor etc..Namely
Say, be laminated following constituents and formed, the constituent is by selected from the straight-chain of vinyl is poly- to be had comprising only having in two ends
The polysiloxane of organic siloxane, it is included in the poly- of straight-chain polysiloxane that two ends and side chain have vinyl and has
Organic siloxane, the polysiloxane comprising the branched polysiloxane only in end with vinyl and it is included in
End and side chain have at least one poly organo in the polysiloxane of the branched polysiloxane of vinyl
Alkane crosslinking is formed.
For the specific example of the polysiloxane, the example of straight-chain polysiloxane can enumerate [chemistry
Formula 1] compound.Additionally, the example of branched polysiloxane can enumerate the compound of [chemical formula 2].
[chemical formula 1]
(in formula, R represents following organic groups, and n represents integer)
[chemical formula 2]
(in formula, R represents following organic groups, and m, n represent integer)
In [chemical formula 1], [chemical formula 2], for the specific example of substituent group (R), following monovalent hydrocarbon base can be enumerated
Group：The aromatic radicals such as the alkyl such as methyl, ethyl, propyl group, phenyl, tolyl or the part being connected with the carbon atom of these groups
Or the hydrogen atom Jing halogen atoms of whole, cyano group etc. replace obtained by group, wherein, identical or different being unsubstituted or being substituted
Unsaturated group of aliphatic series except.Preferably at least 50 moles % are methyl.Substituent group may be the same or different.Additionally, should
Polysiloxane can be mixture alone or in any combination.
In addition, the number average molecular weight for constituting the polysiloxane of adsorption layer has when being 30000 to 100000 fitting
Suitable adsorption.But, in the adjustment of surface roughness, number average molecular weight and the system of the polysiloxane for being used
The calcination temperature for making the stage can be impacted.In order to be readily obtained suitable surface roughness, the quantity of polysiloxane is put down
Average molecular weight preferably 30000 to 60000.
Then, in the present invention, the physical property of the base material with regard to adsorption material is constituted together with adsorption layer, it is preferred that setting is certain
Limit.Base material refers to the supporting member of the treatability for guaranteeing the thin adsorption layer containing Organic substance.Therefore, original base material makes
With grinding performance not in view of grinding pad, but according to the present inventor etc., by making it have appropriate application for base material
Fracture strength and elongation at break, can play grinding performance preferably.Here, the physical property of the base material that should be set be fracture strength and
Elongation at break, it is preferred that fracture strength is 210MPa to 290MPa, elongation at break is 80% to 130%.More preferably rupture
Intensity is 210MPa to 240MPa, elongation at break is 110% to 130%.And, the tensile strength is determined when being dried
Value.
Base material is using with the fracture strength, the flaky resin material of elongation at break.Specifically, it is polyester, poly- second
The resins such as alkene, polystyrene, polypropylene, nylon, polyurethane, polyvinylide pie, polrvinyl chloride.Preferably resin
Material is polyester, polyethylene terephthalate (PET), PEN (PEN), and that particularly good is PET.Base material can be
Monolayer is alternatively the multi-ply construction of various kinds of resin.
Adsorption material is made up of with base material adsorption layer, preferably 20 μm to 30 μm of the thickness of adsorption layer.Additionally, the thickness of base material
Preferably 50 μm to 200 μm of degree.Base material is preferably adjacent to adsorption layer and is engaged.
The making of adsorption material, is to be intended to become the coating solution containing polysiloxane composition of adsorption layer in base material
Going up and being calcined makes polysiloxane crosslinking and forms adsorption layer.Coating fluid includes the straight-chain, branched poly organo
Hydride compounds and cross-linking agent.Cross-linking agent is preferably known cross-linking agent, for example, can enumerate organic hydrogen polysiloxanes.The poly- silica of organic hydrogen
Alkane is that at least have three hydrogen atoms being connected with silicon atom in a molecule, it is practical on from the point of view of, it is preferred that containing total amount
In the molecule of 50 weight % have two ≡ SiH keys, remaining be molecule in have at least three ≡ SiH keys.
Coating fluid can be containing the platinum catalyst used by cross-linking reaction.Platinum catalyst suitably uses known catalyst, for example
Four chloro platinic acid, chlordene can be enumerated and close the chloroplatinic acid such as platinic acid, the alcoholic compound of chloroplatinic acid, aldehyde compound or chloroplatinic acid and various alkene
Complex salt of hydrocarbon etc..Additionally, coating fluid can be no-solvent type, solvent-borne type, arbitrary form of emulsion-type.Using solvent-borne type coating fluid
When, it is preferred that it is dried after coating and removes solvent.Calcination after coating solution, it is preferred that heat in 120 DEG C to 180 DEG C
60 seconds to 150 seconds.
Grinding layer is engaged in adsorption material and is formed by the grinding pad of the present invention.Grinding layer is used using general grinding pad
Abrasive cloth.The non-woven fabrics that for example can be formed using nylon, polyurethane, polyethylene terephthalate etc., foaming
Formed body etc..In addition, the shape of its surface (abradant surface) is not limited to flat, can be suitably formed to keep the ditch of grinding agent
Deng.The thickness for forming the abrasive cloth of grinding layer uses 0.5mm to 3mm.
Grinding layer can be known method with the joint method of base material, as long as example incite somebody to action both using solid, adhesive agent etc.
Engagement.
（The effect of invention）
The grinding pad of the present invention, by the application of adsorption layer, can lift exchange, the workability of fixed operation of grinding pad,
And the high precision int of abradant surface can be sought.
Description of the drawings
Fig. 1 is the schematic diagram of the grinding elements used by embodiment；
Fig. 2 is the pie graph of the grinding pad that explanation possesses adsorption material.
Specific embodiment
Below suitable embodiment to illustrate the invention.In embodiment, different each adsorption materials is bonded on into grinding layer
Grinding pad is made, its abrasive characteristic is assessed.
(making of adsorption material)
In base material (50 μm of thickness, size containing various resin materials (PET, PEN, PVC)810mm) coating containing by
The coating fluid of the polysiloxane composition constituted by polysiloxane.Coating fluid is comprising last only two in 100 weight portions
Hand over containing 0.6 weight portion in the polysiloxane (molecular weight 30000) of straight-chain polysiloxane of the end with vinyl
Connection agent, the no-solvent type polysiloxane liquid of 2 weight portion platinum catalysts.By the coating solution after base material, in 150 DEG C
Polysiloxane is made to be crosslinked and form adsorption layer within 100 seconds to 160 DEG C of calcination.The thickness of the adsorption layer after crosslinking is all 25 μm.
(making of grinding pad)
The abrasive cloth of grinding layer is general-using type chamois leather abrasive cloth (model 7355-000F), is that staple length (nap length) is
450 μm, the circular abrasive cloth that thickness is 1.37mm.Become grinding pad by grinding layer and adsorption material then simultaneously integrated.Grinding layer
With adsorption material be followed by engaged using acrylic acid seriess solid.
For manufactured various grinding pads, the surface roughness of adsorption layer is determined.The measure of surface roughness is foundation
JIS B0601-1994, using roughness tester, with the actuating speed 0.1mm/ second, sampling (cutoff) value 0.08mm,
Measured length 1.6mm × 5 determine.Then, after surface roughness measurement, the grinding of silicon is carried out using each grinding pad, assess
Abrasive characteristic.This assessment content is for example following.
(grinding scar assessment)
The platform of grinding elements grinding pad being attached at shown in Fig. 1, actual grinding as be ground component silicon (8 inches).In grinding steps, by slurry (by Glanzox (Fujimart Co., Ltd.（Fujimi Incorporated）System)
30 times are diluted with pure water) instill in (flow 150ml/ minutes) grinding layer.Other grinding conditions are as following.
. grinding pressure：0.163kgf/cm2。
. the rotary speed of grinding pad：45rpm.
. it is ground the rotary speed of component：47rpm.
. the shake speed of head：250mm/ minutes.
. milling time：3 minutes.
After grinding, the surface to be polished of chip is cleaned with pure water, after dustless state is dried, observe abradant surface, calculate wound
The size and quantity of trace, is assessed from 100 points of full marks with deduction method.Now, big scar deduction is larger.With regard to assessment result, will
Less than more than 95 points 100 points as " ◎ ", more than 90 points are not allocated as "○" up to 95, by more than 85 points not up to 90 be allocated as "
△ ", further will not be allocated as "×" up to 85.
(inner evenness assessment)
The film thickness measuring of the oxide-film of rear silicon chip surface is ground, the uniformity of abradant surface is assessed.The film of oxide-film
It is thick to determine using reflective film thickness measuring instrument (great Zhong Electronics Co., Ltd system).Inner evenness has 1 μ using accumulation on silicon
The sample of m heat oxide films, is ground 1 minute with grinding condition same as described above, the grinding of 25 from chip point ad-hoc location
Film thickness measuring value in front and back tries to achieve grinding rate maximum (Rmax) and grinding rate minima (Rmin), according to following mathematical expression meters
Calculate inner evenness.With regard to assessment result, using less than 5% as " ◎ ", will be more than 5% and less than 8% as "○", will
Less than 10% used as " △ ", will be more than 10% as "×".
[mathematical expression 1]
Inner evenness (%)=(Rmax-Rmin)/(Rmax+Rmin)×100
Above assessment result is shown in table 1.Additionally, also for the conventional grinding pad with adsorption material as comparative example
Carry out above physical property measurement and abrasive characteristic assessment.
[table 1]
Can confirm from table 1, in order that scar assessment is all subjected to inner evenness both sides, as its essential condition, must
The meansigma methodss of the surface roughness of adsorption layer must be limited.This is because though the scar assessment of comparative example be good, in face uniformly
Property is poor.Then, in order that inner evenness precision is higher, the uniformity of the surface roughness for guaranteeing adsorption layer need be sought, preferably
Be that central part (Sc) is less with the difference of end (So).And, if making the fracture strength of the base material for adsorption layer, elongation at break
For suitable, then more preferably abrasive characteristic is shown.
（Industrial utilizability）
As described above, on the one hand grinding pad of the invention possesses convenience obtained by the setting because of adsorption material, and can
Form the excellent high-quality abradant surface of flatness.According to the present invention, the chip developed for ever-larger diameterses, large areaization, display
Plate, can also form high accuracy abradant surface.
Claims (5)
1. a kind of grinding pad, which is passed through the adsorption material containing base material and adsorption layer is engaged with grinding layer and forms, it is characterised in that
The adsorption layer is included by the constituent selected from following at least one polysiloxane crosslinking：Comprising only existing
Two ends have the polysiloxane of the straight-chain polysiloxane of vinyl, be included in two ends and side chain has ethylene
The polysiloxane of the straight-chain polysiloxane of base, comprising the branched poly organo only in end with vinyl
The polysiloxane of alkane and be included in end and side chain have vinyl branched polysiloxane poly-organosilicon
Oxygen alkane,
Meansigma methodss Sa of the surface roughness of the adsorption layer are 0.02 μm to 0.06 μm, and the table of the central part of the adsorption layer
The surface roughness (So) of end of the difference and the adsorption layer of surface roughness (Sc) and Sa and the difference of Sa be all 0.02 μm with
Under.
2. grinding pad according to claim 1, it is characterised in that the thickness of the adsorption layer is 20 μm to 30 μm.
3. grinding pad according to claim 1 and 2, it is characterised in that the base material of the adsorption material comprising fracture strength is
210MPa to 290MPa, elongation at break are 80% to 130% resin.
4. grinding pad according to claim 3, it is characterised in that the thickness of the base material is 50 μm to 200 μm.
5. grinding pad according to claim 1 and 2, it is characterised in that the thickness of the base material is 50 μm to 200 μm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012264968A JP5765858B2 (en) | 2012-12-04 | 2012-12-04 | Polishing pad |
| JP2012-264968 | 2012-12-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103846786A CN103846786A (en) | 2014-06-11 |
| CN103846786B true CN103846786B (en) | 2017-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310425342.3A Active CN103846786B (en) | 2012-12-04 | 2013-09-17 | Grinding pad |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5765858B2 (en) |
| KR (1) | KR101604170B1 (en) |
| CN (1) | CN103846786B (en) |
| TW (1) | TWI515083B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105500186A (en) * | 2016-01-21 | 2016-04-20 | 苏州新美光纳米科技有限公司 | Polishing pad for wafer polishing and self-absorption method thereof |
| JP6917058B2 (en) * | 2017-06-06 | 2021-08-11 | 丸石産業株式会社 | Polishing method using a polishing pad provided with an adsorption layer |
| WO2019012391A1 (en) * | 2017-07-11 | 2019-01-17 | 3M Innovative Properties Company | Abrasive articles including conformable coatings and polishing system therefrom |
| JP7026942B2 (en) * | 2018-04-26 | 2022-03-01 | 丸石産業株式会社 | Underlay for polishing pad and polishing method using the underlay |
| JP7026943B2 (en) * | 2018-05-08 | 2022-03-01 | 丸石産業株式会社 | Polishing pad and polishing method using the polishing pad |
| JP7403174B2 (en) * | 2019-03-20 | 2023-12-22 | 丸石産業株式会社 | Surface plate for polishing equipment, polishing equipment, and polishing method |
| JPWO2021157597A1 (en) | 2020-02-07 | 2021-08-12 | ||
| JP7424729B2 (en) | 2020-02-21 | 2024-01-30 | フジコピアン株式会社 | silicone adsorption film |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4414697B2 (en) * | 2003-08-05 | 2010-02-10 | 東洋インキ製造株式会社 | Polishing pad laminate and double-sided adhesive sheet |
| JP5061308B2 (en) * | 2007-01-05 | 2012-10-31 | フジコピアン株式会社 | Adhesive sheet |
| JP2010158727A (en) * | 2009-01-06 | 2010-07-22 | Hoya Corp | Lens machining pad, method for manufacturing the same, method for manufacturing plastic lens, and adhesion member |
| JP5421635B2 (en) * | 2009-03-30 | 2014-02-19 | 富士紡ホールディングス株式会社 | Polishing pad |
| JP2011000671A (en) * | 2009-06-18 | 2011-01-06 | Okamoto Machine Tool Works Ltd | Polishing surface plate for substrate |
| JP2011183496A (en) * | 2010-03-08 | 2011-09-22 | Meitec Corp | Protective cover for painting robot |
| JP5291647B2 (en) * | 2010-03-08 | 2013-09-18 | 株式会社岡本工作機械製作所 | Easy to replace and replace laminated polishing pad |
| JP3166396U (en) * | 2010-12-20 | 2011-03-03 | 丸石産業株式会社 | Polishing pad |
-
2012
- 2012-12-04 JP JP2012264968A patent/JP5765858B2/en active Active
-
2013
- 2013-08-21 KR KR1020130098861A patent/KR101604170B1/en active IP Right Grant
- 2013-09-17 CN CN201310425342.3A patent/CN103846786B/en active Active
- 2013-09-25 TW TW102134473A patent/TWI515083B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI515083B (en) | 2016-01-01 |
| TW201422372A (en) | 2014-06-16 |
| JP5765858B2 (en) | 2015-08-19 |
| CN103846786A (en) | 2014-06-11 |
| KR101604170B1 (en) | 2016-03-16 |
| KR20140071874A (en) | 2014-06-12 |
| JP2014108498A (en) | 2014-06-12 |
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