CN103824927B - 一种led芯片封装体及其制备方法 - Google Patents
一种led芯片封装体及其制备方法 Download PDFInfo
- Publication number
- CN103824927B CN103824927B CN201410088653.XA CN201410088653A CN103824927B CN 103824927 B CN103824927 B CN 103824927B CN 201410088653 A CN201410088653 A CN 201410088653A CN 103824927 B CN103824927 B CN 103824927B
- Authority
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- China
- Prior art keywords
- led chip
- led
- chip
- conducting wire
- tin cream
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (6)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410088653.XA CN103824927B (zh) | 2014-03-12 | 2014-03-12 | 一种led芯片封装体及其制备方法 |
PCT/CN2014/084503 WO2015135287A1 (zh) | 2014-03-12 | 2014-08-15 | 一种led芯片封装体及其制备方法 |
JP2016574315A JP2017509163A (ja) | 2014-03-12 | 2014-08-15 | Ledチップパッケージ体及びそのパッケージング |
US14/395,102 US20160276318A1 (en) | 2014-03-12 | 2014-08-15 | Package of LED Chip and Manufacturing Method Thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410088653.XA CN103824927B (zh) | 2014-03-12 | 2014-03-12 | 一种led芯片封装体及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103824927A CN103824927A (zh) | 2014-05-28 |
CN103824927B true CN103824927B (zh) | 2016-08-17 |
Family
ID=50759882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410088653.XA Expired - Fee Related CN103824927B (zh) | 2014-03-12 | 2014-03-12 | 一种led芯片封装体及其制备方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20160276318A1 (zh) |
JP (1) | JP2017509163A (zh) |
CN (1) | CN103824927B (zh) |
WO (1) | WO2015135287A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103824927B (zh) * | 2014-03-12 | 2016-08-17 | 亚浦耳照明股份有限公司 | 一种led芯片封装体及其制备方法 |
CN105371161B (zh) * | 2014-08-26 | 2018-08-28 | 蔡鸿 | 一种led直下式背光源及其发光方法 |
CN105304016B (zh) * | 2015-10-03 | 2018-08-24 | 上海铁歌科技有限公司 | 智能全彩玻璃显示屏 |
CN106122779A (zh) * | 2016-08-10 | 2016-11-16 | 浙江七星青和电子科技有限公司 | 一种路灯用led灯 |
CN106838640A (zh) * | 2017-01-20 | 2017-06-13 | 四川鋈新能源科技有限公司 | 一种led灯远程监控系统 |
CN106898682A (zh) * | 2017-03-31 | 2017-06-27 | 宁波升谱光电股份有限公司 | 一种贴片式led光源的制备方法及贴片式led光源 |
USD872038S1 (en) * | 2018-07-18 | 2020-01-07 | Haining Xincheng Electronics Co., Ltd. | LED chips on a printed circuit board |
USD873783S1 (en) * | 2018-10-19 | 2020-01-28 | Haining Xincheng Electronics Co., Ltd. | LED chip |
CN109491139A (zh) * | 2018-10-31 | 2019-03-19 | 武汉华星光电技术有限公司 | 背光源的制作方法 |
WO2021114550A1 (zh) * | 2019-12-10 | 2021-06-17 | 厦门三安光电有限公司 | 一种发光装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1661819A (zh) * | 2004-02-26 | 2005-08-31 | 元砷光电科技股份有限公司 | 发光二极管的焊球制造工艺 |
CN102754229A (zh) * | 2010-02-09 | 2012-10-24 | 日亚化学工业株式会社 | 发光装置、及发光装置的制造方法 |
CN203118987U (zh) * | 2013-01-25 | 2013-08-07 | 廖旭文 | 双面发光的led灯板结构 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100933920B1 (ko) * | 2009-06-05 | 2009-12-28 | 주식회사 케이아이자이맥스 | 발광유니트 및 그 제조방법 |
CN101814487B (zh) * | 2010-02-09 | 2011-09-21 | 中山大学 | 一种多芯片led光源模组及其制作方法 |
CN102237471B (zh) * | 2010-04-29 | 2014-08-27 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
CN202373628U (zh) * | 2011-11-14 | 2012-08-08 | 华宏光电子(深圳)有限公司 | 一种led封装结构 |
CN103824927B (zh) * | 2014-03-12 | 2016-08-17 | 亚浦耳照明股份有限公司 | 一种led芯片封装体及其制备方法 |
-
2014
- 2014-03-12 CN CN201410088653.XA patent/CN103824927B/zh not_active Expired - Fee Related
- 2014-08-15 WO PCT/CN2014/084503 patent/WO2015135287A1/zh active Application Filing
- 2014-08-15 JP JP2016574315A patent/JP2017509163A/ja active Pending
- 2014-08-15 US US14/395,102 patent/US20160276318A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1661819A (zh) * | 2004-02-26 | 2005-08-31 | 元砷光电科技股份有限公司 | 发光二极管的焊球制造工艺 |
CN102754229A (zh) * | 2010-02-09 | 2012-10-24 | 日亚化学工业株式会社 | 发光装置、及发光装置的制造方法 |
CN203118987U (zh) * | 2013-01-25 | 2013-08-07 | 廖旭文 | 双面发光的led灯板结构 |
Also Published As
Publication number | Publication date |
---|---|
WO2015135287A1 (zh) | 2015-09-17 |
US20160276318A1 (en) | 2016-09-22 |
CN103824927A (zh) | 2014-05-28 |
JP2017509163A (ja) | 2017-03-30 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160412 Address after: 201201 Shanghai, Pudong New Area East Road, No. 9, building 1, building 6101 Applicant after: Ayura Terua Limited by Share Ltd Applicant after: Sun Ming Applicant after: Dai Jian Address before: 201201 Shanghai East Road, Pudong New Area, No. 6101, room 1, building 133 Applicant before: Shanghai Oppel Lighting Co., Ltd. Applicant before: Sun Ming Applicant before: Dai Jian |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20200312 |