CN103811639A - 一种新型白光led显示模组的封装方法 - Google Patents

一种新型白光led显示模组的封装方法 Download PDF

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Publication number
CN103811639A
CN103811639A CN201210441735.9A CN201210441735A CN103811639A CN 103811639 A CN103811639 A CN 103811639A CN 201210441735 A CN201210441735 A CN 201210441735A CN 103811639 A CN103811639 A CN 103811639A
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China
Prior art keywords
white light
display module
light led
led display
encapsulation method
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田皓鹏
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Jiangsu Wenrun Optoelectronic Co Ltd
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Jiangsu Wenrun Optoelectronic Co Ltd
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Priority to CN201210441735.9A priority Critical patent/CN103811639A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Sealing Material Composition (AREA)

Abstract

一种白光LED显示模组及其制造方法。白光LED由蓝光LED芯片放置于PCB上对PCB进行封胶作业，荧光粉与硅胶混合后，均匀涂抹在PVC膜片上，再将PVC膜片贴于模组上，通过蓝光晶片激发黄色荧光粉，最终光线复合后形成白光射出。

Description

一种新型白光LED显示模组的封装方法
技术领域：
本发明涉及一种新型白光LED显示模组的封装方法。 
背景技术：
目前，现有白光LED显示模块的封装方法是，采用环氧树脂混合荧光粉作为封装胶，注入反射腔体(REF)内，将已固晶、焊线后的蓝光晶片，通过电路板(PCB)，倒插入反射腔体内，使荧光粉激发蓝光，转换形成白光。由于LED显示模块胶水用量大，耗用荧光粉多，荧光粉价格居高不下等问题，使用现有的封装方法，造成白光LED显示模块生产成本较高，制约其市场扩张。 
发明内容：
为了克服现有白光LED显示模块，生产成本居高不下，制约其市场扩张的特性，发明了一种新型的封装方法，可有效的降低制作成本，缩减到原有价格的一半以上。 
技术方案： 
1、按常规工艺制作蓝光LED显示模组。主要工作流程为：固晶、焊线、封装、测试。 
2、依照LED显示模组发光字段外型，制作丝印钢网，钢网厚度约0.15mm 
3、在PVC膜片上面，均匀涂刷层厚度约0.1mm的硅胶，并进行烘烤 
4、将荧光粉加入硅胶搅拌脱泡备用 
5、准备好自动丝印台，放置丝印钢网，将掺入荧光粉的硅胶到在钢网上进行印刷，形成与LED显示模组发光字段完全匹配的荧光粉涂覆层，并进行烘烤 
6、将制作好的膜片贴于蓝光LED显示模组上，通过模组发射出波长460nm左右的兰光，激发荧光粉产生黄光，并于蓝光晶片发出的蓝光复合形成白光 
新型白光LED显示模块封装方法的优点： 
1、在不增加物料成本及产品性能的基础上，减少荧光粉用量，降低白光LED显示模块的生产成本，性价比提升。 
2、批量化生产一致性好，操作工艺简单。 
附图说明
下面结合附图和实施例对本封装技术进行说明。 
图1：设计方案 
图1中：(1)PVC膜片；(2)硅胶层；(3)荧光粉层；(4)反射腔；(5)晶片；(6)电路板； 
7环氧树脂； 
具体实施方式  详见图1 

Claims (4)

1.使用的蓝色芯片发射波长为430-470nm。
2.使用的黄色荧光粉受蓝光激发发射出波长550570nm的绿光，其辉度值/激发效率达到150。
3.将以上荧光粉和胶水一起混合后，均匀涂抹在PVC膜片上。
4.将PVC膜片覆盖在产品表面产生白光。 
CN201210441735.9A 2012-11-05 2012-11-05 一种新型白光led显示模组的封装方法 Pending CN103811639A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106449951A (zh) * 2016-11-16 2017-02-22 厦门市三安光电科技有限公司 一种发光二极管封装结构的制作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080030994A1 (en) * 2006-08-04 2008-02-07 Hon Hai Precision Industry Co., Ltd. Optical plate and method for manufacturing same and backlight module using same
CN201262377Y (zh) * 2008-09-02 2009-06-24 铜陵市毅远电光源有限责任公司 一种显色性好、出光效率高的白光led
CN101599521A (zh) * 2009-06-29 2009-12-09 大连九久光电科技有限公司 一种大功率led的封装结构
CN202076326U (zh) * 2011-04-22 2011-12-14 深圳市东陆科技有限公司 一种数码管及电子仪器
CN202076263U (zh) * 2010-12-23 2011-12-14 东莞市博源光电科技有限公司 白色发光数码管

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080030994A1 (en) * 2006-08-04 2008-02-07 Hon Hai Precision Industry Co., Ltd. Optical plate and method for manufacturing same and backlight module using same
CN201262377Y (zh) * 2008-09-02 2009-06-24 铜陵市毅远电光源有限责任公司 一种显色性好、出光效率高的白光led
CN101599521A (zh) * 2009-06-29 2009-12-09 大连九久光电科技有限公司 一种大功率led的封装结构
CN202076263U (zh) * 2010-12-23 2011-12-14 东莞市博源光电科技有限公司 白色发光数码管
CN202076326U (zh) * 2011-04-22 2011-12-14 深圳市东陆科技有限公司 一种数码管及电子仪器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106449951A (zh) * 2016-11-16 2017-02-22 厦门市三安光电科技有限公司 一种发光二极管封装结构的制作方法
CN106449951B (zh) * 2016-11-16 2019-01-04 厦门市三安光电科技有限公司 一种发光二极管封装结构的制作方法

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Application publication date: 20140521