CN103811332A - Lower electrode base platform of dry etching device and dry etching device - Google Patents
Lower electrode base platform of dry etching device and dry etching device Download PDFInfo
- Publication number
- CN103811332A CN103811332A CN201410051082.2A CN201410051082A CN103811332A CN 103811332 A CN103811332 A CN 103811332A CN 201410051082 A CN201410051082 A CN 201410051082A CN 103811332 A CN103811332 A CN 103811332A
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- lower electrode
- strutting piece
- electrode base
- substrate
- base station
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- 238000001312 dry etching Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 102
- 229920005989 resin Polymers 0.000 claims abstract description 49
- 239000011347 resin Substances 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims abstract description 28
- -1 polytetrafluoroethylene Polymers 0.000 claims description 9
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 9
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000011148 porous material Substances 0.000 claims description 7
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000004049 embossing Methods 0.000 abstract description 9
- 230000006378 damage Effects 0.000 abstract description 4
- 239000011521 glass Substances 0.000 description 43
- 238000005530 etching Methods 0.000 description 14
- 239000000428 dust Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
Abstract
The invention discloses a lower electrode base platform of a dry etching device and the dry etching device, and provides a novel lower electrode base platform used by a user to place a substrate base plate on. After the substrate base plate placed on the lower electrode base platform is etched through the dry etching device, uniform damage to the inner structure of the substrate base plate can be avoided, and the undesirable phenomenon of Embossing Mura of a display device is avoided. The lower electrode base platform of the dry etching device comprises a first base plate and a plurality of support pieces located on the first base plate, wherein top material of each support piece at least comprises resin.
Description
Technical field
The present invention relates to lithographic technique field, relate in particular to a kind of lower electrode base station and dry etching equipment of dry etching equipment.
Background technology
In Display Technique field, conventionally by dry etch process, glass substrate is carried out to etching, to make corresponding figure.Particularly, glass substrate to be etched is placed in and adopts dry etching equipment, utilize plasma discharge to remove material to be etched on glass substrate and carry out etching.
The principle of its etching is described below in conjunction with the structure of dry etching equipment.
Referring to Fig. 1, be prior art dry etching equipment structural representation, comprising: reaction chamber 100, the upper electrode 101 that is positioned at reaction chamber 100 and lower electrode 102, be positioned at the base station 103 for placing glass substrate 104 on lower electrode 102; In the specific implementation, glass substrate to be etched 104 is placed on the base station 103 of lower electrode 102 tops, in reaction chamber 100, pass into plasma gas, by airtight reaction chamber 100, for upper electrode 101 and lower electrode 102 apply voltage, between the two, form electrical potential difference, thereby impel plasma to move to glass substrate, glass substrate is carried out to etching.
At present, the base station 103 of a kind of preferably lower electrode 102 tops is made up of the surperficial floating-point (Embossing Dot) of substrate and substrate surface, this surface floating-point is made up of aluminium oxide ceramics, because the hardness of aluminium oxide ceramics is higher, general its hardness is higher than glass, in the time that glass substrate to be etched is placed on the surperficial floating-point that hardness is higher, inevitably the surface to described glass substrate and/or internal structure cause damage to a certain degree to surface floating-point, cause the position contacting with surperficial floating-point and contact near zone glass substrate thickness evenness decline, and/or the uniformity decreases of internal structure.When the glass substrate of crossing through dry etching is during as the underlay substrate of display floater, while seeing through described glass substrate from the light of backlight or external light source, easily cause light scattering phenomenon, light scattering phenomenon can cause the generation of stamp (Embossing Mura) bad phenomenon in the time that display floater shows image, have a strong impact on the optical characteristics of display floater, thereby affect the display quality of display floater image.
Summary of the invention
The embodiment of the present invention provides a kind of lower electrode base station and dry etching equipment of dry etching equipment, in order to provide a kind of novel for placing the lower electrode base station of underlay substrate, be placed in underlay substrate on this lower electrode base station after dry etching equipment etching, can avoid the inhomogeneity destruction of glass substrate internal structure, avoid display device generation stamp (Embossing Mura) bad phenomenon.
For achieving the above object, the lower electrode base station of the dry etching equipment that the embodiment of the present invention provides, comprising:
First substrate and be positioned at the multiple strutting pieces on described first substrate;
Wherein, the top material of described strutting piece at least comprises resin.
Preferably, described strutting piece is surperficial floating-point structure.
Preferably, described resin comprises polytetrafluoroethylene and/or epoxy resin.
Preferably, the top material of described strutting piece also comprises inorganic mineral material.
Preferably, also comprise the resin bed being positioned on described first substrate, described resin bed and the described each strutting piece formula structure that links into an integrated entity.
Preferably, also comprise: be arranged at the multiple securing members for fastening described first substrate and described resin bed on described first substrate.
Preferably, the vertical range between the top of described strutting piece and described resin bed is 0.4～0.6mm.
Preferably, described strutting piece be shaped as upright cone-shaped.
Preferably, the side surface of described cone-shaped strutting piece is provided with sunk area, and the depression direction of described sunk area is towards the top of described strutting piece, and has setting angle with described first substrate.
Preferably, the top of described strutting piece is to have the bulge-structure that at least one is needle prick shape.
Preferably, the side surface of described strutting piece at least comprises that multiple tops by described strutting piece extend to the first gully of bottom.
Preferably, the side surface of described strutting piece also comprises the second gully that the bearing of trend in multiple and described the first gully intersects.
Preferably, described first substrate is ceramic substrate.
Preferably, also comprise the pore between described strutting piece, described pore runs through described first substrate and described resin bed.
The embodiment of the present invention provides a kind of dry etching equipment, comprises the lower electrode base station of above-mentioned either type.
In sum, the embodiment of the present invention provides a kind of lower electrode base station and dry etching equipment of dry etching equipment to comprise: first substrate and be positioned at the multiple strutting pieces on first substrate; Wherein, the top material of strutting piece at least comprises resin.On described strutting piece, be resin material with the contact position of the underlay substrate of placing; The hardness of resin is less.The strutting piece top being formed by the material that comprises resin contacts with underlay substrate, strutting piece and underlay substrate that the prior art of comparing adopts pottery to form, for example glass substrate contact, can effectively avoid the breakage to underlay substrate surface or internal structure, thereby while avoiding underlay substrate after described etching as the underlay substrate of display floater, there is stamp (Embossing Mura) bad phenomenon, improve the optical characteristics of display floater, thereby improved the display quality of display floater image.
Accompanying drawing explanation
Fig. 1 is prior art dry etching equipment structural representation;
One of lower electrode base station schematic top plan view that Fig. 2 provides for the embodiment of the present invention;
Fig. 3 be the lower electrode base station shown in Fig. 2 A-A to sectional view;
The lower electrode abutment structure schematic diagram that comprises resin bed that Fig. 4 provides for the embodiment of the present invention;
Two of the lower electrode base station schematic top plan view that Fig. 5 provides for the embodiment of the present invention;
Fig. 6 be the lower electrode base station shown in Fig. 5 B-B to sectional view;
One of supporting piece structure schematic diagram that Fig. 7 provides for the embodiment of the present invention;
Two of the supporting piece structure schematic diagram that Fig. 8 provides for the embodiment of the present invention;
Three of the supporting piece structure schematic diagram that Fig. 9 provides for the embodiment of the present invention;
Four of the supporting piece structure schematic diagram that Figure 10 provides for the embodiment of the present invention;
Figure 11 arranges leachy lower electrode abutment structure schematic diagram for what the embodiment of the present invention provided.
Embodiment
The embodiment of the present invention provides a kind of lower electrode base station and dry etching equipment of dry etching equipment, in order to provide a kind of novel for placing the lower electrode base station of underlay substrate, be placed in underlay substrate on this lower electrode base station after dry etching equipment etching, can avoid the inhomogeneity destruction of underlay substrate internal structure, avoid the bad phenomenon of display device generation stamp (Embossing Mura).
Illustrate below with reference to accompanying drawing the technical scheme that the embodiment of the present invention provides, description of the present invention and accompanying drawing, only for the present invention that explains, are not limited to the present invention.
The lower electrode base station of dry etching equipment provided by the invention is to be positioned on lower electrode for supporting the base station of glass substrate to be etched.Described base station and described lower electrode lamination arrange, and similarly to the prior art, the present invention is following mainly to be specifically described described base station the combination of the two.
The underlay substrate that the embodiment of the present invention provides can be glass substrate or flexible base, board etc.The present invention is take glass substrate as example explanation.
Referring to Fig. 2 and Fig. 3, the lower electrode base station schematic top plan view of the dry etching equipment that Fig. 2 provides for the embodiment of the present invention; Fig. 3 be the lower electrode base station shown in Fig. 2 A-A to sectional view;
The lower electrode base station schematic cross-section of the dry etching equipment that the embodiment of the present invention provides, comprising:
Wherein, the top material of strutting piece 2 at least comprises resin.
Strutting piece 2 shown in Fig. 2 and Fig. 3 is for supporting the glass substrate to be etched being placed on first substrate 1, strutting piece 2 the contact area that can reduce between first substrate 1 and glass substrate is set, guarantee that glass substrate is in etching process, each regional temperature is consistent, thereby guarantees the uniformity to glass substrate etching.
The top material of the strutting piece 2 shown in Fig. 2 of the present invention and Fig. 3 at least comprises resin, at least guarantees on described strutting piece that with the contact position of glass substrate to be etched be resin material; The hardness of resin is less than the hardness of glass, and the hardness of pottery is higher than the hardness of glass.The strutting piece top being formed by the material that comprises resin contacts with glass substrate, strutting piece and glass contact that the prior art of comparing adopts pottery to form, can effectively avoid the breakage to glass baseplate surface or internal structure, thereby while avoiding glass substrate after described etching as the underlay substrate of display floater, cause stamp (Embossing Mura) bad phenomenon, improve the optical characteristics of display floater, thereby improved the display quality of display floater image.
The structure of described strutting piece is not limit, and is preferably upright cone-shaped, follow-up will being described further for the structure of strutting piece; The material of described first substrate is not limit, and first substrate is preferably ceramic substrate.
Further, described strutting piece is integral type structure, and the making material of whole strutting piece is identical, is made by the material that comprises resin.In manufacturing process, can reduce manufacture craft difficulty like this.
Preferably, described strutting piece is surperficial floating-point structure (Embossing Dot), and surperficial floating-point structure is compared without the first substrate of strutting piece, can avoid the display floater generation stamp that glass substrate edge is corresponding bad.
Described resin can be any resin with features such as physical and chemical stability, corrosion resistance, high lubricated not viscosity, good electrical insulating properties, strong ageing resistance, heatproof excellences.
Preferably, described resin can be polytetrafluoroethylene (Polytetrafluoroethylene) and/or epoxy resin etc.
Described polytetrafluoroethylene has good chemical stability, corrosion resistance, high lubricated not viscosity, good electrical insulating properties, strong ageing resistance, heatproof excellence, the features such as nontoxicity, make for strutting piece of the present invention, due to its high lubricated not viscosity feature, the dust producing in etching process falls within on strutting piece and is not easy to be combined with strutting piece, even if there is a small amount of dust on strutting piece, follow-up cleaning is also than being easier to.
The macromolecular compound that contains epoxide group in all molecular structures is referred to as epoxy resin.Epoxy resin after solidifying has that good physics, chemical property, dielectric property are good, product size good stability, hardness are high, and the feature such as pliability is better.Make for strutting piece of the present invention, the dust producing in etching process falls within on strutting piece and is not easy to be combined with strutting piece, even if there is a small amount of dust on strutting piece, follow-up cleaning is also than being easier to.
The above-mentioned strutting piece of being made by resin material, in order further to improve the hardness of strutting piece, the top material of described strutting piece is except described polytetrafluoroethylene (Polytetrafluoroethylene) and/or epoxy resin etc., can also comprise inorganic mineral material, inorganic mineral material can be kaolin, mica, wollastonite, talcum powder etc., and inorganic mineral material can improve the hardness of strutting piece.
Preferably, whole strutting piece, by polytetrafluoroethylene (Polytetrafluoroethylene) and/or epoxy resin, is mixed with inorganic mineral material and is made.
The each strutting piece of the present invention can be produced on first substrate, is combined with first substrate.In order to improve the adhesion between strutting piece and first substrate, improve the stability of strutting piece, described each strutting piece is made as to integral structure, wherein a kind of execution mode is: as shown in Figure 4, on the basis of the structure shown in Fig. 3: also comprise the resin bed 3 being positioned on first substrate 1, resin bed 3 and the each strutting piece 2 formula structure that links into an integrated entity.This integral structure facilitates integral replacing.
Further, in order to guarantee the planarization of resin bed 3 and first substrate 1, the resin bed 3 of described integral type be made with the mode that each strutting piece 2 can be printed by the mode of extrusion modling or 3D, and the evenness of the resin bed in the integral structure of making is better.
Further, for described resin bed 3 is tightly fitted on first substrate 1, avoid using for a long time the two separation, referring to Fig. 5 and Fig. 6, Fig. 6 be Fig. 5 B-B to sectional view, lower electrode base station based on previous embodiment, also comprises: be arranged at the multiple securing members 4 for fastening first substrate 1 and resin bed 3 on first substrate 1.
Preferably, securing member 4 can pass through the realizations such as screw, bolt, pin or rivet.
Further, can also have on the basis of securing member 4, by bonding to first substrate 1 and resin bed 3, further improve the steadiness of resin bed 3 and first substrate 1 by bonding agent.
The present invention is because strutting piece and resin bed are integral type, by securing member by tightly fixing to first substrate and resin bed, thereby make described strutting piece and first substrate tightly fixing, avoided strutting piece to come off from described first substrate.
Preferably, referring to Fig. 6, the vertical range h between the top of strutting piece 2 and resin bed 3 is 0.4～0.6mm, is preferably 0.5mm.
The structure that the structure of the strutting piece in the lower electrode base station of the above-mentioned either type of the present invention is similar taper, the global shape that is strutting piece is cone-shaped, top structure is sharper, can reduce like this contact area between strutting piece and glass substrate placed on it, guarantee that local temperature on glass substrate is not subject to the impact of strutting piece.
Below by several typical supporting piece structure of specifically introducing the embodiment of the present invention and providing.
Referring to Fig. 7, it is the preferably enlarged diagram of supporting piece structure of the first;
Strutting piece 2 be shaped as upright cone-shaped, the strutting piece 2 of this cone-shaped is taper shape or Rhizoma Sparganii taper, the Rhizoma Sparganii of comparing taper, the dust on falling on conical strutting piece 2 is more easily slipped to strutting piece 2 bottom peripheries along sidewall, has extended the cleaning frequency of strutting piece 2.
Preferably, the surface of the strutting piece 2 shown in Fig. 7 is smooth structure, the surface of the coarse structure of comparing, and dust is more easily slipped to strutting piece 2 bottom peripheries along sidewall, has extended the cleaning frequency of strutting piece 2.
Referring to Fig. 8, it is the preferably enlarged diagram of supporting piece structure of the second;
Strutting piece 2 be shaped as upright cone-shaped, the strutting piece 2 of this cone-shaped is taper shape or Rhizoma Sparganii taper, the side surface of cone-shaped strutting piece 2 is provided with sunk area 21, the depression direction (as shown by arrows) of sunk area 21 is towards the top of strutting piece (O point), and has the angle of setting α with first substrate 1.The pine tree shape of these cone-shaped strutting piece 2 similar routines.In the time that dust in etching process is fallen the sidewall of strutting piece 2, because having sunk area 21(, sidewall surfaces there is breach), sidewall surfaces is not easy to form the thicker dust of a whole layer, further be conducive to dust releasing in strutting piece 2 bottom peripheries, further extended the cleaning frequency of strutting piece.
Preferably, the sunk area 21 shown in Fig. 8 is V-type, and V-type sunk area 21 is not easy to gather dust.
Referring to Fig. 9, it is the third enlarged diagram of supporting piece structure preferably;
The overall structure of strutting piece 2 is not limit, and can be shaft-like, or American football shape etc., or be the structure shown in Fig. 7 and Fig. 8.
The top of strutting piece 2 is to have the bulge-structure 22 that at least one is needle prick shape.
Multiple bulge-structures 22 that are needle prick shape can improve the stability of glass substrate on strutting piece, reduce the contact area between strutting piece and glass substrate simultaneously.
In order further to increase the cycle of cleaning strutting piece, can also on the strutting piece 2 shown in Fig. 9, gully be set, make dust enter gully to be slipped to along gully the bottom periphery of strutting piece.
Referring to Figure 10, on the basis of the structure shown in Fig. 9, the side surface of strutting piece 2 at least comprises that multiple tops by strutting piece extend to the first gully 23 of bottom;
Further, the side surface of strutting piece 2 also comprises multiple the second gullies 24 that intersect with bearing of trend the first gully 23.
Referring to Figure 11, in order to reduce the temperature of glass substrate, on first substrate 1, be also provided with the pore 6 between strutting piece 2, pore 6 runs through first substrate 1 and resin bed 3.
The outward appearance such as height, shape, arranged distribution and the quantity of the first substrate upper supporting piece that the embodiment of the present invention provides are determined according to actual conditions; Size, arranged distribution and the quantity of pore are determined according to actual conditions, suitably increase the stoma number of electrode perimeter, are better used to glass substrate cooling.
The embodiment of the present invention provides a kind of dry etching equipment, comprises the lower electrode base station of above-mentioned either type, and this lower electrode base station is transferred and is placed with lower electrode.
In sum, the embodiment of the present invention provides a kind of lower electrode base station of dry etching equipment to comprise: first substrate and be positioned at the multiple strutting pieces on first substrate; Wherein, the top material of strutting piece at least comprises resin.At least guarantee on described strutting piece that with the contact position of glass substrate to be etched be resin material; The hardness of resin is less than the hardness of glass, and the hardness of pottery is higher than the hardness of glass.The strutting piece top being formed by the material that comprises resin contacts with glass substrate, strutting piece and glass contact that the prior art of comparing adopts pottery to form, can effectively avoid the breakage to glass baseplate surface or internal structure, thereby while avoiding glass substrate after described etching as the underlay substrate of display floater, cause stamp (Embossing Mura) bad phenomenon, improve the optical characteristics of display floater, thereby improved the display quality of display floater image.
Obviously, those skilled in the art can carry out various changes and modification and not depart from the spirit and scope of the present invention the present invention.Like this, if within of the present invention these are revised and modification belongs to the scope of the claims in the present invention and equivalent technologies thereof, the present invention is also intended to comprise these changes and modification interior.
Claims (15)
1. a lower electrode base station for dry etching equipment, is characterized in that, comprising:
First substrate and be positioned at the multiple strutting pieces on described first substrate;
Wherein, the top material of described strutting piece at least comprises resin.
2. lower electrode base station according to claim 1, is characterized in that, described strutting piece is surperficial floating-point structure.
3. lower electrode base station according to claim 2, is characterized in that, described resin comprises polytetrafluoroethylene and/or epoxy resin.
4. lower electrode base station according to claim 3, is characterized in that, the top material of described strutting piece also comprises inorganic mineral material.
5. lower electrode base station according to claim 4, is characterized in that, also comprises the resin bed being positioned on described first substrate, described resin bed and the described each strutting piece formula structure that links into an integrated entity.
6. lower electrode base station according to claim 5, is characterized in that, also comprises: be arranged at the multiple securing members for fastening described first substrate and described resin bed on described first substrate.
7. lower electrode base station according to claim 5, is characterized in that, the vertical range between the top of described strutting piece and described resin bed is 0.4～0.6mm.
8. according to the arbitrary described lower electrode base station of claim 1-7, it is characterized in that, described strutting piece be shaped as upright cone-shaped.
9. lower electrode base station according to claim 8, is characterized in that, the side surface of described cone-shaped strutting piece is provided with sunk area, and the depression direction of described sunk area is towards the top of described strutting piece, and has setting angle with described first substrate.
10. according to the arbitrary described lower electrode base station of claim 1-7, it is characterized in that, the top of described strutting piece is to have the bulge-structure that at least one is needle prick shape.
11. lower electrode base stations according to claim 10, is characterized in that, the side surface of described strutting piece at least comprises that multiple tops by described strutting piece extend to the first gully of bottom.
12. lower electrode base stations according to claim 11, is characterized in that, the side surface of described strutting piece also comprises the second gully that the bearing of trend in multiple and described the first gully intersects.
13. lower electrode base stations according to claim 1, is characterized in that, described first substrate is ceramic substrate.
14. lower electrode base stations according to claim 5, is characterized in that, also comprise the pore between described strutting piece, and described pore runs through described first substrate and described resin bed.
15. 1 kinds of dry etching equipments, is characterized in that, comprise the arbitrary described lower electrode base station of claim 1-14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410051082.2A CN103811332B (en) | 2014-02-14 | 2014-02-14 | A kind of lower electrode base station and dry etching equipment of dry etching equipment |
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| CN201410051082.2A CN103811332B (en) | 2014-02-14 | 2014-02-14 | A kind of lower electrode base station and dry etching equipment of dry etching equipment |
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| CN103811332A true CN103811332A (en) | 2014-05-21 |
| CN103811332B CN103811332B (en) | 2016-05-25 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104332380A (en) * | 2014-09-02 | 2015-02-04 | 合肥京东方光电科技有限公司 | Electrode used for dry etching device and preparation method thereof, and dry etching device |
| CN105304446A (en) * | 2015-09-18 | 2016-02-03 | 京东方科技集团股份有限公司 | Lower electrode base platform of dry etching device and dry etching device |
| CN113917720A (en) * | 2021-10-20 | 2022-01-11 | 苏州众芯联电子材料有限公司 | Lower electrode with compact floating point surface structure and manufacturing method thereof |
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| CN104332380A (en) * | 2014-09-02 | 2015-02-04 | 合肥京东方光电科技有限公司 | Electrode used for dry etching device and preparation method thereof, and dry etching device |
| CN104332380B (en) * | 2014-09-02 | 2017-08-25 | 合肥京东方光电科技有限公司 | Electrode for dry etching equipment and preparation method thereof, dry etching equipment |
| CN105304446A (en) * | 2015-09-18 | 2016-02-03 | 京东方科技集团股份有限公司 | Lower electrode base platform of dry etching device and dry etching device |
| CN105304446B (en) * | 2015-09-18 | 2017-05-31 | 京东方科技集团股份有限公司 | The lower electrode base station and dry etching equipment of dry etching equipment |
| CN113917720A (en) * | 2021-10-20 | 2022-01-11 | 苏州众芯联电子材料有限公司 | Lower electrode with compact floating point surface structure and manufacturing method thereof |
| CN113917720B (en) * | 2021-10-20 | 2022-07-05 | 苏州众芯联电子材料有限公司 | Method for manufacturing lower electrode with compact floating point surface structure |
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| CN103811332B (en) | 2016-05-25 |
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