CN113917720B - Method for manufacturing lower electrode with compact floating point surface structure - Google Patents

Method for manufacturing lower electrode with compact floating point surface structure Download PDF

Info

Publication number
CN113917720B
CN113917720B CN202111220383.XA CN202111220383A CN113917720B CN 113917720 B CN113917720 B CN 113917720B CN 202111220383 A CN202111220383 A CN 202111220383A CN 113917720 B CN113917720 B CN 113917720B
Authority
CN
China
Prior art keywords
lower electrode
stainless steel
steel sheet
floating
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202111220383.XA
Other languages
Chinese (zh)
Other versions
CN113917720A (en
Inventor
张立祥
赵凯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Zhongxinlian Electronic Materials Co ltd
Original Assignee
Suzhou Zhongxinlian Electronic Materials Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Zhongxinlian Electronic Materials Co ltd filed Critical Suzhou Zhongxinlian Electronic Materials Co ltd
Priority to CN202111220383.XA priority Critical patent/CN113917720B/en
Publication of CN113917720A publication Critical patent/CN113917720A/en
Application granted granted Critical
Publication of CN113917720B publication Critical patent/CN113917720B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention discloses a lower electrode with a compact floating point surface structure and a manufacturing method thereof, wherein the lower electrode comprises a lower electrode, peripheral protrusions are arranged on the periphery of the electrode surface of the lower electrode, floating points distributed in an array mode are further arranged in the range of the peripheral protrusions, and the distance between the floating points is 0.25-2 mm. The dense floating point structure is arranged on the surface of the lower electrode, so that the uniformity of the cooling gas circulation can be improved, the uniformity of the cooling effect of the cooling gas on the glass substrate is improved, and the mark forming situation on the glass substrate is reduced. Meanwhile, by using the manufacturing method, the floating point array with smaller distance can be arranged on the lower electrode, the circulation of cooling gas is ensured, and the cooling effect on the glass substrate is further improved.

Description

Method for manufacturing lower electrode with compact floating point surface structure
Technical Field
The invention relates to the field of display screens, in particular to a lower electrode with a compact floating point surface structure and a manufacturing method thereof.
Background
In the current display screen field, Liquid Crystal Display (LCD) and organic electro-luminescence display (OELD) are the more commonly used display screens. The lower electrode is one of the core components of the processing equipment of the lower electrode and the processing equipment of the lower electrode, is used for procedures such as dry etching, chemical vapor deposition and the like, and mainly has the function of fixing the glass substrate through electrostatic adsorption in the processing process. The adsorption surface structure of the lower electrode commonly used at present has two types, one type is that the adsorption surface is provided with floating points, and the other type is that the adsorption surface is not provided with the floating points.
At present, in the production of large-size (8 generation and above) panels, a lower electrode with a floating point is mostly used, the floating point is used for supporting a glass substrate, a certain pore is formed between the glass substrate and an adsorption surface, cooling gas can conveniently circulate below the glass substrate (the gas enters a space between the glass substrate and the electrode surface through a through hole), and therefore the cooling effect is improved.
In the floating point structure commonly used at present, the diameter of the floating point is almost 0.5-2mm, and the interval between adjacent floating points is usually more than 2 mm. Moreover, the common method for manufacturing the floating point with the structure is as follows: 1. laser drilling is carried out on a stainless steel sheet, the diameter and the pitch of the holes are consistent with those of the floating points, and the stainless steel sheet is used as a shielding jig for manufacturing the floating points; 2. manually pasting double-sided adhesive tapes between the pores on the stainless steel sheet, and then pasting the stainless steel sheet on the adsorption surface of the electrode through the double-sided adhesive tapes; 3. forming floating points in the pores of the stainless steel sheet by means of thermal spraying; 4. and removing the stainless steel sheet shielding jig.
The floating point structure has a problem that the cooling air flow is not uniform due to the large floating point interval, so that the cooling effect on the glass substrate is also non-uniform, and therefore, the display effect of the LCD/OLED screen is easily affected by the mark left by local overheating at the contact position of the glass substrate and the floating point. And the floating point processing method has a limit on the interval of the floating points, and the interval between adjacent floating points can not be less than 2 mm. If the thickness is less than 2mm, the difficulty of manually pasting the double-sided adhesive tape between the holes of the shielding jig is large, the operation is very difficult, and the holes are easily covered partially during pasting. Meanwhile, if the width of the double-sided adhesive tape is smaller than 2mm, the adhesive force of the double-sided adhesive tape is too small, and the stainless steel sheet is easy to bulge due to thermal deformation in the spraying process (namely the adhesive force of the double-sided adhesive tape is not enough to overcome the stress generated by the thermal deformation of the stainless steel sheet to cause the stainless steel sheet to be separated from the adsorption surface), so that the sprayed ceramic powder enters the originally shielded area.
Therefore, the present inventors have aimed at inventing a lower electrode with a compact floating-point surface structure and a method for fabricating the same.
Disclosure of Invention
In order to overcome the above disadvantages, the present invention provides a lower electrode with a compact floating-point surface structure and a method for fabricating the same.
In order to achieve the above purposes, the invention adopts the technical scheme that: the lower electrode with the compact floating point surface structure comprises a lower electrode body, wherein peripheral protrusions are arranged on the periphery of the surface of the electrode of the lower electrode body, floating points which are distributed in an array mode are further arranged on the lower electrode body, the diameters of the floating points are 0.25-1mm, the distance between the floating points is 0.25-2mm, the heights of the floating points are 10-200 mu m, and the distance between the circle center of the floating point on the outermost side and the inner side of the peripheral protrusion is 1-15 mm.
Preferably, the peripheral bulges are arranged around the lower electrode in a rectangular frame shape, and the width of the frame edge of the rectangular frame is 1-20mm and the height of the frame edge is 30-250 μm.
The diameter of the floating points is represented by d, the interval between the floating points is represented by delta, and the distance between the center of the outermost floating point and the inner sides of the left and right bulges is represented by s1Indicating the distance from the inner side of the upper and lower projections by s2And (4) showing.
Preferably, the floating point is made of a dielectric material. By using a dielectric material that is more resistant to plasma erosion, such as a ceramic material of alumina, yttria, etc.
A method for manufacturing a lower electrode with a compact floating point surface structure comprises the following steps:
s1, manufacturing a lower electrode, and manufacturing a peripheral bulge on the electrode surface of the lower electrode;
s2, manufacturing a floating-point shielding jig,
a, selecting n rectangular stainless steel sheets with the thickness of 1mm, adopting laser drilling on each stainless steel sheet, covering the inner side area of the peripheral bulge with each stainless steel sheet,
b, adopting laser to punch at least a rows of holes on the first stainless steel sheet, wherein the diameter of the holes is d, the longitudinal hole pitch is l, the transverse hole pitch is n x l, and the distances between the first row and the left side are s respectively1The distance between the head and the tail of the two lines and the upper and the lower sides is s2
c, drilling at least a rows of holes on the second stainless steel sheet by adopting laser, wherein the diameter of the holes is d, the longitudinal hole pitch is l, the transverse hole pitch is n x l, and the distances between the first row and the left side are s respectively1+ l, the distance between the head and the tail two rows and the upper and the lower sides is s2
d, at least a rows of holes are drilled on the third stainless steel sheet by laser, the diameter of the holes is d, the longitudinal hole pitch is l, the transverse hole pitch is n x l, and the distance between the first row and the left side is s respectively1+2 x l, the distances between the head and the tail two rows and the upper and the lower sides are s respectively2
e, analogizing in this way, drilling at least a rows of holes on the nth stainless steel sheet by adopting laser, wherein the diameter of each hole is d, the longitudinal hole pitch is l, the transverse hole pitch is n x l, and the distances between the first row and the left side are s respectively1Plus (n-1) l, the distances between the two lines from head to tail and the upper and lower sides are s2
S3, arranging double-sided adhesive tapes between each row of holes of each stainless steel sheet;
s4, arranging a first stainless steel sheet on the lower electrode, enabling four sides of the stainless steel sheet to be in contact with the inner side of the peripheral bulge, shielding the side face of the lower electrode, the joint of the stainless steel sheet and the peripheral bulge by using heat-resistant glue, forming a floating point at the position of a hole on the stainless steel sheet in a thermal spraying mode, and removing the first stainless steel sheet after spraying is finished;
s5, repeating S4, arranging the 2 nd to n th stainless steel sheets on the inner side of the peripheral bulge on the surface of the lower electrode in sequence, and spraying;
s6, the heat-resistant paste is removed, and a lower electrode having a dense floating-point structure with a gap δ — l-d formed on the surface of the lower electrode is obtained.
Preferably, l, s1、s2The holes involved in the distance calculation of (2) all take the circle center as a calculation point.
Preferably, the value of n is determined so as to satisfy the following equation: n x l-d is more than or equal to 2 mm. Namely, enough width is reserved between two adjacent rows of holes on the stainless steel sheet to ensure the arrangement of the double-sided adhesive tape.
Preferably, the length of the lower electrode is L1Width of L2The floating point has n x a columns and b rows, and the following formula is satisfied: 2s1=L1-(n*a-1)*l,2s2=L2- (b-1) × where the length and width of the lower electrode, excluding the peripheral projections, refer to the length and width of the inner region surrounded by the peripheral projections.
Preferably, the number and spacing of the holes in each column is the same.
Preferably, the thermal spraying is a method such as atmospheric plasma spraying, suspension plasma spraying and the like.
Preferably, the stainless steel sheet is composed of a plurality of small pieces, typically 4-16 small pieces, and the size of each small piece is optimally about 0.5m x 0.5 m. If only one stainless steel sheet is used for shielding the whole lower electrode, the stainless steel sheet can float due to thermal deformation during thermal spraying, and the condition of thermal deformation can be effectively avoided by adopting a small-sheet splicing mode.
The lower electrode with the compact floating point surface structure has the advantages that the compact floating point structure is arranged on the surface of the lower electrode, so that the uniformity of cooling gas circulation can be improved, the uniformity of the cooling effect of the lower electrode on a glass substrate is improved, and the condition of forming marks on the glass substrate is reduced.
The manufacturing method of the lower electrode with the compact floating point surface structure has the advantages that the floating point array with smaller distance can be arranged on the lower electrode by using the method, so that the circulation of cooling gas is ensured, and the cooling effect on the glass substrate is further improved.
Drawings
Fig. 1 is a schematic cross-sectional structure diagram of a lower electrode having a dense floating-point structure.
FIG. 2 is a plan partial schematic view of a lower electrode with a dense floating point structure.
Fig. 3 is a partial schematic view of a first stainless steel sheet, taking 3 stainless steel sheets as an example.
Fig. 4 is a partial schematic view of a second stainless steel sheet, exemplified by 3 stainless steel sheets.
Fig. 5 is a partial schematic view of a third stainless steel sheet, taking 3 stainless steel sheets as an example.
FIG. 6 is a schematic view of a stainless steel sheet with double-sided tape attached.
Fig. 7 is a schematic view of the first stainless steel sheet bonded to the electrode sheet.
Fig. 8 is a schematic view of the second stainless steel sheet bonded to the electrode sheet.
Fig. 9 is a schematic view of the third stainless steel sheet bonded to the electrode sheet.
FIG. 10 is a diagram illustrating a conventional floating point preparation method using double-sided tape.
In the figure:
1-lower electrode, 2, peripheral bulge, 3, floating point, 4, stainless steel sheet, 5 and double-sided adhesive tape.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.
Referring to fig. 1 to 10, the lower electrode with a compact floating point surface structure in this embodiment includes a lower electrode 1, peripheral protrusions 2 are disposed around the electrode surface of the lower electrode 1, floating points 3 are further disposed on the lower electrode in an array distribution, the diameter of each floating point 3 is 0.25 to 1mm, the distance between the floating points is 0.25 to 2mm, the height of each floating point is 10 to 200 μm, and the distance between the center of the outermost floating point and the inner side of each peripheral protrusion is 1 to 15 mm.
The utility model provides a lower part electrode's beneficial effect with fine and close floating point surface structure, through set up fine and close floating point structure at lower part electrode surface, can improve the homogeneity that cooling gas circulates to improve its even to the cooling effect of glass substrate, reduce the condition that forms the impression on glass substrate.
The peripheral bulges are arranged around the lower electrode in a rectangular frame, and the width of the frame edge of the rectangular frame is 1-20mm and the height is 30-250 mu m.
Referring to FIG. 2, the diameter of the floating points is represented by d, the interval between the floating points is represented by δ, and the distance between the center of the outermost floating point and the inner side of the left and right protrusions is represented by s1Indicating the distance from the inner side of the upper and lower projections by s2And (4) showing.
The floating point is made of dielectric material. By using a dielectric material that is more resistant to plasma erosion, such as a ceramic material of alumina, yttria, etc.
A method for manufacturing a lower electrode with a compact floating point surface structure comprises the following steps:
s1, manufacturing a lower electrode, and manufacturing a peripheral bulge on the electrode surface of the lower electrode;
s2, manufacturing a floating-point shielding fixture,
a, selecting n rectangular stainless steel sheets with the thickness of 1mm, perforating each stainless steel sheet by adopting laser, covering the inner side area of the peripheral bulge by each stainless steel sheet,
b, adopting laser to punch at least a rows of holes on the first stainless steel sheet, wherein the diameter of the holes is d, the longitudinal hole pitch is l, the transverse hole pitch is n x l, and the distances between the first row and the left side are s respectively1The distance between the head and the tail of the two lines and the upper and the lower sides is s2
c, drilling at least a rows of holes on the second stainless steel sheet by adopting laser, wherein the diameter of the holes is d, the longitudinal hole pitch is l, the transverse hole pitch is n x l, and the distances between the first row and the left side are s respectively1+ l, the distance between the head and the tail two rows and the upper and the lower sides is s2
d, at least a rows of holes are drilled on the third stainless steel sheet by laser, the diameter of the holes is d, the longitudinal hole pitch is l, the transverse hole pitch is n x l, and the distance between the first row and the left side is s respectively1+2 x l, the distances between the head and the tail two rows and the upper and the lower sides are s respectively2
e, analogizing in this way, drilling at least a rows of holes on the nth stainless steel sheet by adopting laser, wherein the diameter of each hole is d, the longitudinal hole pitch is l, the transverse hole pitch is n x l, and the distances between the first row and the left side are s respectively1Plus (n-1) l, the distances between the two lines from head to tail and the upper and lower sides are s2
S3, arranging double-sided adhesive tapes between each row of holes of each stainless steel sheet;
s4, arranging a first stainless steel sheet on the lower electrode, enabling four sides of the stainless steel sheet to be in contact with the inner side of the peripheral bulge, shielding the side face of the lower electrode, the joint of the stainless steel sheet and the peripheral bulge by using heat-resistant glue, forming a floating point at the position of a hole on the stainless steel sheet in a thermal spraying mode, and removing the first stainless steel sheet after spraying is finished;
s5, repeating S4, arranging the 2 nd to n th stainless steel sheets on the inner side of the peripheral bulge on the surface of the lower electrode in sequence, and spraying;
s6, the heat-resistant paste is removed, and a lower electrode having a dense floating-point structure with a gap δ — l-d formed on the surface of the lower electrode is obtained. See figure 2.
l、s1、s2The holes involved in the distance calculation of (2) all take the circle center as a calculation point.
The value of n is determined by satisfying the following formula: n x l-d is more than or equal to 2 mm. I.e. to ensure the setting of the double-sided adhesive tape.
And the number and spacing of the holes in each row are the same.
If the length of the lower electrode is L1Width of L2The floating point has n x a columns and b rows, and the following formula is satisfied: 2s of1=L1-(n*a-1)*l,2s2=L2- (b-1) × where the length and width of the lower electrode, excluding the peripheral projections, refer to the length and width of the inner region surrounded by the peripheral projections.
The thermal spraying is a method such as atmospheric plasma spraying and suspension plasma spraying.
The stainless steel sheet is composed of a plurality of small pieces which are spliced together, and the size of each small piece is optimally within 0.5m x 0.5 m. If only one stainless steel sheet is used for shielding the whole lower electrode, the stainless steel sheet can float due to thermal deformation during thermal spraying, and the condition of thermal deformation can be effectively avoided by adopting a small-sheet splicing mode.
The manufacturing method of the lower electrode with the compact floating point surface structure has the advantages that by the method, the floating point array with smaller distance can be arranged on the lower electrode, the circulation of cooling gas is ensured, and the cooling effect on the glass substrate is improved.
Example 1
Making lower electrode for G5 (size about 1300 x 1100mm), wherein the peripheral protrusion on the surface is protrusion with width of 7.5mm and height of 100 μm, floating point structures with diameter of 1mm, hole pitch (circle center to circle center) of 2mm (interval of 1mm) and height of 80 μm are uniformly distributed in the middle, and the distance s between the floating point and the inner side of the peripheral protrusion1And s2Is 2.5 mm.
The preparation method comprises the following steps:
s1, manufacturing a lower electrode according to the prior art, forming a peripheral bulge on the surface of the lower electrode, wherein the middle of the lower electrode is of a concave structure, and the width and the height of the edge of the peripheral bulge are 7.5mm and 100 mu m respectively;
s2, manufacturing a shielding jig for processing floating points, selecting 8 stainless steel sheets with the thickness of about 1mm, splicing every 4 stainless steel sheets together to form a shielding jig capable of completely covering the inner side of the peripheral bulge of the electrode surface of the lower electrode, and punching holes on each stainless steel sheet by using laser:
a, 1-4 spliced 1 st shielding jigs are used, the diameter of a hole formed by the 1 st shielding jig is 1mm, the longitudinal hole distance is 2mm, the transverse hole distance is 4mm, the distance between the head line of the left side and the leftmost edge of the jig is 2.5mm, and the distance between the head line and the tail line and the upper side and the lower side of the jig is 2.5 mm;
b, shielding the jig by the 2 nd spliced 5-8 pieces, wherein the diameter and the pitch of holes formed by the jig are consistent with those of the 1 st piece, but all hole positions move 2mm in the transverse direction compared with the first piece, namely the distance between the head line of the left side and the leftmost edge of the jig is 4.5mm, and the distance between the head line and the tail line and the upper side and the lower side of the jig is 2.5 mm;
s3, attaching double-sided adhesive tapes between each row of holes of the shielding jig of the stainless steel sheet;
s4, firstly, covering the surface of the electrode by a 1 st to 4 th stainless steel sheet (a 1 st covering jig) to enable the stainless steel sheet to completely cover the inner side area of the protrusion of the surface of the electrode, then covering the side surface of the electrode, the protrusion at the periphery of the electrode, the stainless steel sheet and the joint between the stainless steel sheet by heat-resistant glue, then forming floating points in the pores of the stainless steel by a thermal spraying method, wherein the height of the floating points is 80 mu m, the thermal spraying method is atmospheric plasma spraying, and after the spraying is finished, removing 1 to 4 stainless steel sheets;
and S5, repeating the step S4, shielding the electrode surface by the 5 th to 8 th stainless steel sheets (the 2 nd shielding jig) and manufacturing floating points.
And S6, removing the heat-resistant glue and the shielding jig, and finally forming a compact floating point structure with the interval delta of 1 mm.
Example 2
A lower electrode for G10.5 (size approximately 2950 x 3350mm) was produced, the surface of which was raised peripherally by a width of 15mm and a height of 120 μm, with a central uniform distribution of 0.5mm in diameterA floating point structure with a hole pitch (circle center to circle center) of 1mm (interval of 0.5mm) and a height of 100 μm, and a distance s between the floating point and the inner side of the peripheral protrusion1And s2Is 10 mm.
The preparation method comprises the following steps:
s1, manufacturing a lower electrode according to the prior art, forming a structure with a periphery bulge and a concave middle part on the surface of the lower electrode, wherein the width of the side of the periphery bulge is 15mm, and the height of the side is 120 μm;
s2, manufacturing a shielding jig for processing floating points, selecting 24 stainless steel sheets with the thickness of about 1mm, splicing every 6 stainless steel sheets together to form a shielding jig capable of completely covering the area at the inner side of the peripheral bulge of the electrode surface of the lower electrode, namely forming 4 shielding jigs by the 24 stainless steel sheets, and punching holes on each stainless steel sheet by using laser;
a, 1-6 spliced 1 st shielding jigs are used, the diameter of a hole formed by the 1 st shielding jig is 0.5mm, the longitudinal hole distance is 1mm, the transverse hole distance is 4mm, the distance between the head line of the left side and the leftmost edge of the jig is 10mm, and the distance between the head line and the tail line and the upper side and the lower side of the jig is 10 mm;
b, using 5-8 spliced pieces of the No. 2 shielding jig, wherein the diameter and the pitch of a formed hole are consistent with those of the No. 1 shielding jig, but all hole sites move 1mm in the transverse direction compared with the first piece, the distance between the head line of the left side and the leftmost edge of the jig is 11mm, and the distance between the head line and the tail line and the upper side and the lower side of the jig is 10 mm;
c, using 9-12 spliced 3 rd blocks to shield the jig, wherein the diameter and the pitch of a formed hole are consistent with those of the 1 st block, but all hole positions are moved 2mm in the transverse direction compared with the first block, the distance between the head column at the left side and the leftmost edge of the jig is 12mm, and the distance between the head row and the tail row and the upper side and the lower side of the jig is 10 mm;
d, using 13-16 spliced 3 rd blocks to shield the jig, wherein the diameter and the pitch of a formed hole are consistent with those of the 1 st block, but all hole sites move 3mm in the transverse direction compared with the first block, the distance between the head column at the left side and the leftmost edge of the jig is 13mm, and the distance between the head row and the tail row and the upper side and the lower side of the jig is 10 mm;
s3, attaching double-sided adhesive tapes between each row of holes of the stainless steel sheet;
s4, firstly, shielding the surface of the electrode by a 1 st to 4 th stainless steel sheet (a 1 st shielding jig) to enable the surface to completely cover the concave part in the middle, then covering the side surface of the electrode, the peripheral bulge of the electrode, the stainless steel sheet and the joint between the stainless steel sheet and the heat-resistant glue, then forming a floating point in the pore of the stainless steel by a thermal spraying method, wherein the height of the floating point is 100 mu m, the thermal spraying method is atmospheric plasma spraying, and after the spraying is finished, removing the stainless steel sheet;
s5, repeating the steps, shielding the surface of the electrode by using a 5 th to 8 th stainless steel sheet (a 2 nd shielding jig), a 9 th to 12 th stainless steel sheet (a 3 rd shielding jig) and a 13 th to 16 th stainless steel sheet (a 4 th shielding jig) in sequence, and manufacturing a floating point;
and S6, removing the heat-resistant glue and the stainless steel sheet to finally form a compact floating point structure with the interval delta of 0.5 mm. 24
Similarly, the compact floating point structure with the interval of less than 0.5mm can be prepared by the method.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the present invention is not limited thereto, and any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.

Claims (7)

1. A method for manufacturing a lower electrode with a compact floating point surface structure is characterized by comprising the following steps:
s1, manufacturing a lower electrode, and manufacturing a peripheral bulge on the electrode surface of the lower electrode;
s2, manufacturing a floating-point shielding fixture,
a, selecting n rectangular stainless steel sheets with the thickness of 1mm, perforating each stainless steel sheet by adopting laser, covering the inner side area of the peripheral bulge by each stainless steel sheet,
b, adopting laser to punch at least a rows of holes on the first stainless steel sheet, wherein the diameter of the holes is d, the longitudinal hole pitch is l, the transverse hole pitch is n x l, and the distance between the first row and the left side is s1Two rows head and tail andthe distance between the upper and lower sides is s2
c, drilling at least a rows of holes on the second stainless steel sheet by adopting laser, wherein the diameter of the holes is d, the longitudinal hole pitch is l, the transverse hole pitch is n x l, and the distances between the first row and the left side are s respectively1+ l, the distance between the head and the tail two rows and the upper and the lower sides is s2
d, at least a rows of holes are drilled on the third stainless steel sheet by laser, the diameter of the holes is d, the longitudinal hole pitch is l, the transverse hole pitch is n x l, and the distance between the first row and the left side is s respectively1+2 x l, the distances between the head and the tail two rows and the upper and the lower sides are s respectively2
e, analogizing in this way, drilling at least a rows of holes on the nth stainless steel sheet by adopting laser, wherein the diameter of each hole is d, the longitudinal hole pitch is l, the transverse hole pitch is n x l, and the distances between the first row and the left side are s respectively1Plus (n-1) l, the distances between the two lines from head to tail and the upper and lower sides are s2
S3, arranging double-sided adhesive tapes between each row of holes of each stainless steel sheet;
s4, arranging a first stainless steel sheet on the lower electrode, wherein four sides of the stainless steel sheet are all in contact with the inner side of the peripheral bulge, shielding the side surface of the lower electrode and the joint of the stainless steel sheet and the peripheral bulge by using heat-resistant glue, forming a floating point at the position of a hole on the stainless steel sheet in a thermal spraying manner, and removing the first stainless steel sheet after spraying is finished;
s5, repeating S4, arranging the 2 nd to n th stainless steel sheets on the inner side of the peripheral bulge of the surface of the lower electrode in sequence, and spraying;
s6, the heat-resistant paste is removed, and a lower electrode having a dense floating-point structure with a gap δ — l-d formed on the surface of the lower electrode is obtained.
2. The method of claim 1, wherein the lower electrode has a dense floating-point surface structure, and the method further comprises: l, s1、s2The holes involved in the distance calculation of (2) all take the circle center as a calculation point.
3. The method of claim 1, wherein the lower electrode has a dense floating-point surface structure, and the method further comprises: the value of n is determined by satisfying the following formula: n x l-d is more than or equal to 2 mm.
4. The method as claimed in claim 1, wherein the lower electrode has a dense floating-point surface structure, and the method comprises: the length of the lower electrode is L1Width of L2The floating point has n x a columns and b rows, and the following formula is satisfied: 2s1=L1-(n*a-1)*l,2s2=L2-(b-1)*l。
5. The method of claim 1, wherein the lower electrode has a dense floating-point surface structure, and the method further comprises: the number and spacing of the holes in each row are the same.
6. The method of claim 1, wherein the lower electrode has a dense floating-point surface structure, and the method further comprises: the thermal spraying is atmospheric plasma spraying or suspension plasma spraying.
7. The method of claim 1, wherein the lower electrode has a dense floating-point surface structure, and the method further comprises: each stainless steel sheet is formed by splicing a plurality of small sheets.
CN202111220383.XA 2021-10-20 2021-10-20 Method for manufacturing lower electrode with compact floating point surface structure Active CN113917720B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111220383.XA CN113917720B (en) 2021-10-20 2021-10-20 Method for manufacturing lower electrode with compact floating point surface structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111220383.XA CN113917720B (en) 2021-10-20 2021-10-20 Method for manufacturing lower electrode with compact floating point surface structure

Publications (2)

Publication Number Publication Date
CN113917720A CN113917720A (en) 2022-01-11
CN113917720B true CN113917720B (en) 2022-07-05

Family

ID=79241764

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111220383.XA Active CN113917720B (en) 2021-10-20 2021-10-20 Method for manufacturing lower electrode with compact floating point surface structure

Country Status (1)

Country Link
CN (1) CN113917720B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103149751A (en) * 2013-02-19 2013-06-12 北京京东方光电科技有限公司 Lower part electrode and manufacturing method thereof
CN203084388U (en) * 2013-02-19 2013-07-24 北京京东方光电科技有限公司 Lower part electrode
CN103811332A (en) * 2014-02-14 2014-05-21 北京京东方显示技术有限公司 Lower electrode base platform of dry etching device and dry etching device
CN106094269A (en) * 2016-06-20 2016-11-09 京东方科技集团股份有限公司 A kind of etching device
CN109082623A (en) * 2018-07-27 2018-12-25 芜湖通潮精密机械股份有限公司 A kind of production method of dry etching lower electrode surface salient point

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103149751A (en) * 2013-02-19 2013-06-12 北京京东方光电科技有限公司 Lower part electrode and manufacturing method thereof
CN203084388U (en) * 2013-02-19 2013-07-24 北京京东方光电科技有限公司 Lower part electrode
CN103811332A (en) * 2014-02-14 2014-05-21 北京京东方显示技术有限公司 Lower electrode base platform of dry etching device and dry etching device
CN106094269A (en) * 2016-06-20 2016-11-09 京东方科技集团股份有限公司 A kind of etching device
CN109082623A (en) * 2018-07-27 2018-12-25 芜湖通潮精密机械股份有限公司 A kind of production method of dry etching lower electrode surface salient point

Also Published As

Publication number Publication date
CN113917720A (en) 2022-01-11

Similar Documents

Publication Publication Date Title
CN109207919B (en) Vapor deposition mask, vapor deposition mask device, method for manufacturing vapor deposition mask, and method for manufacturing vapor deposition mask device
CN103451598A (en) Novel fine metal mask plate for producing organic light emitting diode (OLED) display panel and fabrication method of novel fine metal mask plate
KR20200040471A (en) Producing method of mask and producing method of mask integrated frame
CN203559114U (en) Novel fine metal mask for producing OLED (Organic Light Emitting Diode) display panel
KR20200067049A (en) Template for supporting mask, template for supporting mask metal sheet, producing method of template for supporting mask and producing method of mask integrated frame
KR20200061277A (en) Template for supporting mask and producing methoe thereof and producing method of mask integrated frame
CN111218644A (en) Method for manufacturing frame-integrated mask and method for separating/replacing mask of frame-integrated mask
CN113917720B (en) Method for manufacturing lower electrode with compact floating point surface structure
JP2002371349A (en) Mask for vapor deposition
KR102138801B1 (en) Producing method of template for supporting mask and producing method of mask integrated frame
KR20200010856A (en) Mask for forming oled picture element and producing method of mask integrated frame
CN103149751A (en) Lower part electrode and manufacturing method thereof
KR20190114943A (en) Mask integrated frame and producing method of mask integrated frame
JP5256543B2 (en) Ceramic substrate for chip component and method for manufacturing chip component
KR20190105977A (en) Producing method of mask integrated frame
KR20200044747A (en) Producing method of mask and producing method of mask integrated frame
KR102254375B1 (en) Producing method of mask integrated frame
CN108551723B (en) Partitioned seamless laser processing method of circuit board for thick gas electron multiplier
KR20200006351A (en) Producing method of mask
KR20190141965A (en) Producing method of mask
TW202020193A (en) Transfer system of mask and producing method of mask integrated frame
KR20200009785A (en) Producing method of mask integrated frame
KR100326454B1 (en) Flat panel display with manufacturing method and flattened spacer of flat panel display
KR20200006485A (en) Producing method of mask and mask
KR102633781B1 (en) Mask integrated frame and producing method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant