CN103123949A - Flexible light emitting diode package structure and manufacturing method thereof - Google Patents
Flexible light emitting diode package structure and manufacturing method thereof Download PDFInfo
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- CN103123949A CN103123949A CN2011103707542A CN201110370754A CN103123949A CN 103123949 A CN103123949 A CN 103123949A CN 2011103707542 A CN2011103707542 A CN 2011103707542A CN 201110370754 A CN201110370754 A CN 201110370754A CN 103123949 A CN103123949 A CN 103123949A
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Abstract
Disclosed is a flexible light emitting diode package structure. The flexible light emitting diode package structure comprises a flexible substrate and a light emitting diode chip which is arranged on the flexible substrate. The flexible substrate comprises a soft substrate and a hard substrate. The hard substrate comprises a top surface, a bottom surface and side surfaces, the bottom surface is opposite to the top surface, and the top surface and the bottom surface are connected by the side surfaces. The light emitting diode chip is disposed on the top surface of the hard substrate, the soft substrate is connected with the side surfaces of the hard substrate in a surrounding mode, and the bottom surface of the hard substrate is exposed out of the soft substrate. The heat dissipation efficiency of the flexible light emitting diode package structure is high. The invention further provides a manufacturing method of the flexible light emitting diode package structure.
Description
Technical field
The present invention relates to a kind of package structure for LED and manufacture method thereof, particularly a kind of flexible light emitting diode (LED) encapsulating structure and manufacture method thereof.
Background technology
Light-emitting diode is a kind of energy-saving and environmental protection, long-life solid light source, and therefore always very active to the research of LED technology in recent ten years, light-emitting diode also has the trend of conventional light source such as gradually replacing fluorescent lamp, incandescent lamp.
According to actual needs, often can use bendable package structure for LED in illuminating product.Existing flexible light emitting diode (LED) encapsulating structure often will coat by flexible base plate with the light-emitting diode chip for backlight unit of rigid substrate, only exposes light-emitting diode chip for backlight unit, then by the hyaline layer covering luminousing diode chip, reaches the effect of flexible.Adopt such structural design, package structure for LED has hyaline layer, LED core sheet, rigid substrate and flexible base plate in vertical direction, the caloric requirement that light-emitting diode chip for backlight unit produces can be delivered to the outside through rigid substrate plate and flexible base plate double-layer structure, heat is difficult to effectively derive from the bottom of package structure for LED, thereby causes radiating efficiency poor.
Summary of the invention
In view of this, be necessary the flexible light emitting diode (LED) encapsulating structure and the manufacture method thereof that provide a kind of radiating efficiency higher.
A kind of flexible light emitting diode (LED) encapsulating structure, it comprises bendable substrate and is arranged on light-emitting diode chip for backlight unit on this bendable substrate.Described bendable substrate comprises a flexible base plate and a rigid substrate.Described rigid substrate comprises an end face, the bottom surface relative with described end face and the side surface that connects this end face and bottom surface.Described light-emitting diode chip for backlight unit is arranged on the end face of rigid substrate, and described flexible base plate encloses and is connected on the rigid substrate side surface, and the bottom surface of rigid substrate is exposed to outside flexible base plate.
A kind of manufacture method of flexible light emitting diode (LED) encapsulating structure, the method comprise following step:
Step 1, one temporary base is provided, at least one rigid substrate is set on this temporary base, and this rigid substrate comprises an end face, the bottom surface relative with described end face and the side surface that connects this end face and bottom surface, and the bottom surface of described rigid substrate is arranged on temporary base;
Step 2 arranges flexible base plate on temporary base, this flexible base plate encloses and is connected on the rigid substrate side surface;
Step 4 is removed temporary base.
In above-mentioned flexible light emitting diode (LED) encapsulating structure and manufacture method thereof, flexible base plate encloses and is connected on the rigid substrate side surface, and the bottom surface of rigid substrate is exposed to outside flexible base plate, thereby make the heat that light-emitting diode chip for backlight unit produces directly to be delivered to the outside by rigid substrate, heat transmit the route of process shorter, radiating efficiency is higher.
Description of drawings
Fig. 1 is the flexible light emitting diode (LED) encapsulating structure schematic diagram in first embodiment of the invention.
Fig. 2 is the flexible light emitting diode (LED) encapsulating structure schematic diagram in second embodiment of the invention.
Fig. 3 is the manufacture method flow chart of the flexible light emitting diode (LED) encapsulating structure in first embodiment of the invention.
Fig. 4 is the manufacture method flow chart of the flexible light emitting diode (LED) encapsulating structure in second embodiment of the invention.
The main element symbol description
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10、 |
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20、 |
| Light-emitting diode chip for |
30、 |
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40、 400 |
| The |
50 |
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60 |
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11、 |
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12、 |
| Electrode | 121 |
| Accommodating |
51 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
Execution mode one
See also Fig. 1, a kind of flexible light emitting diode (LED) encapsulating structure that first embodiment of the invention provides comprises bendable substrate 10, is arranged on two conductive electrodes 20 on this bendable substrate 10, the transparent covering layer 40 that is arranged on the light-emitting diode chip for backlight unit 30 on bendable substrate 10 and coats this light-emitting diode chip for backlight unit 30.
Described bendable substrate 10 is a slab construction, and it comprises that a flexible base plate 11 and a thickness are greater than the rigid substrate 12 of this flexible base plate 11.This rigid substrate 12 comprises an end face, a bottom surface relative with described end face and the side surface that connects this end face and bottom surface, this flexible base plate 11 encloses and is connected on rigid substrate 12 side surfaces, and the bottom surface of rigid substrate 12 flushes with the bottom surface of flexible base plate 11.Flexible base plate 11 is made of insulating material, and in the present embodiment, flexible base plate 11 adopts silicones or epoxide resin material to consist of.Be respectively arranged with two electrodes 121 on the top of rigid substrate 12, and these two electrodes 121 expose from end face and the side surface of rigid substrate 12 respectively.Rigid substrate 12 is made of the high heat conductive insulating material, and in the present embodiment, rigid substrate 12 adopts pottery, silicon or plastic material to consist of.
What can expect is, in order to dwindle further the volume of flexible light emitting diode (LED) encapsulating structure, the bottom surface that can make described flexible base plate to the distance of the end face of rigid substrate less than or equal to the bottom surface of the described rigid substrate distance to the end face of rigid substrate, that is the bottom surface that the bottom surface of rigid substrate 12 flushes with the bottom surface of flexible base plate 11 or flexible base plate 11 is given prominence in the bottom surface of rigid substrate 12.
Described two conductive electrodes 20 are arranged on flexible base plate 11, and the part of exposing on the side surface of rigid substrate 12 with two electrodes 121 respectively is electrically connected.Conductive electrode 20 also can be the conducting resinl that is coated on flexible base plate 11, and this conducting resinl includes epoxy resin and silver.The hardness of rigid substrate 12 is greater than the hardness of flexible base plate 11 and this conductive electrode 20.
Described light-emitting diode chip for backlight unit 30 is arranged on the end face of rigid substrate 12, and is electrically connected with the end come out in electrode 121 tops.
Described transparent covering layer 40 covers on the surface of bendable substrate 10, and conductive electrode 20 and light-emitting diode chip for backlight unit 30 are all coated.Be understandable that, also can include fluorescent material in described transparent covering layer 40.
In use, because light-emitting diode chip for backlight unit 30 is arranged on rigid substrate 12, can avoid when bending light-emitting diode chip for backlight unit 30 occur breaking, and the bottom surface of rigid substrate 12 is exposed to outside flexible base plate 11, thereby the heat that light-emitting diode chip for backlight unit 30 produces can directly be delivered to the outside by rigid substrate 12, heat transmit the route of process shorter, radiating efficiency is higher.In addition, because the bottom surface of rigid substrate 12 flushes with the bottom surface of flexible base plate 11, also can make more thinning of package structure for LED.
Execution mode two
see also Fig. 2, the schematic diagram of the flexible light emitting diode (LED) encapsulating structure that it provides for second embodiment of the invention, the difference of the flexible light emitting diode (LED) encapsulating structure of this second execution mode and the flexible light emitting diode (LED) encapsulating structure of the first execution mode is: the flexible light emitting diode (LED) encapsulating structure of the second execution mode comprises that also one is arranged on the reflector structure 50 on bendable substrate 10, this reflector structure 50 is offered from end face along the bottom surface direction and is formed an accommodating cup 51, the inner surface of this accommodating cup 51 is the inclined plane, the end face of this inclined plane self-reflection cup structure 50 extends and radially sloping inwardly along accommodating cup 51 to the bottom surface direction, make whole accommodating cup 51 wide at the top and narrow at the bottom, be a funnel-form.Accommodating cup 51 inner surfaces also are coated with reflectorized material.Light-emitting diode chip for backlight unit 30 is contained in this accommodating cup 51, and transparent covering layer 40 covers in the open top of accommodating cup 51.
Be understandable that, can also be filled with encapsulating material in accommodating cup 51, contain fluorescent material in this encapsulating material.
See also Fig. 3, the flow chart of the manufacture method of a kind of flexible light emitting diode (LED) encapsulating structure that it provides for first embodiment of the invention, the manufacture method of this flexible light emitting diode (LED) encapsulating structure comprises following step:
Step 1, one temporary base 60 is provided, a plurality of rigid substrates 12 are set on this temporary base 60, described rigid substrate 12 comprises an end face, the bottom surface relative with described end face and the side surface that connects this end face and bottom surface, be respectively arranged with two electrodes 121 on the end face of each rigid substrate 12, and these two electrodes 121 expose from the side surface of rigid substrate 12 respectively, and the bottom surface of each rigid substrate 12 is arranged on temporary base 60.Rigid substrate 12 is made of the high heat conductive insulating material, and in the present embodiment, rigid substrate 12 adopts pottery, silicon or plastic material to consist of.
Step 2 arranges flexible base plate 11 on temporary base 60, this flexible base plate 11 encloses and is connected on rigid substrate 12 side surfaces.Flexible base plate 11 is made of insulating material, and in the present embodiment, flexible base plate 11 adopts silicones or epoxide resin material to consist of.
Step 4 is separately positioned on a plurality of light-emitting diode chip for backlight unit 30 on the end face of rigid substrate 12, and is electrically connected with the electrode 121 of rigid substrate 12.
Step 5 covers a transparent covering layer 40 on conductive electrode 20 and light-emitting diode chip for backlight unit 30.Be understandable that, also can include fluorescent material in described transparent covering layer 40.
Step 6 is removed temporary base 60, then cuts, and forms a plurality of package structure for LED.
See also Fig. 4, the flow chart of the manufacture method of a kind of flexible light emitting diode (LED) encapsulating structure that it provides for second embodiment of the invention, the manufacture method of this flexible light emitting diode (LED) encapsulating structure comprises following step:
Step 1, one temporary base 60 is provided, a plurality of rigid substrates 12 are set on this temporary base 60, described rigid substrate 12 comprises an end face, the bottom surface relative with described end face and the side surface that connects this end face and bottom surface, be respectively arranged with two electrodes 121 on the end face of each rigid substrate 12, and these two electrodes 121 expose from the side surface of rigid substrate 12 respectively, and the bottom surface of each rigid substrate 12 is arranged on temporary base 60.Rigid substrate 12 is made of the high heat conductive insulating material, and in the present embodiment, rigid substrate 12 adopts pottery, silicon or plastic material to consist of.
Step 2 arranges flexible base plate 11 on temporary base 60, this flexible base plate 11 encloses and is connected on rigid substrate 12 side surfaces.Flexible base plate 11 is made of insulating material, and in the present embodiment, flexible base plate 11 adopts silicones or epoxide resin material to consist of.
Step 4 arranges reflector structure 50 on flexible base plate 11, this reflector structure 50 is offered from end face along the bottom surface direction and formed a plurality of accommodating cups 51, and a plurality of rigid substrates 12 are contained in respectively in each accommodating cup 51.Inner surface of this accommodating cup 51 is the inclined plane, and the end face of this inclined plane self-reflection cup structure 50 extends and along radially the sloping inwardly of accommodating cup 51, makes whole accommodating cup 51 wide at the top and narrow at the bottom to the bottom surface direction, is a funnel-form.Accommodating cup 51 inner surfaces also are coated with reflectorized material.
Step 5 is separately positioned on a plurality of light-emitting diode chip for backlight unit 30 on the end face of each rigid substrate 12, and is electrically connected with the electrode 121 of rigid substrate 12.
Step 6 covers a transparent covering layer 40 in the open top of accommodating cup 51.
Step 7 is removed temporary base 60, then cuts, and forms a plurality of package structure for LED.
Compared to prior art, in flexible light emitting diode (LED) encapsulating structure of the present invention and manufacture method thereof, flexible base plate encloses and is connected on the rigid substrate side surface, and the bottom surface of rigid substrate is exposed to outside flexible base plate, thereby make the heat that light-emitting diode chip for backlight unit produces directly to be delivered to the outside by rigid substrate, heat transmit the route of process shorter, radiating efficiency is higher.
Be understandable that, for the person of ordinary skill of the art, can make change and the distortion that other various pictures are answered by technical conceive according to the present invention, and all these change and distortion all should belong to the protection range of claim of the present invention.
Claims (10)
1. flexible light emitting diode (LED) encapsulating structure, it comprises bendable substrate and is arranged on light-emitting diode chip for backlight unit on this bendable substrate, it is characterized in that: described bendable substrate comprises a flexible base plate and a rigid substrate, described rigid substrate comprises an end face, the bottom surface relative with described end face and the side surface that connects this end face and bottom surface, described light-emitting diode chip for backlight unit is arranged on the end face of rigid substrate, described flexible base plate encloses and is connected on the rigid substrate side surface, and the bottom surface of rigid substrate is exposed to outside flexible base plate.
2. flexible light emitting diode (LED) encapsulating structure as claimed in claim 1 is characterized in that: the bottom surface of described flexible base plate to the distance of the end face of rigid substrate less than or equal to the bottom surface of the described rigid substrate distance to the end face of rigid substrate.
3. flexible light emitting diode (LED) encapsulating structure as claimed in claim 1, it is characterized in that: the bottom surface of described rigid substrate flushes with the bottom surface of described flexible base plate.
4. flexible light emitting diode (LED) encapsulating structure as claimed in claim 1, it is characterized in that: the end face of described rigid substrate is respectively arranged with two electrodes, and these two electrodes expose from end face and the side surface of rigid substrate respectively, described light-emitting diode chip for backlight unit and described two electrodes are electrically connected in the part that the end face of rigid substrate exposes, also be provided with two conductive electrodes on described flexible base plate, this conductive electrode is electrically connected in the part that the side surface of rigid substrate exposes with two electrodes respectively.
5. flexible light emitting diode (LED) encapsulating structure as claimed in claim 4, it is characterized in that: described flexible light emitting diode (LED) encapsulating structure also comprises a transparent covering layer, and described transparent covering layer covers on conductive electrode and light-emitting diode chip for backlight unit.
6. flexible light emitting diode (LED) encapsulating structure as claimed in claim 5, it is characterized in that: described flexible light emitting diode (LED) encapsulating structure also comprises a reflector structure, this reflector structure is offered from end face along the bottom surface direction and is formed an accommodating cup, light-emitting diode chip for backlight unit is contained in this accommodating cup, and transparent covering layer covers in the open top of accommodating cup.
7. the manufacture method of a flexible light emitting diode (LED) encapsulating structure, the method comprises following step:
Step 1, one temporary base is provided, at least one rigid substrate is set on this temporary base, and this rigid substrate comprises an end face, the bottom surface relative with described end face and the side surface that connects this end face and bottom surface, and the bottom surface of described rigid substrate is arranged on temporary base;
Step 2 arranges flexible base plate on temporary base, this flexible base plate encloses and is connected on the rigid substrate side surface;
Step 3 is arranged at least one light-emitting diode chip for backlight unit on the end face of rigid substrate; And
Step 4 is removed temporary base.
8. the manufacture method of flexible light emitting diode (LED) encapsulating structure as claimed in claim 7, it is characterized in that: be respectively arranged with two electrodes on the end face of each rigid substrate, and these two electrodes expose from the side surface of rigid substrate respectively, also be included in after step 2 conductive electrode is set on flexible base plate, the step that the part that this conductive electrode exposes on the side surface of rigid substrate with two electrodes respectively is electrically connected.
9. the manufacture method of flexible light emitting diode (LED) encapsulating structure as claimed in claim 8, is characterized in that: also comprise the step that a transparent covering layer is covered conductive electrode and light-emitting diode chip for backlight unit after step 3.
10. the manufacture method of flexible light emitting diode (LED) encapsulating structure as claimed in claim 9, it is characterized in that: also be provided with the reflector structure on described flexible base plate, this reflector structure is offered from end face along the bottom surface direction and is formed a plurality of accommodating cups, a plurality of rigid substrates are contained in respectively in each accommodating cup, and transparent covering layer covers in the open top of accommodating cup.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103707542A CN103123949A (en) | 2011-11-21 | 2011-11-21 | Flexible light emitting diode package structure and manufacturing method thereof |
| TW100143865A TWI460890B (en) | 2011-11-21 | 2011-11-30 | Led package structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103707542A CN103123949A (en) | 2011-11-21 | 2011-11-21 | Flexible light emitting diode package structure and manufacturing method thereof |
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| CN103123949A true CN103123949A (en) | 2013-05-29 |
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| CN2011103707542A Pending CN103123949A (en) | 2011-11-21 | 2011-11-21 | Flexible light emitting diode package structure and manufacturing method thereof |
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| CN (1) | CN103123949A (en) |
| TW (1) | TWI460890B (en) |
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|---|---|
| TWI460890B (en) | 2014-11-11 |
| TW201322497A (en) | 2013-06-01 |
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Application publication date: 20130529 |