CN101015071A - Light emitting diode package having multiple molding resins - Google Patents
Light emitting diode package having multiple molding resins Download PDFInfo
- Publication number
- CN101015071A CN101015071A CNA2005800301008A CN200580030100A CN101015071A CN 101015071 A CN101015071 A CN 101015071A CN A2005800301008 A CNA2005800301008 A CN A2005800301008A CN 200580030100 A CN200580030100 A CN 200580030100A CN 101015071 A CN101015071 A CN 101015071A
- Authority
- CN
- China
- Prior art keywords
- fin
- led
- resin
- model resin
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals. At least portions of the pair of lead terminals are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding resin covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented.
Description
Technical field
The present invention is about having the LED package of model resin, and particular words about a kind of LED package.Wherein a LED crystal particle has than the model resin of soft with one and covers and another model resin of high rigidity covers to alleviate the distortion that puts on the stress on this LED crystal particle and prevent the upper surface of this model resin with having more then.
Background technology
In general, light-emitting diode (LED) encapsulation comprises and is used to cover the model resin of LED crystal grain after installing.This model resin protects this LED crystal grain not to be subjected to external environment influence.Meaning promptly, this model resin is protected this LED crystal grain and bonding wire not influenced by external force and is prevented that by stoping from the moisture of atmosphere LED crystal grain from damaging.In addition, the model resin can contain the phosphor that can change from this LED crystal grain wavelength of light emitted.As a result, use the LED crystal grain of emission ultraviolet light or blue light can obtain white light.
In addition, when LED crystal grain is luminous, produce heat.This heat is passed on around LED crystal grain.Therefore, owing to the running that repeats of this LED crystal grain, the model resin that covers LED crystal grain experiences a thermal cycle.Have under the situation of higher hardness at this model resin, this model resin can break or peel off during this thermal cycle.In addition, owing to the thermal stress that is produced by the different of the thermal coefficient of expansion of this model resin and LED crystal grain, LED crystal grain can damage or bonding wire can disconnect.Breaking and peeling off of model resin causes light emitted heterogeneity and worsened water proofing property.In addition, under the situation that this model resin is formed by thermoplastic resin, the residual stress after solidifying is very big, so the problems referred to above can be more serious.
Be called in name in No. the 6th, 747,293, United States Patent (USP) people such as () Nitta of " light-emitting device (Light emitting device) " and disclosed a kind of LED that breaks and peel off encapsulation that can stop the model resin owing to thermal cycle.Fig. 1 is for being illustrated in the cutaway view of the LED encapsulation 500 that discloses in No. 293 patent of above-mentioned '.
Referring to Fig. 1, LED encapsulation 500 comprises that the outer lead terminal 501 and 502 that is formed into a lead frame reaches the main body 503 that forms with lead terminal.Main body 503 is made by thermoplastic resin. Place lead terminal 501 and 502 make one end towards each other and its other end opposite outside extension and autonomous agent 503 project on oppositely.
Simultaneously, main body 503 has an opening 505 and a LED crystal grain 506 is installed on the lower surface of this opening.Can use a conductibility bonding agent 507 that LED crystal grain 506 is attached on the lead terminal 501, and be connected to another lead terminal 502 via a bonding wire 509.Opening 505 has a tilt internal wall 504 makes the light of LED crystal grain 506 emissions can be reflected onto the outside.
Sealing resin 511 places in the opening 505 in the mode at the top of covering LED crystal grain 506.Sealing resin 511 is poly-silica resin, and it has the high relatively hardness in the JISA 50 to 90 of Japanese Industrial Standards (JIS).The top that one lens 513 is provided in sealing resin 511 is to collect light.
The hardness of the sealing resin 511 of LED encapsulation 500 is compared low and so can be prevented breaking or peeling off of sealing resin with having in the epoxy resin of the hardness of JISA 95.In addition because the hardness of the sealing resin 511 of LED encapsulation 500 with have compare in the poly-silica resin of the hardness of JISA 30 to 40 higher, so external force is less to the influence of LED crystal grain 506.Yet, have relative higher hardness because the sealing resin 511 of LED encapsulation 500 is compared with poly-silica resin, so it can cause the residual stress of relatively large amount when cured.In addition, produce higher relatively thermal stress owing to thermal cycle.Specific, under the situation that the size of opening or input power increase, above-mentioned stress further increases, thereby has reduced the reliability of LED crystal grain 506 and caused that bonding wire 507 disconnects.
Simultaneously, the luminous power of LED (luminous power) is proportional with input power substantially.Therefore, can obtain high luminous power by the electrical power input that increases to LED.Yet, increase the increase that connects surface temperature that input power can cause LED.The increase that connects surface temperature of LED can cause the loss of the luminous efficiency (photometric efficiency) of representing intake to change into the conversion ratio of visible light.Therefore, need prevent the rising that connects surface temperature of the LED that causes owing to the increase of input power.
The United States Patent (USP) the 6th, 274 that is called " but mounted on surface LED encapsulation (Surface mountable LED package) " in name has disclosed a kind of fin that adopts in 924B1 number and has connect the example of the LED encapsulation that surface temperature rises to prevent LED.Such as in the patent of ' 924 announcement, therefore this LED crystal grain heat be coupled on the fin can remain in the lower surface temperature that connects.Therefore, higher relatively input power can be supplied to this LED crystal grain to obtain higher luminous power.
Yet, in this existing LED encapsulation, fin can be easily from encapsulate body portion from, this can cause structural instability.When fin separates with package main body, the LED crystal grain that is installed on the fin is cut off with the bonding wire that lead-in wire is electrically connected, thereby brings irremediable damage for this LED encapsulation.Therefore, need provide a kind of LED encapsulation that prevents that fin from separating with package main body.
Summary of the invention
Design the present invention is to solve the problems referred to above in this technology.A target of the present invention is for providing a kind of LED package.Wherein can protect LED crystal particle not to be subjected to influence, can alleviate the stress that puts on the LED crystal particle such as the surrounding environment of external force and moisture, and in classification or can prevent the distortion of model resin during assembling the processing procedure of this LED encapsulation.
Another target of the present invention is for providing a kind of LED package.Wherein adopt fin to be dissipated to the outside and can to prevent that also fin from separating with package main body with the heat that reposefully LED crystal particle is produced.
According to an aspect of the present invention that is used to solve the problems of the technologies described above, provide a kind of LED package of tool multiple molding resins.This LED package comprises the pair of lead wires terminal.This is partially submerged in the package main body at least to lead terminal.This package main body has an opening, exposes this to the open air to lead terminal via this opening.One LED crystal particle is placed in this opening and is electrically connected to this to lead terminal.The first model resin covers this LED crystal particle.In addition, compare the second model resin with this first model resin and cover this first model resin with higher hardness.Therefore, this first model resin can be used for alleviating the stress that puts on this light-emitting diode, and can prevent that this second model resin is subjected to external force and is out of shape.
This first model resin can have less than desolate formula hardometer (DurometerShore) value of 50 dusts (angstom) and this second model resin can have the desolate formula durometer value that is not less than 50 dusts.
First and second model resin can be formed by epoxy resin or poly-silica resin.In addition, the one at least of first and second model resin can contain phosphor.
In addition, this first model resin can be thicker relatively than this second model resin.As a result, can further reduce the stress that puts on the LED crystal particle under this first model resin.
One fin can be coupled to the bottom of this package main body.This fin exposes to the open air via this opening portion ground.LED crystal particle is installed on the upper surface that exposes to the open air of fin.Therefore, the heat of LED crystal particle generation can be dissipated to the outside reposefully via fin.
Fin can have a substrate and reach the protuberance that projects upwards from a core of this substrate.Therefore, can not increase surface for heat dissipation because do not need to increase the size of LED package, so can improve heat dissipation efficiency.
Fin can be formed with the locking step (latching step) at least one side of this substrate and/or this protuberance.This locking step is coupled to this package main body to be separated with this package main body to prevent fin.
According to another aspect of the present invention, provide a kind of LED package of tool multiple molding resins.This encapsulation comprises a fin support ring.One fin is fitted into this support ring.At least two lead terminals and this support ring and fin are spaced apart, and place the two opposite sides of this support ring.With package main body and fin and lead terminal model together to support fin and lead terminal.This package main body has an opening, exposes the upper end of fin and the part of lead terminal to the open air via this opening.At least one LED crystal particle is installed on the upper surface of fin.Bonding wire is used for LED crystal particle and lead terminal are electrically connected to each other.The first model resin covers LED crystal particle, and the second model resin covers the first model resin.The second model resin is than the first model resin hardness height.Therefore, the first model resin has alleviated the stress that puts on the LED crystal particle, and has prevented that the second model resin is subjected to external force and is out of shape.In addition, because fin is assembled and is fixed to this support ring, separate with this package main body so can prevent fin.
This first model resin can have less than the desolate formula durometer value of 50 dusts and this second model resin can have the desolate formula durometer value that is not less than 50 dusts.
This first and this second model resin can form by epoxy resin or poly-silica resin.In addition, the one at least of first and second model resin can contain phosphor.
In addition, the first model resin can be thicker relatively than the second model resin.As a result, can further reduce the stress that puts on the LED crystal particle under this first model resin.
Simultaneously, fin can have a substrate and reach the protuberance that projects upwards from the center of this substrate, and this protuberance inserts this support ring.
This fin can be formed with a support ring receiving slit in a side of this protuberance.Support ring can be anchored in this receiving slit.Therefore, can prevent further that fin from separating with this package main body.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Fig. 1 is the cutaway view of explanation one existing LED package.
Fig. 2 is the cutaway view of explanation according to the LED package of one embodiment of the invention.
Fig. 3 is the cutaway view of explanation LED package according to another embodiment of the present invention.
Fig. 4 to Figure 12 makes the method for above-mentioned LED package according to the LED package and of one embodiment of the invention explanation employing one fin.
Figure 13 to Figure 26 illustrates the LED package of employing one fin and the method for the above-mentioned LED package of a manufacturing according to another embodiment of the present invention.
10,50,500: LED package
11,13,51,140,217a, 217b, 217c, 219a, 219b, 219c, 501,502: lead terminal
14,54,163,504: inwall
15,55,230,230a, 503: package main body
17,57,160,240,241,241a, 243,245,506:LED crystal grain
19,59,507: bonding agent
21,61,62,162: bonding wire 23,63,165: the first model resins
25,65,167: the second model resins 26,66,50: opening
27,67,166,250,513: lens 56,153,220: fin
101: lead-in wire panel 141: connecting frame
142,215a, 215b: supporting wire 144: hollow space
151: the second case for packaging of 150: the first case for packaging
152: connecting frame accommodating groove 154,223: protuberance
154a: locking step 155,158: through hole
156:LED assembled portion 159,159a, 159b: step part
210: lead frame 211: external frame
213: support ring 216a, 216b: the support ring of cutting
221: substrate 223a: the support ring accommodating groove
511: sealing resin
Embodiment
Fig. 2 is the cutaway view of explanation according to the LED package 10 of one embodiment of the invention.
Referring to Fig. 2, light-emitting diode (LED) encapsulation 10 comprises pair of lead wires terminal 11 and 13 and one package main body 15 that is formed into outside the lead frame.Main body 15 can use the embedding molding manufacture procedure to be formed by thermoplastic resin or thermosetting resin.Generally speaking, in order to produce LED encapsulation 10 in batches, be arranged with therein in the lead-in wire panel of most lead frames and form most package main body 15.After model resin (23,25 or 27) solidifies, lead frame is cut into other LED encapsulation 10, and therefore lead terminal 11 and 13 forms.Place lead terminal 11 with 13 so that the one end close towards each other and its other end extend in the opposite direction and project to the outside from main body 15.
One LED crystal grain 17 is installed on the lower surface of opening 26.As shown in the figure, can use a conductibility bonding agent 19 that LED crystal grain 17 is attached to a lead terminal 11.This conductibility bonding agent can comprise silver (Ag) epoxy resin.In addition, LED crystal grain 17 can be connected to another lead terminal 13 via a bonding wire 21.Therefore, LED crystal grain 17 is electrically connected with 13 with lead terminal 11.
Simultaneously, the first model resin 23 covers LED crystal grain 17.The first model resin 23 also can cover bonding wire 21.The first model resin 23 has relatively low hardness, anticipates promptly, and its desolate formula durometer value is preferable less than 50 dusts and better 10 dusts that are not more than.The first model resin 23 can be formed by epoxy resin or poly-silica resin.As shown in this figure, the first model resin 23 can cover LED crystal grain 17 and bonding wire 21, and is incorporated in to the inwall of main body 15.Perhaps, the first model resin 23 can cover LED crystal grain 17 but not extend to the inwall of package main body 15.Anticipate promptly, the first model resin can be restricted to the specific region in this opening.
In addition, the second model resin 25 covers the first model resin 23.The second model resin 25 is packed in the opening 26 and is bonded to the inwall 14 of opening 26.The upper surface of the second model resin 25 can be flat or with the constant curvature bending.The second model resin 25 is preferable to have than the first model resin, 23 relative higher hardness, meaning promptly, its desolate formula durometer value is at least 50 dusts.In addition, another model resin (not shown) can be between the first model resin 23 and the second model resin 25.The second model resin 25 can be formed by epoxy resin or poly-silica resin.The second model resin 25 and this another model resin can be by forming with the first model resin, 23 identical materials.For example, under the situation of the first model resin 23 for poly-silica resin, the second model resin 25 also is poly-silica resin.If the first model resin 23 and the second model resin 25 are formed by same material, then can reduce the light loss that causes owing to the reflection on the interface between first and second model resin, and increase cementability between these model resins to improve its water proofing property.In addition, the first model resin 23 can be thicker than the second model resin 25.Herein, first and second model resin 23 and 25 thickness are defined as in vertical direction the value that measures from the upper surface of LED crystal grain 17.Because have thicker than the first model resin, 23 to the second model resins 25 of soft, so can minimize the stress that puts on the LED crystal grain 17.
Can use a moulding cup or dispensing device or use a transfer model processing procedure to make first and second model resin 23 and 25 moulding.
In addition, United States Patent (USP) the 6th, 274 has proposed the LED encapsulation that model resin that a kind of use has the desolate formula durometer value that is no more than 10 dusts is protected LED crystal grain for No. 924.The encapsulation that proposes in ' 924 patents has advantage, because can use the model resin with relatively low hardness to alleviate thermal stress.Yet the model resin with soft can be easy to be subjected to external force and be out of shape.
Generally speaking, after LED encapsulation internal shaping, as mentioned above lead frame is cut into other individual packages at the model resin.Then, independently encapsulation of classification or assembling.At this moment, having model resin than soft may be subjected to external force and be out of shape.In detail, the distortion of the upper surface of model resin has hindered the even emission of the light that LED crystal grain produced.
On the contrary, in this embodiment of the present invention, the second model resin 25 with higher relatively hardness covers the top of the first model resin 23.Therefore, can prevent the distortion of the upper surface of this model resin.In addition, because the first model resin 23 with relatively low hardness can alleviate thermal stress and residual stress in the model resin between the second model resin 25 and LED crystal grain 17.This stress alleviates and causes preventing that model resin 23 and 25 from breaking and peel off.Therefore, can prevent moisture penetration, improve the reliability of LED encapsulation by this.
In addition, the first model resin 23 and/or the second model resin 25 can contain phosphor.This phosphor can be used for changing LED crystal grain institute wavelength of light emitted.In addition, lens 25 can be provided on the second model resin 25.The light that lens 27 are used to allow LED crystal grain 17 to be launched sends with desired visual angle.Perhaps, the second model resin 25 can be made into the form of lens, for example makes semicircle or Fresnel (Fresnel) lens type.
Fig. 3 is the cutaway view of explanation LED encapsulation 50 according to another embodiment of the present invention.
Referring to Fig. 3, LED encapsulation 50 comprises pair of lead wires terminal 51 and 53, main body 55, LED crystal grain 57, conductibility bonding agent 59, the first model resin 63 and the second model resin, and it is with similar with reference to the description of figure 2.Similarly, main body 55 has an opening 66, and its inwall 54 can be inclination.
In addition, LED encapsulation 50 comprises that one is connected to the heat-conducting block or the fin 56 of the lower part of main body 55.As shown in this figure, fin 56 parts expose to the open air via opening 66, and LED crystal grain 57 is installed on the upper surface that exposes fin 56 to the open air.Fin can have the protuberance that a substrate and projects upwards from a core of this substrate.This protuberance is exposed to the outside via opening 66.In addition, fin 56 has more large-area mode configuration with its lower surface than the upper surface that exposes to the open air, to be easy to that heat is dissipated to the outside.
In this embodiment, fin 56 heat that LED crystal grain 57 is produced that is used for dissipating easily.Therefore, can further reduce the thermal stress that produces owing to thermal cycle.
Hereinafter, another embodiment of the LED encapsulation of adopting fin will be described in detail.
Fig. 4 to Figure 12 is according to the method that LED encapsulates and the above-mentioned LED of a manufacturing encapsulates of one embodiment of the invention explanation employing one fin, and Figure 13 to Figure 25 illustrates the method that the LED that adopts a fin encapsulates and the above-mentioned LED of a manufacturing encapsulates according to another embodiment of the present invention.
Fig. 4 is for illustrating the plane graph that is used to produce in batches according to the LED encapsulated LED lead-in wire panel of one embodiment of the invention, Fig. 5 illustrates the decomposition diagram of LED encapsulation according to an embodiment of the invention, and Fig. 6 illustrates that LED encapsulation according to an embodiment of the invention has been formed at the plane graph of the state on the LED lead-in wire panel.
Referring to Fig. 4, one is used to make LED encapsulated LED lead-in wire panel 101 of the present invention comprises with the individual lead frames of the majority of arranged at regular intervals.Lead frame comprises lead terminal 140 and with these lead terminals connecting frame 141 connected to one another.Connecting frame 141 is paired to form a symmetrical structure and through being formed with a hollow space 144 that has a reservation shape at the center.
In addition, connecting frame 141 is fixed to an external frame via lead terminal 140 and supporting wire 142.This external frame configuration becomes to surround connecting frame 141.
Adopt hexagonal shape though described the hollow space 144 that forms in the center of symmetrical connecting frame 141 in this embodiment, the present invention is not restricted to this.Hollow space 1 44 can adopt circle or have other polygonal shape of at least four end points.
Referring to Fig. 5, after LED lead-in wire panel 101 formed, the package main body fixed order that will be made up of first and second outer cover 150 and 151 and one fin 153 was to the LED panel 101 that goes between.
Meaning promptly, first case for packaging 150 with reservation shape (such as rectangle) is placed on this top to connecting frame 141, this is integrally formed in the LED lead-in wire panel together with lead terminal 140 connecting frame, and second case for packaging 151 is placed on this bottom to connecting frame 141.
First case for packaging 150 heart therein partly is formed with a sunk part to take in the model resin.In the bottom of first case for packaging 150, form a through hole 158, expose hollow space 144 and each terminal of connecting frame 141 via this through hole to the open air.Through hole 158 can have and the sunk part area identical, and as shown in FIG. less than the area of sunk part.Sunk part and through hole 158 form the opening of package main body.On an inwall of this sunk part, form a step part 159, hold a model resin of LED encapsulation herein, will be described this hereinafter.
Formation one has identical shaped accommodating groove 152 with connecting frame 141 on a upper surface of second case for packaging 151, and forming fin fitting recess 157, one fin, 153 insertions on the lower surface of second case for packaging 151 and be installed in this fin fitting recess 157.
In addition, second case for packaging 151 is formed centrally the protuberance 154 of a manhole 155 to take in fin 153 therein.The upper surface of protuberance 154 can cave in, and it becomes a LED assembled portion 156, again and hereinafter the LED crystal grain of explaining 160 is assembled and is fixed on herein.
First and second case for packaging 150 and 151 can be formed by thermal conductivity plastic material or high thermal conduc tivity ceramics material.The example of thermal conductivity plastic material comprises ABS (acrylonitrile-butadiene-styrene (ABS) (Acrylonitrile Butadiene Styrene)), LCP (liquid crystal polymer (Liquid CrystallinePolymer)), PA (polyamide (Polyamide)), PPS (polyphenylene sulfide (Polyphenylene Sulfide)), TPE (thermoplastic elastomer (Thermoplastic Elastomer)) or the like.The example of high thermal conduc tivity ceramics material comprises Al
2O
3(aluminium oxide), SiC (carborundum), AlN (aluminium nitride) or the like.Aluminium nitride (AlN) has and aluminium oxide (Al
2O
3) identical character and being widely used because it is better than aluminium oxide aspect thermal conductivity.
Under first and second case for packaging 150 and 151 situations that form by the thermal conductivity plastic material, can respectively these outer covers be placed the top of symmetrical connecting frame 141 and bottom and compacting at high temperature so that it is fixed to LED lead-in wire panel 101.Herein, after first and second case for packaging 150 and 151 places on the LED lead-in wire panel 101, can have corresponding to the press members of the protuberance of the shape of through hole 158 and step part 159 to come hot pressing case for packaging 150 and form through hole 158 and step part 159 by use.Perhaps, can use the embedding forming technique to form first and second case for packaging 150 and 151.
Under first and second case for packaging 150 and 151 situations that form by ceramic material, should make first and second case for packaging 150 and 151 in advance and make it have accurate dimensions and shape.Then, will place the top and the below of the connecting frame 141 of LED lead-in wire panel 101, and use the last one bonding agent or analog to secure it to LED lead-in wire panel 101 then by first and second case for packaging 150 and 151 that ceramic material forms.
Referring to Fig. 6, the LED encapsulation is formed in the lead frame, and this lead frame has been formed on the LED lead-in wire panel 101.Therefore, in LED lead-in wire panel 101, form most LED encapsulation.
One or more LED crystal grain 160 is installed on the LED assembled portion 156 at the center that is arranged in fin 153 and via bonding wire 162 crystal grain is connected to connecting frame 141.
For electric protection is installed on LED crystal grain 160 in the LED assembled portion 156, a Zener diode (Zener diode) 161 can be installed.Therefore this Zener diode 161 can keep constant voltage and can protect this LED crystal grain 160 when transmitting static or quick high electric current, improves product reliability by this.
Fig. 7 and Fig. 8 be respectively from the top and beneath according to the perspective view of the LED of this embodiment encapsulation.The cutaway view that Fig. 9 encapsulates for the LED that adopts a fin according to the present invention.Figure 10 is formed at the model resin in the LED encapsulation and the cutaway view of lens to Figure 12 for explanation.
Most LED encapsulation are formed on the LED lead-in wire panel 101, and according to first and second case for packaging 150 and 151 each of the LED encapsulation that forms are cut off LED lead-in wire panel.
Referring to Fig. 7, lead terminal 140 be cut into have the length of wanting and with desired angular bend so that it can be installed on the PCB substrate (not shown).
In addition, as shown in Figure 8, insert fin 153 and secure it to package main body from the below of second case for packaging 151.At this moment, fin 153 can be given prominence to the lower surface of crossing second case for packaging 151 downwards.Therefore, the surface of outstanding fin 140 is directly contacted downwards with the PCB substrate, thus the maximum thermal effect.
Referring to Fig. 9, in an inner space of first case for packaging 150, form two step part 159a and 159b.These step parts serve as a fixing step when forming hereinafter the model resin that will make an explanation or lens.
In addition, fin 153 can be formed with a locking step 154a in the side of protuberance 154, makes locking step 154a can insert and be fixed in the sunk part that is formed in the inwall of through hole 155 of second case for packaging 151.Therefore, the protuberance 154 of fin 153 through hole 155 that is fixed to second case for packaging 151 makes and can prevent that fin 153 from separating with package main body.Locking step 154a can be formed in the base part of fin.Locking step 154a can be formed on the uppermost margin of protuberance 154.At this moment, locking step 154a is coupled to the upper surface of second case for packaging 151, so that fin 153 can be fixed to package main body.
Referring to Figure 10, in the inner space of first case for packaging 150, form one first model resin 165, the light that its transmission LED crystal grain 160 is launched is protected LED crystal grain 160 and bonding wire 162 simultaneously.
The first model resin 165 can be epoxy resin or poly-silica resin, and also contains the phosphor that is useful on the light that conversion LED crystal grain 160 launched.In addition, the first model resin 165 can contain a light diffuser to be used for scattering equably light.
Referring to Figure 11, the second model resin 167 covers the first model resin 165.The second model resin 167 is epoxy resin or poly-silica resin, the hardness height of its hardness ratio first model resin 165.The second model resin 167 can contain phosphor and/or light diffuser.
Can use a moulding cup or dispensing device or use a transfer model technology that first and second model resin 165 and 167 is formed in the inner space of first case for packaging 150.
Referring to Figure 12, lens 166 are installed on the top of the second model resin 167.These lens can be convex lens that are used in a certain viewing angles scope light that refraction LED crystal grain 160 launched.This lens curvature changes according to desired visual angle.Lens 166 are fixed among the step part 159b of first case for packaging 150.
Hereinafter, will another embodiment that encapsulate according to LED of the present invention be described with reference to figures 13 to Figure 26.
Figure 13 is the perspective view of an explanation lead frame 210 according to another embodiment of the present invention.
Referring to Figure 13, lead frame 210 is formed with a fin support ring 213, a fin can be inserted in this fin support ring.As shown in this figure, the shape that support ring 213 can rounded ring, but the present invention is not limited to this.Support ring 213 can be the shape of a polygon ring.
In addition, an external frame 211 is surrounded support ring 213.External frame 211 is spaced apart with support ring 213.As shown in this figure, external frame 211 can be rectangle, but the present invention is not limited to this.External frame 211 can be circle or polygon.
In addition, at least two lead terminal 217a to 217c extend towards support ring 213 from external frame 211 with 219a to 219c.Yet these lead terminals and support ring 213 are spaced apart.As shown in this figure, each of lead terminal 217a to 217c and 219a to 219c can be formed with a bigger dwell section in the position near support ring 213.The preferable two opposite sides that is placed near support ring 213 of these lead terminals.
Depend on the connection mode of the type of diode to be installed and number and bonding wire and judge the number of wanting of lead terminal.Yet lead frame 210 preferable lead terminals with certain number make it can be used for various situations.As shown in this figure, because lead terminal 217a to 217c is vertical with supporting wire 215a and 215b through being positioned to 219a to 219c, the lead terminal of a number can be placed on the equidirectional.
Though six lead terminals have been described among Figure 13, can settle lead terminal still less, maybe can settle extra lead terminal.These extra lead terminals can be placed on the direction identical with supporting wire 215a and 215b.
Can be by suppressing and manufacturing lead frame 210 according to this embodiment of the invention by phosphorus copper plate and a crystal grain that copper alloy is made.Though single lead frame 210 only is described in Figure 13, can be arranged on this phosphorus copper plate by most lead frames 210 of single phosphorus copper plate manufacturing and with it.In detail, for producing the LED encapsulation in batches, can use most the lead frames of making by single phosphorus copper plate 210.
Figure 14 is the flow chart of explanation manufacturing according to the process of the LED encapsulation of one embodiment of the invention.Figure 15 to Figure 26 makes the perspective view and the plane graph of the method for LED encapsulation according to the process of Figure 14 for explanation.
Referring to Figure 14, at first prepare the lead frame 210 (S01) of Figure 13.As mentioned above, can make lead frame 210 by the compacting phosphorus copper plate.In addition, most lead frames can be made and can be arranged on this phosphorus copper plate by single phosphorus copper plate.
Referring to Figure 14 and Figure 15, the fin 220 of the support ring 213 of lead frame 210 can be inserted and be fixed to preparation.Fin 220 has the upper surface that a LED crystal grain can be installed on it.Preferably, so that fin 220 can be easy to insert support ring 213, and the external diameter of the side of fin 220 is greater than the internal diameter of support ring 213 less than the internal diameter of support ring 213 for the size of the upper surface of fin 220.
In addition, fin 220 can be formed with a support ring accommodating groove 223a, and support ring 213 inserts and be coupled to this accommodating groove.In addition, accommodating groove 223a can provide by spiral form, so that support ring 213 can be fastened to groove 223a easily.
Referring to Figure 14 and Figure 16, fin 220 is inserted and is fixed to the support ring 213 (S05) of lead frame 210.Because the external diameter of fin 220 sides is greater than the internal diameter of support ring 213, so can force fin 220 is inserted and be fixed to support ring 213.
On the other hand, under the situation that forms support ring accommodating groove 223a, support ring 213 is accepted into accommodating groove 223a to support fin 220.At this moment, a part of support ring 213 is incorporated among the accommodating groove 223a and its remainder is preferable outwards outstanding from protuberance 223.In addition, be under the spiral situation at accommodating groove 223a, can fin 220 be inserted in the support ring 213 by rotation fin 220.
Referring to Figure 14 and Figure 17, after fin 220 is fixed to lead frame 210, use the embedding forming technique to form a package main body 230 (S07).Package main body 230 can use the injection molding processing procedure to be formed by thermosetting or thermoplastic resin.
Around fin 220, form package main body 230 with supported ring 213, supporting wire 215a and 215b, lead terminal 217a to 217c and 219a to 219c and fin 220.Supporting wire and lead terminal are partly outwards outstanding from encapsulating main body.In addition, package main body 230 has an opening, and a upper end and the lead terminal of fin 210 expose to the open air via this opening.
As shown in figure 17, the part of supporting wire 215a and 215b and support ring 213 can expose to the open air via this opening.Therefore, in package main body 230a, form a groove or depression.Perhaps, as shown in figure 18, package main body 230a can cover the major part (not comprising the upper end of fin and the part of lead terminal) of fin 220, support ring, supporting wire and lead terminal.For this reason, can provide several openings.Even in this case, as shown in the figure, also can in the top of package main body 230a, form a groove or depression by the side walls enclose of main body 230a.In addition, the lower surface of fin 220 is exposed to the outside.In addition, the side surface of substrate 221 can be exposed to the outside.In this way, the heat that can increase via fin 220 dissipates.
As Figure 17 and shown in Figure 180, package main body 230 or 230a shape can be cylindrical, but the present invention is not limited to this.But this main body shape is the polygon shell, such as a rectangular enclosure.
Because fin 220 be coupled to lead frame 210 and then package main body 230 use the injection molding processing procedures to form by thermosetting resin or thermoplastic resin, so fin 220 can firmly be coupled to package main body 230.
Referring to Figure 14 and Figure 19, encapsulate main body 230 outwards outstanding supporting wire 215a and 215b certainly and be cut off and remove (S09).Therefore as a result, the supporting wire 216a and the 216b of cut-out are retained in the package main body 230, and remaining supporting wire and support ring 213 can prevent further that fin 220 from separating with package main body 230.
Simultaneously, when cutting off supporting wire, also can cut off and remove and except that the lead terminal that is used for supply of current, encapsulate the lead terminals that main body 230 is outwards given prominence to certainly.For example, as shown in figure 20,, then will cut off and remove other lead terminal 217a, 217b, 219a and 219b if only need two lead terminal 217c and 219c.In addition, as shown in figure 21,, then will cut off and remove other lead terminal 217b and 219b if need four lead terminal 217a, 217c, 219a and 219c.
Above-mentioned cut-out and the step that removes lead terminal are only carried out than the lead terminal that needs in LED encapsulation for a long time when the lead terminal of preparation in lead frame 210.Therefore, encapsulate the number of lead terminal of the number of needed lead terminal and preparation in lead frame 210 at LED when identical, the step that does not need to carry out above-mentioned cut-out and remove lead terminal.In addition, even extra lead terminal keeps, it also can't influence the operation of LED encapsulation.And needn't cut off and remove extra lead terminal therefore.
Referring to Figure 14 and Figure 22, a LED crystal grain 240 is installed on the upper surface of fin 220.LED crystal grain 240 can be the so-called two welding crystal grain (two-bond die) that have so-called single welding crystal grain (one-bond die) of electrode on the surface and lower surface thereon or have two electrodes thereon on the surface.
At LED crystal grain 240 is that fin is preferable to be formed by conducting metal under the situation of single welding crystal grain.In this case, use electrically conducting adhesive that LED crystal grain 240 is installed on the fin 220 such as silver epoxy.Perhaps, under the situation of all LED crystal grain for two welding crystal grain that is installed on the fin 220, fin 220 is not required to be conduction.In addition, can use the various heat conduction bonding agents except that silver epoxy that LED crystal grain is installed on the fin 220.
Simultaneously, most LED crystal grain 240 can be installed on the fin 220.In addition, these most LED crystal grain 240 can comprise the various LED crystal grain of the light of launching different wave length.For example, as shown in figure 22, three LED product grains 240 can be installed on the fin.At this moment, these three LED crystal grain 240 can be distinguished red-emitting, green glow and blue light.Therefore, by adopting three LED crystal grain 240, the LED encapsulation can realize the light of all colours.
Referring to Figure 14 and Figure 23, LED crystal grain 241,243 and 245 is electrically connected to lead terminal 217a to 217c and 219a to 219c (S13) respectively via bonding wire.Be all at LED crystal grain 241,243 and 245 under the situation of two welding crystal grain, each of these LED crystal grain is connected to two corresponding lead terminals via two corresponding bonding wires.Anticipate promptly, as shown in the figure, LED crystal grain 241,243 and 245 out of the ordinary can be electrically connected to different right lead terminals respectively.Perhaps, LED crystal grain out of the ordinary is connected to a public lead terminal (for example 217b) via bonding wire, and also is connected to the different lead terminals (for example, 219a, 219b and 219c) with public lead terminal position opposite.In this case, LED crystal grain can be by different current drives.
On the other hand, as shown in figure 24, single welding crystal grain 241a and two welding crystal grain 243 and 245 can be installed together.At this moment, one of lead terminal 217b is electrically connected to fin 220 via a bonding wire.Therefore, lead terminal 217b is electrically connected to the lower surface of single welding crystal grain 241a via bonding wire and fin 220.Because can realize single weld crystal grain and two various combinations of welding crystal grain, so can also various patterns carry out the bonding wire connection that is used for each combination.
In addition, lead terminal and LED crystal grain can be connected to each other in every way, and most LED crystal grain can be in parallel, polyphone or polyphone-configuration in parallel be connected to each other.
With after lead terminal is connected via bonding wire, use first and second model resin (not shown) sealing LED crystal grain 241,243 and 245 (S15) at LED crystal grain 241,243 and 245.The model resin is inserted in the opening of package main body 230, thus sealing LED crystal grain and bonding wire.
In addition, the first and/or second model resin can be incorporated phosphor into.For example, this phosphor can be the phosphor that blue light is converted into gold-tinted or green glow and ruddiness.Therefore, under the LED crystal grain that is used to launch blue light was installed in situation on the fin 220, the part of the light of LED crystal grain emission can change into gold-tinted or green glow and ruddiness, and making to provide the LED of outside emission white light encapsulation.In addition, the model resin can be incorporated diffuser into.This diffuser disperses the light by the emission of LED crystal grain, can equably be radiated to outside from visual observation to LED crystal grain and bonding wire and light so that can prevent.
After LED crystal grain was resin-sealed by model, as shown in figure 26, lens 250 were formed at the top (S17) of package main body 230.These lens are used for launching light in a certain viewing angles, and then it can be omitted if do not need to adopt.In detail, the second model resin curable becomes a lens form to serve as lens.At this moment, can omit the step that forms lens.
Referring to Figure 14 and Figure 25, lead terminal 217a to 217c and 219a to 219c are cut off and from external frame 211 bendings (S19).At last, finish a surface-mountable LED encapsulation.Simultaneously, the step S09 that cuts off and remove supporting wire can carry out with step S19.
Hereinafter will encapsulate with reference to the LED that Figure 25 describes in detail according to this embodiment.
Referring to Figure 25, this LED encapsulation comprises fin support ring 213 once more.Support ring 213 is formed by the copper alloy such as phosphor-copper.As shown in the figure, but support ring 213 shapes are annulus, but the present invention is not limited to this.But this support ring shape is the polygon ring.The supporting wire 216a and the 216b self-supporting ring 213 that cut off stretch out.The two opposite sides that supporting wire 216a that cuts off and 216b can be placed in support ring 213.
To insert support ring 213 in conjunction with the fin 220 that Figure 15 describes.Simultaneously, at least two lead terminal 217a to 217c and 219a to 219c are placed in the both sides of support ring and spaced apart with support ring 213 and fin 220.Flexible lead terminal is so that mounted on surface in addition.
In addition, model package main body 230 is to support fin 220 and lead terminal.Package main body 230 has an opening at an upper portion thereof, exposes the upper end of fin 220 and the part of lead terminal to the open air via this opening.Simultaneously, lead terminal passes the sidewall of package main body 230 and the sidewall of this main body is outwards outstanding certainly.
As explaining referring to Figure 17, the part of support ring 213 and supporting wire 215a and 215b can expose to the open air via this opening.Therefore, in package main body 230, form a groove or depression.In addition, as explaining referring to Figure 18, package main body 230a can cover the major part of fin, support ring, supporting wire and lead terminal except that the part of the upper end of fin and lead terminal.Therefore, can form some openings.Even in this case, as shown in figure 18, preferable a groove or the depression that sidewall surrounded that is formed with by this package main body of package main body 230a.Package main body 230 can be is inserting and is being fixed to the plastic resin that forms by the injection molding of thermoplastic resin after the support ring 213 with fin 220.
In addition, LED crystal grain 241,243 and 245 is mounted to the upper surface of fin 220.Though LED crystal grain shown in Figure 25 is illustrated as two welding crystal grain, the present invention is not limited to this.For example, LED crystal grain can be the combination of single welding crystal grain or single welding crystal grain and two welding crystal grain.
LED crystal grain is electrically connected to lead terminal via bonding wire.At LED crystal grain is that each LED crystal grain is electrically connected to two lead terminals via two bonding wires under the situation of two welding crystal grain.Perhaps, at least one in these LED crystal grain is that fin is electrically connected at least one of these lead terminals under the situation of single welding crystal grain via bonding wire.
These LED crystal grain can be connected with lead terminal in every way according to the desired feature of LED encapsulation.
Simultaneously, first and second sealing resin (not shown) covers and sealing LED crystal grain.The groove that forms on the top of package main body 230 is filled with sealing resin.In addition, sealing resin can contain phosphor and/or diffuser.As shown in figure 26, can further in package main body 230, form lens 250.Perhaps, thus second sealing resin can form lens shape serves as lens.
According to the present invention, provide a kind of LED encapsulation: wherein can protect LED crystal grain not to be subjected to influence, can alleviate the stress that puts on the LED crystal grain, and can prevent the distortion of model resin at classification and assembly process such as the surrounding environment of external force and moisture.In addition, the present invention can provide a kind of LED encapsulation: the heat that wherein adopts a fin to be produced with the LED crystal grain that dissipates reposefully, and this fin can not separate with package main body.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (15)
1. the LED package of a tool multiple molding resins is characterized in that comprising:
At least one pair of lead terminal;
One package main body, it has and exposes this opening to lead terminal to the open air, this at least a portion to lead terminal of this package main body embedding;
One LED crystal particle, it is installed in this opening and is electrically connected to this to lead terminal;
One first model resin, it covers this LED crystal particle; And
One second model resin, it covers this first model resin and has than the higher hardness of this first model resin.
2. the LED package of tool multiple molding resins according to claim 1 is characterized in that the wherein said first model resin has one and has a desolate formula durometer value that is not less than 50 dusts less than desolate formula hardometer (Durometer Shore) value of 50 dusts and the second model resin.
3. the LED package of tool multiple molding resins according to claim 2 is characterized in that the wherein said first model resin and the second model resin are formed by epoxy resin or poly-silica resin.
4. the LED package of tool multiple molding resins according to claim 3 is characterized in that the wherein said second model resin-shaped becomes the shape of lens.
5. the LED package of tool multiple molding resins according to claim 3 is characterized in that the wherein said first model resin and/or the second model resin contain a phosphor.
6. the LED package of tool multiple molding resins according to claim 1, it is characterized in that it further comprises a fin, this fin is coupled to the bottom of package main body and exposes to the open air via opening portion ground, and wherein LED crystal particle is installed on the upper surface of this fin.
7. the LED package of tool multiple molding resins according to claim 6 is characterized in that wherein said fin has the protuberance that a substrate and projects upwards from the core of this substrate.
8. the LED package of tool multiple molding resins according to claim 7 is characterized in that wherein said fin is formed with a locking step at least one side of substrate and/or protuberance.
9. the LED package of a tool multiple molding resins is characterized in that comprising:
One fin support ring;
One fin, it inserts this support ring;
At least two lead terminals, it is placed in the both sides of this support ring and spaced apart with this support ring and this fin;
One package main body, itself and this fin and these lead terminal models are together to support this fin and these lead terminals, and this package main body has an opening, and the upper end of this fin and the part of these lead terminals are exposed to the open air via this opening;
At least one LED crystal particle, it is installed on the upper surface of this fin;
Bonding wire, it is used to be electrically connected this LED crystal particle and these lead terminals;
One first model resin, it covers this LED crystal particle; And
One second model resin, it covers this first model resin and has than the higher hardness of this first model resin.
10. the LED package of tool multiple molding resins according to claim 9 is characterized in that the wherein said first model resin has one and has a desolate formula durometer value that is not less than 50 dusts less than the desolate formula durometer value of 50 dusts and the second model resin.
11. the LED package of tool multiple molding resins according to claim 10 is characterized in that the wherein said first model resin and the second model resin are formed by epoxy resin or poly-silica resin.
12. the LED package of tool multiple molding resins according to claim 11 is characterized in that the wherein said second model resin-shaped becomes the shape of lens.
13. the LED package of tool multiple molding resins according to claim 9 is characterized in that wherein said fin has the protuberance that a substrate and a core from this substrate projected upwards and inserted support ring.
14. the LED package of tool multiple molding resins according to claim 13 is characterized in that wherein said fin further is formed with a support ring accommodating groove to take in support ring in a side of protuberance.
15. the LED package of tool multiple molding resins according to claim 9 is characterized in that wherein said package main body is formed by embedding described lead terminal of moulding and fin by a thermosetting resin or a thermoplastic resin.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040072452 | 2004-09-10 | ||
| KR20040072452A KR100709890B1 (en) | 2004-09-10 | 2004-09-10 | Light emitting diode package having multiple molding resins |
| KR1020040079909 | 2004-10-07 | ||
| KR1020050000269 | 2005-01-03 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100071788A Division CN101521256B (en) | 2004-09-10 | 2005-06-23 | Light emitting diode package having multiple molding resins |
| CN2009100071773A Division CN101521255B (en) | 2004-09-10 | 2005-06-23 | Light emitting diode package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101015071A true CN101015071A (en) | 2007-08-08 |
| CN100533787C CN100533787C (en) | 2009-08-26 |
Family
ID=37129781
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100071773A Active CN101521255B (en) | 2004-09-10 | 2005-06-23 | Light emitting diode package |
| CN2009100071788A Active CN101521256B (en) | 2004-09-10 | 2005-06-23 | Light emitting diode package having multiple molding resins |
| CNB2005800301008A Active CN100533787C (en) | 2004-09-10 | 2005-06-23 | Light emitting diode package having multiple molding resins |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100071773A Active CN101521255B (en) | 2004-09-10 | 2005-06-23 | Light emitting diode package |
| CN2009100071788A Active CN101521256B (en) | 2004-09-10 | 2005-06-23 | Light emitting diode package having multiple molding resins |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100709890B1 (en) |
| CN (3) | CN101521255B (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163656A (en) * | 2010-12-31 | 2011-08-24 | 东莞市万丰纳米材料有限公司 | Method for preparing light emitting diode (LED) packaging module |
| CN102299232A (en) * | 2010-06-24 | 2011-12-28 | 鸿富锦精密工业（深圳）有限公司 | LED (light emitting diode) and light source module |
| CN102318091A (en) * | 2009-03-10 | 2012-01-11 | 株式会社纳沛斯Led | LED leadframe package, LED package using the same, and method of manufacturing the LED package |
| CN102623623A (en) * | 2012-03-26 | 2012-08-01 | 李海涛 | Surface-mounted type LED (light-emitting diode) device with inner core protected by flexible rubber |
| CN102683559A (en) * | 2011-03-17 | 2012-09-19 | 隆达电子股份有限公司 | Light emitting diode packaging structure and manufacturing method thereof |
| CN101447477B (en) * | 2007-11-28 | 2013-01-23 | 三星显示有限公司 | Light emitting diode package, method for fabricating the same and backlight assembly including the same |
| CN103035826A (en) * | 2011-09-30 | 2013-04-10 | 株式会社东芝 | Semiconductor light-emitting device and manufacturing method of the same |
| CN103053036A (en) * | 2010-07-28 | 2013-04-17 | 首尔Opto仪器股份有限公司 | Light emitting diode having distributed Bragg reflector |
| CN103123949A (en) * | 2011-11-21 | 2013-05-29 | 展晶科技(深圳)有限公司 | Flexible light emitting diode package structure and manufacturing method thereof |
| CN103700750A (en) * | 2012-09-25 | 2014-04-02 | Lg伊诺特有限公司 | Light emitting device package |
| CN103797295A (en) * | 2011-07-22 | 2014-05-14 | 葛迪恩实业公司 | Led lighting systems with phosphor subassemblies, and/or methods of making the same |
| CN103915543A (en) * | 2013-01-08 | 2014-07-09 | Lg伊诺特有限公司 | Light emitting device package |
| CN103994380A (en) * | 2014-06-11 | 2014-08-20 | 常州市宏硕电子有限公司 | Light-emitting diode for kiln |
| CN104241492A (en) * | 2013-06-17 | 2014-12-24 | 南京理工大学 | LED chip with metal and dielectric combination raster structure |
| US9142715B2 (en) | 2010-06-24 | 2015-09-22 | Seoul Viosys Co., Ltd. | Light emitting diode |
| US9324919B2 (en) | 2009-11-13 | 2016-04-26 | Seoul Viosys Co., Ltd. | Light emitting diode chip having distributed Bragg reflector and method of fabricating the same |
| CN110491982A (en) * | 2018-05-15 | 2019-11-22 | 东贝光电科技股份有限公司 | LED light emitting source, the manufacturing method of LED light emitting source and its straight-down negative display |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101309758B1 (en) * | 2006-12-28 | 2013-09-23 | 서울반도체 주식회사 | Light emitting diode lamp and method of fabricating the same |
| KR101365623B1 (en) * | 2007-03-30 | 2014-02-25 | 서울반도체 주식회사 | Led package with light transmitional housing |
| KR100849829B1 (en) * | 2008-03-18 | 2008-07-31 | 삼성전기주식회사 | Light emitting diode packet having wide beam angle |
| KR101431711B1 (en) | 2008-05-07 | 2014-08-21 | 삼성전자 주식회사 | Fabricating method of light emitting device and system, fabricated light emitting package and system using the same |
| US8269244B2 (en) * | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
| US9653656B2 (en) * | 2012-03-16 | 2017-05-16 | Advanced Semiconductor Engineering, Inc. | LED packages and related methods |
| JP2017098414A (en) * | 2015-11-24 | 2017-06-01 | 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． | Light-emitting device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08335720A (en) * | 1995-06-08 | 1996-12-17 | Nichia Chem Ind Ltd | Nitrate semiconductor light emitting diode |
| US6274924B1 (en) * | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
| JP2002314139A (en) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | Light emitting device |
| JP4055373B2 (en) * | 2001-05-31 | 2008-03-05 | 日亜化学工業株式会社 | Method for manufacturing light emitting device |
-
2004
- 2004-09-10 KR KR20040072452A patent/KR100709890B1/en active IP Right Grant
-
2005
- 2005-06-23 CN CN2009100071773A patent/CN101521255B/en active Active
- 2005-06-23 CN CN2009100071788A patent/CN101521256B/en active Active
- 2005-06-23 CN CNB2005800301008A patent/CN100533787C/en active Active
Cited By (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101447477B (en) * | 2007-11-28 | 2013-01-23 | 三星显示有限公司 | Light emitting diode package, method for fabricating the same and backlight assembly including the same |
| CN102318091A (en) * | 2009-03-10 | 2012-01-11 | 株式会社纳沛斯Led | LED leadframe package, LED package using the same, and method of manufacturing the LED package |
| US10141480B2 (en) | 2009-11-13 | 2018-11-27 | Seoul Viosys Co., Ltd. | Light emitting diode chip having distributed Bragg reflector and method of fabricating the same |
| US10128306B2 (en) | 2009-11-13 | 2018-11-13 | Seoul Viosys Co., Ltd. | Light emitting diode chip having distributed bragg reflector and method of fabricating the same |
| US9577157B2 (en) | 2009-11-13 | 2017-02-21 | Seoul Viosys Co., Ltd. | Light emitting diode chip having distributed Bragg reflector and method of fabricating the same |
| US9343631B2 (en) | 2009-11-13 | 2016-05-17 | Seoul Viosys Co., Ltd. | Light emitting diode chip having distributed bragg reflector and method of fabricating the same |
| US9324919B2 (en) | 2009-11-13 | 2016-04-26 | Seoul Viosys Co., Ltd. | Light emitting diode chip having distributed Bragg reflector and method of fabricating the same |
| US9142715B2 (en) | 2010-06-24 | 2015-09-22 | Seoul Viosys Co., Ltd. | Light emitting diode |
| CN102299232A (en) * | 2010-06-24 | 2011-12-28 | 鸿富锦精密工业（深圳）有限公司 | LED (light emitting diode) and light source module |
| CN103053036A (en) * | 2010-07-28 | 2013-04-17 | 首尔Opto仪器股份有限公司 | Light emitting diode having distributed Bragg reflector |
| CN103053036B (en) * | 2010-07-28 | 2015-11-25 | 首尔伟傲世有限公司 | There is the light-emitting diode of distributed Bragg reflector |
| CN102163656A (en) * | 2010-12-31 | 2011-08-24 | 东莞市万丰纳米材料有限公司 | Method for preparing light emitting diode (LED) packaging module |
| CN102683559A (en) * | 2011-03-17 | 2012-09-19 | 隆达电子股份有限公司 | Light emitting diode packaging structure and manufacturing method thereof |
| US9450162B2 (en) | 2011-07-22 | 2016-09-20 | Guardian Industries Corp. | LED lighting systems with phosphor subassemblies, and/or methods of making the same |
| CN103797295A (en) * | 2011-07-22 | 2014-05-14 | 葛迪恩实业公司 | Led lighting systems with phosphor subassemblies, and/or methods of making the same |
| CN103035826A (en) * | 2011-09-30 | 2013-04-10 | 株式会社东芝 | Semiconductor light-emitting device and manufacturing method of the same |
| CN103123949A (en) * | 2011-11-21 | 2013-05-29 | 展晶科技(深圳)有限公司 | Flexible light emitting diode package structure and manufacturing method thereof |
| CN102623623A (en) * | 2012-03-26 | 2012-08-01 | 李海涛 | Surface-mounted type LED (light-emitting diode) device with inner core protected by flexible rubber |
| CN103700750A (en) * | 2012-09-25 | 2014-04-02 | Lg伊诺特有限公司 | Light emitting device package |
| US9831406B2 (en) | 2012-09-25 | 2017-11-28 | Lg Innotek Co., Ltd. | Light emitting device package |
| US9842975B2 (en) | 2012-09-25 | 2017-12-12 | Lg Innotek Co., Ltd. | Light emitting device package |
| CN103700750B (en) * | 2012-09-25 | 2018-05-18 | Lg伊诺特有限公司 | Light emitting device package |
| CN108538999A (en) * | 2012-09-25 | 2018-09-14 | Lg伊诺特有限公司 | Light emitting device package |
| CN103915543B (en) * | 2013-01-08 | 2018-05-04 | Lg 伊诺特有限公司 | Light emitting device package |
| CN103915543A (en) * | 2013-01-08 | 2014-07-09 | Lg伊诺特有限公司 | Light emitting device package |
| CN104241492A (en) * | 2013-06-17 | 2014-12-24 | 南京理工大学 | LED chip with metal and dielectric combination raster structure |
| CN103994380A (en) * | 2014-06-11 | 2014-08-20 | 常州市宏硕电子有限公司 | Light-emitting diode for kiln |
| CN110491982A (en) * | 2018-05-15 | 2019-11-22 | 东贝光电科技股份有限公司 | LED light emitting source, the manufacturing method of LED light emitting source and its straight-down negative display |
| CN110491982B (en) * | 2018-05-15 | 2020-12-08 | 东贝光电科技股份有限公司 | LED luminous source, manufacturing method of LED luminous source and direct type display thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101521256B (en) | 2011-04-13 |
| KR20060023663A (en) | 2006-03-15 |
| CN101521255A (en) | 2009-09-02 |
| CN101521256A (en) | 2009-09-02 |
| CN101521255B (en) | 2012-12-26 |
| CN100533787C (en) | 2009-08-26 |
| KR100709890B1 (en) | 2007-04-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101521256B (en) | Light emitting diode package having multiple molding resins | |
| EP1794808B1 (en) | Light emitting diode package having multiple molding resins | |
| JP4523496B2 (en) | Light emitting diode package manufacturing method and light emitting diode package manufactured using the same | |
| US8067778B2 (en) | Ultraviolet light emitting diode package | |
| US7592631B2 (en) | LED package frame and LED package having the same | |
| JP5295107B2 (en) | LIGHT EMITTING DIODE PACKAGE USING LEAD FRAME HAVING HEAT SINK SUPPORTING UNIT AND METHOD FOR MANUFACTURING THE LIGHT EMITTING DIODE PACKAGE | |
| US7683474B2 (en) | LED assembly with LED position template and method of making an LED assembly using LED position template | |
| CN101080822B (en) | Light emitting diode package and fabricating method thereof | |
| KR100635779B1 (en) | Leadframe having a heat sink support ring, fabricating method of the light emitting diode package using the same and light emitting diode package fabrecated by the method | |
| JP3109109U (en) | Solid state semiconductor light emitting device | |
| TWI481079B (en) | Led package and method for manufacturing the same | |
| KR100579388B1 (en) | Light emitting diode package employing a heat sink with a sprial groove |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |