CN102299232A - LED (light emitting diode) and light source module - Google Patents
LED (light emitting diode) and light source module Download PDFInfo
- Publication number
- CN102299232A CN102299232A CN2010102086314A CN201010208631A CN102299232A CN 102299232 A CN102299232 A CN 102299232A CN 2010102086314 A CN2010102086314 A CN 2010102086314A CN 201010208631 A CN201010208631 A CN 201010208631A CN 102299232 A CN102299232 A CN 102299232A
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- China
- Prior art keywords
- light
- packaging body
- emitting diode
- micro
- backlight unit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The invention relates to an LED (light emitting diode) which comprises an LED chip, a first packaging body and a second packaging body, wherein the first packaging body is used to seal the LED chip, the first packing body is provided with a flat first surface; the second packaging body is provided with a second surface corresponding to the first surface, the second surface is provided with multiple microstructures protruding towards the first surface, a gap exists between the first surface and the second surface, the interior of the gap is vacuum and is provided with filler, and the refractive index of the filler is less than that of the first packaging body and the second packaging body. The invention also provides a light source module which comprises multiple LEDs provided by the invention.
Description
Technical field
The light source module that the present invention relates to light-emitting diode and comprise this light-emitting diode.
Background technology
The light source module usually with light-emitting diode as being back light, and adopt light guide plate that point-source of light or line source are expanded to area source, yet, because the rising angle of light source is narrower, radiation scope is limited, if do not increase astigmatic structure, and the usually bright dark inequality of the exiting surface of light guide plate.Therefore, generally can astigmatic structure be set in the light inlet side of light guide plate.But along with the thickness of light guide plate is more and more thinner, diffusing structure is also wanted slimming.So, when light guide plate is reduced to 1mm when following, burr appear in slim diffusing structure easily, thereby influence its astigmatic effect.
Summary of the invention
In view of this, the light source module that is necessary to provide the bigger light-emitting diode of a kind of rising angle and comprises this light-emitting diode.
A kind of light-emitting diode, it comprises: a light-emitting diode chip for backlight unit; One first packaging body, this first packaging body is used to seal this light-emitting diode chip for backlight unit, and this first packaging body has a smooth first surface; And one second packaging body, this second packaging body has one and this first surface opposing second surface, this second surface is provided with a plurality of micro-structurals of protruding towards this first surface, there is the gap between this first surface and this second surface, be vacuum or be provided with filler in this gap, and the refractive index of this filler is less than the refractive index of this first packaging body and this second packaging body
A kind of light source module, it comprises a light guide plate and a plurality of light-emitting diode as light source, and this light guide plate has a smooth incidence surface, and these a plurality of light-emitting diodes are located at this incidence surface one side, and this light-emitting diode comprises a light-emitting diode chip for backlight unit; One first packaging body, this first packaging body is used to seal this light-emitting diode chip for backlight unit, and this first packaging body has the exiting surface of a smooth first surface as this light-emitting diode chip for backlight unit; And one second packaging body, this second packaging body has one and this first surface opposing second surface, this second surface is provided with a plurality of micro-structurals of protruding towards this first surface, there is the gap between this first surface and this second surface, be vacuum or be provided with filler in this gap, and the refractive index of this filler is less than the refractive index of this first packaging body and this second packaging body.
With respect to prior art, second packaging body of light-emitting diode provided by the invention is provided with a plurality of micro-structurals in exiting surface one side towards light-emitting diode chip for backlight unit, and there is the gap between this second packaging body and first packaging body, can enlarges the rising angle of light-emitting diode.The light source module is a light source with a plurality of these light-emitting diodes, and luminous energy is more evenly distributed, and goes out the dark uneven problem of light thereby can effectively solve light guide plate.
Description of drawings
Fig. 1 is the light-emitting diode structure schematic diagram that first embodiment of the invention provides.
Fig. 2 is the II-II directional profile view of light-emitting diode shown in Figure 1.
Fig. 3 is the II-II directional profile view of another kind of micro-structural of second surface of second packaging body of light-emitting diode shown in Figure 1.
Fig. 4 is the light-emitting diode structure schematic diagram that second embodiment of the invention provides.
Fig. 5 is the structural representation of the light source module that provides of third embodiment of the invention.
Fig. 6 is the light-emitting diode structure schematic diagram that fourth embodiment of the invention provides.
The main element symbol description
Light- emitting diode 10,30,60
Light-emitting diode chip for backlight unit 12,61
Loading end 160
Second surface 180,380,630
Micro-structural 20,31,631
V-arrangement raised line 200
Taper salient point 202
Light source module 50
Light guide plate 52
Incidence surface 520
Embodiment
See also Fig. 1, Fig. 2 and Fig. 3, the light-emitting diode 10 that first embodiment of the invention provides comprises 12, one first packaging bodies 14 of a light-emitting diode chip for backlight unit and one second packaging body 18.
This first packaging body 14 is used to seal this light-emitting diode chip for backlight unit 12, and this first packaging body 14 has a smooth first surface 140.The light that this light-emitting diode chip for backlight unit 12 sends is through these first packaging body, 14 outgoing.This first surface 140 also is the exiting surface of this light-emitting diode chip for backlight unit 12.
This second packaging body 18 is used to seal this first packaging body 14, this second packaging body 18 have one with these first surface 140 opposing second surface 180, this second surface 180 be provided with a plurality of micro-structurals of protruding towards this first surface 140 20 in other words this second packaging body 18 be provided with the micro-structural 20 that a plurality of these first surfaces 140 dorsad are recessed to this second surface 180, have gap 21 between this first surface 140 and this second surface 180, the refractive index of the filler in this gap 21 is less than the refractive index of first packaging body 14 and second packaging body 18.This filler can be an air, and water etc. also can be vacuum in this gap 21.In the present embodiment, fill air in the gap 21.
These a plurality of micro-structurals 20 are a plurality of V-arrangement raised line 200 or taper salient points 202 side by side.But being not limited thereto kind of a structure, can also be the micro-structural of other shape, and for example the cross section is a trapezoidal projection etc.
The bearing of trend of a plurality of V-arrangement raised lines 200 is identical, both can closely link to each other between a plurality of V-arrangement raised lines 200, also can have the gap, be equally spaced.
Taper salient point 202 is uniformly distributed in this second surface 180, can have the gap between these a plurality of taper salient points 202, and preferably, these a plurality of taper salient points 202 closely link to each other.
This first packaging body 14 be in epoxy resin, silicone resin or the glass any, the material of this second packaging body 18 be in epoxy resin, silicone resin or the glass any, but be not limited to cited material.Comprise in this first packaging body 14 that fluorophor (figure does not show) carries out wavelength Conversion with the light that this light-emitting diode chip for backlight unit 12 is sent.
When this first surface 140 and second surface 180 were contactless, promptly micro-structural 20 was not touched this first surface 140, and the light that this light-emitting diode chip for backlight unit 12 sends enters this second packaging body 18 through behind this gap 21.Because light enters optically thinner medium (air the gap 21) from optically denser medium (first packaging body 14), enters optically denser medium (second packaging body 18) once more by optically thinner medium then, to compare without the direct outgoing of optically thinner medium with light, the divergence of beam angle increases.And the micro-structural 20 on these second surface 180 surfaces can make light enter in second packaging body 18 with bigger refraction angle.
This light-emitting diode chip for backlight unit 12 is located at a loading end 160, and the lead 120 and the lead frame 121 of this light-emitting diode chip for backlight unit 12 join.
See also Fig. 4, the light-emitting diode 10 that the light-emitting diode 30 that second embodiment of the invention provides and first embodiment provide is basic identical, difference is: all micro-structurals 31 of light-emitting diode 30 contact with this first surface 340, because micro-structural 31 is raised in second surface 380, so form gap 33 between this second surface 380 and the first surface 340.
See also Fig. 5, the light source module 50 that third embodiment of the invention provides has a light guide plate 52, and this light guide plate has an incidence surface 520.These incidence surface 520 1 sides are provided with a plurality of light-emitting diode 10 (30) as light source.Because light-emitting diode 10 (30) shooting angles are big, luminous energy is more evenly distributed, and goes out the dark uneven problem of light thereby can effectively solve light guide plate.In the present embodiment, this incidence surface 520 is smooth, but the outgoing light homogeneity of diffusing structure with further raising light guide plate 52 also can be set.
See also Fig. 6, light-emitting diode 60 and light-emitting diode 10 differences that fourth embodiment of the invention provides are: the outer surface of light-emitting diode 10 is a curve, and the light ray radiation scope is big; The outer surface 600 of light-emitting diode 60 is the plane, and overall structure is flat, and spatial volume is little.
Light-emitting diode 60 comprises a light-emitting diode chip for backlight unit 61, one first packaging bodies 62 and one second packaging body 63.This first packaging body 62 is used to seal this light-emitting diode chip for backlight unit 61, and this first packaging body 62 has a smooth first surface 620.This second packaging body 63 have one with these first surface 620 opposing second surface 630, this second surface 630 is provided with a plurality of micro-structurals of protruding towards this first surface 620 631.There is gap 64 between this first surface 620 and this second surface 630.The refractive index of the filler in this gap 64 is less than the refractive index of first packaging body 62 and second packaging body 63.This filler can be an air, and water etc. also can be vacuum in this gap 64.In the present embodiment, fill air in the gap 64.
This second packaging body 63 can only be positioned at the top of this first surface 620 as shown in Figure 6, and realizes the fixing of this second packaging body 63 by the tip of micro-structural 631 with contacting of first surface 620.This second packaging body 63 also can seal this first packaging body 62 fully.
This second packaging body 63 is tabular, and material is an epoxy resin, and outer surface 600 is opposing with this second surface 630.
Because light enters optically thinner medium (air the gap 64) from optically denser medium (first packaging body 62), enter optically denser medium (second packaging body 63) once more by this optically thinner medium then, compare without the direct outgoing of optically thinner medium with light, the divergence of beam scope increases.And the micro-structural 631 on these second surface 630 surfaces can make light enter in second packaging body 63 with bigger refraction angle.
The light-emitting diode that the embodiment of the invention provides only encapsulates at a light-emitting diode chip for backlight unit.Certainly, also can encapsulate a plurality of light-emitting diode chip for backlight unit.
Be understandable that those skilled in the art also can do other variation in spirit of the present invention, all should be included within the present invention's scope required for protection.
Claims (10)
1. light-emitting diode, it comprises:
A light-emitting diode chip for backlight unit;
One first packaging body, this first packaging body is used to seal this light-emitting diode chip for backlight unit, and this first packaging body has a smooth first surface; And
One second packaging body, this second packaging body has one and this first surface opposing second surface, this second surface is provided with a plurality of micro-structurals of protruding towards this first surface, there is the gap between this first surface and this second surface, be vacuum or be provided with filler in this gap, and the refractive index of this filler is less than the refractive index of this first packaging body and this second packaging body.
2. light-emitting diode as claimed in claim 1 is characterized in that, each micro-structural contacts with this first surface.
3. light-emitting diode as claimed in claim 1 is characterized in that, these a plurality of micro-structurals are the taper salient point.
4. light-emitting diode as claimed in claim 1 is characterized in that, these a plurality of micro-structurals are a plurality of V-arrangement raised lines side by side.
5. light-emitting diode as claimed in claim 1 is characterized in that, comprises in this first packaging body that fluorophor carries out wavelength Conversion with the light that this light-emitting diode chip for backlight unit is sent.
6. light-emitting diode as claimed in claim 1 is characterized in that, the material of this first packaging body be in epoxy resin, silicone resin or the glass any, the material of this second packaging body be in epoxy resin, silicone resin or the glass any.
7. light source module, it comprises a light guide plate and a plurality of light-emitting diode as light source, and this light guide plate has a smooth incidence surface, and these a plurality of light-emitting diodes are located at this incidence surface one side, and this light-emitting diode comprises a light-emitting diode chip for backlight unit; One first packaging body, this first packaging body is used to seal this light-emitting diode chip for backlight unit, and this first packaging body has the exiting surface of a smooth first surface as this light-emitting diode chip for backlight unit; And one second packaging body, this second packaging body has one and this first surface opposing second surface, this second surface is provided with a plurality of micro-structurals of protruding towards this first surface, there is the gap between this first surface and this second surface, be vacuum or be provided with filler in this gap, and the refractive index of this filler is less than the refractive index of this first packaging body and this second packaging body.
8. light source module as claimed in claim 7 is characterized in that, each micro-structural contacts with this first surface.
9. light source module as claimed in claim 7 is characterized in that, these a plurality of micro-structurals are the taper salient point.
10. light source module as claimed in claim 7 is characterized in that, these a plurality of micro-structurals are a plurality of V-arrangement raised lines side by side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102086314A CN102299232A (en) | 2010-06-24 | 2010-06-24 | LED (light emitting diode) and light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102086314A CN102299232A (en) | 2010-06-24 | 2010-06-24 | LED (light emitting diode) and light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102299232A true CN102299232A (en) | 2011-12-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102086314A Pending CN102299232A (en) | 2010-06-24 | 2010-06-24 | LED (light emitting diode) and light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102299232A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103777447A (en) * | 2012-10-17 | 2014-05-07 | 深圳市绎立锐光科技开发有限公司 | Light source system, wavelength conversion device and relevant projection system |
| CN103794696A (en) * | 2012-10-30 | 2014-05-14 | 南京灿华光电设备有限公司 | Light emitting diode packaging structure of multilayer curved surface textures |
| CN104409657A (en) * | 2014-12-01 | 2015-03-11 | 昆山国显光电有限公司 | Encapsulating cover plate and application thereof in organic electroluminescence device |
| CN104576879A (en) * | 2013-10-14 | 2015-04-29 | 新世纪光电股份有限公司 | Flip chip type light emitting diode packaging structure |
| US9859459B2 (en) | 2014-07-14 | 2018-01-02 | Genesis Photonics Inc. | Method for manufacturing light emitting unit |
| US10050183B2 (en) | 2014-05-07 | 2018-08-14 | Genesis Photonics Inc. | Light emitting device |
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| CN1928651A (en) * | 2005-09-07 | 2007-03-14 | 鸿富锦精密工业（深圳）有限公司 | Straight down type back light module unit |
| CN101015071A (en) * | 2004-09-10 | 2007-08-08 | 首尔半导体株式会社 | Light emitting diode package having multiple molding resins |
| CN101064357A (en) * | 2006-04-26 | 2007-10-31 | 罗门哈斯公司 | Patterned light extraction sheet and method of making same |
| JP2007311423A (en) * | 2006-05-16 | 2007-11-29 | Alps Electric Co Ltd | Light emitting substance and its manufacturing method |
| US20090315051A1 (en) * | 2008-06-19 | 2009-12-24 | Chia-Hao Wu | Photoelectric semiconductor device capable of generating uniform compound lights |
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2010
- 2010-06-24 CN CN2010102086314A patent/CN102299232A/en active Pending
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| CN101015071A (en) * | 2004-09-10 | 2007-08-08 | 首尔半导体株式会社 | Light emitting diode package having multiple molding resins |
| CN1928651A (en) * | 2005-09-07 | 2007-03-14 | 鸿富锦精密工业（深圳）有限公司 | Straight down type back light module unit |
| CN101064357A (en) * | 2006-04-26 | 2007-10-31 | 罗门哈斯公司 | Patterned light extraction sheet and method of making same |
| JP2007311423A (en) * | 2006-05-16 | 2007-11-29 | Alps Electric Co Ltd | Light emitting substance and its manufacturing method |
| US20090315051A1 (en) * | 2008-06-19 | 2009-12-24 | Chia-Hao Wu | Photoelectric semiconductor device capable of generating uniform compound lights |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103777447A (en) * | 2012-10-17 | 2014-05-07 | 深圳市绎立锐光科技开发有限公司 | Light source system, wavelength conversion device and relevant projection system |
| CN103777447B (en) * | 2012-10-17 | 2016-03-16 | 深圳市绎立锐光科技开发有限公司 | A kind of light-source system, Wavelength converter and relevant projecting system |
| CN103794696A (en) * | 2012-10-30 | 2014-05-14 | 南京灿华光电设备有限公司 | Light emitting diode packaging structure of multilayer curved surface textures |
| CN104576879A (en) * | 2013-10-14 | 2015-04-29 | 新世纪光电股份有限公司 | Flip chip type light emitting diode packaging structure |
| US10050183B2 (en) | 2014-05-07 | 2018-08-14 | Genesis Photonics Inc. | Light emitting device |
| US9859459B2 (en) | 2014-07-14 | 2018-01-02 | Genesis Photonics Inc. | Method for manufacturing light emitting unit |
| CN104409657A (en) * | 2014-12-01 | 2015-03-11 | 昆山国显光电有限公司 | Encapsulating cover plate and application thereof in organic electroluminescence device |
| CN104409657B (en) * | 2014-12-01 | 2018-10-02 | 昆山国显光电有限公司 | A kind of encapsulation cover plate and its application in Organnic electroluminescent device |
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Application publication date: 20111228 |