CN103775887B - LEDbulb lamp preparation method - Google Patents
LEDbulb lamp preparation method Download PDFInfo
- Publication number
- CN103775887B CN103775887B CN201410051767.7A CN201410051767A CN103775887B CN 103775887 B CN103775887 B CN 103775887B CN 201410051767 A CN201410051767 A CN 201410051767A CN 103775887 B CN103775887 B CN 103775887B
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- Prior art keywords
- lamp
- pedestal
- lamp housing
- heat
- hole
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- 238000002360 preparation method Methods 0.000 title description 8
- 239000003292 glue Substances 0.000 claims abstract description 71
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 70
- 239000012530 fluid Substances 0.000 claims abstract description 18
- 239000000565 sealant Substances 0.000 claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 description 9
- 239000011324 bead Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 3
- 241000258971 Brachiopoda Species 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Abstract
A kind of LEDbulb lamp manufacture method, comprises the steps：Fluid sealant is applied in stage portion；By lamp housing and stage portion clamping, lamp housing is fixed on pedestal by fluid sealant；Lamp body is vertically placed, by hole for injecting glue to filling heat-conductive glue in lamp housing；Lamp holder is arranged on pedestal, hole for injecting glue is sealed by lamp holder.By the convenient filling heat-conductive glue of hole for injecting glue, then the opening of hole for injecting glue is sealed by lamp holder, simple and fast, there is provided operating efficiency, save production cost.
Description
Technical field
The present invention relates to the technical field of light fixture, more particularly to a kind of LEDbulb lamp and preparation method thereof.
Background technology
The heat dissipation problem of LEDbulb lamp is always technical barrier urgently to be resolved hurrily in industry, and general LEDbulb lamp passes through
Metal heat sink is radiated, but, metal heat sink must have the same air contact of sufficiently large area, can be only achieved radiating
Effect.Therefore, metal heat sink occupies larger space, causes the light-emitting area of LEDbulb lamp to reduce, and lighting angle is received
Limit, LEDbulb lamp profile are heavy, and cost increases.
The content of the invention
Based on this, it is necessary to for above-mentioned technical problem, there is provided a kind of radiating does not affect light-emitting area and angle, and volume
Compact, with low cost LEDbulb lamp and preparation method thereof.
A kind of LEDbulb lamp, including lamp body, lamp housing and lamp holder；
The lamp body includes light source assembly and pedestal, and the light source assembly is fixedly connected with the pedestal；
The light source assembly is located in the lamp housing, and the lamp housing is socketed on the pedestal, and the pedestal is at least part of
In the lamp housing, heat-conducting glue between the pedestal and the lamp housing, is filled with；The lamp holder is fixedly connected with the pedestal,
And the lamp holder is located at outside the lamp housing；The hole for injecting glue with the lamp holder inside the connection lamp housing is opened up on the pedestal.
Wherein in one embodiment, the light source assembly includes lamp bead and substrate, and the lamp bead is arranged on the substrate
On, the substrate is fixedly connected with the pedestal.
Wherein in one embodiment, the substrate and the pedestal are Heat Conduction Material, and the lamp holder is metal material.
Wherein in one embodiment, the hole for injecting glue is in horn-like near the opening of the lamp holder.
Wherein in one embodiment, groove on the pedestal, is opened up, the groove connects the lamp by the hole for injecting glue
Extend to the light source assembly at opening inside shell.
Wherein in one embodiment, the aperture of the hole for injecting glue is more than 2mm.
Wherein in one embodiment, the outside of the pedestal is provided with the stage portion of annular, the lamp housing with described
The clamping of rank portion, and the lamp housing is fixed on the pedestal by fluid sealant.
Wherein in one embodiment, the lamp housing includes globular part and columnar part, the globular part and the columnar part
Connection, the light source assembly are located in the globular part, and the pedestal is at least partially disposed in the columnar part, the columnar part
It is near the pedestal and parallel with the pedestal, the heat-conducting glue is filled between the columnar part and the pedestal.
Wherein in one embodiment, the heat-conducting glue is heat conductive silica gel, heat-conducting silicone grease or epoxide resin AB glue.
A kind of LEDbulb lamp manufacture method, for manufacturing LEDbulb lamp；
The LEDbulb lamp includes lamp body, lamp holder and lamp housing；The lamp body includes light source assembly and pedestal, the light source
Component is fixedly connected with the pedestal；The light source assembly is located in the lamp housing, and the lamp housing is socketed on the pedestal, institute
State pedestal to be at least partially disposed in the lamp housing, between the pedestal and the lamp housing, be filled with heat-conducting glue；The lamp holder and institute
State pedestal to be fixedly connected, and the lamp holder is located at outside the lamp housing；Open up inside the connection lamp housing and described on the pedestal
The hole for injecting glue of lamp holder；The outside of the pedestal is provided with the stage portion of annular, the lamp housing and the stage portion clamping, and described
Lamp housing is fixed on the pedestal by fluid sealant；
The manufacture method comprises the steps：
The fluid sealant is applied in the stage portion；
By the lamp housing and the stage portion clamping, the lamp housing is fixed on the pedestal by fluid sealant；
The lamp body is vertically placed, and injects the heat-conducting glue by the hole for injecting glue into the lamp housing；
The lamp holder is arranged on the pedestal, the hole for injecting glue is sealed by the lamp holder.
Above-mentioned LEDbulb lamp, the heat that light source assembly is produced are conducted to pedestal, then by filling between pedestal and lamp housing
Heat-conducting glue, conducts heat to lamp housing, then is diffused in air by lamp housing, reaches the purpose of LEDbulb lamp radiating.By filling
Heat-conducting glue realizes heat sinking function, it is not necessary to arrange metal heat sink, does not interfere with the light-emitting area and light emitting anger of LEDbulb lamp
Degree, while reducing LEDbulb lamp volume, saves material, reduces cost.
Above-mentioned LEDbulb lamp manufacture method, by the convenient filling heat-conductive glue of hole for injecting glue, then by lamp holder by hole for injecting glue
Opening is sealed, simple and fast, there is provided operating efficiency, saves production cost.
Description of the drawings
Fig. 1 is the schematic diagram of an embodiment LEDbulb lamp；
Schematic diagrames of the Fig. 2 for the light source assembly and pedestal of LEDbulb lamp shown in Fig. 1；
Fig. 3 is the schematic diagram after the lamp housing installation of LEDbulb lamp shown in Fig. 1；
Fig. 4 is the schematic diagram after the injecting glue of LEDbulb lamp shown in Fig. 1；
Fig. 5 is the flow chart of an embodiment LEDbulb lamp manufacture method.
Specific embodiment
For the ease of understanding the present invention, LEDbulb lamp and preparation method thereof is carried out below with reference to relevant drawings more complete
The description in face.The first-selected embodiment of LEDbulb lamp and preparation method thereof is given in accompanying drawing.But, LEDbulb lamp and its making
Method can be realized in many different forms, however it is not limited to embodiment described herein.On the contrary, providing these enforcements
The purpose of example is to make the disclosure to LEDbulb lamp and preparation method thereof more thorough comprehensive.
Unless otherwise defined, all of technology used herein and scientific terminology and the technical field for belonging to the present invention
The implication that technical staff is generally understood that is identical.Herein in the art used in the description of LEDbulb lamp and preparation method thereof
Language is intended merely to the purpose for describing specific embodiment, it is not intended that of the invention in limiting.Term as used herein " and/or "
Including the arbitrary and all of combination of one or more related Listed Items.
As shown in figure 1, the LEDbulb lamp 1 of an embodiment, including lamp body 10, lamp housing 20 and lamp holder 30.Lamp body 10 includes
Light source assembly 120 and pedestal 140, light source assembly 120 are fixedly connected with pedestal 140.Light source assembly 120 is located in lamp housing 20, lamp
Shell 20 is socketed on pedestal 140, and pedestal 140 is at least partially disposed in lamp housing 20, and heat conduction is filled between pedestal 140 and lamp housing 20
Glue 40, heat-conducting glue 40 form heat-conducting glue filling block between pedestal 140 and lamp housing 20.The heat conduction that light source assembly 120 is produced
To pedestal 140, then the heat-conducting glue 40 by filling between pedestal 140 and lamp housing 20, lamp housing 20 is conducted heat to, then by lamp housing
20 are diffused in air, reach the purpose of the radiating of LEDbulb lamp 1.LEDbulb lamp is not interfered with by filling the radiating of heat-conducting glue 40
1 light-emitting area and lighting angle, while reducing 1 volume of LEDbulb lamp, save material, reduces cost.Lamp holder 30 and pedestal
140 are fixedly connected, and lamp holder 30 is located at outside lamp housing 20.The hole for injecting glue with lamp holder 30 inside connection lamp housing 20 is opened up on pedestal 140
142.By 142 convenient filling heat-conductive glue 40 of hole for injecting glue, then the opening of hole for injecting glue 142 is sealed by lamp holder 30, it is simple fast
It is prompt, there is provided operating efficiency, save production cost.
As shown in figure 1, the LEDbulb lamp 1 of an embodiment, including lamp body 10, lamp housing 20 and lamp holder 30.Lamp body 10 includes
Light source assembly 120 and pedestal 140, light source assembly 120 include lamp bead 122 and substrate 124, and lamp bead 122 is arranged on substrate 124,
Substrate 124 is fixedly connected with pedestal 140.Lamp bead 122 can operationally produce heat, wherein in one embodiment, substrate 124
It is Heat Conduction Material with pedestal 140, beneficial to the heat that lamp bead 122 is produced is conducted to heat-conducting glue 40.
Lamp housing 20 includes globular part 220 and columnar part 240, and globular part 220 is connected with columnar part 240, light source assembly 120
In globular part 220, pedestal 140 is at least partially disposed in columnar part 240, columnar part 240 near pedestal 140 and with pedestal 140
It is parallel, heat-conducting glue 40 is filled between columnar part 240 and pedestal 140.In the present embodiment, heat-conducting glue 40 is heat conductive silica gel,
In other embodiment, heat-conducting glue 40 can also be heat-conducting silicone grease or epoxide resin AB glue.The heat that lamp bead 122 is produced passes through substrate
124 conduct to pedestal 140, then the heat-conducting glue 40 by filling between pedestal 140 and lamp housing 20, conduct heat to lamp housing 20,
It is diffused in air by lamp housing 20 again, reaches the purpose of the radiating of LEDbulb lamp 1.
Referring also to Fig. 2, wherein in one embodiment, the outside of pedestal 140 is provided with the stage portion 144 of annular, lamp
Shell 20 and 144 clamping of stage portion, and lamp housing 20 is fixed on pedestal 140 by fluid sealant 50.50 preferred strong sealing of fluid sealant
Glue 50.Stage portion 144 can be used for applying fluid sealant 50, referring also to Fig. 3, after lamp housing 20 and 144 clamping of stage portion, fluid sealant 50
It is extruded into inside lamp housing 20, lamp housing 20 is fixed on pedestal 140 by fluid sealant 50.Wherein in one embodiment, base
Seat 140 outside be additionally provided with external screw thread 146, the external screw thread 146 for by LEDbulb lamp 1 be arranged on lamp socket.
Lamp holder 30 is fixedly connected with pedestal 140, and lamp holder 30 is located at outside lamp housing 20.Lamp holder 30 can be with auxiliary heat dissipation, at which
In middle one embodiment, lamp holder 30 be metal material, metal material conduct heat better performances.Connection is opened up on pedestal 140
Inside lamp housing 20 and lamp holder 30 hole for injecting glue 142, the schematic diagram after 1 injecting glue of LEDbulb lamp referring also to shown in Fig. 4 can be with
By 142 convenient filling heat-conductive glue 40 of hole for injecting glue, then the opening of hole for injecting glue 142 is sealed by lamp holder 30, simple and fast is carried
Operating efficiency has been supplied, production cost has been saved.
Filling heat-conductive glue 40 for convenience, hole for injecting glue 142 near lamp holder 30 opening can be designed as it is horn-like.Wherein
In one embodiment, on pedestal 140, open up groove 148, groove 148 from hole for injecting glue 142 connect lamp housing 20 inside opening to
Light source assembly 120 extends.Groove 148 can reduce the resistance that heat-conducting glue 40 is injected in lamp housing 20 from hole for injecting glue 142, make heat-conducting glue
40 smoothly inject lamp housing 20, and pile up in the bottom of lamp housing 20.Wherein in one embodiment, the aperture of hole for injecting glue 142 is big
In 2mm, the material of heat-conducting glue 40 is more special, and viscosity is higher and easily condenses, if the aperture of hole for injecting glue 142 is less very
Blocking is easily caused, it is more suitable more than 2mm.
As shown in figure 5,1 manufacture method of LEDbulb lamp of an embodiment, for manufacturing the LEDbulb lamp 1 shown in Fig. 1,
Referring also to Fig. 1 to Fig. 3,1 manufacture method of LEDbulb lamp comprise the steps：
S120, applies fluid sealant 50 in stage portion 144.Stage portion 144 is coated the schematic diagram after fluid sealant 50 and can be found in figure
2。
S140, lamp housing 20 is fixed on pedestal 140 by lamp housing 20 and 144 clamping of stage portion by fluid sealant 50.Utilize
Stage portion 144 and fluid sealant 50 are combined and are sealed, and lamp housing 20 can be made to stablize, firmly seal with pedestal 140.
S160, lamp body 10 are vertically placed, by hole for injecting glue 142 to filling heat-conductive glue 40 in lamp housing 20.Lamp body 10 is vertically put
Put, heat-conducting glue 40 is deposited on the bottom of lamp housing 20 under gravity, is centered around around pedestal 140.
S180, lamp holder 30 is arranged on pedestal 140, is sealed hole for injecting glue 142 by lamp holder 30.By hole for injecting glue 142
Convenient filling heat-conductive glue 40, then the opening of hole for injecting glue 142 is sealed by lamp holder 30, simple and fast, there is provided operating efficiency,
Save production cost.
Wherein in one embodiment, after step S140, also include lamp housing before step S160 by hole for injecting glue 142
The step of portion gas in 20 are extracted out.Before filling heat-conductive glue 40, certain negative pressure is formed in lamp housing 20 and be beneficial to heat conduction
The smooth injection of glue 40.In other embodiments, after step S140, can also include by hole for injecting glue before step S160
142 by lamp housing 20 air extract out, injection protective gas the step of.
Above example only expresses the several embodiments of the present invention, and its description is more concrete and detailed, but can not
Therefore it is interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art,
Without departing from the inventive concept of the premise, some deformations and improvement can also be made, these belong to the protection model of the present invention
Enclose.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (1)
1. a kind of LEDbulb lamp manufacture method, it is characterised in that for manufacturing LEDbulb lamp；
The LEDbulb lamp includes lamp body, lamp holder and lamp housing；The lamp body includes light source assembly and pedestal, the light source assembly
It is fixedly connected with the pedestal；The light source assembly is located in the lamp housing, and the lamp housing is socketed on the pedestal, the base
Seat is at least partially disposed in the lamp housing, and heat-conducting glue is filled between the pedestal and the lamp housing；The lamp holder and the base
Seat is fixedly connected, and the lamp holder is located at outside the lamp housing；Open up on the pedestal inside the connection lamp housing and the lamp holder
Hole for injecting glue；The outside of the pedestal is provided with the stage portion of annular, the lamp housing and the stage portion clamping, and the lamp housing
It is fixed on the pedestal by fluid sealant；
The manufacture method comprises the steps：
The fluid sealant is applied in the stage portion；
By the lamp housing and the stage portion clamping, the lamp housing is fixed on the pedestal by fluid sealant；
The lamp body is vertically placed, and injects the heat-conducting glue by the hole for injecting glue into the lamp housing；
The lamp holder is arranged on the pedestal, the hole for injecting glue is sealed by the lamp holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410051767.7A CN103775887B (en) | 2014-02-14 | 2014-02-14 | LEDbulb lamp preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410051767.7A CN103775887B (en) | 2014-02-14 | 2014-02-14 | LEDbulb lamp preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103775887A CN103775887A (en) | 2014-05-07 |
| CN103775887B true CN103775887B (en) | 2017-04-05 |
Family
ID=50568450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410051767.7A Active CN103775887B (en) | 2014-02-14 | 2014-02-14 | LEDbulb lamp preparation method |
Country Status (1)
| Country | Link |
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| CN (1) | CN103775887B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104595769A (en) * | 2015-01-29 | 2015-05-06 | 佛山市三目照明电器有限公司 | Production method of LED (light emitting diode) lamp |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101699135A (en) * | 2009-10-19 | 2010-04-28 | 上海海丰照明电器有限公司 | Common LED lamp bulb |
| CN201875518U (en) * | 2010-10-08 | 2011-06-22 | 鹤山市银雨照明有限公司 | Lamp cap structure of sealant-pouring lamp string |
| CN103174950A (en) * | 2011-12-20 | 2013-06-26 | 富准精密工业(深圳)有限公司 | Light-emitting diode bulb |
| CN203784676U (en) * | 2014-02-14 | 2014-08-20 | 深圳市裕富照明有限公司 | LED (light emitting diode) bulb lamp |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200923262A (en) * | 2007-11-30 | 2009-06-01 | Tysun Inc | High heat dissipation optic module for light emitting diode and its manufacturing method |
| TWM345930U (en) * | 2008-01-30 | 2008-12-01 | wen-song Hu | Light-gathering and enhancing device for light bulb using SMD LED or LED as lighting source |
| CN201425248Y (en) * | 2009-04-14 | 2010-03-17 | 福建联合动力设备制造有限公司 | Lamp |
| CN201909264U (en) * | 2010-03-26 | 2011-07-27 | 福州鑫华奥光电有限公司 | Solar energy water proof LED (light-emitting diode) lamp |
-
2014
- 2014-02-14 CN CN201410051767.7A patent/CN103775887B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101699135A (en) * | 2009-10-19 | 2010-04-28 | 上海海丰照明电器有限公司 | Common LED lamp bulb |
| CN201875518U (en) * | 2010-10-08 | 2011-06-22 | 鹤山市银雨照明有限公司 | Lamp cap structure of sealant-pouring lamp string |
| CN103174950A (en) * | 2011-12-20 | 2013-06-26 | 富准精密工业(深圳)有限公司 | Light-emitting diode bulb |
| CN203784676U (en) * | 2014-02-14 | 2014-08-20 | 深圳市裕富照明有限公司 | LED (light emitting diode) bulb lamp |
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| Publication number | Publication date |
|---|---|
| CN103775887A (en) | 2014-05-07 |
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Address after: Building A, B, C, and D, Industrial Park, No. 10 Huanping Road, Gaoqiao Community, Pingdi Street, Longgang District, Shenzhen City, Guangdong Province, 518000 Patentee after: Shenzhen Yufu Lighting Co.,Ltd. Country or region after: China Address before: 518000 Industrial Park, No. 6 Fugao East Road, Gaoqiao Community, Pingdi Street, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Eastfield Lighting Co.,Ltd. Country or region before: China |