CN104595769A - Production method of LED (light emitting diode) lamp - Google Patents

Production method of LED (light emitting diode) lamp Download PDF

Info

Publication number
CN104595769A
CN104595769A CN201510048072.8A CN201510048072A CN104595769A CN 104595769 A CN104595769 A CN 104595769A CN 201510048072 A CN201510048072 A CN 201510048072A CN 104595769 A CN104595769 A CN 104595769A
Authority
CN
China
Prior art keywords
glue
led lamp
production method
light emitting
surface cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510048072.8A
Other languages
Chinese (zh)
Inventor
刘璆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foshan City San Mu Lighting Electric Appliance Co Ltd
Original Assignee
Foshan City San Mu Lighting Electric Appliance Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foshan City San Mu Lighting Electric Appliance Co Ltd filed Critical Foshan City San Mu Lighting Electric Appliance Co Ltd
Priority to CN201510048072.8A priority Critical patent/CN104595769A/en
Publication of CN104595769A publication Critical patent/CN104595769A/en
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources

Abstract

The invention discloses a production method of an LED (light emitting diode) lamp. The method comprises the following steps that a, an LED lamp main body is fixedly placed on a jig; b, glue is injected into a glue injecting groove formed in the LED lamp main body, after the glue injection is completed, aging test and electric performance detection are started, in the process of carrying out the aging test and electric performance detection, the gluewater leveling is synchronously carried out, a light transmission surface cover is mounted, and the work such as gluewater curing is carried out; c, finished products are packaged. After the technical scheme is adopted, compared with the prior art, the technical scheme has the following advantages that according to the production method, in the process of implementing the steps such as gluewater leveling, transparent surface cover installation and curing, the work of aging and electric performance detection is synchronously carried out, the production time is greatly shortened, the production efficiency is improved, and the production cost is reduced.

Description

A kind of production method of LED lamp
Technical field:
The present invention relates to a kind of production method of LED lamp.
Background technology:
The production process of traditional LED lamp tool is, first burin-in process is carried out to LED lamp main body, then be fixed on special fixture, manual or by equipment mode is adopted to carry out injecting glue, light emitting surface cover is loaded onto after glue levelling, the wall body of light emitting surface cover is crimped on the injecting glue groove of LED lamp main body, then glue curing is waited for, solidify and aging and electrical property is carried out to finished product detected afterwards, and aging in above-mentioned steps, glue levelling, transparent surface cover is installed, it is all after often completing a step that solidification and electrical property detect, just carry out next step operation, such production is consuming time very long, serious reduction production efficiency, increase production cost.
Summary of the invention:
The object of the invention is the shortcoming in order to overcome above-mentioned prior art, a kind of production method that greatly can improve LED lamp production efficiency is provided.
Goal of the invention of the present invention can be realized by following technical scheme: a kind of production method of LED lamp, the concrete steps of the method are as follows: a. by LED lamp main body fixed placement on tool, b. toward the injecting glue groove injecting glue in LED lamp main body, after injecting glue completes, unlatching burn-in test and electrical property detect, in the process of carrying out burn-in test and electrical property detection, synchronously carry out glue levelling, load onto light emitting surface cover, and wait for these work of glue curing, c. packed products.
After loading onto light emitting surface cover, inside is exhausted, then waits for that glue completes solidification.
After adopting the technical program, compared with prior art, the technical program has the following advantages: this production method can realize at glue levelling, installs transparent surface cover, solidify in the process of these steps, synchronously carry out work that is aging and electrical property detection, greatly shorten the production time, enhance productivity, reduce production cost.
Accompanying drawing illustrates:
Fig. 1 is the flow chart of prior art production method;
Fig. 2 is the flow chart of production method of the present invention.
Detailed description of the invention:
Below in conjunction with accompanying drawing, this technology is described further.
The concrete steps of the LED lamp production method of the present embodiment are as follows:
1. LED lamp main body to be assembled is placed on tool fixing, the injecting glue groove of LED lamp main body is in horizontal positioned state, this localization tool must design according to specific products, to reach fixing product, whole piece injecting glue groove is in level, for follow-up levelling provides sharp condition, and tool can fix multiple LED lamp main body simultaneously;
2. toward injecting glue groove injecting glue;
3. after injecting glue completes, open and LED burn-in test and electrical property are detected, wait for glue levelling simultaneously, then light emitting surface cover is loaded onto, the wall body of light emitting surface cover is crimped on injecting glue groove, compress light emitting surface cover, light emitting surface cover is allowed fully to contact with glue, light emitting surface cover and LED lamp main body are completely in conjunction with formation confined space, owing to there is steam in the air in confined space, need to be exhausted process, discharge the air of confined space inside, so both can prevent LED lamp from producing water smoke when normal work inside light emitting surface cover, the generation preventing glue bubble can be conducive to again, during exhaust, because confined space is in negative pressure state, bubble in glue automatically will be separated out and is discharged.Exhaust will be performed until till glue completes solidification, and solidification also completes while terminating and detects the burn-in test of LED and electrical property.In this step, whole process LED lamp production is all in 30 ~ 60 DEG C of these temperature ranges and carries out aging and electrical property detection, can accelerate the curing proceeding of glue under such temperature conditions, enhance productivity.
Step 3. in aging and electrical property to detect be the carrying out under a kind of intelligent program controls, the constant temperature that this step can be implemented under 30-65 DEG C of condition is aging, aging temperature can carry out setting and controlling in 30-65 DEG C of interval, and aging cycle time can regulate in the scope of 1 hour to 4 hours.The described aging segmentation including multiple different voltage range (from 9VDC ~ 48VDC or 100VAC ~ 305VAC scope) is aging, aging voltage can select setting in (from 9VDC ~ 48VDC or 100VAC ~ 305VAC scope), and segmentation ageing time can select setting at 5 minutes-30 minutes.The described aging electrical property that can realize detects, detection includes high voltage (48VDC or 305VAC)) periodic shock and the low-voltage (periodic shock under 9VDC or 100VAC condition, impulse period can regulate between 0.1S ~ 60S, effectively can detect by the product of 5 ~ 15 sub-high pressures impacts and 5 ~ 15 low pressure impacts the weak link that product exists, reduce product greatly in percent defective after sale and return of goods rate.Described aging can be implemented in aging while carry out glue levelling, transparent surface cover installation, glue curing, electrical property detect, and constant temperature aging line can be guaranteed while aging, glue solidifies completely, and hardening time shortens greatly.
4. closed grate hole, to guarantee that waterproof meets IP67 grade;
5. visual examination is carried out, to find outward appearance product defective and to reprocess in time;
6. packed products, completes production.
Best practices effect of the present invention is: it is the most time-consuming in all process steps that aging and electrical property detects, and aging and electrical property detection are carried out by the technical program after injecting glue at once, in the process of carrying out aging and electrical property detection, complete glue levelling, transparent surface cover is installed, glue curing, so just greatly can shorten the production time, production cycle of rubber seal LED lamp shortens more than 50%, return of goods rate after sale reduces by more than 50%.
The above is only preferred embodiment of the present invention, not does any pro forma restriction to the present invention.Any those of ordinary skill in the art, do not departing under technical solution of the present invention ambit, the Method and Technology content of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solution of the present invention, or be revised as the Equivalent embodiments of equivalent variations.Therefore every content not departing from technical solution of the present invention, the equivalence done according to the shape of the present invention, structure and principle change, all should be covered by protection scope of the present invention.

Claims (2)

1. the production method of a LED lamp, the concrete steps of the method are as follows: a. by LED lamp main body fixed placement on tool, b. toward the injecting glue groove injecting glue in LED lamp main body, after injecting glue completes, unlatching burn-in test and electrical property detect, in the process of carrying out burn-in test and electrical property detection, synchronously carry out glue levelling, load onto light emitting surface cover, and wait for these work of glue curing, c. packed products.
2. the production method of a kind of LED lamp according to claim 1, is characterized in that: after loading onto light emitting surface cover, is exhausted inside, then waits for that glue completes solidification.
CN201510048072.8A 2015-01-29 2015-01-29 Production method of LED (light emitting diode) lamp Pending CN104595769A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510048072.8A CN104595769A (en) 2015-01-29 2015-01-29 Production method of LED (light emitting diode) lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510048072.8A CN104595769A (en) 2015-01-29 2015-01-29 Production method of LED (light emitting diode) lamp

Publications (1)

Publication Number Publication Date
CN104595769A true CN104595769A (en) 2015-05-06

Family

ID=53121725

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510048072.8A Pending CN104595769A (en) 2015-01-29 2015-01-29 Production method of LED (light emitting diode) lamp

Country Status (1)

Country Link
CN (1) CN104595769A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102185051A (en) * 2011-04-25 2011-09-14 刘振亮 Light-emitting, radiating and wiring process of light-emitting diode (LED) outdoor product chip integrated package
US20120175671A1 (en) * 2011-01-07 2012-07-12 Han-Ming Lee Glued light core for light-emitting diode
CN103216743A (en) * 2012-01-19 2013-07-24 吴金水 Full-automatic production technology of LED (light-emitting diode) bulb lamp
US20130309789A1 (en) * 2011-05-24 2013-11-21 Tsmc Solid State Lighting Ltd. Batwing LED with Remote Phosphor Configuration
CN103775887A (en) * 2014-02-14 2014-05-07 深圳市裕富照明有限公司 LED (Light Emitting Diode) ball bulb and manufacturing method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120175671A1 (en) * 2011-01-07 2012-07-12 Han-Ming Lee Glued light core for light-emitting diode
CN102185051A (en) * 2011-04-25 2011-09-14 刘振亮 Light-emitting, radiating and wiring process of light-emitting diode (LED) outdoor product chip integrated package
US20130309789A1 (en) * 2011-05-24 2013-11-21 Tsmc Solid State Lighting Ltd. Batwing LED with Remote Phosphor Configuration
CN103216743A (en) * 2012-01-19 2013-07-24 吴金水 Full-automatic production technology of LED (light-emitting diode) bulb lamp
CN103775887A (en) * 2014-02-14 2014-05-07 深圳市裕富照明有限公司 LED (Light Emitting Diode) ball bulb and manufacturing method thereof

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
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Application publication date: 20150506