CN203784676U - LED (light emitting diode) bulb lamp - Google Patents
LED (light emitting diode) bulb lamp Download PDFInfo
- Publication number
- CN203784676U CN203784676U CN201420067027.8U CN201420067027U CN203784676U CN 203784676 U CN203784676 U CN 203784676U CN 201420067027 U CN201420067027 U CN 201420067027U CN 203784676 U CN203784676 U CN 203784676U
- Authority
- CN
- China
- Prior art keywords
- lamp
- pedestal
- heat
- led bulb
- lamp housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003292 glue Substances 0.000 claims abstract description 76
- 239000000463 material Substances 0.000 claims abstract description 9
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 71
- 239000000758 substrate Substances 0.000 claims description 13
- 239000012530 fluid Substances 0.000 claims description 11
- 239000000565 sealant Substances 0.000 claims description 11
- 239000007769 metal material Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 5
- 238000005286 illumination Methods 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model provides an LED (light emitting diode) bulb lamp, which comprises a lamp body, a lamp case and a lamp head, wherein the lamp body comprises a light source assembly and a base, the light source assembly is fixedly connected with the base and is positioned in the lamp case, the lamp case is sheathed and connected onto the base, the base is at least partially positioned in the lamp case, heat conducting glue is filled between the base and the lamp case, the heat conducting glue forms a heat conducting glue filling block between the base and the lamp case, the lamp head and the base are fixedly connected, in addition, the lamp head is positioned outside the lamp case, and a glue filling hole communicated with the inside of the lamp case and the lamp head is formed in the base. The heat generated by the light source assembly is conducted to the base, is then conducted to the lamp case through the heat conducting glue filled between the base and the lamp case, and is next diffused into air through the lamp case to reach the goal of heat radiation of the LED bulb lamp. The illumination area and the illumination angle of the LED bulb lamp cannot be influenced through the filling of the heat radiation glue, meanwhile, the size of the LED bulb lamp is reduced, the materials are saved, and the cost is reduced.
Description
Technical field
The utility model relates to the technical field of light fixture, particularly relates to a kind of LED bulb lamp.
Background technology
The heat dissipation problem of LED bulb lamp is technical barrier urgently to be resolved hurrily in industry always, and general LED bulb lamp dispels the heat by metal heat sink, and still, metal heat sink must have enough large area to contact with air, just can reach the effect of heat radiation.Therefore, metal heat sink has taken larger space, causes the light-emitting area of LED bulb lamp to reduce, and lighting angle is limited, LED bulb lamp profile heaviness, and cost increases.
Utility model content
Based on this, be necessary for above-mentioned technical problem, provide a kind of heat radiation not affect light-emitting area and angle, and volume LED bulb lamp small and exquisite, with low cost.
A kind of LED bulb lamp, comprises lamp body, lamp housing and lamp holder;
Described lamp body comprises light source assembly and pedestal, and described light source assembly is fixedly connected with described pedestal;
Described light source assembly is positioned at described lamp housing, described lamp housing is socketed on described pedestal, described pedestal is positioned at described lamp housing at least partly, between described pedestal and described lamp housing, is filled with heat-conducting glue, and described heat-conducting glue forms heat-conducting glue filling block between described pedestal and described lamp housing; Described lamp holder is fixedly connected with described pedestal, and described lamp holder is positioned at outside described lamp housing; On described pedestal, offer the hole for injecting glue that is communicated with described lamp housing inside and described lamp holder.
In an embodiment, described light source assembly comprises lamp pearl and substrate therein, and described lamp pearl is arranged on described substrate, and described substrate is fixedly connected with described pedestal.
In an embodiment, described substrate and described pedestal are Heat Conduction Material therein, and described lamp holder is metal material.
In an embodiment, described hole for injecting glue is horn-like near the opening of described lamp holder therein.
In an embodiment, on described pedestal, offer groove therein, the opening part that described groove is communicated with described lamp housing inside by described hole for injecting glue extends to described light source assembly.
In an embodiment, the aperture of described hole for injecting glue is greater than 2mm therein.
In an embodiment, the outer setting of described pedestal has annular stage portion therein, described lamp housing and described stage portion clamping, and described lamp housing is fixed on described pedestal by fluid sealant.
Therein in an embodiment, described lamp housing comprises globular part and cylindrical portion, described globular part and described cylindrical portion are communicated with, described light source assembly is positioned at described globular part, described pedestal is positioned at described cylindrical portion at least partly, described cylindrical portion, near described pedestal and parallel with described pedestal, is filled with described heat-conducting glue between described cylindrical portion and described pedestal, and described heat-conducting glue forms described heat-conducting glue filling block between described cylindrical portion and described pedestal.
In an embodiment, the material of described heat-conducting glue filling block is heat conductive silica gel, heat-conducting silicone grease or epoxide resin AB glue therein.
In an embodiment, the outer setting of described pedestal has external screw thread therein.
Above-mentioned LED bulb lamp, the heat that light source assembly produces conducts to pedestal, then by the heat-conducting glue of filling between pedestal and lamp housing, heat is conducted to lamp housing, then is diffused in air by lamp housing, reaches the object of LED bulb lamp heat radiation.Realize heat sinking function by filling heat-conducting glue, do not need to arrange metal heat sink, can not affect light-emitting area and the lighting angle of LED bulb lamp, reduced LED bulb lamp volume simultaneously, save material, reduce costs.
Brief description of the drawings
Fig. 1 is the schematic diagram of an embodiment LED bulb lamp;
Fig. 2 is the light source assembly of LED bulb lamp shown in Fig. 1 and the schematic diagram of pedestal;
Fig. 3 is the schematic diagram after the lamp housing of LED bulb lamp shown in Fig. 1 is installed;
Fig. 4 is the schematic diagram after the injecting glue of LED bulb lamp shown in Fig. 1.
Detailed description of the invention
For the ease of understanding the utility model, below with reference to relevant drawings, LED bulb lamp is described more fully.In accompanying drawing, provide the first-selected embodiment of LED bulb lamp.But LED bulb lamp can be realized in many different forms, be not limited to embodiment described herein.On the contrary, providing the object of these embodiment is to make to the disclosure of LED bulb lamp more thoroughly comprehensively.
Unless otherwise defined, all technology that use are herein identical with the implication that belongs to the common understanding of those skilled in the art of the present utility model with scientific terminology.The term using in the description of LED bulb lamp herein, just in order to describe the object of specific embodiment, is not intended to be restriction the utility model.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
As shown in Figure 1, the LED bulb lamp 1 of an embodiment, comprises lamp body 10, lamp housing 20 and lamp holder 30.Lamp body 10 comprises light source assembly 120 and pedestal 140, and light source assembly 120 is fixedly connected with pedestal 140.Light source assembly 120 is positioned at lamp housing 20, and lamp housing 20 is socketed on pedestal 140, and pedestal 140 is positioned at lamp housing 20 at least partly, between pedestal 140 and lamp housing 20, is filled with heat-conducting glue, and heat-conducting glue forms heat-conducting glue filling block 40 between pedestal 140 and lamp housing 20.The heat that light source assembly 120 produces conducts to pedestal 140, then by the heat-conducting glue of filling between pedestal 140 and lamp housing 20, heat is conducted to lamp housing 20, then be diffused in air by lamp housing 20, reaches the object that LED bulb lamp 1 dispels the heat.Dispel the heat and can not affect the light-emitting area of LED bulb lamp 1 and lighting angle by filling heat-conducting glue filling block 40, reduced LED bulb lamp 1 volume simultaneously, save material, reduce costs.Lamp holder 30 is fixedly connected with pedestal 140, and lamp holder 30 is positioned at outside lamp housing 20.On pedestal 140, offer the hole for injecting glue 142 that is communicated with lamp housing 20 inside and lamp holder 30.By hole for injecting glue 142 filling heat-conductive glue easily, then by lamp holder 30, the opening of hole for injecting glue 142 is sealed, simple and fast, provides operating efficiency, saves production cost.
As shown in Figure 1, the LED bulb lamp 1 of an embodiment, comprises lamp body 10, lamp housing 20 and lamp holder 30.Lamp body 10 comprises light source assembly 120 and pedestal 140, and light source assembly 120 comprises lamp pearl 122 and substrate 124, and lamp pearl 122 is arranged on substrate 124, and substrate 124 is fixedly connected with pedestal 140.Lamp pearl 122 can produce heat in the time of work, and in an embodiment, substrate 124 and pedestal 140 are Heat Conduction Material, are beneficial to the heat that lamp pearl 122 is produced and conduct to heat-conducting glue filling block 40 therein.
Lamp housing 20 comprises globular part 220 and cylindrical portion 240, globular part 220 and cylindrical portion 240 are communicated with, light source assembly 120 is positioned at globular part 220, pedestal 140 is positioned at cylindrical portion 240 at least partly, cylindrical portion 240, near pedestal 140 and parallel with pedestal 140, is filled with heat-conducting glue and forms heat-conducting glue filling block 40 between cylindrical portion 240 and pedestal 140.In the present embodiment, heat-conducting glue is heat conductive silica gel, and in other embodiments, heat-conducting glue can be also heat-conducting silicone grease or epoxide resin AB glue.The heat that lamp pearl 122 produces conducts to pedestal 140 by substrate 124, then by the heat-conducting glue of filling between pedestal 140 and lamp housing 20, heat is conducted to lamp housing 20, then be diffused in air by lamp housing 20, reaches the object that LED bulb lamp 1 dispels the heat.
Referring to Fig. 2, in an embodiment, the outer setting of pedestal 140 has annular stage portion 144 therein simultaneously, lamp housing 20 and stage portion 144 clampings, and lamp housing 20 is fixed on pedestal 140 by fluid sealant 50.The preferred strong sealing glue 50 of fluid sealant 50.Stage portion 144 can be for being coated with fluid sealant 50, and simultaneously referring to Fig. 3, after lamp housing 20 and stage portion 144 clampings, fluid sealant 50 is extruded into lamp housing 20 inside, and lamp housing 20 is fixed on pedestal 140 by fluid sealant 50.In an embodiment, the outside of pedestal 140 is also provided with external screw thread 146 therein, and this external screw thread 146 is for being arranged on lamp socket by LED bulb lamp 1.
Lamp holder 30 is fixedly connected with pedestal 140, and lamp holder 30 is positioned at outside lamp housing 20.Lamp holder 30 can auxiliary heat dissipation, and in an embodiment, lamp holder 30 is metal material therein, the better performances of metal material conduction heat.On pedestal 140, offer the hole for injecting glue 142 that is communicated with lamp housing 20 inside and lamp holder 30, schematic diagram after LED bulb lamp 1 injecting glue simultaneously shown in Figure 4, can pass through hole for injecting glue 142 filling heat-conductive glue easily, by lamp holder 30, the opening of hole for injecting glue 142 is sealed again, simple and fast, operating efficiency is provided, has saved production cost.
In order to facilitate filling heat-conductive glue, hole for injecting glue 142 can be designed as horn-like near the opening of lamp holder 30.In an embodiment, offer groove 148 on pedestal 140 therein, the opening part that groove 148 is communicated with lamp housing 20 inside by hole for injecting glue 142 extends to light source assembly 120.Groove 148 can reduce heat-conducting glue and inject the resistance in lamp housing 20 from hole for injecting glue 142, makes heat-conducting glue inject smoothly lamp housing 20, and piles up in the bottom of lamp housing 20.In an embodiment, the aperture of hole for injecting glue 142 is greater than 2mm therein, and the material of heat-conducting glue is more special, and viscosity is higher and easily condense, if less being easy in the aperture of hole for injecting glue 142 results in blockage, is greater than 2mm comparatively suitable.
Manufacture method for the manufacture of the LED bulb lamp 1 shown in Fig. 1 comprises the steps:
S120 is coated with fluid sealant 50 in stage portion 144.The schematic diagram that stage portion 144 is coated after fluid sealant 50 can be referring to Fig. 2.
S140, by lamp housing 20 and stage portion 144 clampings, is fixed on lamp housing 20 on pedestal 140 by fluid sealant 50.Utilize stage portion 144 and fluid sealant 50 in conjunction with sealing, can make lamp housing 20 and pedestal 140 stablize, firmly seal.
S160, lamp body 10 is vertically placed, by hole for injecting glue 142 to the interior filling heat-conductive glue of lamp housing 20.Lamp body 10 is vertically placed, heat-conducting glue under the effect of gravity, be deposited on lamp housing 20 bottom, be centered around around pedestal 140, form heat-conducting glue filling block 40.
S180, is arranged on lamp holder 30 on pedestal 140, by lamp holder 30, hole for injecting glue 142 is sealed.By hole for injecting glue 142 filling heat-conductive glue easily, then by lamp holder 30, the opening of hole for injecting glue 142 is sealed, simple and fast, provides operating efficiency, saves production cost.
In an embodiment, after step S140, before step S160, also comprise the step of the portion gas in lamp housing 20 being extracted out by hole for injecting glue 142 therein.Before filling heat-conductive glue, be beneficial to the smooth injection of heat-conducting glue in the certain negative pressure of the interior formation of lamp housing 20.In other embodiments, after step S140, before step S160, can also comprise by hole for injecting glue 142 air in lamp housing 20 is extracted out, inject the step of protective gas.
Above embodiment has only expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (10)
1. a LED bulb lamp, is characterized in that, comprises lamp body, lamp housing and lamp holder;
Described lamp body comprises light source assembly and pedestal, and described light source assembly is fixedly connected with described pedestal;
Described light source assembly is positioned at described lamp housing, described lamp housing is socketed on described pedestal, described pedestal is positioned at described lamp housing at least partly, between described pedestal and described lamp housing, is filled with heat-conducting glue, and described heat-conducting glue forms heat-conducting glue filling block between described pedestal and described lamp housing; Described lamp holder is fixedly connected with described pedestal, and described lamp holder is positioned at outside described lamp housing; On described pedestal, offer the hole for injecting glue that is communicated with described lamp housing inside and described lamp holder.
2. LED bulb lamp according to claim 1, is characterized in that, described light source assembly comprises lamp pearl and substrate, and described lamp pearl is arranged on described substrate, and described substrate is fixedly connected with described pedestal.
3. LED bulb lamp according to claim 2, is characterized in that, described substrate and described pedestal are Heat Conduction Material, and described lamp holder is metal material.
4. LED bulb lamp according to claim 1, is characterized in that, described hole for injecting glue is horn-like near the opening of described lamp holder.
5. LED bulb lamp according to claim 1, is characterized in that, on described pedestal, offers groove, and the opening part that described groove is communicated with described lamp housing inside by described hole for injecting glue extends to described light source assembly.
6. according to the LED bulb lamp described in claim 4 or 5, it is characterized in that, the aperture of described hole for injecting glue is greater than 2mm.
7. LED bulb lamp according to claim 1, is characterized in that, the outer setting of described pedestal has annular stage portion, described lamp housing and described stage portion clamping, and described lamp housing is fixed on described pedestal by fluid sealant.
8. LED bulb lamp according to claim 1, it is characterized in that, described lamp housing comprises globular part and cylindrical portion, described globular part and described cylindrical portion are communicated with, described light source assembly is positioned at described globular part, and described pedestal is positioned at described cylindrical portion at least partly, and described cylindrical portion is near described pedestal and parallel with described pedestal, between described cylindrical portion and described pedestal, be filled with described heat-conducting glue, described heat-conducting glue forms described heat-conducting glue filling block between described cylindrical portion and described pedestal.
9. according to the LED bulb lamp described in claim 1 or 8, it is characterized in that, the material of described heat-conducting glue filling block is heat conductive silica gel, heat-conducting silicone grease or epoxide resin AB glue.
10. LED bulb lamp according to claim 1, is characterized in that, the outer setting of described pedestal has external screw thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420067027.8U CN203784676U (en) | 2014-02-14 | 2014-02-14 | LED (light emitting diode) bulb lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420067027.8U CN203784676U (en) | 2014-02-14 | 2014-02-14 | LED (light emitting diode) bulb lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203784676U true CN203784676U (en) | 2014-08-20 |
Family
ID=51320861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420067027.8U Expired - Fee Related CN203784676U (en) | 2014-02-14 | 2014-02-14 | LED (light emitting diode) bulb lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203784676U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103775887A (en) * | 2014-02-14 | 2014-05-07 | 深圳市裕富照明有限公司 | LED (Light Emitting Diode) ball bulb and manufacturing method thereof |
| CN107401685A (en) * | 2016-05-19 | 2017-11-28 | 嘉兴山蒲照明电器有限公司 | A kind of LEDbulb lamp |
-
2014
- 2014-02-14 CN CN201420067027.8U patent/CN203784676U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103775887A (en) * | 2014-02-14 | 2014-05-07 | 深圳市裕富照明有限公司 | LED (Light Emitting Diode) ball bulb and manufacturing method thereof |
| CN103775887B (en) * | 2014-02-14 | 2017-04-05 | 深圳市裕富照明有限公司 | LEDbulb lamp preparation method |
| CN107401685A (en) * | 2016-05-19 | 2017-11-28 | 嘉兴山蒲照明电器有限公司 | A kind of LEDbulb lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140820 |